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Part Manufacturer Description Datasheet Download Buy Part
RI-TRP-REHP-30 Texas Instruments 23 mm Glass Transponder R/O ECO 0-RFIDT
RI-TRP-WE2B-30 Texas Instruments 32mm Glass Transponder R/W ECO 0-RFIDT
TPS54040QDGQRQ1 Texas Instruments Automotive 3.5V to 42V, 500mA Buck Converter with Eco-Mode™ 10-MSOP-PowerPAD -40 to 125
TPS57060QDGQRQ1 Texas Instruments Automotive 3.5V to 60V, 500mA Buck Converter with Eco-Mode™ 10-MSOP-PowerPAD -40 to 125
TPS57160QDGQRQ1 Texas Instruments Automotive 3.5V to 60V, 1.5A Buck Converter with Eco-Mode™ 10-MSOP-PowerPAD -40 to 125
TPS53318DQPT Texas Instruments High-Efficiency 8-A Synchronous Buck Converter with Eco-mode ™ 22-LSON-CLIP -40 to 85

Senju eco solder paste Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2014 - Senju M705-GRN360-K2-V

Abstract: Senju M705-GRN360-K2-V solder paste Senju eco solder paste Senju M705-GRN360-K2-V TYPE 4 OZ63-221CM5-42-10 senju type 5
Text: : Senju Metal Industry Co.,Ltd. Eco Solder Paste P/N:M705-GRN360-K2-V Temperature measurment part , Metal Mask : 0.1~0.12mm Recommended Solder Paste : Senju Metal Industry Co.,Ltd. Eco Solder Paste P/N , Mask : 0.1~0.12mm → Time(S) Recommended Solder Paste : Senju Metal Industry Co.,Ltd. Sparkle , Recommended Solder Paste : Senju Metal Industry Co.,Ltd. Sparkle Paste P/N: OZ63-221CM5-42-10 Reflow Cycle , —‹ Recommended Reflow Temperature Profiles ■for Leaded Solder Paste ※Max.230℃ (On the surface of the


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PDF M705-GRN360-K2-V Senju M705-GRN360-K2-V Senju M705-GRN360-K2-V solder paste Senju eco solder paste Senju M705-GRN360-K2-V TYPE 4 OZ63-221CM5-42-10 senju type 5
2014 - Not Available

Abstract: No abstract text available
Text: Recommended Solder Paste : Senju Metal Industry Co.,Ltd. Eco Solder Paste P/N:M705-GRN360-K2-V Reflow , ○ Recommended Reflow Temperature Profiles ■for Leaded Solder Paste ※Max.230℃ (On the , temperature on the surface of housing is 230℃(max.) Metal Mask : 0.1∼0.12mm Recommended Solder Paste : Senju Metal Industry Co.,Ltd. Sparkle Paste P/N: OZ63-221CM5-42-10 Reflow Cycle : 2 times ■for Lead Free Solder Paste ※Max.250℃ (On the surface of the housing) 250 220â


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PDF FF14C M705-GRN360-K2-V
2014 - Senju M705-GRN360-K2-V solder paste

Abstract: Senju M705-GRN360-K2-V
Text: Mask : 0.1∼0.12mm Recommended Solder Paste : Senju Metal Industry Co.,Ltd. Eco Solder Paste P/N , Mask : 0.1∼0.12mm Recommended Solder Paste : Senju Metal Industry Co.,Ltd. Sparkle Paste P/N: OZ63-221CM5-42-10 Reflow Cycle : 2 times ■for Lead Free Solder Paste ※Max.250℃ (On the surface of the housing , ■for Leaded Solder Paste ※Max.230℃ (On the surface of the housing) 250 215â , might be changed the temperature condition depend on the solder paste , volumne and flax. â


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PDF M705-GRN360-K2-V Senju M705-GRN360-K2-V solder paste Senju M705-GRN360-K2-V
2011 - Not Available

Abstract: No abstract text available
Text: .) Metal Mask : 0.1∼0.12mm Recommended Solder Paste : Senju Metal Industry Co.,Ltd. Eco Solder Paste P/N , Mask : 0.1∼0.12mm Recommended Solder Paste : Senju Metal Industry Co.,Ltd. Sparkle Paste P/N: OZ63-221CM5-42-10 Reflow Cycle : 2 times ■for Lead Free Solder Paste ※Max.250℃ (On the surface of the housing , Solder Paste ※Max.230℃ (On the surface of the housing) 250 215â , might be changed the temperature condition depend on the solder paste , volumne and flax. â


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PDF M705-GRN360-K2-V
2009 - Senju M705

Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
Text: flux dip and 50% dip depth for solder paste . Senju 529D-1 was used for flux dip, while Senju M705-TVA , quality and reliability of final assembly: · Circuit board design · Solder paste characteristics · Solder paste deposition · Reflow profile · Fluxing or solder paste deposition onto the PoP memory , . 8 4.3 Solder Paste Stencil Design . , 012 Figure 13. Passive Component Profile for Robust Handling and Assembly 4.3 Solder Paste


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PDF SWPA156 Senju M705 Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
2004 - senju m705 solder paste

Abstract: senju solder paste Senju M705 Senju metal solder paste Senju senju M705 solder paste data sheet SENJU 221CM5 M705-221CM5 M705 solder paste stiffener
Text: air Solder composition : Paste , 63%Sn/37%Pb ( Senju Metal Industry, Co., Ltd.'s Part Number: OZ63 , air Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu Temperature 200 200ç ( Senju Metal , Profile qUsing Typical Solder Paste 5 sec. max. 250 Temperature 240ç 200 200ç 160ç , individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific


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PDF 51pos. 11gramms. senju m705 solder paste senju solder paste Senju M705 Senju metal solder paste Senju senju M705 solder paste data sheet SENJU 221CM5 M705-221CM5 M705 solder paste stiffener
1999 - senju solder paste

Abstract: Senju
Text: ! Solder and Flux (1) Solder Paste Reflow Soldering : Use RA type or equivalent type of solder paste , mounting conditions, shown the points below. (1) Printing Conditions of Solder Paste 1) Recommendable thickness of solder paste printing shall be 200µm. 2) After soldering, the solder fillet shall be a height , 'SPT-70-0F-2063', manufactured by SENJU METAL INDUSTRY CO., LTD. (Sn:Pb:Ag=63wt%:35wt%:2wt%), for any Internal , solder solder (L : Thickness of product) 3) Too much solder gives too strong mechanical stress to this


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PDF SPT-70-0F-2063' senju solder paste Senju
2000 - Senju

Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Text: ! Solder and Flux (1) Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal , ) Printing Conditions of Solder Paste 1) Solder amount will be around 0.03mg on the land side. Coat the solder paste a thickness of 150µm. (Reference : solder amount) 2) The amount of solder is critical. Height of fillet as below is judged as good product. E T electrode 1/3 E V T V E solder solder


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PDF SPT-70-OF-2063 Senju H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste Ultrasonic flow
2000 - Senju

Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Text: ! Solder and Flux (1) Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal , ) Printing Conditions of Solder Paste 1) Solder amount will be around 0.3mg on the land side. Coat the solder paste a thickness of 200µm. (Reference : solder amount) 2) The amount of solder is critical. Height of fillet as below is judged as good product. E T electrode 1/3 E V T V E solder solder


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PDF SPT-70-OF-2063 Senju senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
1999 - SENJU SOLDER PASTE

Abstract: Senju Senju metal solder paste Senju flux senju solder h63 37wt viscosity senju H63
Text: gSolder and Flux (1) Solder Paste 1) Flow Soldering : Use H60 (Sn:Pb=60wt%:40wt%) type, H63 (Sn:Pb=63wt%:37wt%) type or equivalent type of solder paste . 2) Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%) For , mounting conditions, shown the points below. (1) Printing Conditions of Solder Paste 1) Recommendable thickness of solder paste printing shall be from 150 to 200 . 2) After soldering, the solder fillet shall


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PDF SPT-70-0F-2063' SENJU SOLDER PASTE Senju Senju metal solder paste Senju flux senju solder h63 37wt viscosity senju H63
2008 - OMAP4

Abstract: LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera lf4300 OMAP35xx solder dipping pop
Text: effect on the quality and reliability of final assembly: the circuit board design, the solder paste characteristics, solder paste deposition, the reflow profile, and the fluxing or solder paste deposition onto the , Solder Paste Stencil Design . 7 , Attachment Options . 9 Solder Paste , SPRAAV2 ­ April 2008 Submit Documentation Feedback Solder Paste Stencil Design www.ti.com


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PDF OMAP35xx OMAP4 LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera lf4300 solder dipping pop
2004 - 40 pin zif connector 1mm FPC

Abstract: g3244 M705-221CM5-42-10 Senju flux FH265 senju solder specification
Text: NR-2) Environment: :Room air Solder composition: : Paste , 63%Sn/37%Pb ( Senju Metal Industry, Co , Temperature Profile qUsing Typical Solder Paste 5 sec. max. 250 240 200 200 150 160 150 100 , solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment , 90 sec. 0 Start 60 Preheating 120 Time (Seconds) Soldering qUsing Lead-free Solder Paste MAX 250 , : Paste , 96.5%Sn/3.0%Ag/0.5%Cu ( Senju Metal Industry, Co., Ltd.'s Part Number: M705-221CM5-42-10.5) Test


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PDF 05N/pin 40 pin zif connector 1mm FPC g3244 M705-221CM5-42-10 Senju flux FH265 senju solder specification
2004 - senju m705 solder paste

Abstract: Senju M705 SENJU SENJU SOLDER PASTE M705-221CM5 Senju metal solder paste standard ul94v0 plastic paste M705 solder paste
Text: :Room air Solder composition : Paste , 63%Sn/37%Pb ( Senju Metal Industry, Co., Ltd.'s Part Number: OZ63 , air Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu Temperature 200 200ç ( Senju Metal , BRecommended Temperature Profile qUsing Typical Solder Paste 5 sec. max. 250 Temperature 240ç 200 , individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific


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PDF 51pos. 11gramms. senju m705 solder paste Senju M705 SENJU SENJU SOLDER PASTE M705-221CM5 Senju metal solder paste standard ul94v0 plastic paste M705 solder paste
2004 - senju m705 solder paste

Abstract: Senju M705 SENJU mobile actuator ltds senju solder paste
Text: air Solder composition : Paste , 63%Sn/37%Pb ( Senju Metal Industry, Co., Ltd.'s Part Number: OZ63 , 2,500 pieces per reel. 6 BRecommended Temperature Profile qUsing Typical Solder Paste 5 sec , Preheating Start (20 sec. to 30 sec.) depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment Time (Seconds) manufacturer for specific recommendations. qUsing Lead-free Solder Paste MAX 250ç HRS test condition 250 230ç Solder method


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2004 - senju M705 solder paste

Abstract: Senju M705 senju solder paste M705 M705 solder paste Senju metal solder paste senju solder paste senju solder specification
Text: ., Ltd.'s Part Number: SENSBY NR-2) Environment :Room air Solder composition : Paste , 63%Sn/37%Pb ( Senju , qUsing Typical Solder Paste 5 sec. max. 250 240ç Temperature 200 200ç 150 160ç 150ç ç , vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. qUsing Lead-free Solder Paste MAX , : 0.3mm0.65mm, 0.3mm0.8mm Metal mask :0.230.550.1mm thick, 0.230.650.1mm thick Solder composition : Paste , 96.5


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PDF 51pos. 11gramms. senju M705 solder paste Senju M705 senju solder paste M705 M705 solder paste Senju metal solder paste senju solder paste senju solder specification
2004 - Senju M705

Abstract: Senju Sn Pb 60 40 solder Senju PASTE Senju
Text: 44.5 86 BRecommended Temperature Profile qUsing Typical Solder Paste 5 sec. max. 250 240ç , /hot air (Nihon Den-netsu Co., Ltd.'s Part SENSBY NR-2) Environment :Room air Solder composition : Paste , , depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. qUsing Lead-free Solder Paste MAX 250ç 250 230ç 200 , Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu 150ç 150 100 50 25ç 0 Start (60sec.) 90 sec


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2004 - Senju M705

Abstract: No abstract text available
Text: 44.5 86 BRecommended Temperature Profile qUsing Typical Solder Paste 5 sec. max. 250 240ç , /hot air (Nihon Den-netsu Co., Ltd.'s Part SENSBY NR-2) Environment :Room air Solder composition : Paste , , depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. qUsing Lead-free Solder Paste MAX 250ç 250 230ç 200 , Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu 150ç 150 100 50 25ç 0 Start (60sec.) 90 sec


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PDF
Not Available

Abstract: No abstract text available
Text: :Room air Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu Temperature 200 200ç ( Senju , Solder Paste 5 sec. max. 250 Temperature 240ç 200 200ç 160ç 150 150ç à , : Paste , 63%Sn/37%Pb ( Senju Metal Industry, Co., Ltd.’s Part Number: OZ63-201C-50-9) Test board , individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific


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PDF 51pos. 11gramms.
2004 - senju m705 solder paste

Abstract: 1mm 30 pin fpc connector datasheet 40 pin zif connector 1mm FPC FH26-35S-0.3SHW SN 0203 FPC CONNECTOR SENJU 221CM5 FH26-13S-0.3SHW FPC CONNECTOR 1.25 8 pin zif connector 0.3mm FPC
Text: : SENSBY NR-2) Environment: :Room air Solder composition: : Paste , 63%Sn/37%Pb ( Senju Metal Industry, Co , -2) Environment :Room air Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu ( Senju Metal Industry, Co., Ltd.'s , .) Top cover tape 73 BRecommended Temperature Profile qUsing Typical Solder Paste 5 sec. max , solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Time (Seconds) qUsing Lead-free Solder Paste MAX 250ç 250


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PDF 05N/pin senju m705 solder paste 1mm 30 pin fpc connector datasheet 40 pin zif connector 1mm FPC FH26-35S-0.3SHW SN 0203 FPC CONNECTOR SENJU 221CM5 FH26-13S-0.3SHW FPC CONNECTOR 1.25 8 pin zif connector 0.3mm FPC
2005 - Senju M705

Abstract: M705 solder paste senju m705 solder paste
Text: 44.5 86 BRecommended Temperature Profile qUsing Typical Solder Paste 5 sec. max. 250 240ç , /hot air (Nihon Den-netsu Co., Ltd.'s Part SENSBY NR-2) Environment :Room air Solder composition : Paste , , depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. qUsing Lead-free Solder Paste MAX 250ç 250 230ç 200 , Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu 150ç 150 100 50 25ç 0 Start (60sec.) 90 sec


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2006 - SENJU 221CM5

Abstract: 08005E OZ63-201C-50-9 M705-221CM5-42-10 SENJU
Text: . BRecommended Temperature Profile qUsing Typical Solder Paste 5 sec. max. 250 240ç Temperature(ç) 200 , Den-netsu Co., Ltd.'s Part Number: SENSBY NR-2) Environment :Room air Solder composition : Paste , 63 , (Seconds) qUsing Lead-free Solder Paste MAX 250ç HRS test condition 250 230ç Solder method , NR-2) Environment :Room air Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu 150 150ç , (Seconds) Soldering depending on solder paste type, volume / thickness and board size / thickness


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2006 - Senju M705

Abstract: M705-221CM5 senju m705 solder paste senju solder paste senju Senju metal solder paste SENJU 221CM5 M7052 221CM5 M705-221CM5-42-10
Text: ., Ltd.'s Part Number: SENSBY NR-2) Environment :Room air Solder composition : Paste , 63%Sn/37%Pb ( Senju , :Room air Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu 150 150ç ( Senju Metal Industry , Profile qUsing Typical Solder Paste 5 sec. max. 250 240ç Temperature(ç) 200 200ç 160ç , Lead-free Solder Paste MAX 250ç HRS test condition 250 230ç Solder method :Reflow, IR/hot air , ) Soldering depending on solder paste type, volume / thickness and board size / thickness. Consult your


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SnBiAg

Abstract: senju solder paste WALSIN philips mlcc Senju flux Senju oz
Text: of Pb Free solder paste Score=1 means very good, score=6 means very poor. Score=10 means extremely , than Solder paste . *7 Sn-Ag-Cu is secured by some patents; some authorizations and patents secure , . Multicore Sn-3.8Ag-0.7Cu) of Lead free solder paste . Recommended by NEMI. 3. Sn , 4. Y Sn-3Ag-0.5Cu series of Lead free solder paste . Recommended by JEITIA on Jun.-2000. Typical , (Engineering version) Pb free solder material was started in 1995. A composition of (Sn


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PDF OZ-7085-340F-32-12) 2Ag-20In SnBiAg senju solder paste WALSIN philips mlcc Senju flux Senju oz
2004 - senju m705 solder paste

Abstract: senju M705-221BM5-42-11 M705-221BM5-42-11 RMA9086 senju solder paste M705 SENJU m705 NCP18 90-4-M20 NCP03 NCP15
Text: Chip Type !Caution/Notice Continued from the preceding page. Solder and Flux 1. Solder and Paste (1) Reflow Soldering : NCP03/15/18/21 Series Use RA/RMA type or equivalent type of solder paste . For your reference, we are using the solder paste below for any internal tests of this product. ·RMA9086 , are using the solder paste below. For any internal tests of this product. ·Sn : Pb=63wt%:37wt% ·Sn , product. Printing Conditions of Solder Paste The amount of solder is critical. Standard height of


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PDF R44E8 40kHz. NCP03 NCP15 NCP18/NCP21 senju m705 solder paste senju M705-221BM5-42-11 M705-221BM5-42-11 RMA9086 senju solder paste M705 SENJU m705 NCP18 90-4-M20
1998 - senju solder paste

Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux 62Sn36Pb2Ag solder powder soldering paste Senju
Text: 2.3.1 SOLDER PASTE (1) Material Composition Soldering paste is mainly made from soldering powder and , influences soldering paste viscosity and solder thickness after reflow. Suitable soldering powder and flux , amorphous type, as shown in Fig. 6. The shape influences soldering paste printability. (Source: Senju , deformation) No separation of flux and solder powder No paste surface solidification after manufacture , . · If paste is too viscous, solder does not separate from the die plate easily, possibly causing


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PDF 80-95wt% 63Sn/37Pb) 62Sn/36Pb/2Ag) senju solder paste senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux 62Sn36Pb2Ag solder powder soldering paste Senju
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