| SOT630-1 |
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NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm |
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Original |
PDF
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| SOT630-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT630-1 |
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Original |
PDF
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| SOT630-2 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT630-2 |
|
Original |
PDF
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| SOT631-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT631-1 |
|
Original |
PDF
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| SOT631-2 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT631-2 |
|
Original |
PDF
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| SOT631-3 |
|
NXP Semiconductors
|
LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm |
|
Original |
PDF
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| SOT631-4 |
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NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1 mm |
|
Original |
PDF
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| SOT632a |
|
NXP Semiconductors
|
leadless surface mounted package; plastic cap; 12 terminations |
|
Original |
PDF
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| SOT633-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad |
|
Original |
PDF
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| SOT634a |
|
NXP Semiconductors
|
Flanged ceramic package; 2 mounting holes; 2 leads |
|
Original |
PDF
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| SOT634A_112 |
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NXP Semiconductors
|
CDFM2; blister pack; standard product orientation 12NC ending 112 |
|
Original |
PDF
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| SOT635-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink |
|
Original |
PDF
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| SOT635-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT635-1 |
|
Original |
PDF
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| SOT636-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT636-1 |
|
Original |
PDF
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| SOT636-1 |
|
NXP Semiconductors
|
Plastic heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink |
|
Original |
PDF
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| SOT637 |
|
NXP Semiconductors
|
Plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads |
|
Original |
PDF
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| SOT638-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT638-1 |
|
Original |
PDF
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| SOT638-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
|
Original |
PDF
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| SOT638-2 |
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NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
|
Original |
PDF
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| SOT638-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT638-2 |
|
Original |
PDF
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