| SOT540A |
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NXP Semiconductors
|
Flanged balanced ceramic package; 2 mounting holes; 4 leads |
|
Original |
PDF
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| SOT54_126 |
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NXP Semiconductors
|
Ammo pack radial taped; standard product orientation 12NC ending 126 |
|
Original |
PDF
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| SOT541A |
|
NXP Semiconductors
|
Flanged balanced ceramic package; 2 mounting holes; 4 leads |
|
Original |
PDF
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| SOT542-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm |
|
Original |
PDF
|
| SOT543-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm |
|
Original |
PDF
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| SOT54_412 |
|
NXP Semiconductors
|
Bulk pack; standard product orientation 12NC ending 412 |
|
Original |
PDF
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| SOT545-1 |
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NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad |
|
Original |
PDF
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| SOT545-2 |
|
NXP Semiconductors
|
Footprint information for reflow soldering of HTQFP48 package |
|
Original |
PDF
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| SOT545-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad |
|
Original |
PDF
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| SOT545-3 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad |
|
Original |
PDF
|
| SOT546-2 |
|
NXP Semiconductors
|
Plastic, heatsink ball grid array package; 352 balls; body 35 x 35 x 0.9 mm |
|
Original |
PDF
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| SOT549-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad |
|
Original |
PDF
|
| SOT549-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT549-1 |
|
Original |
PDF
|
| SOT549-3 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad |
|
Original |
PDF
|
