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LT1030CS#TR Linear Technology IC LINE DRIVER QUAD LP 14SOIC
LT1236AILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C
LT1236BILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C
LTC2226HLX#PBF Linear Technology LTC2226H - 12-Bit, 25Msps 125°C ADC in LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C
LTC2246HLX#PBF Linear Technology LTC2246H - 14-Bit, 25Msps 125°C ADC In LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C
LTC2758BCLX#PBF Linear Technology LTC2758 - Dual Serial 18-Bit SoftSpan IOUT DACs; Package: LQFP; Pins: 48; Temperature Range: 0°C to 70°C

SN63 PB37 PROFILES Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2007 - SN95PB5

Abstract: PB10
Text: Gold Gold Gold Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 100%Tin Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 Gold Sn63 / Pb37 Sn63 / Pb37 Sn63 / Pb37 4211 4212 4214 4221 4222 4232 4302 4307 4379 4426 4445 4448 4470 4494 4501 Sn90/Pb10 Sn90/Pb10 Sn90/Pb10 Sn90/Pb10 Sn90/Pb10 Sn63 / Pb37 Sn63 / Pb37


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PDF Sn96/Cu4 MIL1330 MIL1331 P1330 P1812 PD104 PD105 S1008 S1210 S1812 SN95PB5 PB10
2012 - Recommended Solder Reflow Profile for Caddock Surface Mount Resistors

Abstract: SN62 PB36 ag2
Text: seconds, depending on the mass of assembly. 100°C Recommended Solders: Sn62/Pb36/Ag2 or Sn63 / Pb37 , products are NOT recommended for common “Lead-Free” SMT reflow soldering profiles that have peak


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PDF AEN-0108 MP725, MP725 Sn62/Pb36/Ag2 Sn63/Pb37 Recommended Solder Reflow Profile for Caddock Surface Mount Resistors SN62 PB36 ag2
SN63

Abstract: SN63 PB37 IPC-J-STD-006 sn63pb37 361F ingot
Text: Sn63 / Pb37 ElectropureTM Solder Alloy Features: - High Purity - Reduces Drossing - Melting Temperature 183° C (361°F) - Exceeds IPC-J-STD-006 Specifications Description: Sn63 / Pb37 ElectropureTM is , soldering. Sn63 / Pb37 is a eutectic alloy with a melting point of 183°C (361°F). Typical applications are wave soldering and plating where Sn63 / Pb37 is primarily used as a coating for corrosion protection , , preforms, powder, solder paste, ingot, and anode form. Flux Compatibility: Sn63 / Pb37 ElectropureTM is


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PDF Sn63/Pb37 IPC-J-STD-006 Sn63/Pb37 ISO9001 45-micron SN63 SN63 PB37 sn63pb37 361F ingot
wafer level package

Abstract: SN63 PB37 PROFILES with or without underfill IRF6100 desoldering
Text: flux than gold. The solder alloy should be the same as the solder bumps ( Sn63 Pb37 ) and of type 3 or , uniform joint. A standard reflow profile for Sn63 Pb37 (Figure 9) consists of four zones: 1 , Time (sec) 180 240 300 Figure 9 Typical reflow profile for Sn63 Pb37 If a cleaning , be assembled using existing processes and standard reflow profiles . However, procedures and


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PDF AN-1011 800mm wafer level package SN63 PB37 PROFILES with or without underfill IRF6100 desoldering
MA4PH611

Abstract: No abstract text available
Text: Diode V1 Assembly Recommendations • Devices may be soldered using standard Sn63 / Pb37 or any , be used to mount MELF packages to circuit boards. Alloys such as Sn63 / Pb37 or any RoHS compliant , optimum connection. • For recommended Sn/Pb and RoHS soldering time/temperature profiles . See


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PDF MA4PH611 MA4PH611
im-sx20mam

Abstract: sx20 series SN62 PB36 ag2 SnPb37 SN63 PB37 multicore SN62 PB36 ag2 kester SN95 solder SX20 SN62 PB36 ag2 Copper Multicore Solders
Text: temperature than industry standard Sn63 / Pb37 alloy? A. Yes ­ for example, 42Sn/58Bi alloy solder has a , . An Sn63 / Pb37 or Sn62/Pb36/Ag2 alloy is recommended. · A lead-free alloy solder may also be , reduce IR hotspots. Industry Standard Sn63 / Pb37 or Sn62/Pb36/Ag2 alloy can be used to attach the , melting point of 217°C or less. · Figure 5 is recommended for Sn63 / Pb37 or Sn62/Pb36/Ag2 alloy and , 12/01 SX20 Manufacturing Application Manual Page 10 Recommended SX Reflow Profile for Sn63


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PDF IM-SX20MAM E90370 Sn-Pb37 im-sx20mam sx20 series SN62 PB36 ag2 SnPb37 SN63 PB37 multicore SN62 PB36 ag2 kester SN95 solder SX20 SN62 PB36 ag2 Copper Multicore Solders
Not Available

Abstract: No abstract text available
Text: : -W = Nickel/solder coated ( Sn63 , Pb37 ) Packaging C o d e , TERMINATION: Nickel/Solder coated ( Sn63 , Pb37 ) compatible with auto­ matic soldering technologies: reflow , ® 9 Accu-L® SM D High-Q RF Inductor Recommended Soldering Profiles IR Reflow Wave Soldering


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PDF D-85757 150-763-v AP-AL99610M-C
U8439-1

Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 X23-7772 DCL4
Text: .5 (RoHS), Sn63 / Pb37 (Standard) Substrate: Page 2 of 4 Die Bump: 95Pb5Sn Underfill: NAU-8 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0/Cu0.5 (RoHS), Sn63 / Pb37 (Standard) Substrate , /ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0/Cu0.5 (RoHS), Sn63 / Pb37 (Standard) Substrate


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PDF A1006-03 23-Jul-2010 FCBGA-1156 FCBGA-900 23-Oct-2010 89HPES16T16ZABL 89HPES16T16ZABR 89HPES22T16ZABL 89HPES22T16ZABLI U8439-1 AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 X23-7772 DCL4
MADP-000504-10720T

Abstract: No abstract text available
Text: Diode V1 Assembly Recommendations • Devices may be soldered using standard Sn63 / Pb37 or any , optimum connection. • For recommended Sn/Pb and RoHS soldering time/temperature profiles . See , soldering or reflow techniques may be used to mount MELF packages to circuit boards. Alloys such as Sn63 / Pb37 or any RoHS compliant solder may be used. For more information visit the M/A-COM Tech website


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PDF MADP-000504-10720T MADP-000504-10720T
raychem heat shrinkable sleeve

Abstract: RTD-50-M-00 MIL-C-390128 raychem rpip 683-00 RPIP-683-00 RTD-50-X-02 temperature RTD scale code example SN63 PB37
Text: MODIFIED POLYVINYLIDENE FLOURIDE. 3. SOLDER PREFORM. Sn63 Pb37 SOLDER ALLOY WITH MILDLY ACTIVATED ROSIN , . TIN PLATED COPPER BRAID WITH ACTIVATED ROSIN FLUX. 8. SOLDER PREFORM (ON L AND M SIZE ONLY). Sn63 Pb37 SOLDER ALLOY WITH MILDLY ACTIVATED ROSIN FLUX. 9. HEAT SHRINKABLE INSULATION SLEEVE, BLACK


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PDF RTD-50-M-00 RTD-50-X-XX D030312 D990336 29MAR11 raychem heat shrinkable sleeve RTD-50-M-00 MIL-C-390128 raychem rpip 683-00 RPIP-683-00 RTD-50-X-02 temperature RTD scale code example SN63 PB37
2005 - 73494

Abstract: NXR-1400 ekra e5 ekra nicolet nxr1400 pyramax tamura solder paste IPC-9701 nicolet SAC387
Text: for tin-lead ( Sn63 / Pb37 ) solder paste Peak temperature: 215 °C Time above 183 °C: 54 seconds Soak , were selected. Varieties of reflow profiles used are ramp-to-spike (RTS), ramp-soakspike (RSS), and , parameters: reflow profile and stencil aperture (c) Experiment with three different reflow profiles and , reflow profile using a 5-mil stencil. PROCESS PARAMETERS: a. Reflow profiles : Selection criteria: 1 , time. Details of different profiles used in this experiment are shown in figures 1 through 3 for lead


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PDF AN611 15-mm 31-Aug-05 73494 NXR-1400 ekra e5 ekra nicolet nxr1400 pyramax tamura solder paste IPC-9701 nicolet SAC387
SN62 PB36 ag2

Abstract: SN63 PB37 mepcopal
Text: elevated temperatures. Suggested solder compositions are Sn63 / Pb37 , Sn60/Pb40, or Sn62/Pb36/Ag2, with Sn63 / Pb37 preferred. Typical solder paste print thickness would be .008 to .010 inches thick. Reflow of


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2011 - MADS-001317-1500

Abstract: Schottky diode Die flip chip MADS-001317-1500AG SN63 PB37 PROFILES MADS-001317-1500AP MADS-001317
Text: . Solder Die Attach: This device can be mounted with Sn63 / Pb37 or RoHS compliant solder. Typical reflow profiles are provided on M/A-Com application note M538, " Surface Mounting Instructions" which can be


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PDF MADS-001317-1500 MADS-001317-1500 Schottky diode Die flip chip MADS-001317-1500AG SN63 PB37 PROFILES MADS-001317-1500AP MADS-001317
marking code s22

Abstract: roundup OC192 marking s11 duobinary
Text: Product Family: Bessel Absorptive Filter-9th Order Part Number Series: FL9 Series Construction: Features: · · · · · High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS (Sn95.5/Ag3.8/Cu0.7) or Non-RoHS ( Sn63 / Pb37 ) · · · · Cutoff frequencies between 2.5GHz and 4.0 GHz Low pass Absorptive Ball Grid Array , with solder finishes of Sn63 / Pb37 , as well as a RoHS compliant / Lead Free solder finish of Sn95.5/Ag3


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PDF Sn63/Pb37) 25Ghz) marking code s22 roundup OC192 marking s11 duobinary
Not Available

Abstract: No abstract text available
Text: FL02M652-00 - Rev. J - Page 1 of 3 Construction: ï‚·ï€ ï‚·ï€ ï‚·ï€ ï‚·ï€ High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS (Sn95.5/Ag3.8/Cu0.7) or Non-RoHS ( Sn63 / Pb37 ) ï‚·ï€ ï‚·ï€ ï‚·ï€ ï‚·ï€ ï‚·ï€ Cutoff frequencies between 2.5GHz and 4.0 GHz Low pass Absorptive Ball Grid Array (BGA) for high bandwidth Competitive , correction beyond 12Gb/s. This product is currently available with solder finishes of Sn63 / Pb37 , as well as


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PDF FL02M652-00 Sn63/Pb37) 25Ghz)
Not Available

Abstract: No abstract text available
Text: SOLDER PREFORM. Sn63 Pb37 SOLDER ALLOY WITH MILDLY ACTIVATED ROSIN FLUX. 4 . THREADED TRANSITION PART , ACTIVATED ROSIN FLUX. 8 . SOLDER PREFORM (ON L AND M SIZE ONLY). Sn63 Pb37 SOLDER ALLOY WITH MILDLY


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PDF RTD-50-Y-XX 2APR12
JESD22A113-A

Abstract: MEDER rm05 JEDEC wave 166 relay JESD22-A113-A
Text: sealed Material of Case FR4, Thermoset Molding Compound Material of Pins Sn63 / Pb37 , 0.65mm , Sn63 / Pb37 , 0.025" diameter www.meder.com 190 RM Series MEDER electronic RF Reed Relay , Compound Material of Pins Sn63 / Pb37 , 0.025" diameter www.meder.com 194 RM Series MEDER , Material of Case FR4, Thermoset Molding Compound Material of Pins Sn63 / Pb37 , 0.65mm diameter


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PDF RM05-4A-S-4/2 RM05-2A2B-S-4/2 220oC. JESD22-A113A Sn63/Pb37, JESD22A113-A MEDER rm05 JEDEC wave 166 relay JESD22-A113-A
2011 - Not Available

Abstract: No abstract text available
Text: FL02M652-00 - Rev. J - Page 1 of 3 Product Family: Part Number Series: Bessel Absorptive Filter-9th Order FL9 Series Construction: High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS (Sn95.5/Ag3.8/Cu0.7) or Non-RoHS ( Sn63 / Pb37 ) Features: Cutoff frequencies between 2.5GHz and 4.0 GHz Low pass Absorptive Ball Grid Array (BGA) for , solder finishes of Sn63 / Pb37 , as well as a RoHS compliant / Lead Free solder finish of Sn95.5/Ag3.8/Cu0


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PDF FL02M652-00 Sn63/Pb37) 25Ghz)
2013 - Not Available

Abstract: No abstract text available
Text: be mounted with Sn63 / Pb37 or RoHS compliant solder. Typical reflow profiles are provided on M


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PDF MAVR-000120-1411 70GHz
land pattern BGA 0.75

Abstract: AG38 10ghz low pass filter marking code s22 SN63 PB37
Text: Product Family: Bessel Absorptive Filter-7th Order Part Number Series: FL7 Series Construction: Features: · · · · · High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS (Sn95.5/Ag3.8/Cu0.7) or Non-RoHS ( Sn63 / Pb37 ) · · · · Cutoff frequencies between 6.0GHz and 10.0GHz Low pass Absorptive Ball Grid Array , . This product is currently available with solder finishes of Sn63 / Pb37 , as well as a RoHS compliant


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PDF Sn63/Pb37) land pattern BGA 0.75 AG38 10ghz low pass filter marking code s22 SN63 PB37
Not Available

Abstract: No abstract text available
Text: FL02M651.00 - Rev J - Page 1 of 3 Construction: ï‚·ï€ ï‚·ï€ ï‚·ï€ ï‚·ï€ High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS (Sn95.5/Ag3.8/Cu0.7) or Non-RoHS ( Sn63 / Pb37 ) ï‚·ï€ ï‚·ï€ ï‚·ï€ ï‚·ï€ ï‚·ï€ Cutoff frequencies between 6.0GHz and 10.0GHz Low pass Absorptive Ball Grid Array (BGA) for high bandwidth Competitive , finishes of Sn63 / Pb37 , as well as a RoHS compliant / Lead Free solder finish of Sn95.5/Ag3.8/Cu0.7. For


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PDF FL02M651 Sn63/Pb37)
2013 - Not Available

Abstract: No abstract text available
Text: FL02M651.00 - Rev J - Page 1 of 3 Product Family: Part Number Series: Bessel Absorptive Filter-7th Order FL7 Series Construction: High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS (Sn95.5/Ag3.8/Cu0.7) or Non-RoHS ( Sn63 / Pb37 ) Features: Cutoff frequencies between 6.0GHz and 10.0GHz Low pass Absorptive Ball Grid Array (BGA) for , product is currently available with solder finishes of Sn63 / Pb37 , as well as a RoHS compliant / Lead Free


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PDF FL02M651 Sn63/Pb37)
Not Available

Abstract: No abstract text available
Text: BLUE. RADIATION CROSS-LINKED MODIFIED POLYVI NYU DENE FLOURIDE. 3. SOLDER PREFORM: Sn63 Pb37 SOLDER , PREFORM (ON L AND M SIZE ONLY): Sn63 Pb37 SOLDER ALLOY WITH MILDLY ACTIVATED ROSIN FLUX. 9. INSULATION


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PDF RBD-75-Y-XX 20APR
2011 - JESD22-A113-A

Abstract: JESD22A113-A RM05-6A JESD22-A113A MEDER rm05 6AS4 bga reflow
Text: JEDEC Norm JESD22-A113A o o FR4, Thermoset Molding Compound Sn63 / Pb37 , 0.65mm diameter , o o JEDEC Norm JESD22-A113A o FR4, Thermoset Molding Compound Sn63 / Pb37 , 0.025" diameter , -20 -35 190 1011 1.5 50 10 85 125 220 fully sealed FR4, Thermoset Molding Compound Sn63 / Pb37 , 0.025 , Compound Sn63 / Pb37 , 0.65mm diameter kVDC g g o C C C o o www.meder.com 197 Meder


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PDF RM05-4A-S-4/2 RM05-2A2B-S-4/2 220oC. JESD22-A113A Sn63/Pb37, JESD22-A113-A JESD22A113-A RM05-6A JESD22-A113A MEDER rm05 6AS4 bga reflow
2013 - Not Available

Abstract: No abstract text available
Text: conductive epoxy or with solder. Solder Die Attach: This device can be mounted with Sn63 / Pb37 or RoHS compliant solder. Typical reflow profiles are provided on M/A-Com application note M538, “ Surface


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PDF MADS-001317-1500 80GHz MADS-001317â MADS-001317-1500
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