SOT1210 |
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NXP Semiconductors
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Plastic single ended surface mounted package (LFPAK33); 4 leads |
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Original |
PDF
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SOT1210 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1210 |
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Original |
PDF
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SOT1211-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 16 leads(flat) |
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Original |
PDF
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SOT1212-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 16 leads(flat) |
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Original |
PDF
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SOT1214A |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 4 leads |
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Original |
PDF
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SOT1214B |
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NXP Semiconductors
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earless flanged ceramic package; 4 leads |
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Original |
PDF
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SOT1215 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1215 |
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Original |
PDF
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SOT1215 |
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NXP Semiconductors
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Plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals |
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Original |
PDF
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SOT1216 |
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NXP Semiconductors
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Plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals |
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Original |
PDF
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SOT121B |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 4 leads |
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Original |
PDF
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SOT121B_112 |
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NXP Semiconductors
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CRFM4; Blister pack Packing method; standard product orientation 12NC ending 112 |
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Original |
PDF
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