SOT630-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm |
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Original |
PDF
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SOT630-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT630-1 |
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Original |
PDF
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SOT630-2 |
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NXP Semiconductors
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Footprint for reflow soldering SOT630-2 |
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Original |
PDF
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SOT631-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT631-1 |
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Original |
PDF
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SOT631-2 |
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NXP Semiconductors
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Footprint for reflow soldering SOT631-2 |
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Original |
PDF
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SOT631-3 |
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NXP Semiconductors
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LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm |
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Original |
PDF
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SOT631-4 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1 mm |
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Original |
PDF
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SOT632a |
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NXP Semiconductors
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leadless surface mounted package; plastic cap; 12 terminations |
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Original |
PDF
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SOT633-1 |
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NXP Semiconductors
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Plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad |
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Original |
PDF
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SOT634a |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 2 leads |
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Original |
PDF
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SOT634A_112 |
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NXP Semiconductors
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CDFM2; blister pack; standard product orientation 12NC ending 112 |
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Original |
PDF
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SOT635-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink |
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Original |
PDF
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SOT635-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT635-1 |
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Original |
PDF
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SOT636-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT636-1 |
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Original |
PDF
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SOT636-1 |
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NXP Semiconductors
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Plastic heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink |
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Original |
PDF
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SOT637 |
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NXP Semiconductors
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Plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads |
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Original |
PDF
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SOT638-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT638-1 |
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Original |
PDF
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SOT638-1 |
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NXP Semiconductors
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Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
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Original |
PDF
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SOT638-2 |
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NXP Semiconductors
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Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
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Original |
PDF
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SOT638-2 |
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NXP Semiconductors
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Footprint for reflow soldering SOT638-2 |
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Original |
PDF
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