| SSTU32864 |
|
NXP Semiconductors
|
Memory interfaces; Support logic for memory modules and other memory subsystems |
|
Original |
PDF
|
| SSTU32864 |
|
Philips Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications |
|
Original |
PDF
|
| SSTU32864 |
|
Philips Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications |
|
Original |
PDF
|
| SSTU32864EC |
|
Philips Semiconductors
|
SSTU32864, 1.8 V configurable registered buffer for DDR2 RDIMM applications |
|
Original |
PDF
|
| SSTU32864EC,518 |
|
NXP Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications - Application: DDR2 400-533 Registered DIMMs ; Hold time (CLK-DATA): 0.5 ns; Inputs: 14 (1:2) or 25 (1:1) x SSTL_18 ; Operating frequency: 0~270 MHz; Operating temperature: 0~+70 Cel; Other features: Configurable 1:1 25-bit or 1:2 14-bit ; Outputs: 25 (1:1) or 28 (1:2) x SSTL_18 ; Propagation delay: 1.4~1.8 ns; Set-up time (DATA-CLK): 0.5 ns; Supply voltage: 1.7~1.9 V; Package: SOT536-1 (LFBGA96); Container: Tape reel smd |
|
Original |
PDF
|
| SSTU32864EC,551 |
|
NXP Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications - Application: DDR2 400-533 Registered DIMMs ; Hold time (CLK-DATA): 0.5 ns; Inputs: 14 (1:2) or 25 (1:1) x SSTL_18 ; Operating frequency: 0~270 MHz; Operating temperature: 0~+70 Cel; Other features: Configurable 1:1 25-bit or 1:2 14-bit ; Outputs: 25 (1:1) or 28 (1:2) x SSTL_18 ; Propagation delay: 1.4~1.8 ns; Set-up time (DATA-CLK): 0.5 ns; Supply voltage: 1.7~1.9 V; Package: SOT536-1 (LFBGA96); Container: Tray Dry Pack, Bakeable, Single |
|
Original |
PDF
|
| SSTU32864EC,557 |
|
NXP Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications - Application: DDR2 400-533 Registered DIMMs ; Hold time (CLK-DATA): 0.5 ns; Inputs: 14 (1:2) or 25 (1:1) x SSTL_18 ; Operating frequency: 0~270 MHz; Operating temperature: 0~+70 Cel; Other features: Configurable 1:1 25-bit or 1:2 14-bit ; Outputs: 25 (1:1) or 28 (1:2) x SSTL_18 ; Propagation delay: 1.4~1.8 ns; Set-up time (DATA-CLK): 0.5 ns; Supply voltage: 1.7~1.9 V; Package: SOT536-1 (LFBGA96); Container: Tray Dry Pack, Bakeable, Multiple |
|
Original |
PDF
|
| SSTU32864EC/G |
|
Philips Semiconductors
|
SSTU32864, 1.8 V configurable registered buffer for DDR2 RDIMM applications |
|
Original |
PDF
|
| SSTU32864EC/G,518 |
|
NXP Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications; Package: SOT536-1 (LFBGA96); Container: Tape reel smd |
|
Original |
PDF
|
| SSTU32864EC/G,551 |
|
NXP Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications; Package: SOT536-1 (LFBGA96); Container: Tray Dry Pack, Bakeable, Single |
|
Original |
PDF
|
| SSTU32864EC/G,557 |
|
NXP Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications; Package: SOT536-1 (LFBGA96); Container: Tray Dry Pack, Bakeable, Multiple |
|
Original |
PDF
|
| SSTU32864EC/G-T |
|
NXP Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications - Application: DDR2 400-533 Registered DIMMs ; Hold time (CLK-DATA): 0.5 ns; Inputs: 14 (1:2) or 25 (1:1) x SSTL_18 ; Operating frequency: 0~270 MHz; Operating temperature: 0~+70 Cel; Other features: Configurable 1:1 25-bit or 1:2 14-bit ; Outputs: 25 (1:1) or 28 (1:2) x SSTL_18 ; Propagation delay: 1.4~1.8 ns; Set-up time (DATA-CLK): 0.5 ns; Supply voltage: 1.7~1.9 V |
|
Original |
PDF
|
| SSTU32864EC-T |
|
NXP Semiconductors
|
1.8 V configurable registered buffer for DDR2 RDIMM applications - Application: DDR2 400-533 Registered DIMMs ; Hold time (CLK-DATA): 0.5 ns; Inputs: 14 (1:2) or 25 (1:1) x SSTL_18 ; Operating frequency: 0~270 MHz; Operating temperature: 0~+70 Cel; Other features: Configurable 1:1 25-bit or 1:2 14-bit ; Outputs: 25 (1:1) or 28 (1:2) x SSTL_18 ; Propagation delay: 1.4~1.8 ns; Set-up time (DATA-CLK): 0.5 ns; Supply voltage: 1.7~1.9 V |
|
Original |
PDF
|
