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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
935298867118 Nexperia HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20
935302247118 Nexperia HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20
935298937118 Nexperia HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20
935302249118 Nexperia HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20
935298787118 Nexperia HC/UH SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20
935298939118 Nexperia HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20

SOT163-1 datasheet (4)

Part Manufacturer Description Type PDF
SOT163-1 NXP Semiconductors Footprint for wave soldering SOT163-1 Original PDF
SOT163-1 NXP Semiconductors Footprint for reflow soldering SOT163-1 Original PDF
SOT163-1_115 NXP Semiconductors Tape reel SMD; standard product orientation 12NC ending 115 Original PDF
SOT163-1_118 NXP Semiconductors SO20; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF

SOT163-1 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2013 - Not Available

Abstract: No abstract text available
Text: SO 20 SOT163-1 Tape reel SMD; standard product orientation 12NC ending 115 Rev. 1 — 25 April 2013 Packing information 1 . Packing method Printed plano box Barcode label Reel , Outer box dimensions l x w x h (mm) SOT163-1 115 180 x 24 500 1 190 x 190 x 38 [ 1 ] d = reel diameter; w = tape width. SOT163-1 NXP Semiconductors Tape reel SMD; standard , rights reserved. 2 of 3 SOT163-1 NXP Semiconductors Tape reel SMD; standard product


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PDF OT163-1 msc074 OT163-1
2000 - SOT-263

Abstract: MS-013AC 100H01
Text: -92 TOP3D TOP3L TSOP6 Philips Name SOT163-1 SOT137- 1 SOT96- 1 SOD80C SOD87 SOT404 SOT426 SOT427 SOD106 SOD68 SOT428 SOT533 SOT341- 1 SOT96- 1 SOT163-1 SOT137- 1 SOT54 SOT346 SOT89 SOT323 SOT223 SOT457 SOT416 SOD323 SOD523 SOT363 SOT353 SOT490 SOD124 SOT163-1 SOT137- 1 SOT96- 1 SOT341- 1 SOT32 SOT128B SOT263 SOT263 , SOD95 SOT128B SOT137- 1 SOT163-1 SOT186 SOT186A SOT223 SOT226 SOT263 SOT263-01 SOT281 SOT32 SOT323 SOT340- 1 , SOT78 SOT89 SOT96- 1 Industry Name TO-220F, 2-lead DO-214AC TO-220AB, 2-lead SMA SC-76 SC-79 TO


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PDF 075E04 075E05 076E03S 100H01 100H03 DO-214AC MO-150AH MS-012AA MS-013AC MS-013AD SOT-263
2006 - SOT163

Abstract: SOT163-1 packing 12nc SOT-163 SOT-163-1 sot163 Package
Text: SOT163-1_1 © NXP B.V. 2006. All rights reserved. Rev. 01 - 30 June 2009 2 of 4 SOT163-1 , SOT163-1 Standard product orientation 12NC ending 118 Rev. 01 - 30 June 2009 Packing , ) SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT163-1 118 330 x 24.40 2000 1 336 x 335 x 36 SOT163-1 NXP Semiconductors Standard product orientation , Fig. 4 Package version 12NC ending Reel dimensions d x w (mm) SPQ/PQ (pcs) SOT163-1


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PDF OT163-1 OT163-1 30-june- SOT163 SOT163-1 packing 12nc SOT-163 SOT-163-1 sot163 Package
74hc

Abstract: SOT27-1 sot27 SOT109-1 SOT163-1 SOT402-1 SOT360-1 SOT38 SOT339-1 1/CN0944
Text: SOT338- 1 SOT403- 1 74HC/HCT240 20 SOT146- 1 SOT163-1 SOT339- 1 SOT360- 1 74HC/HCT241 20 SOT146- 1 SOT163-1 SOT339- 1 SOT360- 1 74HC/HCT242 14 SOT27- 1 SOT108- 1 , 20 SOT146- 1 SOT163-1 SOT339- 1 SOT360- 1 74HC/HCT245 20 SOT146- 1 SOT163-1 , 16 SOT38-4 SOT109- 1 SOT338- 1 SOT403- 1 74HC/HCT273 20 SOT146- 1 SOT163-1 , /HCT299 20 SOT146- 1 SOT163-1 SOT339- 1 SOT360- 1 74HC/HCT354 20 SOT146- 1 SOT163-1


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PDF 74HC/HCT00 OT27-1 OT108-1 OT337-1 OT402-1 74HC/HCT02 74hc SOT27-1 sot27 SOT109-1 SOT163-1 SOT402-1 SOT360-1 SOT38 SOT339-1 1/CN0944
2013 - Not Available

Abstract: No abstract text available
Text: SO 20 SOT163-1 SO20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part , 2000 1 338 x 338 x 37 SOT163-1 NXP Semiconductors SO20; Reel pack; SMD, 13" Q1/T1 , . Rev. 2 — 15 April 2013 © NXP B.V. 2013. All rights reserved. 2 of 4 SOT163-1 NXP , disclaimers. Rev. 2 — 15 April 2013 © NXP B.V. 2013. All rights reserved. 3 of 4 SOT163-1 , 1 . Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD


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PDF OT163-1 001aak603 OT163-1
2003 - LCD 09151

Abstract: HVQFN24 PCA9504A PCA9552 PCA8550 SO24 PCA9518 PCA9541 PCA954X SOT616
Text: ) Operating voltage (VDC) # of Addresses PCA9564 SOT662- 1 (HVQFN20) SOT163-1 (SO20) SOT360- 1 , 1 SOT109 (SO16) SOT403- 1 (TSSOP16) -40~85 400 3.0~3.6 1 4 PCA9518 SOT163-1 , (TSSOP14) 1 2 2-1 SOT662- 1 (HVQFN20) SOT163-1 (SO20) SOT360- 1 (TSSOP20) SOT662- 1 (HVQFN20) SOT163-1 (SO20) SOT360- 1 (TSSOP20) SOT109- 1 (SO16) SOT403- 1 (TSSOP16) 1 4 4-1 1 4 , SOT163-1 (SO20) SOT360- 1 (TSSOP20) 5 1 2 0~70 25 100.0 400 3.0~3.6 4 PCA9561


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PDF PCF8574 OT38-4 DIP16) OT162-1 PCF8574A OT266-1 SSOP20) LCD 09151 HVQFN24 PCA9504A PCA9552 PCA8550 SO24 PCA9518 PCA9541 PCA954X SOT616
2013 - TDA5051AT

Abstract: PCA9541A LM75AD SA630D
Text: SOT765- 1 SOT505- 1 SOT629- 1 SOT162- 1 SOT403- 1 SOT662- 1 SOT163-1 SOT360- 1 SOT96- 1 SOT505- 1 SOT96- 1 , SOT505- 1 SOT1069-2 SOT96- 1 SOT505- 1 SOT163-1 SOT360- 1 SOT360- 1 SOT616- 1 SOT360- 1 SOT96- 1 SOT505- 1 , -2 SOT629- 1 SOT403- 1 SOT629- 1 SOT403- 1 SOT402- 1 SOT402- 1 SOT402- 1 SOT662- 1 SOT163-1 SOT360- 1 SOT662- 1 SOT163-1 SOT360- 1 SOT360- 1 SOT360- 1 SOT629- 1 SOT403- 1 SOT616- 1 SOT137- 1 SOT355- 1 , SOT629- 1 SOT403- 1 SOT361- 1 SOT360- 1 SOT360- 1 SOT360- 1 SOT662- 1 SOT163-1 SOT360- 1 SOT902- 1


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PDF OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 TDA5051AT PCA9541A LM75AD SA630D
1997 - Transient Voltage Suppressor diode application no

Abstract: rz 7888
Text: voltage suppressor FEATURES · ESD rating >8 kV, according to IEC1000-4-2 · SOT163-1 surface mount package , voltage suppressor in an SO20; SOT163-1 surface mount package. The device is ideal in situations where , 4 5 6 7 8 9 10 Fig. 1 Pin configuration for SO20 ( SOT163-1 ) and symbol , INFORMATION Typical common anode application BZA109 A 9-fold transient suppressor in an SO20; SOT163-1 , small outline package; 20 leads; body width 7.5 mm BZA109 SOT163-1 D E A X c y HE v M


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PDF M3D184 BZA109 IEC1000-4-2 OT163-1 13-Feb-03) Transient Voltage Suppressor diode application no rz 7888
1997 - BZA109

Abstract: IEC1000-4-2 SO20 rz 7888
Text: -4-2 9-fold monolithic transient voltage suppressor in an SO20; SOT163-1 surface mount package. The device is ideal in situations where board space is a premium. · SOT163-1 surface mount package · , . MBK268 Fig. 1 Pin configuration for SO20 ( SOT163-1 ) and symbol. LIMITING VALUES In accordance with , Typical common anode application A 9-fold transient suppressor in an SO20; SOT163-1 package makes it , BZA109 PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1


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PDF M3D184 BZA109 IEC1000-4-2 OT163-1 OT163-1 SCA56 117027/00/03/pp12 BZA109 IEC1000-4-2 SO20 rz 7888
1996 - SOT163-1

Abstract: MS-013 SO20
Text: package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index Lp L 10 1 e bp detail X w M 0 5 , . REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 EIAJ EUROPEAN , max. A1 A2 A3 bp c D ( 1 ) E ( 1 ) e HE L Lp Q v w y mm , 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z ( 1


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PDF OT163-1 075E04 MS-013 SOT163-1 MS-013 SO20
2008 - 74AHC245

Abstract: 74AHC245D 74AHC245PW 74AHCT245 74AHCT245D 74AHCT245PW SO20
Text: 7.5 mm SOT163-1 74AHC245PW -40 °C to +125 °C TSSOP20 plastic thin shrink small outline , small outline package; 20 leads; body width 7.5 mm SOT163-1 74AHCT245PW -40 °C to +125 °C , leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 , . REFERENCES OUTLINE VERSION JEDEC SOT163-1 Fig 7. IEC 075E04 MS-013 JEITA EUROPEAN PROJECTION Package outline SOT163-1 (SO20) 74AHC_AHCT245_4 Product data sheet © NXP B.V. 2008


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PDF 74AHC245; 74AHCT245 74AHCT245 74AHC245: 74AHCT245: 74AHC245 74AHC245D 74AHC245PW 74AHCT245D 74AHCT245PW SO20
HEF40240B

Abstract: DIP20 HE4000B HEF40240BD HEF40240BP HEF40240BT SC603 SO20 HEF4024
Text: . HEF40240BP(N): 20-lead DIL; plastic (SOT146- 1 ) HEF40240BD(F): 20-lead DIL; ceramic (cerdip) (SOT152) HEF40240BT(D): 20-lead SO; plastic ( SOT163-1 ) ( ): Package Designator North America PINNING IA1 to IA4 , mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 , IEC JEDEC SOT163-1 075E04 MS-013AC January 1995 EIAJ EUROPEAN PROJECTION , output enable inputs (active LOW) FAMILY DATA, IDD LIMITS category buffers Fig. 1 Functional diagram


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PDF HE4000B HEF40240B HEF40240B OT163-1 075E04 MS-013AC DIP20 HEF40240BD HEF40240BP HEF40240BT SC603 SO20 HEF4024
74LVC244A

Abstract: 74LVC244AD 74LVC244ADB 74LVC244APW 74LVCH244A 74LVCH244AD 74LVCH244ADB 74LVC244ABQ
Text: °C 20 SO20 plastic SOT163-1 74LVCH244AD -40 to +125 °C 20 SO20 plastic SOT163-1 74LVC244ADB -40 to +125 °C 20 SSOP20 plastic SOT339- 1 74LVCH244ADB -40 , ; 74LVCH244A PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 , (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 , Notes 1 . CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N +


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PDF 74LVC244A; 74LVCH244A 74LVC244A/74LVCH244A OT339-1 MO-150 74LVC244A 74LVC244AD 74LVC244ADB 74LVC244APW 74LVCH244A 74LVCH244AD 74LVCH244ADB 74LVC244ABQ
2007 - 74HC240

Abstract: 74HC240D 74HCT240 74HC240DB 74HC240N 74HC240PW 74HC244 74HCT244 74HC-HCT240
Text: leads; body width 7.5 mm SOT163-1 74HC240DB -40 °C to +125 °C SSOP20 plastic shrink , width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3 , OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION Fig 10. Package outline SOT163-1 (SO20) 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All , 74HC240; 74HCT240 Octal buffer/line driver; 3-state; inverting Product data sheet 1 . General


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PDF 74HC240; 74HCT240 74HCT240 74HC244; 74HCT244 74HC240 74HC240D 74HC240DB 74HC240N 74HC240PW 74HC244 74HC-HCT240
HEF40373BP

Abstract: DIP20 HE4000B HEF40373B HEF40373BD HEF40373BT SC603 SO20
Text: output enable input (active LOW) (SOT152) HEF40373BT(D): data inputs (SOT146- 1 ) HEF40373BD(F): D0 to D7 O0 to O7 3-state buffered outputs 20-lead SO; plastic ( SOT163-1 ) FAMILY DATA , mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 , IEC JEDEC SOT163-1 075E04 MS-013AC January 1995 EIAJ EUROPEAN PROJECTION , . Supply voltage range: 3 to 15 V. Fig. 1 Functional diagram. Fig.2 Pinning diagram. PINNING


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PDF HE4000B HEF40373B OT163-1 075E04 MS-013AC HEF40373BP DIP20 HEF40373B HEF40373BD HEF40373BT SC603 SO20
2009 - bza100

Abstract: MBG393 MS-013 SO20 K1817 18-fold
Text: ( SOT163-1 ) and symbol. ­ Medical equipment. LIMITING VALUES In accordance with the Absolute Maximum , small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A , are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS , dissipation: 27.5 W at tp = 1 ms · Maximum clamping voltage at peak pulse current: 11 V at 2.5 A PINNING handbook, 4 columns · Low leakage current: max. 2 µA k1 1 k2 2 3 18 k16 k4 4 5


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PDF M3D184 BZA100 18-fold 117027/00/02/pp7 bza100 MBG393 MS-013 SO20 K1817
2010 - Not Available

Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of SO20 package SOT163-1 1.20 (2×) enlarged solder land 0.3 (2×) 1.50 8.00 11.00 11.40 0.60 (18×) 1.27 (18×) 13.40 preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm www.nxp.com © 2010 NXP B.V. placement accurracy ± 0.25 sot163-1_fw All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright


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PDF OT163-1 sot163-1 con18Ã
HEF40244BP

Abstract: DIP20 HE4000B HEF40244B HEF40244BD HEF40244BT SC603 SO20 hef40244
Text: ; plastic (SOT146- 1 ) HEF40244BD(F): 20-lead DIL; ceramic (cerdip) (SOT152) HEF40244BT(D): 20-lead SO; plastic ( SOT163-1 ) ( ): Package Designator North America PINNING IA1 to IA4 inputs IB1 to IB4 , outlines SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X , maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 , (active LOW) FAMILY DATA, IDD LIMITS category buffers See Family Specifications Fig. 1 Functional


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PDF HE4000B HEF40244B HEF40244B OT163-1 075E04 MS-013AC HEF40244BP DIP20 HEF40244BD HEF40244BT SC603 SO20 hef40244
1999 - SOT163-1

Abstract: SOT-163 MS-013-AC MS013AC sot163 Package MS-013AC
Text: package; 20 leads; body width 7.5 mm SOT163-1 D E A X c y HE v M A Z 20 11 Q A2 A1 pin 1 index Lp L 1 e bp 10 w M detail X (A 3) A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1 . Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS , 0.23 D ( 1 ) 13.0 12.6 0.51 0.49 E ( 1 ) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q


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PDF OT163-1 OT163-1 075E04 MS-013AC SOT163-1 SOT-163 MS-013-AC MS013AC sot163 Package
1998 - power DIODES

Abstract: M3D423 M3D333 TO-220F JEDEC M3D087 TO220 SMALL heatsink "Philips Semiconductors" Cross-Reference M3D295 SOD115 M3D117
Text: -220AB M3D307 SOT163-1 (SO20) Plastic small outline package; 20 leads; body width 7.5 mm M3D184 , -220AB TO-220AC TO-220F TO-220F TO-220F TO-220F TO-247 OUTLINE SOD106 SOD106A SOT163-1 SOT78 SOD59 SOD100 , single-ended package; heatsink mounted; 1 mounting hole; 2 lead TO-220 M3D306 SOD61A Hermetically , Hermetically sealed glass package; axial leaded; 2 leads handbook, 2 columns M3D118 1998 Nov 19 1 , sealed glass package; technology; axial leaded; 2 leads ImplotecTM( 1 ) 3D VIEW (not to scale) handbook


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PDF M3D116 OT428 M3D300 OT429 M3D314 OT457 M3D302 DO-214AC MS-013AC power DIODES M3D423 M3D333 TO-220F JEDEC M3D087 TO220 SMALL heatsink "Philips Semiconductors" Cross-Reference M3D295 SOD115 M3D117
1996 - 075E04

Abstract: SOT163-1 SOT163 MS-013 SO20 SOT-163
Text: package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index Lp L 10 1 e bp detail X w M 0 5 , included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA , max. A1 A2 A3 bp c D ( 1 ) E ( 1 ) e HE L Lp Q v w y mm , 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z ( 1


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PDF OT163-1 075E04 MS-013 075E04 SOT163-1 SOT163 MS-013 SO20 SOT-163
MBE513

Abstract: A1593 DIP18 S020 TDA1593 TDA1593T MBE521
Text: leads; body width 7.5 mm SOT163-1 1996 Oct 10 2 ■711002b 010^701 IT? This Material Copyrighted By , /demodulator for FM car radio receivers TDA1593 PINNING PIN SYMBOL SQT102- 1 SOT163-1 DESCRIPTION DIP18 , 80 K/W SOT163-1 90 K/W 1996 Oct 10 6 ■7110fl2b 0ia^?05 fl42 This Material Copyrighted By Its , package; 20 leads; body width 7.5 mm SOT163-1 TT a -He- -a v. X » V® A H2 20 R RlR R R R , included. OUTLINE VERSION REFERENCES EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT163-1


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PDF A1593 TDA1593 711062b MBE513 A1593 DIP18 S020 TDA1593T MBE521
2003 - BUK1M200-50SDLD

Abstract: MS-013 SO20
Text: technology in a 20-pin surface mount plastic package. Product availability: BUK1M200-50SDLD in SOT163-1 , MBL801 Fig 2. Symbol; Quad channel low-side TOPFETTM Fig 1 . Pinning; SOT163-1 (SO20). 2.1 Pin , ; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q , OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 Fig 21. SOT163-1. © Koninklijke Philips Electronics N.V. 2003. All rights


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PDF BUK1M200-50SDLD 20-pin BUK1M200-50SDLD OT163-1 MS-013 SO20
TOKO 113kn if transformer

Abstract: philips SQ20 TOKO fi transformer Philips 153 AVP TOKO 113kn SSOP20 TOKO+113kn TDA5632M TDA5632T SQ20
Text: package; 20 leads; body width 7.5 mm SOT163-1 TDA5632M SSOP20 plastic shrink small outline package; 20 , in free air SOT163-1 SOT266- 1 82 120 K/W K/W HANDLING Human body model: the IC withstands 2000 V in , : plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 ïf -D——-» - i i_ -i , ISSUE DATE IEC JEDEC E1AJ SOT163-1 075E04 MS-013AC OS 11 17 95-01-24 711052b D0AA72M 153 1995 , . UNIT VF supply voltage - 9.0 _ V lp supply current - 40 mA ffl frequency range band A; note 1


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PDF TDA5632 TDA5632 SSQP20: OT266-1 711002b TOKO 113kn if transformer philips SQ20 TOKO fi transformer Philips 153 AVP TOKO 113kn SSOP20 TOKO+113kn TDA5632M TDA5632T SQ20
74LVCH245ABQ

Abstract: 74LVC245A 74LVC245ABQ 74LVC245AD 74LVC245ADB 74LVC245APW 74LVCH245A 74LVCH245AD 74LVCH245ADB
Text: SOT163-1 74LVCH245AD -40 to +125 °C 20 SO20 plastic SOT163-1 74LVC245ADB -40 to , ; 74LVCH245A PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 , (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 , power dissipation capacitance per buffer 15 pF CL = 50 pF; VCC = 3.3 V VCC = 3.3 V; notes 1 and 2 Notes 1 . CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2


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PDF 74LVC245A; 74LVCH245A 74LVC245A/74LVCH245A OT360-1 MO-153 74LVCH245ABQ 74LVC245A 74LVC245ABQ 74LVC245AD 74LVC245ADB 74LVC245APW 74LVCH245A 74LVCH245AD 74LVCH245ADB
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