SOT560-1 |
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NXP Semiconductors
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Plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm |
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Original |
PDF
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SOT560-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT560-1 |
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Original |
PDF
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SOT-563 |
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SYNC Power
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OUTLINE |
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Original |
PDF
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SOT564-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT564-1 |
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Original |
PDF
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SOT564-1 |
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NXP Semiconductors
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Plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm |
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Original |
PDF
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SOT566-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 24 leads |
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Original |
PDF
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SOT566-2 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 24 leads; low stand-off height |
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Original |
PDF
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SOT566-3 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 24 leads; low stand-off height |
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Original |
PDF
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SOT567a |
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NXP Semiconductors
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leadless surface mounted package; plastic cap; 8 terminations |
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Original |
PDF
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SOT569-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT569-1 |
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Original |
PDF
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SOT569-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm |
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Original |
PDF
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SOT569-2 |
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NXP Semiconductors
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Footprint for reflow soldering SOT569-2 |
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Original |
PDF
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SOT569-2 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 144 balls |
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Original |
PDF
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