The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC3854IDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854EMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRMPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C

SO16 footprint Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
SD card socket, footprint to PCB

Abstract: SD card CARD PCB FOOTPRINT SO16 footprint FOOTPRINTS CONNECTOR 2 PIN SD card footprint PCB pentawatt socket SOT363-6 so8 wide socket TSSOP28 sot23-6 footprint
Text: MBED module. Through hole, Ethernet socket footprint for use with Ethernet connectors with built in magnetic. Surface mount SD Card connector footprint . Surface mount miniUSB footprint . Single in line row of 12 x 0.1 inch through-hole footprint for use with Spark Fun LCD modules. 3 x SO8 footprints. 2 x TSSOP8 footprints. 2 x SOT23-3 footprints. 1 x SOT23-6 footprint . 2 x SOT363-6 footprints. 1 x SOT223 footprint . 1 x SO16 footprint . 1 x wide SO16 footprint . 1 x TSSOP28 footprint . 1 x wide TSSOP28


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P603

Abstract: cpu 8082 82 sot363-6 SO16 footprint COP103 SOT363-6 390201 TSSOP28 P104 P103
Text: -3 footprints. 2 x SOT363-6 footprints. 1 x SOT223 footprint . 1 x SOT26-6 footprint . 1 x TO252 footprint . 3 x SO8 footprints. 2 x TSSOP8 footprints. 1 x TSSOP28 footprint . 1 x wide TSSOP28 footprint . 1 x SO16 footprint . 1 x wide SO16 footprint . 20 x 19 through plated holes on a general purpose on 0.1 , to a common 0.1 inch pitch array of through-hole pads. This means an SO8 footprint for example has on the reverse a TSSOP8 footprint , which means the user has the option of either placing an SO8


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PDF Overla2082 082POSTAP71082POSTAP8102POSTAP91082POSTAP 028POSTAP 1208POSTAP 208POSTAP 3208POSTAP 4208POSTAP 5208POSTAP6208POSTAP7208POSTAP820 1082POSTAP21082POSTAP1082POSTAP0182POSTAP 9082POSTAP P603 cpu 8082 82 sot363-6 SO16 footprint COP103 SOT363-6 390201 TSSOP28 P104 P103
2010 - STM8S105C6T6

Abstract: LD1117-3V3 MB867 UM0817 stm8s105 STM8S105C6 STM8S-DISCOVERY stm8s pwm SO16 footprint UM0627
Text: ) STM8S105C6T6 module STM8S105C6T6 Touch sensing button (TS1) Wrapping area SO16 footprint Doc ID


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PDF UM0817 STM8S105 STM8S105C6T6 LD1117-3V3 MB867 UM0817 stm8s105 STM8S105C6 STM8S-DISCOVERY stm8s pwm SO16 footprint UM0627
2011 - LD1117-3V3

Abstract: stm8s-discovery MB867 UM0817 STM8S105C6T6 AN2927 stm32f103c8t6 s1ck stm8s105 mb867 a
Text: Touch sensing button (TS1) Wrapping area SO16 footprint Doc ID 16361 Rev 3 5/18 Hardware


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PDF UM0817 STM8S105 STM8S105C6T6 LD1117-3V3 stm8s-discovery MB867 AN2927 stm32f103c8t6 s1ck mb867 a
2009 - STM8S105C6T6

Abstract: STM8S-DISCOVERY LD1117-3V3 UM0817 adc example sTM8s stm8s family MB867 3v3 regulator STMicroelectronics UM0627 STM8 spi programming manual
Text: ) STM8S105C6T6 module STM8S105C6T6 Touch sensing button (TS1) Wrapping area SO16 footprint Doc ID


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PDF UM0817 STM8S105 STM8S105C6T6 STM8S-DISCOVERY LD1117-3V3 UM0817 adc example sTM8s stm8s family MB867 3v3 regulator STMicroelectronics UM0627 STM8 spi programming manual
2009 - harddisk motor driver

Abstract: CON16A ATX SMPS DC ATX SMPS schematic flash disk Harddisk motor STR912FAW44x6 ARM966E-S AM01 rAised cosine FILTER
Text: connect the CN5 and CN6 of EVAL-STR910, and a wrap area with 2.54 mm pitch through-hole with one SO16 footprint . Figure 1. STEVAL-PCC006V1, HDD bridge extension board AM01397v1 August 2009 Doc ID


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PDF UM0592 STEVAL-PCC006V1, STEVALPCC006V1) EVAL-STR910 STR912FAW44X6 ARM966E-S 128-pin LQFP128 EVAL-STR910. harddisk motor driver CON16A ATX SMPS DC ATX SMPS schematic flash disk Harddisk motor AM01 rAised cosine FILTER
2001 - ST7FLITE05

Abstract: ST7FLITE09
Text: SO16 (150") device adapter footprint constraint . 60 , If you are using the SO16 (150") package, your SO16 footprint must follow constraints described in Section B.4: SO16 (150") device adapter footprint constraint on page 60. ST7MDT00-EMU2B Emulator User , analyzer probe cable. 6 A SO16 (150") device adapter (ref.: DB489). See Section B.4: SO16 (150") device adapter footprint constraint on page 60 for additional information. 7 One generic emulation


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PDF ST7MDT00-EMU2B DOC-ST7MDT00-EMU2B 89/336/EEC EN55022 ST7FLITE05 ST7FLITE09
2010 - passive rfid tag circuit diagram

Abstract: STM8S105C6T6 AN3255 how to design 13.56 MHz RFID tag smd diode code B4 ST RFID tag i2c J1 HE10 CR14 CRX14 STM8S105C6
Text: RP1 RP2 LD1 SO16 footprint J1 HE10 I2C bus GPIO's STM8S105C6T6 5V STLINK , couplers Contactless coupler compliant with shortrange ISO14443 type-B standard SO16 13.56 MHz


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PDF AN3255 ISO14443 passive rfid tag circuit diagram STM8S105C6T6 AN3255 how to design 13.56 MHz RFID tag smd diode code B4 ST RFID tag i2c J1 HE10 CR14 CRX14 STM8S105C6
2001 - SO16 footprint

Abstract: No abstract text available
Text: for the SO-16 package assumes the use of the recommended footprint on a glass epoxy printed circuit , 751B-05, STYLE 4 SO-16 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 ELECTRICAL CHARACTERISTICS (TA = 25 , ns ns http://onsemi.com 1107 MMPQ3467 INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to


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PDF MMPQ3467 751B-05, SO-16 SO16 footprint
2001 - SO16 footprint

Abstract: No abstract text available
Text: for the SO-16 package assumes the use of the recommended footprint on a glass epoxy printed circuit , 16 1 mAdc CASE 751B-05, STYLE 4 SO-16 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 ELECTRICAL , Publication Order Number: MMPQ6700/D MMPQ6700 INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to


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PDF MMPQ6700 751B-05, SO-16 SO16 footprint
2002 - SO16 footprint

Abstract: No abstract text available
Text: 10 9 Unit Vdc Vdc Vdc mAdc 2 3 4 5 6 7 8 1 SO-16 CASE 751B STYLE 4 MARKING DIAGRAM , Week ORDERING INFORMATION Device MMPQ3904 Package SO-16 Shipping 48 Units/Rail Preferred devices , ://onsemi.com 1110 MMPQ3904 INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder


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PDF MMPQ3904 SO16 footprint
2002 - Not Available

Abstract: No abstract text available
Text: 1.0 watt The 125°C/W for the SO-16 package assumes the use of the recommended footprint on a glass , Unit Vdc Vdc Vdc mAdc 2 3 4 5 6 7 8 1 SO-16 CASE 751B STYLE 4 MARKING DIAGRAM MMPQ3906 , ORDERING INFORMATION Device MMPQ3906 Package SO-16 Shipping 48 Units/Rail Preferred devices are , - 43 155 - - ns ns http://onsemi.com 1113 MMPQ3906 INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout


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PDF MMPQ3906
2001 - Not Available

Abstract: No abstract text available
Text: INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the , CASE 751B-05, STYLE 4 SO-16 1 2 3 4 5 6 7 16 15 14 13 12 11 10 9 ELECTRICAL CHARACTERISTICS , SO-16 SO-16 POWER DISSIPATION The power dissipation of the SO-16 is a function of the pad size , temperature, TA. Using the values provided on the data sheet for the SO-16 package, PD can be calculated as


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PDF MMPQ2369 751B-05, SO-16
2001 - MMPQ2222A

Abstract: No abstract text available
Text: ­55 to +150 °C SO­16 CASE 751B STYLE 4 MARKING DIAGRAM MMPQ2222A AWLYWW MMPQ2222A = , INFORMATION Device Package Shipping MMPQ2222A SO­16 48 Units/Rail Preferred devices are , %. http://onsemi.com 2 MMPQ2222A INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure


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PDF MMPQ2222A r14525 MMPQ2222A/D MMPQ2222A
2006 - MMPQ3906

Abstract: No abstract text available
Text: INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the , °C/W = 1.0 watt The 125°C/W for the SO-16 package assumes the use of the recommended footprint , mW/°C 16 1 Four Transistors Equal Power SO-16 CASE 751B STYLE 4 Power Dissipation @ , Device MMPQ3906 Package Shipping SO-16 48 Units/Rail Preferred devices are recommended


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PDF MMPQ3906 SO-16 MMPQ3906/D MMPQ3906
2001 - MMPQ2222A

Abstract: No abstract text available
Text: SO­16 CASE 751B STYLE 4 MARKING DIAGRAM MMPQ2222A AWLYWW MMPQ2222A = Specific Device Code , Package Shipping MMPQ2222A SO­16 48 Units/Rail Preferred devices are recommended choices , %. http://onsemi.com 2 MMPQ2222A INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure


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PDF MMPQ2222A r14525 MMPQ2222A/D MMPQ2222A
2001 - SO16 footprint

Abstract: MMPQ3906
Text: SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor , 156°C/W for the SO­16 package assumes the use of the recommended footprint on a glass epoxy printed , CASE 751B­05, STYLE 4 SO­16 Four Transistors Equal Power Power Dissipation @ TA = 25°C Derate , reflow process. 0.060 1.52 0.275 7.0 0.155 4.0 0.024 0.6 0.050 1.270 inches mm SO­16


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PDF MMPQ3906 r14525 MMPQ3906/D SO16 footprint MMPQ3906
2006 - MMPQ2369

Abstract: SO16 footprint
Text: MMPQ2369 INFORMATION FOR USING THE SO-16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint , °C/W = 1.0 watt The 125°C/W for the SO-16 package assumes the use of the recommended footprint , , STYLE 4 SO-16 Four Transistors Equal Power 0.4 3.2 Total Power Dissipation @ TA = 25 , inches mm 0.050 1.270 SO-16 SO-16 POWER DISSIPATION SOLDERING PRECAUTIONS The power


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PDF MMPQ2369 751B-05, SO-16 MMPQ2369/D MMPQ2369 SO16 footprint
1996 - MMPQ3467

Abstract: No abstract text available
Text: °C/W = 1.2 watts The 104°C/W for the SO­16 package assumes the use of the recommended footprint , 11 7 10 8 Motorola Preferred Device 9 16 1 CASE 751B­05, STYLE 4 SO­16 , Small­Signal Transistors, FETs and Diodes Device Data MMPQ3467 INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be


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PDF MMPQ3467/D MMPQ3467 MMPQ3467/D* MMPQ3467
1996 - Not Available

Abstract: No abstract text available
Text: MMPQ2222A INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR , 1.0 watts The 125°C/W for the SO­16 package assumes the use of the recommended footprint on a glass , Unit Vdc Vdc Vdc mAdc CASE 751B­05, STYLE 4 SO­16 ELECTRICAL CHARACTERISTICS (TA = 25°C unless , footprint for the semiconductor packages must be the correct size to insure proper solder connection , 1.270 inches mm SO­16 SO­16 POWER DISSIPATION The power dissipation of the SO­16 is a function of


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PDF MMPQ2222/D MMPQ2222 MMPQ2222A MMPQ2222 MMPQ2222A MMPQ2222/D*
2001 - MMPQ3906

Abstract: No abstract text available
Text: SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor , CASE 751B­05, STYLE 4 SO­16 Four Transistors Equal Power Power Dissipation @ TA = 25°C Derate , SO­16 SO­16 POWER DISSIPATION SOLDERING PRECAUTIONS The power dissipation of the SO­16 is a , ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SO­16


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PDF MMPQ3906 r14525 MMPQ3906/D MMPQ3906
2001 - MMPQ6700

Abstract: No abstract text available
Text: 125°C/W for the SO­16 package assumes the use of the recommended footprint on a glass epoxy printed , Each Transistor CASE 751B­05, STYLE 4 SO­16 Four Transistors Equal Power Total Power , Rev. 1 1 Publication Order Number: MMPQ6700/D MMPQ6700 INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be


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PDF MMPQ6700 r14525 MMPQ6700/D MMPQ6700
1996 - MMPQ3467

Abstract: SO16 footprint
Text: Data MMPQ3467 INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT , °C/W for the SO­16 package assumes the use of the recommended footprint on a glass epoxy printed , Collector Current - Continuous Each Transistor CASE 751B­05, STYLE 4 SO­16 Four Transistors , design. The footprint for the semiconductor packages must be the correct size to insure proper solder , 0.024 0.6 0.050 1.270 inches mm SO­16 SO­16 POWER DISSIPATION The power dissipation of the


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PDF MMPQ3467/D MMPQ3467 MMPQ3467/D* MMPQ3467 SO16 footprint
1996 - MMPQ3725

Abstract: No abstract text available
Text: 1.4 watts The 89.3°C/W for the SO­16 package assumes the use of the recommended footprint on a , 10 8 Motorola Preferred Device 9 16 1 CASE 751B­05, STYLE 4 SO­16 MAXIMUM RATINGS , and Diodes Device Data MMPQ3725 INFORMATION FOR USING THE SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure


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PDF MMPQ3725/D MMPQ3725 MMPQ3725/D* MMPQ3725
2001 - MMPQ2369

Abstract: No abstract text available
Text: SO­16 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor , 156°C/W for the SO­16 package assumes the use of the recommended footprint on a glass epoxy printed , and Storage Junction Temperature Range CASE 751B­05, STYLE 4 SO­16 Four Transistors Equal , reflow process. 0.060 1.52 0.275 7.0 0.155 4.0 0.024 0.6 0.050 1.270 inches mm SO­16


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PDF MMPQ2369 r14525 MMPQ2369/D MMPQ2369
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