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TLV2462CPE4 TLV2462CPE4 ECAD Model Texas Instruments Dual Low-Power, Rail-to-Rail Input/Output Operational Amplifier 8-PDIP 0 to 70
TLV2462CDRG4 TLV2462CDRG4 ECAD Model Texas Instruments Dual Low-Power, Rail-to-Rail Input/Output Operational Amplifier 8-SOIC 0 to 70
TLV2462CP TLV2462CP ECAD Model Texas Instruments Dual Low-Power, Rail-to-Rail Input/Output Operational Amplifier 8-PDIP 0 to 70
TLV2462CDGK TLV2462CDGK ECAD Model Texas Instruments Dual Low-Power, Rail-to-Rail Input/Output Operational Amplifier 8-VSSOP 0 to 70
TLV2462CDG4 TLV2462CDG4 ECAD Model Texas Instruments Dual Low-Power, Rail-to-Rail Input/Output Operational Amplifier 8-SOIC 0 to 70
TLV2462CD TLV2462CD ECAD Model Texas Instruments Dual Low-Power, Rail-to-Rail Input/Output Operational Amplifier 8-SOIC 0 to 70
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SMS-462C SURFACE MOUNT SHIELD COVER, RECT; Product Range:Two-Piece SMS Series; Gasket Material:Tin Plated Steel; Length:27.79mm; Width:70.66mm; Depth:3mm; Attenuation:- SMS-462C ECAD Model
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Newark element14 SMS-462C Bulk 24 863 $0.86 $0.759 $0.582 $0.368 $0.341 More Info
Allied Electronics & Automation SMS-462C Bulk 102 1 $0.87 $0.87 $0.54 $0.48 $0.48 More Info
element14 Asia-Pacific SMS-462C Each 24 1 $1.32 $1.16 $0.888 $0.888 $0.888 More Info
Farnell element14 SMS-462C Each 24 1 £0.835 £0.671 £0.482 £0.337 £0.337 More Info

SMS-462C datasheet (1)

Part ECAD Model Manufacturer Description Type PDF
SMS-462C SMS-462C ECAD Model Leader Tech RF/IF and RFID - RF Shields - 1.07X2.758X0.236-NON-VENTED SURF Original PDF

SMS-462C Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2006 - 462C

Abstract: add 2201
Text: Filename: tfs 462c .doc Version 1.2 28.02.2006 VI TELEFILTER Measurement condition , Filter specification TFS 462C 1/5 Characteristics Remark: The maximum attenuation in the pass , accompany the sale of any such product(s) or information. Filename: tfs 462c .doc Version 1.2 , TFS 462C 2/5 0 -1 -2 -3 9 magnitude in dB -40 -50 -60 -70 -80 -90 -100 -4 -5 -6 -7 -8 , 0 468 Construction and pin connection (All dimensions in mm) 7 5 462C U09 1 3 Date code


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2008 - ecl 10K

Abstract: SSB Receiver ICS853013 ICS853013AM MC100EL13 MC100LVEL13 MS-013
Text: -40°C to +85°C Package Thermal Impedance, JA 46.2°C /W (0 lfpm) Storage Temperature, TSTG , used. Assuming no air flow and a multi-layer board, the appropriate value is 46.2°C /W per Table 6 , * 46.2°C /W = 108.1°C. This is below the limit of 125°C. This calculation is only an example. Tj will , °C/W 65.7°C/W 57.5°C/W Multi-Layer PCB, JEDEC Standard Test Boards 46.2°C /W 39.7°C/W , Multi-Layer PCB, JEDEC Standard Test Boards 46.2°C /W 39.7°C/W 36.8°C/W NOTE: Most modern PCB


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PDF ICS853013 ICS853013 ecl 10K SSB Receiver ICS853013AM MC100EL13 MC100LVEL13 MS-013
2007 - 20-PIN

Abstract: ICS853017 ICS853017AM ICS853017AMLF ICS853017AMT MC100EP58 MS-013
Text: , TA -40°C to +85°C Storage Temperature, TSTG -65°C to 150°C Package Thermal Impedance, JA 46.2°C , value is 46.2°C /W per Table 6 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.377W * 46.2°C /W = 102.4°C. This is well below the limit of 125°C. This calculation , , JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 200 500 83.2°C/W 46.2°C , PCB, JEDEC Standard Test Boards 200 500 83.2°C/W 46.2°C /W 65.7°C/W 39.7°C/W 57.5°C/W


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PDF ICS853017 ICS853017 199707558G 20-PIN ICS853017AM ICS853017AMLF ICS853017AMT MC100EP58 MS-013
2008 - 462C

Abstract: No abstract text available
Text: ) -5.5V (ECL mode, VCC = 0V) -0.5V to VCC + 0.5V 0.5V to VEE ­ 0.5V 50mA 100mA -40°C to +85°C 46.2°C /W (0 , . Assuming no air flow and a multi-layer board, the appropriate value is 46.2°C /W per Table 6 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.501W * 46.2°C /W = , 83.2°C/W 46.2°C /W 200 65.7°C/W 39.7°C/W 500 57.5°C/W 36.8°C/W NOTE: Most modern PCB designs use , Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 0 83.2°C/W 46.2°C /W


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PDF ICS853013 ICS853013 the441764 462C
2008 - 20-PIN

Abstract: ICS853017 ICS853017AM ICS853017AMLF ICS853017AMT MC100EP58 MS-013
Text: , TA -40°C to +85°C Storage Temperature, TSTG -65°C to 150°C Package Thermal Impedance, JA 46.2°C , resistance JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 46.2°C /W , : 85°C + 0.377W * 46.2°C /W = 102.4°C. This is well below the limit of 125°C. This calculation is only , Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 200 500 83.2°C/W 46.2°C /W , PCB, JEDEC Standard Test Boards 200 500 83.2°C/W 46.2°C /W 65.7°C/W 39.7°C/W 57.5°C/W


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PDF ICS853017 ICS853017 199707558G 20-PIN ICS853017AM ICS853017AMLF ICS853017AMT MC100EP58 MS-013
2010 - 462C

Abstract: ICS8745B-21 ICS8745BI-21 MS-013 506mW
Text: , IO Continuous Current Surge Current 10mA 15mA Package Thermal Impedance, JA 46.2°C /W (0 , value is 46.2°C /W per Table 7below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.721W * 46.2°C /W = 118.3°C. This is well below the limit of 125°C. This calculation , 46.2°C /W 39.7°C/W 36.8°C/W NOTE: Most modern PCB designs use multi-layered boards. The data in , 65.7°C/W 57.5°C/W Multi-Layer PCB, JEDEC Standard Test Boards 46.2°C /W 39.7°C/W 36.8°C/W


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PDF ICS8745BI-21 ICS8745BI-21 25MHz 700MHz. 462C ICS8745B-21 MS-013 506mW
2006 - 462C

Abstract: No abstract text available
Text: . Generated 9/12/2012 - 51ea4cff-fddd- 462c -bc1a-81dca2d2a60f © 2006-2012 IntelliData.net KEMET


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PDF C0402C223K4RACTU C0402C223K4RAC7867) 51ea4cff-fddd-462c-bc1a-81dca2d2a60f 462C
2003 - 20-PIN

Abstract: ICS87339-01 ICS87339AM01 ICS87339AM-01 ICS87339AM-01T MC100LVEL39 MS-013
Text: Thermal Impedance, JA (Junction-to-Ambient) 46.2°C /W (0 lfpm) TABLE 4A. POWER SUPPLY DC , , JEDEC Standard Test Boards 83.2°C/W 46.2°C /W 200 500 65.7°C/W 39.7°C/W 57.5°C/W 36.8 , PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W


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PDF ICS87339-01 ICS87339-01 87339AM-01 20-PIN ICS87339AM01 ICS87339AM-01 ICS87339AM-01T MC100LVEL39 MS-013
2008 - Block diagram of 8-1 multiplexer design logic

Abstract: No abstract text available
Text: Temperature, TSTG Rating 4.6V -0.5V to VCC+ 0.5V 50mA 100mA 46.2°C /W (0 lfpm) 73.2°C/W (0 lfpm) -65°C to 150 , Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 0 83.2°C/W 46.2°C /W , Boards 0 83.2°C/W 46.2°C /W 200 65.7°C/W 39.7°C/W 500 57.5°C/W 36.8°C/W NOTE: Most modern PCB design


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PDF ICS85356I 900MHz temperatu441764 Block diagram of 8-1 multiplexer design logic
2007 - ICS85356AGI

Abstract: ICS85356AMI ICS85356AMIT ICS85356I MC100LVEL56
Text: Impedance, JA 46.2°C /W (0 lfpm) Storage Temperature, TSTG -65°C to 150°C NOTE: Stresses beyond , Multi-Layer PCB, JEDEC Standard Test Boards 46.2°C /W 39.7°C/W 36.8°C/W NOTE: Most modern PCB designs use , SOIC JA by Velocity (Linear Feet per Minute) 0 200 500 83.2°C/W 46.2°C /W Single-Layer


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PDF ICS85356I ICS85356I 85356AMI ICS85356AMI ICS85356AGI ICS85356AMIT MC100LVEL56
2003 - 20-PIN

Abstract: ICS8735-21 ICS8735I-21 MS-013
Text: , VCCO -0.5V to VCCO + 0.5V Package Thermal Impedance, JA 46.2°C /W (0 lfpm) Storage , Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W 200 500 , 46.2°C /W Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards


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PDF ICS8735I-21 700MHZ, ICS8735I-21 25MHz 700MHz. 8735AMI-21 20-PIN ICS8735-21 MS-013
2003 - Not Available

Abstract: No abstract text available
Text: , JA Storage Temperature, TSTG 4.6V -0.5V to VDD + 0.5 V -0.5V to VDDO + 0.5V 46.2°C /W (0 lfpm) -65°C , PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W 200 , Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W 200 65.7°C/W 39.7°C/W 500 57.5°C/W 36.8


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PDF ICS8725-21 25MHz 630MHz 250MHz 125ps 8725AM-21
2001 - ICS8735-21

Abstract: ICS8735AM-21 ICS8735AM-21T MS-013
Text: , TSTG 4.6V -0.5V to VCC+0.5 V -0.5V to VCCO+0.5V 46.2°C /W (0 lfpm) -65°C to 150°C Stresses , 83.2°C/W 46.2°C /W 200 500 65.7°C/W 39.7°C/W 57.5°C/W 36.8°C/W NOTE: Most modern PCB , Minute) 0 200 500 83.2°C/W 46.2°C /W Single-Layer PCB, JEDEC Standard Test Boards


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PDF ICS8735-21 700MHZ, ICS8735-21 25MHz 700MHz. ICS8735AM-21 ICS8735AM-21 ICS8735AM-21T MS-013
2003 - MS-013

Abstract: 300MIL ICS87339AGI-11 ICS87339I-11 MC100EP139 MC10EP139
Text: SOIC 73.2°C/W (0 lfpm) 46.2°C /W (0 lfpm) Storage Temperature, TSTG -65°C to 150°C NOTE , Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W 200 500 65.7°C/W 39.7°C/W 57.5 , Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W 200 500 65.7°C/W 39.7°C/W 57.5


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PDF ICS87339I-11 ICS87339I-11 87339AGI-11 MS-013 300MIL ICS87339AGI-11 MC100EP139 MC10EP139
Not Available

Abstract: No abstract text available
Text: appendix, the 6ja for still air is 46.2'C /watt. The S3LV306's junction temperature would then be: 70"C + (.961 watts x 46.2'C /watt) = 114"C Note this is below the 140'C maximum junction temperature. Table 3


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PDF 20-OUTPUT S3LV306 84-unit 52-pin S3LV306Q-1/D Page10
UT AT66

Abstract: No abstract text available
Text: graph in the Package appendix, the 0 j a for still air is 46.2'C /watt. The SC3507's junction tempera ture would then be: 70` C + (1.173 watts x 46.2'C /watt) = 124' C Note this is below the 140'C maximum


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PDF 20-OUTPUT SC3507 84-unit 52-pin SC3507Q-1/D UT AT66
2010 - ICS8745B-21

Abstract: ICS8745BI-21 MO-220 MS-013
Text: Package Thermal Impedance, JA 20 Lead SOIC package 32 Lead VFQFN package D Item 46.2°C /W (0 , value is 46.2°C /W per Table 7A below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.721W * 46.2°C /W = 118.3°C. This is well below the limit of 125°C. This , Boards 46.2°C /W 39.7°C/W 36.8°C/W NOTE: Most modern PCB designs use multi-layered boards. The , 46.2°C /W 39.7°C/W 36.8°C/W NOTE: Most modern PCB designs use multi-layered boards. The data in


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PDF ICS8745BI-21 ICS8745BI-21 25MHz 700MHz. ICS8745B-21 MO-220 MS-013
2003 - 8725A

Abstract: ICS8725-21 MS-013 MEAN WELL ps-65-r9
Text: -0.5V to VDD + 0.5 V Outputs, VO -0.5V to VDDO + 0.5V Package Thermal Impedance, JA 46.2°C /W , -pin SOIC, Forced Convection JA by Velocity (Linear Feet per Minute) 0 200 500 83.2°C/W 46.2°C , 500 83.2°C/W 46.2°C /W Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC


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PDF ICS8725-21 ICS8725-21 25MHz 630MHz. 8725AM-21 8725A MS-013 MEAN WELL ps-65-r9
2001 - Not Available

Abstract: No abstract text available
Text: +0.5V 46.2°C /W (0 lfpm) -65°C to 150°C ABSOLUTE MAXIMUM RATINGS Supply Voltage, VCCx Inputs, VI Outputs , PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 0 83.2°C/W 46.2°C /W 200 , °C/W 46.2°C /W 200 65.7°C/W 39.7°C/W 500 57.5°C/W 36.8°C/W NOTE: Most modern PCB designs use


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PDF ICS8735-21 700MHZ, 25MHz 700MHz 250MHz 100ps ICS8735AM-21
2008 - ICS873S02I

Abstract: ICS873S02BMIT 1GHz PLL Generator 20-PIN ICS873S02BMI ICS873S02BMILF MS-013 Nippon capacitors
Text: periods may affect product reliability. 50mA 100mA Package Thermal Impedance, JA 46.2°C /W (0 lfpm , Multi-Layer PCB, JEDEC Standard Test Boards 46.2°C /W 39.7°C/W 36.8°C/W NOTE: Most modern PCB designs use , °C/W 65.7°C/W 57.5°C/W Multi-Layer PCB, JEDEC Standard Test Boards 46.2°C /W 39.7°C/W


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PDF ICS873S02I ICS873S02I ICS873S02BMIT 1GHz PLL Generator 20-PIN ICS873S02BMI ICS873S02BMILF MS-013 Nippon capacitors
2004 - ICS85356AGI

Abstract: ICS85356AGILF ICS85356AGIT ICS85356AMI ICS85356AMIT ICS85356I MC100LVEL56
Text: Current 50mA 100mA Package Thermal Impedance, JA 46.2°C /W (0 lfpm) Storage Temperature, TSTG , Test Boards 46.2°C /W 39.7°C/W 36.8°C/W NOTE: Most modern PCB designs use multi-layered boards. The , 20 LEAD SOIC JA by Velocity (Linear Feet per Minute) 0 200 500 83.2°C/W 46.2°C /W


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PDF ICS85356I ICS85356I 85356AMI ICS85356AGI ICS85356AGILF ICS85356AGIT ICS85356AMI ICS85356AMIT MC100LVEL56
2003 - Not Available

Abstract: No abstract text available
Text: ) -0.5V to VCC + 0.5 V 0.5V to VEE - 0.5V 50mA 100mA ± 0.5mA -65°C to 150°C 46.2°C /W (0 lfpm) to the , Boards 83.2°C/W 46.2°C /W 200 65.7°C/W 39.7°C/W 500 57.5°C/W 36.8°C/W NOTE: Most modern PCB , Boards Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W 200 65.7°C/W 39.7°C/W 500


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PDF 200ps 87339AM-01
2003 - MEAN WELL ps-65-r9

Abstract: No abstract text available
Text: -0.5V to VDD + 0.5 V -0.5V to VDDO + 0.5V 46.2°C /W (0 lfpm) -65°C to 150°C NOTE: Stresses beyond those , PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W 200 , Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W 200 65.7°C/W 39.7°C/W 500 57.5°C/W 36.8


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PDF ICS8725-21 25MHz 630MHz 250MHz 125ps 8725AM-21 MEAN WELL ps-65-r9
2010 - 87339AGI-11LF

Abstract: No abstract text available
Text: lfpm) 46.2°C /W (0 lfpm) -65°C to 150°C NOTE: Stresses beyond those listed under Absolute Maximum , for 20-pin SOIC, Forced Convection by Velocity (Linear Feet per Minute) JA 0 83.2°C/W 46.2°C , Standard Test Boards 83.2°C/W 46.2°C /W 200 65.7°C/W 39.7°C/W 500 57.5°C/W 36.8°C/W NOTE: Most


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PDF ICS87339I-11 ICS87339I-11 87339AGI-11 87339AGI-11LF
2003 - Not Available

Abstract: No abstract text available
Text: :1 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR 4.6V -0.5V to VDD + 0.5V 10mA 15mA 46.2°C /W (0 , Boards 83.2°C/W 46.2°C /W 200 65.7°C/W 39.7°C/W 500 57.5°C/W 36.8°C/W NOTE: Most modern PCB , Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 46.2°C /W


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PDF ICS874S02I TIA/EIA-644, 500MHz 874S02AMI
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