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SMS-401C EMI SHIELDING, 14.22 X 13.26 X 2.01MM; Product Range:Two-Piece SMS Series; Gasket Material:Tin Plated Steel; Length:14.22mm; Width:13.26mm; Depth:2.01mm; Attenuation:- SMS-401C ECAD Model
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Newark element14 SMS-401C Bulk 0 1,000 $0.61 $0.525 $0.392 $0.238 $0.217 Buy Now

SMS-401C datasheet (1)

Part ECAD Model Manufacturer Description Type PDF
SMS-401C SMS-401C ECAD Model Leader Tech RF/IF and RFID - RF Shields - 0.5X0.538X0.1-NON-VENTED SURFACE Original PDF

SMS-401C Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
abb REL531

Abstract: REL531 SYS500 REL551 REL511 microscada abb REL 551 rel 511 microscada REL521
Text: High voltage software modules LIB 520* 4.0.1C 1MRK 511 057-BEN Page 1 Issued June 1999 , the LIB 500/510 standard library functions. High voltage software modules LIB 520* 4.0.1C 1MRK , LIB 520* 4.0.1C 1MRK 511 057-BEN Page 3 Table 3: Requirements for the MicroSCADA computer , . 8.4.1C; LIB500, ver. 4.0.1C ; * MicroNET, ver. 8.2C; PCNET, ver. 8.4.1 (97-04-21 or later) HV/REL501 3 MB SYS500 ver. 8.4.1C; LIB500, ver. 4.0.1C ; * MicroNET, ver. 8.2C; PCNET, ver. 8.4.1


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PDF 057-BEN 524-FA REL511, HV/REL511 016-BEN 014-BEN SE-721 abb REL531 REL531 SYS500 REL551 REL511 microscada abb REL 551 rel 511 microscada REL521
Not Available

Abstract: No abstract text available
Text: Ordering number : ENA2137 STK672- 401C -E Thick-Film Hybrid IC 2-phase Stepping Motor Driver ht t p://onse m i.c om Overview The STK672- 401C -E is a hybrid IC for use as a unipolar, 2 , , 2013 June, 2013 O1712HKPC 018-07-0001 No.A2137-1/19 STK672- 401C -E Specifications Absolute , Item 1 is the design target and not measured. No.A2137-2/19 STK672- 401C -E Package Dimensions , 0.52 1.0 18 1.0=18.0 3.6 (5.6) Derating Curve of Motor Current, IOH, vs. STK672- 401C


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PDF ENA2137 STK672-401C-E STK672-401C-E A2137-19/19
Not Available

Abstract: No abstract text available
Text: Ordering number : ENA2137 STK672- 401C -E Thick-Film Hybrid IC 2-phase Stepping Motor Driver Overview http://onsemi.com The STK672- 401C -E is a hybrid IC for use as a unipolar, 2-phase stepping , 018-07-0001 No.A2137-1/19 STK672- 401C -E Specifications Absolute Maximum Ratings at Tc = 25°C Parameter , . No.A2137-2/19 STK672- 401C -E Package Dimensions unit:mm (typ) 29.2 25.6 (20.4) 4.5 (12.9) 14.4 R1.7 1 19 4.0 (5.6) 18 1.0=18.0 Derating Curve of Motor Current, IOH, vs. STK672- 401C


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PDF ENA2137 STK672-401C-E STK672-401C-E A2137-19/19
2012 - Not Available

Abstract: No abstract text available
Text: Ordering number : ENA2137 STK672- 401C -E Overview Thick-Film Hybrid IC 2-phase Stepping Motor Driver The STK672- 401C -E is a hybrid IC for use as a unipolar, 2-phase stepping motor driver , equipment. O1712HKPC 018-07-0001 No.A2137-1/19 STK672- 401C -E Specifications Absolute Maximum , must be used. The value of Item 1 is the design target and not measured. No.A2137-2/19 STK672- 401C , ) 18 1.0=18.0 Derating Curve of Motor Current, IOH, vs. STK672- 401C -E Operating Substrate


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PDF ENA2137 STK672-401C-E STK672-401C-E A2137-19/19
2006 - Not Available

Abstract: No abstract text available
Text: ASSR- 401C and ASSR-402C Low C x R, Form A, Solid State Relay (Photo MOSFET) (400V/100Ω/15pF , of 0.8V or less. ASSR- 401C is available in 4-pin SO package and ASSR402C is available in 8-pin DIP , by ESD. Ordering Information ASSR- 401C -X03E 003E = Small Outline 4-Pin Package, 100 units per , ASSR- 401C Opto-isolation Opto-isolation 1 1 3 Equivalent Relay Diagram Turn -off , 3 6 4 5 Package Outline Drawings ASSR- 401C 4-Pin Small Outline Package LAND PATTERN


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PDF ASSR-401C ASSR-402C 00V/100â /15pF) ASSR-40xC AV02-0453EN
2005 - Not Available

Abstract: No abstract text available
Text: ASSR- 401C and ASSR-402C Low C x R, Form A, Solid State Relay (Photo MOSFET) (400V/100/15pF , voltage of 0.8V or less. ASSR- 401C is available in 4-pin SO package and ASSR402C is available in 8-pin DIP , Option Part number ASSR- 401C RoHS Compliant -003E -503E -002E -302E -502E Package SO , . Contact your Avago sales representative or authorized distributor for information. Schematic ASSR- 401C , Drawings ASSR- 401C 4-Pin Small Outline Package 0.100 2.54 LEAD FREE TYPE NUMBER DATE CODE xxxx


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PDF ASSR-401C ASSR-402C 00V/100/15pF) ASSR-40xC ASSR-402C AV02-0453EN
2006 - dvi schematic

Abstract: marked code tc 780 AC ASSR-401C ASSR-402C photovoltaic mosfet driver VDE0109 avago Infrared Diode
Text: ASSR- 401C and ASSR-402C Low C x R, Form A, Solid State Relay (Photo MOSFET) (400V/100/15pF , relay turns off (contact opens) with an input voltage of 0.8V or less. ASSR- 401C is available in 4 , number RoHS Compliant -003E ASSR- 401C -002E -502E Tape & Reel Quantity 100 units per , ASSR- 401C Opto-isolation Opto-isolation 1 1 3 Equivalent Relay Diagram Turn -off , 3 6 4 5 Package Outline Drawings ASSR- 401C 4-Pin Small Outline Package LAND PATTERN


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PDF ASSR-401C ASSR-402C 00V/100/15pF) ASSR-40xC 650pF· AV02-0453EN dvi schematic marked code tc 780 AC ASSR-402C photovoltaic mosfet driver VDE0109 avago Infrared Diode
2002 - sx634

Abstract: 4510 208E 213B 251C
Text: ) 1.3 max - 401C ~ 901C 18.0 pF (standard) #1 ! ! ! ! 50ppm from -101C ~ 701C standard 30ppm from -101C ~ 701C available 100ppm from - 401C ~ 851C standard 50ppm from - 401C ~ 851C available , available 10.0 lW ( 100 lW max. ) Solderability 3.5 -101C ~ 701C, - 401C ~ 851C Drive Level , = - 401C ~ 851C 9 = Cust spec A = Bulk (<1000 pcs) E = Tape & Reel* ! 100 ppm ! 50 ppm ! 30


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PDF SX632/SX634 2601C 1000pcs/reel) -401C -101C sx634 4510 208E 213B 251C
SX-532

Abstract: SX532 4510 251C sx534
Text: Resistance Drive Level Humidity Hermetic Seal Solderability Vibration Shock Packaging - 401C ~ 901C , 30ppm from -101C ~ 701C 50ppm from -101C ~ 701C 50ppm from - 401C ~ 851C 30ppm from 01C ~ 701C 100ppm from - 401C ~ 851C 2.6 Top View #2 #4 #3 #3 #1 #2 CO.3 1.4 #4 1.6 1.3 , ~ 701C* 01C ~ 701C -201C ~ 701C - 401C ~ 851C Cust spec C 1 PACKAGING FREQUENCY A =


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PDF SX532 SX532 SX534 2601C 1000pcs/reel) -101C -201C -401C SX-532 4510 251C sx534
1998 - fujitsu

Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 401 PIN CERAMIC To Top / Package Lineup / Package Index PGA- 401C -A04 401-pin ceramic PGA Lead pitch 1.27 mm Pin matrix 30 Sealing method Metal seal (PGA- 401C -A04) 401-pin ceramic PGA (PGA- 401C -A04) 0.20 ± 0.05 DIA (.008 ± .002) 39.37 ± 0.40 SQ (1.550 ± .016) 1.27 ± 0.15 (.050 ± .006) 1.27 (.050) MAX 36.83 (1.450) REF INDEX AREA 1.50 ± 0.03 (.059 ± .0012) INDEX LEAD 3.81 ± 0.30 (.150 ± .012


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PDF PGA-401C-A04 401-pin PGA-401C-A04) R401005SC-1-2 fujitsu
1999 - PGA-401C-A02

Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 401 PIN CERAMIC PGA- 401C -A02 401-pin ceramic PGA Lead pitch 2.54 interstitial Pin matrix 37 Sealing method Metal seal (PGA- 401C -A02) 401-pin ceramic PGA (PGA- 401C -A02) 48.26 ± 0.55 SQ (1.900 ± .022) 2.54 (.100) TYP 0.40 ± 0.10 DIA (.016 ± .004) 1.00 (.039) DIA TYP (4 PLCS) 45.72 (1.800) REF INDEX AREA 1.02 (.040) C TYP (4 PLCS) 1.20 ± 0.25 (.047 ± .010) EXTRA INDEX PIN 3.40 ± 0.40 (.134 ± .016


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PDF PGA-401C-A02 401-pin PGA-401C-A02) R401002SC-2-2 PGA-401C-A02
1999 - Not Available

Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 401 PIN CERAMIC PGA- 401C -A04 401-pin ceramic PGA Lead pitch 1.27 mm Pin matrix 30 Sealing method Metal seal (PGA- 401C -A04) 401-pin ceramic PGA (PGA- 401C -A04) 0.20 ± 0.05 DIA (.008 ± .002) 39.37 ± 0.40 SQ (1.550 ± .016) 1.27 ± 0.15 (.050 ± .006) 1.27 (.050) MAX 36.83 (1.450) REF INDEX AREA 1.50 ± 0.03 (.059 ± .0012) INDEX LEAD 3.81 ± 0.30 (.150 ± .012) C 1994 FUJITSU LIMITED R401005SC


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PDF PGA-401C-A04 401-pin PGA-401C-A04) R401005SC-1-2
MB91230

Abstract: MB91360 PGA-401C-A02 AN-FMEMCU-910026-12 fujitsu STARTERkit mb90f MB91362
Text: . 7 1.2 PGA- 401C -A02 Systems , . 9 2 SETTING UP A MB91360 EMULATION SYSTEM (PGA- 401C -A02) . 11 2.1 , SETTING UP A MB91230 EMULATION SYSTEM (PGA- 401C -A02) . 16 3.1 Installing , the 32-bit emulation system for Evaluation MCUs: · 1.2 Emulator Main Unit MB2198-01 PGA- 401C , Emulation System (PGA- 401C -A02) 2 Setting up a MB91360 Emulation System (PGA- 401C -A02) HARDWARE


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PDF AN-FMEMCU-910026-12 MB2198-01 MB2198 MB91V230 AN-910026-12 AN-910098-12 MB91230 MB91360 PGA-401C-A02 AN-FMEMCU-910026-12 fujitsu STARTERkit mb90f MB91362
2000 - MB89P195A-201P

Abstract: MB90F654APFV MB89P195A-201PF MB90V660A MB89P147V2P-SH MB89P147V2PF MB89P147V1P-SH MB89P147V1PF MB89140 MB8916xPF
Text: /APFV MB89P165-xxxPFV MB8916xPFM/APFM X MB89P165-xxxPFM PGA-256C-A02 PGA-299C-A01 PGA- 401C , MB89P538PFM/HPFM MQP-100C-P01 MQP-100C-P02 PGA-135C-A02 PGA-256C-A02 PGA-299C-A01 PGA- 401C -A02 0,5 , MQP-64C-P01 MQP-80C-P01 MQP-100C-P01 MQP-100C-P02 PGA-135C-A02 PGA-256C-A02 PGA-299C-A01 PGA- 401C , -299C-A01 PGA- 401C -A02 0,5 X X X X 0,5 0,65 FPT-100C-A02 FPT-100C-C01 0,65 MQP , MB89P657A-xxxPFV MQP-100C-P01 MQP-100C-P02 PGA-135C-A02 PGA-256C-A02 PGA-299C-A01 PGA- 401C -A02 0,5 X X


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PDF MB89120/A MB89150/A MB89160/A MB89W165-xxxCF MB89PV160-xxxCF MB8912xPFV/APFV MB8912xPFM/APFM MB89130/A MB89130ACF MB8913xPFM/APFM MB89P195A-201P MB90F654APFV MB89P195A-201PF MB90V660A MB89P147V2P-SH MB89P147V2PF MB89P147V1P-SH MB89P147V1PF MB89140 MB8916xPF
1998 - 27-207

Abstract: PGA-401C-A02
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 401 PIN CERAMIC To Top / Package Lineup / Package Index PGA- 401C -A02 401-pin ceramic PGA Lead pitch 2.54 interstitial Pin matrix 37 Sealing method Metal seal (PGA- 401C -A02) 401-pin ceramic PGA (PGA- 401C -A02) 48.26 ± 0.55 SQ (1.900 ± .022) 2.54 (.100) TYP 0.40 ± 0.10 DIA (.016 ± .004) 1.00 (.039) DIA TYP (4 PLCS) 45.72 (1.800) REF INDEX AREA 1.02 (.040) C TYP (4 PLCS) 1.20 ± 0.25 (.047


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PDF PGA-401C-A02 401-pin PGA-401C-A02) R401002SC-2-2 27-207 PGA-401C-A02
2002 - SX752

Abstract: 4510 208E 251C LW100
Text: 3rd Overtone) 1.6 max -101C ~ 701C, - 401C ~ 851C - 401C ~ 901C #1 18.0 pF (standard , (-101C ~ 701C) ! 50ppm, ! 100ppm (- 401C ~ 851C) 5.8 1.4 10.0 ~ 15.999 = 50 (W) Fundamental 16.0 , = -101C ~ 701C* 5 = - 401C ~ 851C 9 = Cust spec A = Bulk (<1000 pcs) E = Tape & Reel* ! 100


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PDF SX752 SX752/SX754 2601C 1000pcs/reel) -101C -401C SX752 4510 208E 251C LW100
2002 - Not Available

Abstract: No abstract text available
Text: Resistance Drive Level Humidity Hermetic Seal Solderability Vibration Shock Packaging - 401C ~ 901C , 30ppm from -101C ~ 701C 50ppm from -101C ~ 701C 50ppm from - 401C ~ 851C 30ppm from 01C ~ 701C 100ppm from - 401C ~ 851C 2.6 Top View #2 #4 #3 #3 #1 #2 CO.3 1.4 #4 1.6 1.3 , ~ 601C* 01C ~ 701C -201C ~ 701C - 401C ~ 851C Cust spec C 1 PACKAGING FREQUENCY A =


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PDF SX532 SX532 SX534 2601C 1000pcs/reel) -101C -201C -401C
2002 - TC813

Abstract: 551c 101C 201C 401C 601C TC815
Text: - 101C 1 01C 1 - 201C 1 - 301C 1 - 301C 1 - 401C ~ ~ ~ ~ ~ ~ ~ 1 551C 1 , * - 401C ~ 851C 85% RH, 851C, 48 Hours MIL-STD-202F Method 208E 2151C for 10 seconds MIL-STD , - 301C ~ 751C M M M - 301C ~ 851C M M - 401C ~ 851C M PART NUMBERING KEY SERIES , -201C ~ 701C -301C ~ 751C -301C ~ 851C - 401C ~ 851C MECHANICAL TRIMMER PACKAGING A = Yes


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PDF TC813 TC815 TCV813 TCV815 TCV813 TCV813, TCV815) 551c 101C 201C 401C 601C
1994 - PGA-401C-A02

Abstract: 401C
Text: PIN GRID ARRAY PACKAGE 401 PIN CERAMIC PGA- 401C -A02 Lead pitch 2.54 interstitial Pin matrix 37 Sealing method Metal seal 401-pin ceramic PGA (PGA- 401C -A02) 401-pin ceramic PGA (PGA- 401C -A02) 48.26 ± 0.55 SQ (1.900 ± .022) 2.54 (.100) TYP 0.40 ± 0.10 DIA (.016 ± .004) 1.00 (.039) DIA TYP (4 PLCS) 45.72 (1.800) REF INDEX AREA 1.02 (.040) C TYP (4 PLCS) 1.20 ± 0.25 (.047 ± .010) EXTRA INDEX PIN 3.40 ± 0.40 (.134 ± .016) 5.27 (.207) MAX


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PDF PGA-401C-A02 401-pin PGA-401C-A02) R401002SC-2-2 PGA-401C-A02 401C
1994 - Not Available

Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 401 PIN CERAMIC PGA- 401C -A04 Lead pitch 1.27mm Pin matrix 30 Sealing method Metal seal 401-pin ceramic PGA (PGA- 401C -A04) 401-pin ceramic PGA (PGA- 401C -A04) 0.20 ± 0.05 DIA (.008 ± .002) 39.37 ± 0.40 SQ (1.550 ± .016) 1.27 ± 0.15 (.050 ± .006) 1.27 (.050) MAX 36.83 (1.450) REF INDEX AREA 1.50 ± 0.03 (.059 ± .0012) INDEX LEAD 3.81 ± 0.30 (.150 ± .012) © 1994 FUJITSU LIMITED R401005SC-1-2 Dimensions in mm (inches). Fujitsu


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PDF PGA-401C-A04 401-pin PGA-401C-A04) R401005SC-1-2
2005 - RS232-PC

Abstract: fujitsu display 30 pin connector MB91230 MB91360 PGA-401C-A02
Text: . 7 1.2 PGA- 401C -A02 Systems , . 9 2 SETTING UP A MB91360 EMULATION SYSTEM (PGA- 401C -A02) . 11 2.1 , SETTING UP A MB91230 EMULATION SYSTEM (PGA- 401C -A02) . 16 3.1 Installing , -01 PGA- 401C -A02 Systems · Evaluation Chip · MB91(F)V360 (FR-50) · · Evaluation Chip , up a MB91360 Emulation System (PGA- 401C -A02) 2 Setting up a MB91360 Emulation System (PGA- 401C


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PDF MCU-AN-391026-E-V12 MB2198-01 MB2198 MB91V230 N-391026-E-V12 RS232-PC fujitsu display 30 pin connector MB91230 MB91360 PGA-401C-A02
2001 - SM750

Abstract: 434 mhz oscillator 4510 pioneer pll SM753 1251C 24-HOUR 1000G1 SM75521C3A
Text: Stability ! 100 ppm standard (! 50 ppm avail) Oper Temp Range -201C ~ 701C (- 401C ~ 851C avail , SPECIFICATIONS OUT + VCC Operating Temp Range -201C ~ 701C (- 401C ~ 851C available) Storage Temp , ~ 701C* SM755 22 = 60/40 %* C = 50 ppm 5 = - 401C ~ 851C A = Bulk (< 500pcs) E = Tape &


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PDF SM750 SM753: SM755: -401C 500pcs) 500pcs SM753 SM755 SM75322B3E 434 mhz oscillator 4510 pioneer pll SM753 1251C 24-HOUR 1000G1 SM75521C3A
2001 - 5001c

Abstract: 1251C 213B 208E
Text: max 50/50 ! 10% standard (50/50 ! 5% available) 50 01C to 701C standard (- 401C to 851C available , Reflow Solderability Packaging TAPE & REEL SPECIFICATIONS 01C to 701C std (- 401C to 851C avail , ~ 701C =- 401C ~ 851C =-101C ~ 701C C 2 PACKAGING FREQUENCY A = Bulk E = Tape & Reel


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PDF -201C -401C -101C 5001c 1251C 213B 208E
2001 - Not Available

Abstract: No abstract text available
Text: (- 401C to 851C available) Logic “0” Level 10% of Vcc max Logic “1” Level 80% of Vcc , (- 401C to 851C available) Storage Temp Range -551C to 1251C Vibration MIL-STD-202F Method 204 , PACKAGING 2 = 01C ~ 701C 3 = -201C ~ 701C 5 = - 401C ~ 851C 7 = -101C ~ 701C* A = Bulk (<500pcs) E


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PDF SM996 SM997 500pcs/reel 500pcs] SM996 SM99621B2E SM99722E2A
1999 - FPT-100P-M05

Abstract: MB89P165-xxxPF MB89P185-xxxPF FPT-208P-M01 DIP-64P-M01 MB86830 FPT-100P-M06 MB90630A
Text: -256C-A02 PGA-299C-A01 PGA- 401C -A02 Package Cross-Reference Matrix Package Cross-Reference Matrix MQP-100C-P01 MQP-100C-P02 PGA-135C-A02 PGA-256C-A02 PGA-299C-A01 X PGA- 401C -A02 X FPT-100P-M06 FPT-100P-M05 FPT , -100C-P02 PGA-135C-A02 PGA-256C-A02 PGA-299C-A01 PGA- 401C -A02 MB89550 MB89590 MB86831-66/80/100PFV , Package Cross-Reference Matrix MQP-100C-P01 MQP-100C-P02 PGA-135C-A02 PGA-256C-A02 PGA-299C-A01 X PGA- 401C , Matrix MQP-100C-P01 MQP-100C-P02 PGA-135C-A02 PGA-256C-A02 PGA-299C-A01 X PGA- 401C -A02 X FPT


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PDF MB86830 MB8694x MB86831-66/80/100PFV MB86832-66/80/100PFV MB86833-66PFV MB86941PFV MB86942PFV DIP-28P-M05 DIP-28P-M03 DIP-48P-M01 FPT-100P-M05 MB89P165-xxxPF MB89P185-xxxPF FPT-208P-M01 DIP-64P-M01 MB86830 FPT-100P-M06 MB90630A
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