The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
SMD291AX500T3 Chip Quik Inc SOLDER PASTE SN63/PB37 500G
70-1002-0510 Kester SOLDER 500G JAR, SN63/PB37
SMD4300AX250T3 Chip Quik Inc SOLDER PASTE SN63/PB37 250G
SMD291AX250T3 Chip Quik Inc SOLDER PASTE SN63/PB37 250G
SMD2215-25000 Chip Quik Inc SOLDER SPHERES SN63/PB37 .030 D
SMD291AX50T3 Chip Quik Inc SLDR PASTE NO-CLN SN63/PB37 50G
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Search Stock (26)

  You can filter table by choosing multiple options from dropdownShowing 26 results of 26
Part Manufacturer Supplier Stock Best Price Price Each Buy Part
62GB-16J10-06SN-63 Amphenol Corporation Avnet - - -
ASN-6350-SR03-GLB Digi International Inc Chip1Stop 1 $665.38 $665.38
ASN-6350-SR04-GLB Digi International Inc Chip1Stop 1 $614.10 $614.10
ASN-6350-SR06-GLB Digi International Inc Chip1Stop 1 $716.67 $716.67
CG5SN63TNSR-150-X6011 SMC Corporation of America Allied Electronics & Automation - $424.79 $424.79
CTSN631/12W CamdenBoss Ltd element14 Asia-Pacific 483 $2.37 $1.49
CTSN631/12W CamdenBoss Ltd Farnell element14 494 £2.53 £1.12
CTSN631/12W CamdenBoss Ltd Newark element14 472 $2.30 $1.83
CTSN631/12W CamdenBoss Ltd Chip1Stop 196 $2.29 $2.12
CTSN633/12W CamdenBoss Ltd Farnell element14 203 £3.59 £1.05
CTSN633/12W CamdenBoss Ltd element14 Asia-Pacific 170 $2.56 $1.61
CTSN633/12W CamdenBoss Ltd Chip1Stop 200 $2.75 $2.55
CTSN634/12W CamdenBoss Ltd Farnell element14 117 £4.45 £1.44
CTSN634/12W CamdenBoss Ltd Newark element14 111 $3.79 $2.90
CTSN634/12W CamdenBoss Ltd element14 Asia-Pacific 111 $2.99 $2.20
CTSN635/12W CamdenBoss Ltd Newark element14 93 $6.25 $4.79
CTSN635/12W CamdenBoss Ltd element14 Asia-Pacific 93 $4.94 $3.64
CTSN635/12W CamdenBoss Ltd Farnell element14 95 £6.81 £3.02
FLSTEHUE-(SN)-6,3X0,8(0,5-1,5) MISC HE-G Heilind Electronics - Europe 51 €0.13 €0.13
FLSTEHUE-(SN)-6,3X0,8(4,0-6,0) MISC HE-G Heilind Electronics - Europe 90 €0.23 €0.23
FLSTEHUE-(SN)6,3X0,8-(2,5-4,0) MISC HE-G Heilind Electronics - Europe 88 €0.15 €0.15
LSN-63 Festo Allied Electronics & Automation 5 $82.95 $78.80
SN63-PB37 WASHERS Bisco Industries 48 - -
SN63209AXT2%-.062-1 AIM Inc Master Electronics 21 $19.46 $15.82
SN6337NC210AX-.025 AIM Inc Master Electronics 22 - -
SN63PB37ROL0-.032 MISCELLANEOUS Bisco Industries 75 - -

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SN63 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2007 - SN95PB5

Abstract: PB10
Text: Gold Gold Gold Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 100%Tin Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 Gold Sn63 /Pb37 Sn63 /Pb37 Sn63 /Pb37 4211 4212 4214 4221 4222 4232 4302 4307 4379 4426 4445 4448 4470 4494 4501 Sn90/Pb10 Sn90/Pb10 Sn90/Pb10 Sn90/Pb10 Sn90/Pb10 Sn63 /Pb37 Sn63 /Pb37


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PDF Sn96/Cu4 MIL1330 MIL1331 P1330 P1812 PD104 PD105 S1008 S1210 S1812 SN95PB5 PB10
2013 - HST X-Ref

Abstract: M83519 S01-02-R M83519/2-8 M83519/1-2
Text: Sn63 Solder with ROL1 Flux NO Thermal Indicator SEIP GLENAIR Braid Description Solder , 640 CMA - 6" long 640 CMA - 6" long 640 CMA - 6" long 640 CMA - 6" long 640 CMA - 6" long Sn63 Solder with ROL1 Flux NO Thermal Indicator Sn63 Solder with ROL1 Flux NO Thermal Indicator Sn63 Solder with ROL1 Flux NO Thermal Indicator Sn63 Solder with ROL1 Flux NO Thermal Indicator Sn63


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PDF M83519/1-1 M83519/1-2 M83519/1-3 M83519/1-4 M83519/1-5 M83519/2-1 M83519/2-2 M83519/2-3 M83519/2-4 M83519/2-5 HST X-Ref M83519 S01-02-R M83519/2-8 M83519/1-2
SN63

Abstract: SN63 PB37 IPC-J-STD-006 sn63pb37 361F ingot
Text: Sn63 /Pb37 ElectropureTM Solder Alloy Features: - High Purity - Reduces Drossing - Melting Temperature 183° C (361°F) - Exceeds IPC-J-STD-006 Specifications Description: Sn63 /Pb37 ElectropureTM is , soldering. Sn63 /Pb37 is a eutectic alloy with a melting point of 183°C (361°F). Typical applications are wave soldering and plating where Sn63 /Pb37 is primarily used as a coating for corrosion protection , , preforms, powder, solder paste, ingot, and anode form. Flux Compatibility: Sn63 /Pb37 ElectropureTM is


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PDF Sn63/Pb37 IPC-J-STD-006 Sn63/Pb37 ISO9001 45-micron SN63 SN63 PB37 sn63pb37 361F ingot
MIL-F-14256

Abstract: SN63 "ultrasonic cleaner" mil-f-14256* rma SN96 80Au
Text: Liquidous Temp. (degrees C.) Recommended Platings for Heatsink/Baseplates SN63 SN96 80Au/20Sn , amount of RMA flux (MIL-F-14256) to the areas to be soldered. 3. SN63 solder is generally recommended , device. (Aeroflex-KDI can supply pretinned devices, SN63 or SN96) Tabs: When attaching tabs to a , circuit board using SN63 (183 °C) Wire Bonding: Attach the device to the circuit board using solder as


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2003 - LFCSP

Abstract: TM0011 21502 5mm Ansys AN-772 IPC-SM-782 ipc-SM-782* LFCSP SN63 PB37 MO-220 MO220
Text: 26. XI. 10k 51 9.6031 0.9828 Sn63 /Pb37 10 1 7mm×7mm LFCSP = 9.6031 = 169739373 = 0.9828 18756 Sn63 /Pb37 SnPb , 827 T50.0% 50 1634 Sn95.5/Ag4.0/Cu0.5 SnPb 27919 Sn63 /Pb37 Sn 98384 67 Sn63 /Pb37 SnPb 149652 103 Sn95.5/Ag4.0/Cu0.5 Sn 87494 60 Sn95.5/Ag4.0/Cu0.5 SnPb 146450 100 Sn63 /Pb37 Sn 21502 59 Sn63 /Pb37 SnPb 32706


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PDF AN-772 MO220MO229 AN-617 EM-99-19 EM-99-03 EM-98-57 85mm8MLF3D EM-2000-011 7mm244 LFCSP TM0011 21502 5mm Ansys AN-772 IPC-SM-782 ipc-SM-782* LFCSP SN63 PB37 MO-220 MO220
SMD-291AX

Abstract: No abstract text available
Text: 2.66E+10 PASS Recommended Profiles: Profile-A for Sn62 & Sn63 alloy Ramp Profile Profile-A , øó÷î ìpÝñ-»1/2±21/4·-·1/4»¿´º±®¬¸» Liquidus Temperature for Sn62 & Sn63 alloys , allow more time for solvent components of the Profile-B for Sn62 & Sn63 alloy Soak Profile , Sn63 alloys solder paste to outgas prior to reflow. Reflow Time: 30-60 S ec. Flux Activation


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PDF SMD291AX SMD291AX10 900Kcps IPC-TM-650 SMD-291AX
Not Available

Abstract: No abstract text available
Text: . Ramp Profile Profile-A for Sn62 & Sn63 alloy 250 Temp.(°C) 220 200 183 Topside temperature of board to be @ 220-230°C Liquidus Temperature for Sn62 & Sn63 alloys Reflow Time: 30-60 , Profile-B for Sn62 & Sn63 alloy 250 Temp.(°C) 220 200 183 Topside temperature of board to be @ 220-230°C Liquidus Temperature for Sn62 & Sn63 alloys Reflow Time: 30-60 Sec. Flux


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PDF SMD4300AX10 900Kcps 450Kcps IPC-TM-650
Sn63

Abstract: RM05-8A SN63 PB37 bga1014 MEDER rm05 meder -b
Text: 190 220 o C FR4, Sn63 /Pb37, 0.65mm www.meder.com 186 RM , o C FR4, Sn63 /Pb37, 0.65mm www.meder.com g o 190 g RM , o C JEDECJESD22-A113A 190 220 o C FR4, Sn63 /Pb37 , 1.5 190 FR4, Sn63 /Pb37, 0.65mm www.meder.com 197 Meder Electronic


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PDF RM05-4A-S-4/2RM05-2A2B-S-4/2 40psBGA RM05-4A-S-4/2 RM05-8A 1/211ms JEDECJESD22-A113A Sn63/Pb37, Sn63 RM05-8A SN63 PB37 bga1014 MEDER rm05 meder -b
SN62 PB36 ag2

Abstract: SN62 PB36 ag2 kester SN63 PB36 SN63 PB37 PB36 gefstoffv SN62 MP kester 256 omar Sn62Pb36Ag2
Text: Sn62/Pb36/Ag2, Sn63 /Pb37 · Artikelnummer: 7087 · Ämnets användning / tillredningen Lödlegering · , : 07.11.2002 Handelsnamn: 256-; 276 Sn62/Pb36/Ag2, Sn63 /Pb37 (Fortsättning från sida 1) · Efter förtäring , -; 276 Sn62/Pb36/Ag2, Sn63 /Pb37 (Fortsättning från sida 2) · Personlig skyddsutrustning: · Allmänna , -; 276 Sn62/Pb36/Ag2, Sn63 /Pb37 (Fortsättning från sida 3) · Farliga upplösningsprodukter: Inga , /Pb36/Ag2, Sn63 /Pb37 (Fortsättning från sida 4) · Farosymbol och farobeteckning: Xn Hälsoskadlig


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PDF 91/155/EEG Sn62/Pb36/Ag2 Sn63/Pb37 D-82216 SN62 PB36 ag2 SN62 PB36 ag2 kester SN63 PB36 SN63 PB37 PB36 gefstoffv SN62 MP kester 256 omar Sn62Pb36Ag2
Not Available

Abstract: No abstract text available
Text: Solder Paste Water Washable with Lead and No_lead in Jars - 250g & 500g  Sn63 /Pb37 250g jar, 25-45 microns  (T3), water washable 90% Sn63 /Pb37 250g jar, 15-25 microns  SMD4300AX250T5   (T5


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PDF ANSI/J-STD-006 Sn63/Pb37 SMD4300AX250T5 SMD4300AX250T3 SAC305 SMD4300SNL250T5 SMD4300SNL250T3
Not Available

Abstract: No abstract text available
Text: Jars - 250g & 500g  Sn63 /Pb37 250g jar, 25-45 microns (T3), No-Clean 90.25% Sn63 /Pb37 500g jar


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PDF ANSI/J-STD-006 Sn63/Pb37 SMD291AX500Tolder SMD291AX500T3 SMD291AX250T3
Not Available

Abstract: No abstract text available
Text: for a tin-lead soldering process is Sn63 (63%Sn, 37%Pb), which clearly is the industry standard for a number of reasons. Sn63 is a eutectic compound with a melting point (+183°C) high enough to , internal component materials are not damaged during proper solder refold. The one draw back of Sn63 , the solder joint. Pretinning the package leads with Sn63 solder paste with RMA flux reduces the gold


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PDF J-STD-020
2002 - RFP-125-100RF

Abstract: Sn63
Text: using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with


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PDF RFP-125-100RF MIL-E-5400. RFP-125-100RF Sn63
2002 - RFP-200-50TB

Abstract: SN63 210c
Text: mounting surface and solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron (210°C). Sales Desk USA: Voice


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PDF RFP-200-50TB MIL-E-5400. RFP-200-50TB SN63 210c
Not Available

Abstract: No abstract text available
Text: a thermal design. Solder Selection A typical solder for a tin-lead soldering process is Sn63 (63%Sn, 37%Pb), which clearly is the industry standard for a number of reasons. Sn63 is a eutectic , proper solder refold. The one draw back of Sn63 solder when used in combination with gold plated , with Sn63 solder paste with RMA flux reduces the gold concentration and produces a stronger joint. A


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PDF J-STD-020
2002 - RFP-40-50TPP

Abstract: SN63
Text: mounting surface and solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron (210°C). Sales Desk USA: Voice


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PDF RFP-40-50TPP MIL-E-5400. RFP-40-50TPP SN63
2002 - Sn63

Abstract: RFP-300-100RN 300100r
Text: using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with


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PDF RFP-300-100RN MIL-E-5400. Sn63 RFP-300-100RN 300100r
2013 - 81A3001B

Abstract: 81A3001BXXXF
Text: finishes include: Lead-free, RoHS compliant plating (silver or gold), solder finish with SN63 or solder fused finish with SN63 depending upon package type. Select from bulk, tape & reel, or waffle packaging


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PDF 81A3001BXXXF 81A3001B
ansi-j-std-006

Abstract: ANSI-J-STD-004 ANSI-J-STD 004 raychem heat shrinkable sleeve Raychem splice ANSI-J-STD-006 a Sn63 RPIP-699-00 raychem splice kit rpip699-00
Text: SPECIFICATION CONTROL DRAWING SOLDERSHIELD* Device SOLDERSLEEVE* Device Insulation Tubing MATERIALS 1. INSULATION SLEEVE: Heat -shrinkable, transparent clear, radiation cross-linked modified polyolefin. 2. SHIELD: Solder impregnated, flux coated, tin plated copper braid. SOLDER: TYPE Sn63 per ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. 3. INSULATION SLEEVE: Heat -shrinkable, transparent , : TYPE Sn63 per ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. 5. DIELECTRIC BARRIER


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PDF ANSI-J-STD-006. ANSI-J-STD-004. B20282 D980565 B-202-82 ansi-j-std-006 ANSI-J-STD-004 ANSI-J-STD 004 raychem heat shrinkable sleeve Raychem splice ANSI-J-STD-006 a Sn63 RPIP-699-00 raychem splice kit rpip699-00
2005 - bc 103

Abstract: ET-7403 pth posistor JIS 5102 ptf04bd SN63 PB37 pTH murata pdf/bd138 smd
Text: 10-55-10Hz (1) 1.5mm 326 JIS C 5102 8.4 Sn63 /Pb37 (60/40) 230±5 3±0.5 Sn63 /Pb37 (60/40) 0.2wt 150±5 3 260±5 , 51028.2 PTCPCB 10-55-10Hz (1) 1.5mm 326 JIS C 5102 8.4 Sn63 /Pb37 (60/40) 230±5 3±0.5 Sn63 /Pb37 (60/40


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PDF PRF18BG471QB1RB PRF18BF471QB1RB PRF18BE471QB1RB PRF18BD471QB1RB PRF18BC471QB1RB PRF18BB471QB1RB PRF18BA471QB1RB PRF18AR471QB1RB PRF18AS471QB1RB 5mm350 bc 103 ET-7403 pth posistor JIS 5102 ptf04bd SN63 PB37 pTH murata pdf/bd138 smd
2002 - RFP-30-50T

Abstract: SN63
Text: 150 2. Position device on mounting surface and solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron


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PDF RFP-30-50T MIL-E-5400. RFP-30-50T SN63
HMC408

Abstract: QFN PACKAGE Junction to PCB thermal resistance HMC408LP3 RO4350 SN63
Text: resistance from junction to case (bottom metal paddle of the package) sn63 = Thermal resistance of the , or G-10 Laminate 0.008 Alumina (Al2O3) 0.701 SN63 Solder 1.270 Thermally Conductive , www.hittite.com v00.0703 (0.0007" thick). During assembly, the via holes are filled with SN63 solder , calculate sn63 , we use a thermal conductivity for SN63 solder of 1.27 W/in-ºK, an area of 0.004225 in2


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2002 - SN63

Abstract: RFP-300-50TD
Text: mounting surface and solder in place using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with a controlled temperature iron (210°C). Sales Desk USA: Voice


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PDF RFP-300-50TD MIL-E-5400. SN63 RFP-300-50TD
2002 - Sn63

Abstract: RFP-30-100R
Text: using an indalloy type or an SN63 type solder. 3. Solder leads in place using an SN63 type solder with


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PDF RFP-30-100R MIL-E-5400. Sn63 RFP-30-100R
U8439-1

Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 X23-7772 DCL4
Text: .5 (RoHS), Sn63 /Pb37 (Standard) Substrate: Page 2 of 4 Die Bump: 95Pb5Sn Underfill: NAU-8 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0/Cu0.5 (RoHS), Sn63 /Pb37 (Standard) Substrate , /ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0/Cu0.5 (RoHS), Sn63 /Pb37 (Standard) Substrate


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PDF A1006-03 23-Jul-2010 FCBGA-1156 FCBGA-900 23-Oct-2010 89HPES16T16ZABL 89HPES16T16ZABR 89HPES22T16ZABL 89HPES22T16ZABLI U8439-1 AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 X23-7772 DCL4
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