SOT93 |
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STMicroelectronics
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SOT93 - ASD & DISCRETES - TOURS |
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Original |
PDF
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SOT930-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm |
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Original |
PDF
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SOT931-1 |
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NXP Semiconductors
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Plastic thermal enhanced low profile small outline package; no leads; 10 terminals; resin based; body 4 x 4 x 1.1 mm |
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Original |
PDF
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SOT932-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 176 balls; body 6 x 15 x 0.7 mm |
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Original |
PDF
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SOT933-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm |
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Original |
PDF
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SOT934-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm |
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Original |
PDF
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SOT935-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm |
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Original |
PDF
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SOT935-2 |
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NXP Semiconductors
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Plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based |
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Original |
PDF
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SOT936-1 |
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NXP Semiconductors
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Plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based |
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Original |
PDF
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SOT936-2 |
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NXP Semiconductors
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Plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based |
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Original |
PDF
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SOT938-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 36 leads; low stand-off height |
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Original |
PDF
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SOT939-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 36 leads; low stand-off height |
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Original |
PDF
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