SOT370-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering |
|
Original |
PDF
|
SOT370-1_118 |
|
NXP Semiconductors
|
Standard product orientation 12NC ending 118 |
|
Original |
PDF
|
SOT371-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering |
|
Original |
PDF
|
SOT375-1 |
|
NXP Semiconductors
|
TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm |
|
Original |
PDF
|
SOT376-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT376-1 |
|
Original |
PDF
|
SOT376-1 |
|
NXP Semiconductors
|
Plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm |
|
Original |
PDF
|
SOT379-1 |
|
NXP Semiconductors
|
Plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2 mm |
|
Original |
PDF
|
SOT379-2 |
|
NXP Semiconductors
|
Footprint information for reflow soldering of QFP52 package |
|
Original |
PDF
|
SOT379-2 |
|
NXP Semiconductors
|
Plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2 mm |
|
Original |
PDF
|