| SOT82 |
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STMicroelectronics
|
SOT82 - ASD & DISCRETES - TOURS |
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Original |
PDF
|
| SOT820-1 |
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NXP Semiconductors
|
Plastic thermal enhanced small outline package; 16 leads; body width 7.5 mm; heatsink |
|
Original |
PDF
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| SOT821-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm |
|
Original |
PDF
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| SOT82_127 |
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NXP Semiconductors
|
Tube pack; standard product orientation; 12NC ending 127 |
|
Original |
PDF
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| SOT822-1 |
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NXP Semiconductors
|
Plastic, heatsink small outline package; 16 leads |
|
Original |
PDF
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| SOT822-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT822-1 |
|
Original |
PDF
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| SOT823-1 |
|
NXP Semiconductors
|
Plastic low profile quad flat package; 80 leads; body 14 x 14 x 1.4 mm |
|
Original |
PDF
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| SOT824-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm |
|
Original |
PDF
|
| SOT825-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm |
|
Original |
PDF
|
| SOT825-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT825-1 |
|
Original |
PDF
|
| SOT826-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 73 balls; body 7 x 7 x 0.9 mm |
|
Original |
PDF
|
| SOT826-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT826-1 |
|
Original |
PDF
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| SOT827-1 |
|
NXP Semiconductors
|
Plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) |
|
Original |
PDF
|
| SOT829-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm |
|
Original |
PDF
|
|
|
| SOT82 DPG AGRATE |
|
STMicroelectronics
|
SOT82 DEDICATED PRODUCT PACKAGE |
|
Original |
PDF
|
