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LM3478MMX/NOPB Texas Instruments 2.97~40V Wide Input Range Boost/SEPIC/Flyback DC-DC Controller 8-VSSOP -40 to 125
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LM3478MM Texas Instruments 2.97~40V Wide Input Range Boost/SEPIC/Flyback DC-DC Controller 8-VSSOP -40 to 125
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SN96,5/AG3/CU0,5WS/0,78MM Amtech TME Electronic Components 21 $80.33 $72.45

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2013 - pan overseas AC CAPACITOR

Abstract: Pan Overseas cx 20015 a ceramic disc capacitor YP0AC151K060 YU0AC222M
Text: Ceramic Tin-silver Ag Tinned copper clad steel wire CH/SL/Y5P/Y5U/Y5V Sn96. 5-Ag3-Cu0.5 1.SP-160PL 2 , (Blue / UL 94 V-0 /) The minimum thickness of coating (reinforced insulation) is 0.4mm BaTiO3 Sn96. 5-Ag3-Cu0.5 , 2009.9.14 5 2009.12.24 6 2011/1/13 7 2011/ 5 /13 8 2012/2/7 9 1 Change PSA & POE , +125°C" to "-40 to +125°C" 9 11 6 8 6 9 10 14 6 4, 5 ,8 15 20 4 9 6~8 10 9 10 14 8 3. 2012/4/6 , :10 Page:3 / 19 Table of Contents No. 1 2 3 4 5 6 7 8 9 10 Part number for SAP system


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PDF POE-D12-00-E-10 POE-D12-00-E-10 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL pan overseas AC CAPACITOR Pan Overseas cx 20015 a ceramic disc capacitor YP0AC151K060 YU0AC222M
2012 - AH102K

Abstract: walsin ah AH332M ah101k AH681K CQC11001055510 AH472M110 ah472m ah471k ah102m
Text: /Y5P/Y5U/Y5V Sn96. 5-Ag3-Cu0.5 1.SP-160PL 2.SP-260PL 0.6+0.1/-0.05mm Component Epoxy resinPigment (Blue / UL 94 V-0 /) The minimum thickness of coating (reinforced insulation) is 0.4mm BaTiO3 Sn96. 5-Ag3-Cu0.5 , trace back to production "Lot No." 21 3 4-5 page 2008.12.12 3 2009.7.8 4 10 12 2009.9.14 5 9 9 10 10 11 14 4 6 4, 5 ,8,9 14 19 10 5 ~6 9 8~9 8 2009.12.24 6 2011.1.11 7 2011.5.12 8 , SERIES Ver: 10 Page: 3 / 18 Table of Contents No. 1 2 3 4 5 6 7 8 9 10 Part number for SAP


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PDF POE-D10-00-E-10 POE-D10-00-E-10 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL AH102K walsin ah AH332M ah101k AH681K CQC11001055510 AH472M110 ah472m ah471k ah102m
2011 - ac103m

Abstract: ac222m iec60384-14 250V ac472m AC102M060 E1465 WALSIN CERAMIC CAP Pan Overseas yv walsin y2 ceramic capacitor AC102K
Text: /Y5U/Y5V Sn96. 5-Ag3-Cu0.5 1.SP-160PL 2.SP-260PL 0.6+0.1/-0.05mm Substrate metal: Fe & Cu Surface , (reinforced insulation) is 0.4mm BaTiO3 Sn96. 5-Ag3-Cu0.5 SilverGlass frit Walsin Technology , * YV0AC152M060* 20 3 4 9 11 6 2009.9.14 2009.12.24 5 6 1. "Protrusion length": "+0.5 to , 11 14 6 2011/1/13 7 2011/4/27 8 4, 5 ,8,9 15 20 4 6 8 9 POE-D11-00-E-08 CERAMIC , 4 5 6 7 8 9 10 Part number for SAP system Mechanical Part numbering/T.C/Capacitance/ Tolerance


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PDF POE-D11-00-E-08 POE-D11-00-E-08 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL ac103m ac222m iec60384-14 250V ac472m AC102M060 E1465 WALSIN CERAMIC CAP Pan Overseas yv walsin y2 ceramic capacitor AC102K
2011 - ah102m

Abstract: AH332M ah101k ah472m AH681K AH152M ah331k AH471K SU03017-4003 AH222M
Text: Material Model/Type 1.EF-150C 2.EF-150(HF) 3.PCE-210 2.PCE-300(HF) CH/SL/Y5P/Y5U/Y5V Sn96. 5-Ag3-Cu0.5 1 , of coating (reinforced insulation) is 0.4mm BaTiO3 Sn96. 5-Ag3-Cu0.5 SilverGlass frit Substrate metal , material list" 21 3 4-5 page 2008.12.12 3 2009.7.8 4 10 12 2009.9.14 5 9 9 10 10 11 14 4 6 4, 5 ,8,9 14 19 2009.12.24 6 2011.1.11 7 POE-D10-00-E-07 SAFETY STANDARDS REGULATED, REINFORCED INSULATION TYPE, AH SERIES Ver: 7 Page: 3 / 19 Table of Contents No. 1 2 3 4 5 6 7 8 9


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PDF POE-D10-00-E-07 POE-D10-00-E-07 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL ah102m AH332M ah101k ah472m AH681K AH152M ah331k AH471K SU03017-4003 AH222M
2012 - ef 933

Abstract: ceramic disc capacitor
Text: Ceramic Tin-silver Ag Tinned copper clad steel wire CH/SL/Y5P/Y5U/Y5V Sn96. 5-Ag3-Cu0.5 1.SP-160PL 2 , (Blue / UL 94 V-0 /) The minimum thickness of coating (reinforced insulation) is 0.4mm BaTiO3 Sn96. 5-Ag3-Cu0.5 , codes of SAP P/N. 2. Page layout adjustment. page 19 3 4 2009.9.14 5 2009.12.24 6 2011/1/13 7 2011/ 5 /13 8 2012/2/7 9 1 Change PSA & POE logo to Walsin & POE logo. 2 , 6 8 6 9 10 14 6 4, 5 ,8 15 20 4 9 6~8 10 9 10 14 8 3. 2012/4/6 10 Review the temperature of


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PDF POE-D12-00-E-10 POE-D12-00-E-10 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL ef 933 ceramic disc capacitor
2013 - ac103m

Abstract: ac222m ac102m pan overseas AC CAPACITOR cx 20015 a YV MARKING CODE ceramic disc capacitor AC472M 101 Ceramic Disc Capacitors
Text: wire Ceramic Tin-silver Ag Tinned copper clad steel wire CH/SL/Y5P/Y5U/Y5V Sn96. 5-Ag3-Cu0.5 1 , resinPigment (Blue / UL 94 V-0 /) The minimum thickness of coating (reinforced insulation) is 0.4mm BaTiO3 Sn96. 5-Ag3-Cu0.5 , ) page 2009.9.14 2009.12.24 5 6 1 Complete lead code 2. Add last SAP code " H" for halogen and , 2012/4/6 10 4, 5 ,8,9 15 20 1. Add "1AC" type; 4 2. Delete "old P/N" 6 3. Define the marking of the , RECOGNIZED, AC SERIES Ver : 10 Page: 3 / 19 Table of Contents No. 1 2 3 4 5 6 7 8 9 10 Part number


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PDF POE-D11-00-E-10 POE-D11-00-E-10 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL ac103m ac222m ac102m pan overseas AC CAPACITOR cx 20015 a YV MARKING CODE ceramic disc capacitor AC472M 101 Ceramic Disc Capacitors
2013 - CQC11001055510

Abstract: No abstract text available
Text: Sn96. 5-Ag3-Cu0.5 Sn96. 5-Ag3-Cu0.5 4 Electrodes Ag 1.SP-160PL 2 , 1 2 2008.12.12 3 2009.7.8 4 2009.9.14 5 2009.12.24 6 2011.1.11 7 2011.5.12 8 2012.1.30 9 2012/4/6 10 2013/ 5 /13 11 2013/10/16 12 1 , 11 14 10 4 6 4, 5 ,8,9 14 19 10 5 ~6 9 8~9 In order to improve the traceability of the , € 1. Review the Lead diameter φ from 0.60 +0.1/-0.05mm to 0.55+/-0.05mm 5 ,6,7 2. Addâ


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PDF POE-D10-00-E-12 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL CQC11001055510
2011 - cx 20015 a

Abstract: cx 20015 P YP0AC331K060 YU0AC222M series cx 20015 YP0AC101K080 Pan Overseas yv*472M100 ceramic disc capacitor 104 Ceramic Disc Capacitors p0921
Text: wire Ceramic Tin-silver Ag Tinned copper clad steel wire CH/SL/Y5P/Y5U/Y5V Sn96. 5-Ag3-Cu0.5 1 , resinPigment (Blue / UL 94 V-0 /) The minimum thickness of coating (reinforced insulation) is 0.4mm BaTiO3 Sn96. 5-Ag3-Cu0.5 , * 20 3 4 9 11 6 2009.9.14 2009.12.24 5 6 1. "Protrusion length": "+0.5 to-1.0" revised , internal structure and material list" 9 10 11 14 6 2011/1/13 7 4, 5 ,8,9 15 20 POE-D11 , 2 3 4 5 6 7 8 9 10 Part number for SAP system Mechanical Part numbering/T.C/Capacitance/ Tolerance


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PDF POE-D11-00-E-07 POE-D11-00-E-07 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL cx 20015 a cx 20015 P YP0AC331K060 YU0AC222M series cx 20015 YP0AC101K080 Pan Overseas yv*472M100 ceramic disc capacitor 104 Ceramic Disc Capacitors p0921
2013 - ac103m

Abstract: ac222m ac472m ic cx 20015 A
Text: Dielectric Element Ceramic CH/SL/Y5P/Y5U/Y5V BaTiO3 3 Solder Tin-silver Sn96. 5-Ag3-Cu0.5 Sn96. 5-Ag3-Cu0.5 4 Electrodes Ag 5 Leads wire Tinned copper clad steel wire 1 , 2009.9.14 5 2009.12.24 6 2011/1/13 7 2011/4/27 8 2012/2/7 9 2012/4/6 10 , traceability of the product, change the date code on 9 11 6 9 6 4, 5 ,8,9 15 20 4 6 8 9 9 10 , manufacture, review the 2013/ 5 /6 11 date code on capacitor body, new date code can know the month of


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PDF POE-D11-00-E-11 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL ac103m ac222m ac472m ic cx 20015 A
2013 - ah681k

Abstract: AH102K AH152M ah101k AH222M ah102m WALSIN capacitor ac Pan Overseas walsin capacitor Walsin Safety capacitor
Text: /Y5P/Y5U/Y5V Sn96. 5-Ag3-Cu0.5 1.SP-160PL 2.SP-260PL 0.6+0.1/-0.05mm Component Epoxy resinPigment (Blue / UL 94 V-0 /) The minimum thickness of coating (reinforced insulation) is 0.4mm BaTiO3 Sn96. 5-Ag3-Cu0.5 , 2008.12.12 3 2009.7.8 4 10 12 2009.9.14 5 9 9 10 10 11 14 4 6 4, 5 ,8,9 14 19 10 5 ~6 9 8~9 8 , No. 1 2 3 4 5 6 7 8 9 10 Part number for SAP system Mechanical Part numbering/T.C/Capacitance , Drawing of Internal Structure and material list Item Page 4/18 5 /18 6/18 7/18 8/18 9/18 10/18~13/18 14/18


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PDF POE-D10-00-E-10 POE-D10-00-E-10 EF-150C EF-150 PCE-210 PCE-300 SP-160PL SP-260PL ah681k AH102K AH152M ah101k AH222M ah102m WALSIN capacitor ac Pan Overseas walsin capacitor Walsin Safety capacitor
sn63pb37 solder wire

Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: . Designed to be reflow88. 5 %, -400/+500 (Type 4) 88.5%, -400/+500 (Type 4) able in air as well as nitrogen , WWW.Kester.com | 800 253 7837 | 5 Solder Paste for Tin-lead No-Clean Water-Soluble Solder Paste for , 985M No-Clean 5 gallon 65-0004-0985 985M No-Clean 53 gallon drum 63-0020-0959 959T No-Clean 1 gallon 64-0020-0959 959T No-Clean 5 gallon 65-0020-0959 959T No-Clean 53 , -VF VOC-Free Water-Soluble 5 gallon 65-0056-2220 2220-VF VOC-Free Water-Soluble 53 gallon drum


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24-7068-1407

Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Text: bright as SnPb joints. Prints down to 01005 pad sites. Designed to be reflow88. 5 %, -400/+500 (Type 4 , Sn96.5Ag3.0Cu0.5 600g cartridge WWW.Kester.com | 800 253 7837 | 5 Solder Paste for Tin-lead , 985M No-Clean 5 gallon 65-0004-0985 985M No-Clean 53 gallon drum 63-0020-0959 959T No-Clean 1 gallon 64-0020-0959 959T No-Clean 5 gallon 65-0020-0959 959T No-Clean 53 , -VF VOC-Free Water-Soluble 5 gallon 65-0056-2220 2220-VF VOC-Free Water-Soluble 53 gallon drum


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2014 - Not Available

Abstract: No abstract text available
Text: * NPO J = ± 5 % ≥ 10pF ONLY K L M Z P = = = = = ± 10% -10% / +20% ± 20% +80% / -20% +100%/ -0% ALL J VOLTAGE CODE 1 2 3 4 5 6 7 8 9 = 25 = 50 = 100 = 200 =


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GR-78-CORE

Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A sn63pb37 solder wire bellcore GR-78 RF771 959T TC-527
Text: Water-Soluble Packaging 1 gallon 5 gallon 53 gallon drum 1 gallon 5 gallon 53 gallon drum 1 gallon 5 gallon 53 , lead-free applications. 1 gallon 5 gallon 53 gallon drum . Kester Part # 04-9574-0050 Alloy , Solder Saver 2 lb. 56-0005-5744 5744 Solder Saver 5 lb. 56-0025-5744 5744 Solder Saver 25 lb. Page 9 , B32. Solid Wire 5 lbs. Alloy Sn63Pb37 Sn63Pb37 Sn63Pb37 Sn63Pb37 Sn63Pb37 Diameter .062 .125 .031 , No-Clean 979T VOC-Free No-Clean 979T VOC-Free No-Clean Packaging 1 gallon 5 gallon 53 gallon drum 1


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PDF 65-0n-Tien GR-78-CORE ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A sn63pb37 solder wire bellcore GR-78 RF771 959T TC-527
SN63PB37

Abstract: No abstract text available
Text: 64-0004-0985 985M No-Clean 5 gallon 65-0004-0985 985M No-Clean 53 gallon drum 63-0020-0959 959T No-Clean 1 gallon 64-0020-0959 959T No-Clean 5 gallon 65-0020-0959 959T No-Clean , -VF VOC-Free Water-Soluble 5 gallon 65-0056-2220 2220-VF VOC-Free Water-Soluble 53 gallon drum 63-0000-2235 2235 Water-Soluble 1 gallon 64-0000-2235 2235 Water-Soluble 5 gallon , Description 56-0002-5744 5744 Solder Saver 2 lb. 56-0005-5744 5744 Solder Saver 5 lb. 56-0025-5744 5744


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PDF EM907 EM828 SN63PB37
2012 - Not Available

Abstract: No abstract text available
Text: : 100 = 10 pF 101 = 100 pF 102 = 1000 pF 103 = .01 µF K TOLERANCE CODE* F = ± 1% G = ± 2% J = ± 5 % K = ± 10% M = ± 20% 2 VOLTAGE CODE 1 2 3 4 5 6 = = = = = = 25 50 100 200 300 500 VDC VDC VDC VDC , 1 2 3 4 5 6 1 2 3 4 5 6 1 2 3 4 5 6 1 2 3 4 5 6 1 2 3 4 5 6 C ± (.025) D (Max) Width E (Max


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PDF MIL-PRF-49470
2010 - Not Available

Abstract: No abstract text available
Text: 100 pF 102 = 1000 pF 103 = .01 µF TOLERANCE CODE F = ± 1% G = ± 2% J = ± 5 % K = ± 10 , * F, G, and J tolerances are available for NPO parts only. 8 NPO X7R XHT 1 2 3 4 5 6 , 20 .80 100 70 2.5 .425 5 15 9.0 .39 42 24 .96 120 84 3.0 , 28 15 .70 90 50 2.0 .490 5 – – – 12 6.0 .33 33 18 , .520 4 – – – 7.0 3.5 .20 20 9.0 .50 60 30 1.5 .640 5


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PDF 225re-tinning, MIL-PRF-49470
2012 - hmp solder

Abstract: No abstract text available
Text: TOLERANCE CODE F = ± 1% 10pF NPQ* G = ± 2% 10pF NPO J = ± 5 % 10pF ONLY K= M= Z = P= ± 10% ± 20% +80% / -20% +100%/ -0% 2 VOLTAGE CODE 1 2 3 4 5 6 = = = = = = 25 50 100 200 300 500 VDC VDC VDC VDC VDC , . Caps per Stack 1 2 3 4 5 6 1 2 3 4 5 6 1 2 3 4 5 6 1 2 3 4 5 6 1 2 3 4 5 6 C ± (.025) D (Max) Width


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PDF MIL-PRF-49470 hmp solder
Not Available

Abstract: No abstract text available
Text: available in the following alloys: Sn96. 5 /Ag3.0/Cu. 5 , Sn96. 5 /Ag3. 5 , Sn99.3/Cu.7, Sn95/Sb5 and Sn95/Ag5 , to 24 mil 38 - 20 Type-4 12mil to 16mil 25 - 15 Type- 5 <12mil 15 - 5 Type , . Profile for Sn96. 5 /Ag3.0/Cu. 5 and Sn96. 5 /Ag3. 5 alloys 300 Peak Temperature (Min 230°C–Max 249Â


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PDF SMD4300SNL10 LF-4300 2002/95/EC 900Kcps 400Kcps
U8439-1

Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 X23-7772 DCL4
Text: Assembly Materials Underfill: Namics U8439-1 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96. 5 /Ag3.0/Cu0. 5 , -8 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96. 5 /Ag3.0/Cu0. 5 (RoHS), Sn63/Pb37 (Standard) Substrate , -7772-4_2 DCL- 5 Heat Spreader Adhesive: Heat Spreader Adhesive: Ablestik I/AMC723_1.5 DCL- 5 Die , Substrate: Solder Balls: Sn96. 5 /Ag3.0/Cu0. 5 Die Bump: 95Pb5Sn Underfill: NAU-8 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96. 5 /Ag3.0/Cu0. 5 (RoHS), Sn63/Pb37 (Standard) Substrate


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PDF A1006-03 23-Jul-2010 FCBGA-1156 FCBGA-900 23-Oct-2010 89HPES16T16ZABL 89HPES16T16ZABR 89HPES22T16ZABL 89HPES22T16ZABLI U8439-1 AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 X23-7772 DCL4
2013 - Not Available

Abstract: No abstract text available
Text: 103 = .01 µF K 2 TOLERANCE CODE F = ± 1% ≥ 10pF G = ± 2% ≥ 10pF NPQ* NPO J = ± 5 , / -0% ALL J VOLTAGE CODE 1 2 3 4 5 6 7 8 9 = 25 = 50 = 100 = 200 = 300 = 500 , 100 70 2.5 .425 5 – – 15 9.0 .39 42 24 .96 120 84 3.0 , 28 15 .70 90 50 2.0 .490 5 – – 12 6.0 .33 33 18 .84 , €“ – 7.0 3.5 .20 20 9.0 .50 60 30 1.5 .640 5 – – â


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2014 - Not Available

Abstract: No abstract text available
Text: , hard residues can be left on the board Flux Type: F-SW26 Alloy: Sn96,5Ag3Cu0, 5 Flux Content: 3,3 , €¢ high reliability Flux Type: TYP 1.1.2 Alloy: Sn95,5Ag3,8Cu0,7/ Sn99Cu1 Flux Content: 2, 5 , . Description S 1532 Sn96,5Ag3Cu0, 5 Ord.No. Desktop stand for fume extractor LDA1, Round. LDS 6 , S-Sn95,5Ag3Cu0, 5 solder manufactured in the first melt of tin and silver according to PN EN 29453:2000 , eliminate oxide occurrence Flux Type: TYP 1.1.3 Alloy: Sn96,5Ag3Cu0, 5 Flux Content: 2% Melting


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PDF F-SW26 220/240V/18W, 40dBA, 130x130x10mm, 220x270x168mm S-Sn95 ZD-153 SAC305
Not Available

Abstract: No abstract text available
Text: Figure 5 : PC Board Mounted Chip Resistor Filled via holes 0.25 (0.010) min. dia. Conductor pad , lengths of solid Sn96 (Sn96. 5 /Ag3. 5 ) wire, about 0.030" in diameter, placed in the center of the chip


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2014 - Not Available

Abstract: No abstract text available
Text: % ≥ 10pF G = ± 2% ≥ 10pF NPQ* NPO J = ± 5 % ≥ 10pF ONLY K L M Z P = = = = = ± 10% -10% / +20% ± 20% +80% / -20% +100%/ -0% ALL J VOLTAGE CODE 1 2 3 4 5 6 , 100 70 2.5 .425 (10.80) 5 – – – 15 9.0 .39 42 24 .96 , 90 50 2.0 .490 (12.45) 5 – – – 12 6.0 .33 33 18 .84 , 60 30 1.5 .640 (16.26) 5 – – – – – – – – â


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PDF HT0805XHT473K1Q5R
Not Available

Abstract: No abstract text available
Text: alloys: Sn96. 5 /Ag3.0/Cu. 5 , Sn96. 5 /Ag3. 5 , Sn99.3/Cu.7, Sn95/Sb5 and Sn95/Ag5 alloys. Powder Distribution , -3 16mil to 24 mil 38 - 20 Type-4 12mil to 16mil 25 - 15 Type- 5 <12mil 15 - 5 Type , without risking damage to thermally sensitive components. Profile for Sn96. 5 /Ag3.0/Cu. 5 and Sn96. 5 /Ag3. 5


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PDF SMD291SNL, SMD291SNL10 700to1 000Kcps 450Kcps IPC-TM-650 SoakTemp140-200Â SoakTime60-90Sec
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