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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
397127 Henkel Corporation / Multicore SN62 370 3% .024DIA/23SWG
421562 Henkel Corporation / Multicore SN62 C502 5C 1.02MM 0.5KG .040
OPB365N51 TT Electronics OPTEK Technology Transistor Output Slotted Switch, 1-Channel, 3.11mm Slot Width, ROHS COMPLIANT, PLASTIC PACKAGE-4
OPB360P11 TT Electronics OPTEK Technology Transistor Output Slotted Switch, 1-Channel, 3.11mm Slot Width, ROHS COMPLIANT, PLASTIC PACKAGE-4
OPB360T55 TT Electronics OPTEK Technology Transistor Output Slotted Switch, 1-Channel, 3.11mm Slot Width, ROHS COMPLIANT, PLASTIC PACKAGE-4
OPB365L51 TT Electronics OPTEK Technology Transistor Output Slotted Switch, 1-Channel, 3.11mm Slot Width, ROHS COMPLIANT, PLASTIC PACKAGE-4

SN62 PB36 ag2 kester Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
im-sx20mam

Abstract: sx20 series SN62 PB36 ag2 SnPb37 SN63 PB37 multicore SN62 PB36 ag2 kester SN95 solder SX20 SN62 PB36 ag2 Copper Multicore Solders
Text: . An Sn63/Pb37 or Sn62 / Pb36 / Ag2 alloy is recommended. · A lead-free alloy solder may also be , reduce IR hotspots. Industry Standard Sn63/ Pb37 or Sn62 / Pb36 / Ag2 alloy can be used to attach the , melting point of 217°C or less. · Figure 5 is recommended for Sn63/Pb37 or Sn62 / Pb36 / Ag2 alloy and , /Pb37 or Sn62 / Pb36 / Ag2 250 Peak Temperature 210-225°C 1.3­ 1.6°C/Second Temperature (°C , 300 Figure 5. Recommended Lead Based Solder Re-flow Profile ­ Source: Kester Recommended SX


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PDF IM-SX20MAM E90370 Sn-Pb37 im-sx20mam sx20 series SN62 PB36 ag2 SnPb37 SN63 PB37 multicore SN62 PB36 ag2 kester SN95 solder SX20 SN62 PB36 ag2 Copper Multicore Solders
2001 - AG04

Abstract: No abstract text available
Text: Sn62 / Pb36 / Ag2 or Sn62 .8/ Pb36 .8/Ag0.4 composition and type 4 or finer powder is recommended. The , Specification Type 4, Sn62 / Pb36 / Ag2 or Sn62 .8/ Pb36 .8/Ag0.4 Flux Specification No Clean or tacky


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PDF SI00-06 MO-211. AG04
2001 - SI00-06

Abstract: SN62 PB36 ag2 SN62 PB36 ag2 Copper MO-211 SFC05-4 with or without underfill thermal cycling reliability SN62 PB36 ag2 gold smd ag2 design ideas
Text: paste with a Sn62 / Pb36 / Ag2 or Sn62 .8/ Pb36 .8/Ag0.4 composition and type 4 or finer powder is , Solder Paste Specification Type 4, Sn62 / Pb36 / Ag2 or Sn62 .8/ Pb36 .8/Ag0.4 Flux Specification No Clean


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PDF SI00-06 MO-211. SI00-06 SN62 PB36 ag2 SN62 PB36 ag2 Copper MO-211 SFC05-4 with or without underfill thermal cycling reliability SN62 PB36 ag2 gold smd ag2 design ideas
2012 - Recommended Solder Reflow Profile for Caddock Surface Mount Resistors

Abstract: SN62 PB36 ag2
Text: seconds, depending on the mass of assembly. 100°C Recommended Solders: Sn62 / Pb36 / Ag2 or Sn63/Pb37


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PDF AEN-0108 MP725, MP725 Sn62/Pb36/Ag2 Sn63/Pb37 Recommended Solder Reflow Profile for Caddock Surface Mount Resistors SN62 PB36 ag2
2002 - SN62 PB36 ag2

Abstract: MA4SW424B-1 PIN diode switch DIODE BY 255 diode AG2
Text: chip bonding using 80Au/20Sn, Sn62 / Pb36 / Ag2 solders or electrically conductive silver epoxy. Each RF , seconds should be required for the attachment. Sn62 / Pb36 / Ag2 Solder is also acceptable for use. Wire


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PDF MA4SW424B-1 MA4SW424B-1 SN62 PB36 ag2 PIN diode switch DIODE BY 255 diode AG2
SN62 PB36 ag2

Abstract: SN63 PB37 mepcopal
Text: elevated temperatures. Suggested solder compositions are Sn63/Pb37, Sn60/Pb40, or Sn62 / Pb36 / Ag2 , with Sn63


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2010 - NC-SMQ92J

Abstract: NC-SMQ92J solder paste Loctite 406 ADHESIVE GAP PAD mcpcb reflow criteria SN62 PB36 ag2 SN62 MP 1B73 pliobond 20 LOCTITE 384
Text: 82676 so that cleaning theIndium Sn62 / Pb36 / Ag2 composition PCB · Sn62 / Pb36 / Ag2 composition after reflow soldering is not required. Cree uses the following Sn62 / Pb36 / Ag2 composition · Flux: paste , . Indium Corporation of America Part number 82676 Solder Solder composition Sn62 / Pb36 / Ag2 Paste Solder


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PDF CLD-AP36 NC-SMQ92J NC-SMQ92J solder paste Loctite 406 ADHESIVE GAP PAD mcpcb reflow criteria SN62 PB36 ag2 SN62 MP 1B73 pliobond 20 LOCTITE 384
Sn96Ag4 0.6

Abstract: Sn96Ag4 solder Sn96Ag4 62Sn36Pb2Ag 107B SN62 PB36 ag2 Copper SN62 PB36 ag2 heat conductivity Automotive Power Electronics
Text: Resistivity Solder Wetting ( Sn62 / Pb36 / Ag2 ) >1.8kgf 0.35% R/R 1.7 m/sq/mil >95% minimum coverage


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PDF Mil-Std-202 Sn62/Pb36/Ag2) Sn96Ag4 0.6 Sn96Ag4 solder Sn96Ag4 62Sn36Pb2Ag 107B SN62 PB36 ag2 Copper SN62 PB36 ag2 heat conductivity Automotive Power Electronics
2008 - 20g0

Abstract: No abstract text available
Text: Tape and reel S= Sn62 / Pb36 / Ag2 W = Waffle CDHV = A = 3-sided CDHV2512 B = top only A = Palladium


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PDF 18-Jul-08 20g0
J-STD-006 electronic grade solder alloys

Abstract: TC-527 4662-SM ASTM B32 QQ-S-571F nte semiconductors Kester sn62 tinning kester 245 solder wire ceiling fan RV8NA
Text: TV/Radio Solder, .062 dia. 40/60 Metal Mender Solder, Acid Core, .062 dia. SN62 / PB36 /AG02 Elec , E L E C T R O N I C S, I N C. www.nteinc.com Kester Solder Wide range of solders and related materials from the leader in the industry. KESTER · Wire Solder · Bar Solder · Carded & Counter Display , and Accessories E L E C T R O N I C S, I N C. Spooled Wire Solder Kester 's reputation as the , Flux Kester Part Number 24-4060-0061 24-4060-0066 24-6040-0007 24-6040-0010 24-6040-0018


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2008 - vishay m

Abstract: No abstract text available
Text: = Sn62 / Pb36 / Ag2 B = Bulk T = Tape and reel W = Waffle Historical Part Numbering: CRHV1206AF1006F100e2


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PDF 18-Jul-08 vishay m
2012 - Not Available

Abstract: No abstract text available
Text: = T/R E = Sn100 (full reel) F = Sn95/Ag5 1 = T/R N = No solder (1000 pcs) S= 5 = T/R Sn62 / Pb36 / Ag2 , (500 pcs) HSD T = T/R T = Sn90/Pb10 (250 pcs min.) W = Waffle Historical Part


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PDF te1resist5J2500Ge2 CDHV2512 23-Nov-11 VMN-PT9175-1201
CR1206 vishay

Abstract: SN62 PB36 ag2 CR0002 vishay cr1206 5050-0002 CR0003 Sn62Pb36Ag2 CR2010 CR1206 SN62 PB36 ag2 gold
Text: TERMINATION PACKAGING S= Sn62 / Pb36 / Ag2 F = Sn95/Ag5 N = No Solder B = Bulk T = Tape and Reel W =


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PDF CR0001 CR5050 CR0002 CR0003 CR1010 CR1206 CR0004 CR0005 CR2010 08-Apr-05 CR1206 vishay SN62 PB36 ag2 CR0002 vishay cr1206 5050-0002 CR0003 Sn62Pb36Ag2 CR2010 CR1206 SN62 PB36 ag2 gold
2010 - arctic silver thermal adhesive

Abstract: LOCTITE ACTIVATOR 7387 SN62 PB36 ag2 NC-SMQ92J Loctite Loctite sumo Loctite 406 hydrocarbon polymeric HUmiseal 1B73 ADHESIVE GAP PAD
Text: 82676 so that cleaning theIndium Sn62 / Pb36 / Ag2 composition PCB · Sn62 / Pb36 / Ag2 composition after reflow soldering is not required. Cree uses the following Sn62 / Pb36 / Ag2 composition · Flux: paste , . Indium Corporation of America Part number 82676 Solder Solder composition Sn62 / Pb36 / Ag2 Paste Solder


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PDF CLD-AP36 arctic silver thermal adhesive LOCTITE ACTIVATOR 7387 SN62 PB36 ag2 NC-SMQ92J Loctite Loctite sumo Loctite 406 hydrocarbon polymeric HUmiseal 1B73 ADHESIVE GAP PAD
2008 - Not Available

Abstract: No abstract text available
Text: = Sn62 / Pb36 / Ag2 B = Bulk T = Tape and reel W = Waffle Historical Part Numbering: CRHV1206AF1006F100e2


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PDF 08-Apr-05
2008 - RC1206

Abstract: RC1206* Vishay
Text: PACKAGING TERMINATION K = 100 ppm S= B = Bulk L = 150 ppm Sn62 / Pb36 / Ag2 T = Tape and N = 200 ppm F = Sn95


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PDF 18-Jul-08 RC1206 RC1206* Vishay
2008 - Dow Corning 1-2577

Abstract: HUmiseal 1B73 CLD-AP25 HUmiseal Dow corning 3-1953 nc-smq92 pliobond SN62 PB36 ag2 Dow Corning Cree XLamp XP-G LED
Text: PCBCree · · · Indium Corporation of America® 82676 Sn62 / Pb36 / Ag2 NC-SMQ92J Cree


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PDF -AP25 CLD-AP25 Dow Corning 1-2577 HUmiseal 1B73 HUmiseal Dow corning 3-1953 nc-smq92 pliobond SN62 PB36 ag2 Dow Corning Cree XLamp XP-G LED
2012 - Not Available

Abstract: No abstract text available
Text: ppm (500 pcs) P = 500 ppm Sn62 / Pb36 / Ag2 , HSD T = T/R T = Sn90/Pb10 (250 pcs min.) W = Waffle


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PDF CRHV1206AF1006F100e2 23-Nov-11 VMN-PT9048-1201
2011 - Not Available

Abstract: No abstract text available
Text: and reel N = No solder W = Waffle S= Sn62 / Pb36 / Ag2 T = Sn90/Pb10 K = 100 ppm N = 200 ppm W = 350


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PDF 2002/95/EC 18-Jul-08
2011 - 500 platinum Hot wire

Abstract: No abstract text available
Text: solder S= Sn62 / Pb36 / Ag2 T = Sn90/Pb10 PACKAGING B = Bulk T = Tape and reel W = Waffle CDHV = A = 3


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PDF 2002/95/EC 18-Jul-08 500 platinum Hot wire
2009 - RC1100 CE

Abstract: RC05 SN62 PB36 ag2 RC0550 RC1206 RC2010 RC-722 Vishay Techno RC
Text: 0 F K S B SOLDER PACKAGING TERMINATION K = 100 ppm S= B = Bulk L = 150 ppm Sn62 / Pb36 / Ag2 T = Tape and N = 200 ppm F = Sn95/Ag5 reel W = 350 ppm N = No solder W = Waffle TCR F


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PDF 18-Jul-08 RC1100 CE RC05 SN62 PB36 ag2 RC0550 RC1206 RC2010 RC-722 Vishay Techno RC
2011 - Not Available

Abstract: No abstract text available
Text: 25 % P = 500 ppm SOLDER TERMINATION E = Sn100 F = Sn95/Ag5 N = No solder S = Sn62 / Pb36 / Ag2 T =


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PDF 2002/95/EC 11-Mar-11
2008 - Not Available

Abstract: No abstract text available
Text: temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 230 200 183 150 Peak


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2010 - platinum Hot wire

Abstract: CRHV2512 sided 500 platinum Hot wire CRHV2510 CRHV2010 CRHV1210 CRHV1206 SN62 PB36 ag2 CRHV1206AF100MFKFB
Text: TERMINATION E = Sn100 B = Bulk F = Sn95/Ag5 T = Tape and N = No solder reel S= W = Waffle Sn62 / Pb36 / Ag2 T = Sn90/Pb10 F 100 e2 TOLERANCE TCR SOLDER TERMINATION * Pb containing


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PDF 18-Jul-08 platinum Hot wire CRHV2512 sided 500 platinum Hot wire CRHV2510 CRHV2010 CRHV1210 CRHV1206 SN62 PB36 ag2 CRHV1206AF100MFKFB
2010 - Not Available

Abstract: No abstract text available
Text: T = Tape and reel N = No solder S= W = Waffle Sn62 / Pb36 / Ag2 T = Sn90/Pb10 CDHV = A = 3


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PDF 2002/95/EC 18-Jul-08
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