The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT6300CGN#PBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C
LT6300IGN#TR Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LT6300CGN#TRPBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C
LT6300IGN#TRPBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LT6300IGN#PBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LT6300CGN#TR Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C

SO8W Package Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2002 - M24128-BMN6

Abstract: SO8w SO8W Package AT24C04-10TI atmel 030 AT24C1024 10PI25 at25010 bn M93C46-WMN6 part numbering at25256
Text: TSSOP20 package TSSOP20 package TSSOP20 package TSSOP20 package TSSOP20 package TSSOP20 package SO8W package SO8W package SO8W package SO8W package SO8W package SO8W package 8LAP 0.23 package 8LAP , 8LAP 0.30 package 8LAP 0.30 package 8LAP 0.30 package 8LAP 0.30 package 8LAP 0.30 package SO8W package SO8W package Organization by 16 only Organization by 16 only Organization by 16 only , between ATMEL and ST SO8W package SO8W package SO8W package SO8W package SO8W package SO8W package


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PDF TSSOP14 CREEATMEL/0201 M24128-BMN6 SO8w SO8W Package AT24C04-10TI atmel 030 AT24C1024 10PI25 at25010 bn M93C46-WMN6 part numbering at25256
2008 - ST33F1M

Abstract: ST33F1M package SC300TM ST33F1M NESCRYPT SO8W Package ST33F SO8w iso iec 7816-2 ecopack MCU 32-Bit ST33F
Text: Current consumption compatible with GSM and ETSI specifications October 2008 SO8W package Wafer , protection greater than 4 kV (HBM) 8-lead plastic small outline (208 mils body width) ECOPACK® package , ® packages are lead-free. The category of second Level Interconnect is marked on the package and on the


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PDF ST33F1M 32-bit SC300TM ST33F1M 10-year ST33F1M package ST33F1M NESCRYPT SO8W Package ST33F SO8w iso iec 7816-2 ecopack MCU 32-Bit ST33F
2002 - ST 93c86

Abstract: 93C76 wp 93LCS66SN 93C76 93LC56BX 24C02CP 25C640-E/P 24c04ap m93c46 24LC025/P
Text: MICROCHIP and ST SO8W package SO8W package 1MHz clock frequency 1MHz clock frequency 1MHz clock , 1.8V to 5.5V = 1.8V to 3.6V = 2.7V to 3.6V D W 6 Package BN = PSDIP8 DL = TSSOP14 DW = , 0°C to +70°C I =-40°C to +85°C E =-40°C to +125°C Package P = MS = SN = SM = ST = ST14 , 1.80V to 6.00V Vcc 1.80V to 6.00V and SOT23-5L package Vcc 1.80V to 6.00V and DIP8 package Vcc 1.80V to 6.00V Vcc 1.80V to 6.00V Vcc 1.80V to 6.00V and SOT23-5L package Vcc 1.80V to 6.00V and DIP8


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PDF CREEMICRO/0502 ST 93c86 93C76 wp 93LCS66SN 93C76 93LC56BX 24C02CP 25C640-E/P 24c04ap m93c46 24LC025/P
2011 - mlp8 Package

Abstract: No abstract text available
Text: available · Packages (RoHS compliant) ­ SO8N (MN) 150mils ­ SO8W (MW) 208mils ­ PDIP8 (BA) 300mils ­ VFDFPN8 , . 38 Package Information , . 44 Figure 28: SO8W 208mils Body Width , underside of the MLP8 package that is pulled internally to V SS, and must not be connected to any other voltage or signal line on the PCB. The Package Mechanical section provides information on package


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PDF M25P80 M25P80-VMC6G, M25P80-VMC6GT M25P80-VMN3PB, M25P80-VMN3TPB M25P80-VMN6P, M25P80-VMN6PBA M25P80-VMN6TP, M25P80-VMN6TPBA mlp8 Package
2011 - M25P80-VMC6G

Abstract: M25P80-VMW6TG dfn8 tray m25p80 micron M25P80-VMN6PBA M25P80-VMN3PB Micron M25P80-VMN6TP JESD22A
Text: available · Packages (RoHS-compliant) ­ SO8N (MN) 150 mils ­ SO8W (MW) 208 mils ­ PDIP8 (BA) 300 mils ­ , . 39 Package Information , . 45 Figure 28: SO8W 208 mils Body Width , central pad on the underside of the MLP8 package that is pulled internally to V SS, and must not be connected to any other voltage or signal line on the PCB. The Package Mechanical section provides


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PDF M25P80 M25P80-VMC6G, M25P80-VMC6GT M25P80-VMN3PB, M25P80-VMN3TPB M25P80-VMN6P, M25P80-VMN6PBA M25P80-VMN6TP, M25P80-VMN6TPBA M25P80-VMC6G M25P80-VMW6TG dfn8 tray m25p80 micron M25P80-VMN3PB Micron M25P80-VMN6TP JESD22A
2011 - Not Available

Abstract: No abstract text available
Text: available · Packages (RoHS compliant) ­ SO8N (MN) 150mils ­ SO8W (MW) 208mils ­ PDIP8 (BA) 300mils ­ VFDFPN8 , . 38 Package Information , . 44 Figure 28: SO8W 208mils Body Width , underside of the MLP8 package that is pulled internally to V SS, and must not be connected to any other voltage or signal line on the PCB. The Package Mechanical section provides information on package


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PDF M25P80 M25P80-VMC6G, M25P80-VMC6GT M25P80-VMN3PB, M25P80-VMN3TPB M25P80-VMN6P, M25P80-VMN6PBA M25P80-VMN6TP, M25P80-VMN6TPBA
2011 - MLP8 package

Abstract: SO8n micron m25p80-vmw6g M25P80-VMW6TG M25PX64 marking code micron label
Text: available · Packages (RoHS compliant) ­ SO8N (MN) 150mils ­ SO8W (MW) 208mils ­ PDIP8 (BA) 300mils ­ VFDFPN8 , . 38 Package Information , . 44 Figure 28: SO8W 208mils Body Width , central pad on the underside of the MLP8 package that is pulled internally to V SS, and must not be connected to any other voltage or signal line on the PCB. The Package Mechanical section provides


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PDF M25P80 M25P80-VMC6G, M25P80-VMC6GT M25P80-VMN3PB, M25P80-VMN3TPB M25P80-VMN6P, M25P80-VMN6PBA M25P80-VMN6TP, M25P80-VMN6TPBA MLP8 package SO8n micron m25p80-vmw6g M25P80-VMW6TG M25PX64 marking code micron label
2011 - ufdfpn8

Abstract: M25P80
Text: available · Packages (RoHS compliant) ­ SO8N (MN) 150mils ­ SO8W (MW) 208mils ­ PDIP8 (BA) 300mils ­ VFDFPN8 , . 38 Package Information , . 44 Figure 28: SO8W 208mils Body Width , underside of the MLP8 package that is pulled internally to V SS, and must not be connected to any other voltage or signal line on the PCB. The Package Mechanical section provides information on package


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PDF M25P80 M25P80-VMC6G, M25P80-VMC6GT M25P80-VMN3PB, M25P80-VMN3TPB M25P80-VMN6P, M25P80-VMN6PBA M25P80-VMN6TP, M25P80-VMN6TPBA ufdfpn8
2011 - M25P80-VMN6TP

Abstract: ufdfpn8 M25P80-VMN3TPB M25P80-VMC6G M25P UID M25P80-VMC6GT M25P80-VMN6P 10000A-0000 M25P80-VMP6G marking code micron label
Text: grade parts available · Packages (RoHS compliant) ­ SO8N (MN) 150mils ­ SO8W (MW) 208mils ­ PDIP8 , . 38 Package Information , . 44 Figure 28: SO8W 208mils Body Width , exposed central pad on the underside of the MLP8 package that is pulled internally to V SS, and must not be connected to any other voltage or signal line on the PCB. The Package Mechanical section provides


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PDF M25P80 M25P80-VMC6G, M25P80-VMC6GT M25P80-VMN3PB, M25P80-VMN3TPB M25P80-VMN6P, M25P80-VMN6PBA M25P80-VMN6TP, M25P80-VMN6TPBA M25P80-VMN6TP ufdfpn8 M25P80-VMN3TPB M25P80-VMC6G M25P UID M25P80-VMC6GT M25P80-VMN6P 10000A-0000 M25P80-VMP6G marking code micron label
2007 - SO8w package outline

Abstract: AEC-Q100-002 JESD22-A114D J-STD-020D M24256-BR M24256-BW M24512-R M24512-W M24512-X
Text: . . . . . . . . . . . 24 SO8W ­ 8 lead plastic small outline, 208 mils body width, package , . . . . . . . . . . . . . . 25 SO8W ­ 8 lead plastic small outline, 208 mils body width, package , , M24256-BW, M24256-BR Package mechanical Figure 12. SO8W ­ 8 lead plastic small outline, 208 mils body , . Drawing is not to scale. Table 15. SO8W ­ 8 lead plastic small outline, 208 mils body width, package , to 5.5 V Package M24512-R 1.8 V to 5.5 V SO8N (MN) Range 6 SO8W (MW) Range 6 -


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PDF M24512-W M24512-R M24256-BW M24256-BR M24xxx-R) M24xxx-W) 40-year SO8w package outline AEC-Q100-002 JESD22-A114D J-STD-020D M24256-BR M24512-R M24512-X
2003 - STMicroelectronics M24C32 marking code date

Abstract: AI00795C STMicroelectronics marking code date M24C64 m24c32 marking Marking STMicroelectronics m24c32 STMicroelectronics marking code TSSOP-8 K M24C64 M24C32
Text: 2.5V devices SO8W package removed. -S voltage range removed 20-Apr-2001 2.6 16-Jan-2002 2.7 , E1 E2 VSS 1 2 3 4 8 7 6 5 AI01845C VCC WC SCL SDA Note: 1. See page 18 (onwards) for package , devices b earing the process letter "B" in the package marking (on the top side of the package ), otherwise , 17/24 M24C64, M24C32 PACKAGE MECHANICAL PDIP8 ­ 8 pin Plastic DIP, 0.25mm lead frame, Package , . PDIP8 ­ 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data mm Symb. Typ. A A1 A2 b b2 c D E


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PDF M24C64 M24C32 64Kbit 32Kbit M24Cxx M24Cxx-W M24Cxx-R M24C64, STMicroelectronics M24C32 marking code date AI00795C STMicroelectronics marking code date M24C64 m24c32 marking Marking STMicroelectronics m24c32 STMicroelectronics marking code TSSOP-8 K M24C32
2003 - STMicroelectronics M24C32 marking code date

Abstract: STMicroelectronics marking code date M24C64 M24C32 M24C64 Marking STMicroelectronics m24c32 CP2024
Text: offered for 5V and 2.5V devices 04-Feb-2003 2.9 SO8W package removed. -S voltage range removed , package dimensions, and how to identify pin-1. M24C64, M24C32 SIGNAL DESCRIPTION Serial Clock (SCL , package marking (on the top side of the package ), otherwise (for devices bearing the process letter "N" , M24C64, M24C32 PACKAGE MECHANICAL PDIP8 ­ 8 pin Plastic DIP, 0.25mm lead frame, Package Outline E , . PDIP8 ­ 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data mm inches Symb. Typ


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PDF M24C64 M24C32 64Kbit 32Kbit M24Cxx M24Cxx-W M24Cxx-R M24C64, STMicroelectronics M24C32 marking code date STMicroelectronics marking code date M24C64 M24C32 M24C64 Marking STMicroelectronics m24c32 CP2024
2007 - SO8w package outline

Abstract: M24256-BR M24256-BW M24512-R M24512-W M24512-X
Text: . . . . . . . . . . . 23 SO8W ­ 8 lead plastic small outline, 208 mils body width, package , . . . . . . . . . . . . . . 24 SO8W ­ 8 lead plastic small outline, 208 mils body width, package , M24512-W, M24512-R, M24256-BW, M24256-BR 7 Package mechanical Package mechanical Figure 12. SO8W , ) M24512-W 2.5 V to 5.5 V Package M24512-R 1.8 V to 5.5 V SO8N (MN) Range 6 Range 6 SO8W , removed from Table 11: DC characteristics (M24xxx-W). SO8W package specifications modified in Section 7


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PDF M24512-W M24512-R M24256-BW M24256-BR M24xxx-R) M24xxx-W) 40-year M2451and SO8w package outline M24256-BR M24512-R M24512-X
2006 - SO8W Package

Abstract: No abstract text available
Text: Packages ­ ECOPACK® (RoHS compliant) SO8N (MN) 150 mils width SO8W (MW) 208 mils width VFQFPN8 (MP) 6 × 5mm , parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Package mechanical , Quad Flat Package No lead, 6 × 5 mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . , width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 SO8N ­ 8 lead Plastic Small Outline, 150 mils body width, package


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PDF M25P80 2014h) SO8W Package
2006 - SO8W Package

Abstract: M25P80 SO8w package outline M25P80 SO8w package outline M25P80 reel
Text: signature (13h) Packages ­ ECOPACK® (RoHS compliant) SO8W (MW) 200 mils width VFQFPN8 (MP) (MLP8 , . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Package mechanical . . . . . . . . . . . . , thin Fine Pitch Quad Flat Package No lead, 6x5mm, package mechanical data . . . . . . . . . . . . . . . , , 200 mils body width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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PDF M25P80 40MHz SO8W Package M25P80 SO8w package outline M25P80 SO8w package outline M25P80 reel
2006 - Not Available

Abstract: No abstract text available
Text: ECOPACK® (RoHS compliant) SO8N (MN) 150 mils width VFQFPN8 (MP) 6 × 5mm (MLP8) SO8W (MW) 208 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Package mechanical . . . . , Quad Flat Package No lead, 6x5mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . , width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 SO8N ­ 8 lead Plastic Small Outline, 150 mils body width, package


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PDF M25P80 50MHz 2014h)
2006 - Not Available

Abstract: No abstract text available
Text: ECOPACK® (RoHS compliant) SO8N (MN) 150 mils width VFQFPN8 (MP) 6 × 5mm (MLP8) SO8W (MW) 208 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Package mechanical . . . . , Quad Flat Package No lead, 6x5mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . , width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 SO8N ­ 8 lead Plastic Small Outline, 150 mils body width, package


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PDF M25P80 50MHz 2014h)
2009 - Not Available

Abstract: No abstract text available
Text: ) SO8W (MW) 208 mils width · · · · · · June 2009 Rev 20 1/54 www.numonyx.com 1 , . . . . . . 39 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 43 VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Quad Flat Package No lead, 6 × 5 mm, package mechanical , lead Plastic Small Outline, 208 mils body width, package mechanical data . . . . . . . . . . . . . . . , Outline, 150 mils body width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . .


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PDF M25P80 2014h)
2010 - Not Available

Abstract: No abstract text available
Text: compliant Automotive Certified Parts Available VFDFPN8 (MP) 6 x 5 mm (MLP8) SO8W (MW) 208 mils width , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Package mechanical . , Quad Flat Package No lead, 6 × 5 mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . , width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 SO8N ­ 8 lead Plastic Small Outline, 150 mils body width, package


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PDF M25P80 2014h)
2007 - vdfpn8

Abstract: VDFPN8 package AN1995 M25P80
Text: backward compatibility SO8W (MW) 208 mils width More than 100 000 Program/Erase cycles per , 11 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , Package No lead, 6 × 5 mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . , , package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 SO8N ­ 8 lead Plastic Small Outline, 150 mils body width, package mechanical


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PDF M25P80 2014h) vdfpn8 VDFPN8 package AN1995 M25P80
2007 - Not Available

Abstract: No abstract text available
Text: Packages ­ ECOPACK® (RoHS compliant) SO8N (MN) 150 mils width SO8W (MW) 208 mils width VFQFPN8 (MP) 6 × 5 , parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Package mechanical , Quad Flat Package No lead, 6 × 5 mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . , width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 SO8N ­ 8 lead Plastic Small Outline, 150 mils body width, package


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PDF M25P80 2014h)
2008 - SO8w package outline M25P80

Abstract: SO8w package outline M25P80 reel AN1995 M25P80 SO8w package outline VFQFPN8
Text: backward compatibility SO8W (MW) 208 mils width More than 100 000 Program/Erase cycles per , 11 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , Pitch Quad Flat Package No lead, 6 × 5 mm, package mechanical data . . . . . . . . . . . . . . . . . . , body width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , , package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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PDF M25P80 2014h) SO8w package outline M25P80 SO8w package outline M25P80 reel AN1995 M25P80 SO8w package outline VFQFPN8
2013 - Micron 32MB NOR FLASH

Abstract: Micron 4Mb NOR FLASH m25p32 micron
Text: (RoHS-compliant) ­ SO8W (MW) 208 mils ­ SO16 (MF) 300 mils ­ VFQFPN8 (MP) MLP8 6mm x 5mm ­ VFDFPN8 (MP) MLP8 8mm x , . 39 Package Information , . 43 Figure 28: SO8W 208 mils Body Width , Note: 1. There is an exposed central pad on the underside of the MLP8 package that is pulled internally to VSS, and must not be connected to any other voltage or signal line on the PCB. The Package


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PDF M25P32 512Kb 2016h) 09005aef84566541 Micron 32MB NOR FLASH Micron 4Mb NOR FLASH m25p32 micron
2013 - Not Available

Abstract: No abstract text available
Text: (RoHS-compliant) – SO8W (MW) 208 mils – SO16 (MF) 300 mils – VFQFPN8 (MP) MLP8 6mm x 5mm – VFDFPN8 (MP , . 38 Package Information , . 42 Figure 28: SO8W 208 mils Body Width , the MLP8 package that is pulled internally to VSS, and must not be connected to any other voltage or signal line on the PCB. The Package Mechanical section provides information on package dimensions and


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PDF M25P32 2016h) 09005aef84566541
2012 - k3844

Abstract: Part Marking M24512-W M24256-BR
Text: . . 24 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , -lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 33 SO8N ­ 8 lead plastic small outline, 150 mils body width, package data . . . . . . . . . . . . . . 34 UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . , 8-bump wafer-level chip scale package mechanical data. 37 Ordering information scheme . . . . . . .


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PDF M24512-W M24512-R M24512-DR M24512-DF 512-Kbit M24512-D 200-year k3844 Part Marking M24512-W M24256-BR
Supplyframe Tracking Pixel