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551001

Abstract: 551-008 SMCH1060-551009-T SMCH1060-551014-T SMCH1060-551007-T SMCH1060-551026-T SMCH1060-551001-T 551024
Text: ) Tolerance Test Freq. of L DCR ( max) IDC ( A) SMCH1060-551001- T SMCH1060-551002- T SMCH1060-551003- T SMCH1060-551004-T SMCH1060-551005- T SMCH1060-551006- T SMCH1060-551007- T SMCH1060-551008- T SMCH1060-551009- T SMCH1060-551010- T SMCH1060-551011- T SMCH1060-551012- T SMCH1060-551013- T SMCH1060-551014- T SMCH1060-551015- T SMCH1060-551016- T SMCH1060-551017- T SMCH1060-551018- T SMCH1060-551019- T SMCH1060-551020- T SMCH1060-551021- T SMCH1060-551022- T SMCH1060-551023- T SMCH1060-551024- T SMCH1060-551025- T SMCH1060-551026- T 10 12 15


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PDF 5528E SMCH1060-Series SMCH1060-551001-T SMCH1060-551002-T SMCH1060-551003-T SMCH1060-551004-T SMCH1060-551005-T SMCH1060-551006-T SMCH1060-551007-T SMCH1060-551008-T 551001 551-008 SMCH1060-551009-T SMCH1060-551014-T SMCH1060-551007-T SMCH1060-551026-T SMCH1060-551001-T 551024
scw75

Abstract: No abstract text available
Text: -5 ! J I Outline Drawings 551-002 551-004 0 015 ± .00L ± 025nn> 0.0 1 5 T 'jO l «O 'f i r '- 'i - 0 281nm O 381 f in 0 015 i .001 ± C ic l'jr-V ' 0.0 LS t Ü0I 0 3 8 , 551-004 551-004 551-004 C j represents total capacitance. Maximum C j unbalance @ OV, 1 MHz = .025 pF , available for matched sets. Maximum Ratings t stg Packing Methods 1. Vacuum release gel-pack. 2. W , mil thick, max. : -6 5 ° C to +175°C -6 5 ° C to +150°C T op: P d is s CW: 75 mW


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2002 - Not Available

Abstract: No abstract text available
Text: 0.50 5 2 551-004 DME3930-000 S Medium 300 400 10 0.30 0.50 5 3 551-004 DMJ3931-000 S High 500 600 10 0.30 0.50 5 4 551-004 DMF4102-000 X Low 250 310 10 0.15 0.3 14 2 551-004 DME4101-000 X Medium 325 425 10 0.15 0.3 14 3 551-004 DMJ4103-000 X High 550 650 10 0.15 0.3 14 4 551-004 Bridge Quad (Note 3) Series Pair (Note 3) DMF3932-000 S


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PDF 200793D
551-056

Abstract: DME3927-000 DME3930-000 DME3943-000 DMF3926 DMF3929 DMJ3928-000 DMJ3931-000 DMJ3944-000
Text: 551-002 Bridge Quad3 DMF3929—000 s Low 200 260 10 0.3 0.5 5.0 2 551-004 DME3930-000 s Medium 300 400 10 0.3 0.5 5.0 3 551-004 DMJ3931-000 s High 500 600 10 0.3 0.5 5.0 4 551-004 1. Cj , 3 1E-5 DMJ 9E-13 4 1.04 1.E-11 0.39 0.42 0.69 0.84 2 0.5 3 1E-5 Outline Drawings 551-002 551-004 , „¢ ± ,025nn) 0.015 ± .001 <0.381nn ± .025mn> 0.006 ± .001 <0.18mm ± .025nn) T - 0.006 Â


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PDF 381mm 025mm) 0035X 089mn> 381nn 025nn) 381mn C25nm) 551-056 DME3927-000 DME3930-000 DME3943-000 DMF3926 DMF3929 DMJ3928-000 DMJ3931-000 DMJ3944-000
Not Available

Abstract: No abstract text available
Text: 0.3 0.3 0.5 0.5 0.5 8.0 8.0 8.0 551-004 551-004 551-004 ALPHA INDUSTRIES, INC. · 20 SYLVAN ROAD , of pure gold wire. 5-12 ALPHA INDUSTRIES, INC. · 20 SYLVAN ROAD. WOBURN, MA 01801 T E L (617 , - -2 4 - L -w - 0015 < 0 .3 8 tn r .001 Ï 025nn) S C H E M A T IC .001 (0 3 8 l n n 1 , m ± . 0 2 5 n r . ) T T 0L 8n n : 0.006 t 001 025nn) 5-14 ALPHA INDUSTRIES


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PDF 025nn)
Not Available

Abstract: No abstract text available
Text: 551-002 s s s Low 220 290 10 0.3 0.5 8.0 551-004 Medium 300 525 400 10 0.3 0.5 8.0 551-004 625 10 0.3 0.5 8.0 551-004 Bridge Quad , 01801 T E L (617) 9 35-5150 • FAX: (617) 824-4579 0D0Sb77 433 5 “ 11 Silicon Beamless , .089x.089nn> 4 PLACES t 0.015 ± .001 (0.381m + .025nn> S 1 2 i 0.006 ± .001 T (0.18rw Â


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PDF AK006L1-01 AS004M2-11 AT002N5-00 AK006L1-10 AS004R2-08 AT002N5-01 AK006M1-00 AS004R2-11 AT002N5-10 AK006M1-01
Not Available

Abstract: No abstract text available
Text: 0.3 0.3 0.5 0.5 0.5 8.0 8.0 8.0 551-004 551-004 551-004 ALPHA INDUSTRIES, INC. · 20 SYLVAN ROAD , 5 < .0 8 9 x.0 8 9 n m > 4 P LA C E S i&uS 2 3 C0.381n t 1 .001 ± .025Hn> L 1 Tr 1 ! * 0.006 t .001 <0.18nn j 0 2 5 n n ) 0.006 ± 001 (0 .1 8 n n ± Ü25nm ) J 5-14


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PDF 025mm) 025Hn>
1997 - 5516 DIODE

Abstract: 5516 schottky diode DME3927 IF 5514 5512 DMJ3931 DMJ3928 DMF3929 DMF3926 DME3930
Text: 5.0 5.0 5.0 2 3 4 551­004 551­004 551­004 Ring Quad3 DMF3926­000 DME3927­000 DMJ3928


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2002 - Not Available

Abstract: No abstract text available
Text: 551-004 DME3930-000 S Medium 300 400 10 0.30 0.50 5 3 551-004 DMJ3931-000 S High 500 600 10 0.30 0.50 5 4 551-004 DMF3932-000 S Low 200 , • SILICON BEAMLESS SCHOTTKY DIODES Figure 6. 588-065 Package Dimensions Figure 7. 551-004


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PDF 200793C
2002 - DME3927

Abstract: DME3930 DMF3926 DMF3929 DMJ3928 DMJ3931 551-056
Text: 0.3 0.3 0.3 0.5 0.5 0.5 5 5 5 2 3 4 551­004 551­004 551­004 S S S Low , Sheet · Silicon Beamless Schottky Diodes 551-004 Schematic 3 1 2 0.015 (0.381 mm) ± 0.001


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Not Available

Abstract: No abstract text available
Text: from chart at bottom of page. .025 DIA. .072 DIA. “ T .031 _L .063 DIA. T " T â , part number for your specific requirement. ~ T I .110 .157 - 1 - EXAMPLE OF COMPLETE , and fitted with 551.004 header pins. Pins are gold plated. i .019 DIA. Pin Type 04 For L


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PDF 11x11
1999 - 192-PIN

Abstract: No abstract text available
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 192 PIN PLASTIC BGA-192P-M01 192-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 16 Package width × package length 14.00 × 14.00 mm Sealing method Plastic mold Mounting height 1.45 mm MAX Ball size 0.45 (BGA-192P-M01) 192-pin plastic FBGA (BGA-192P-M01) 14.00±0.10(. 551±.004 )SQ Note: The , 11 10 9 8 7 6 5 4 3 2 1 0.15(.006) INDEX T R P N M L K J H G F E D C B A C0


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PDF BGA-192P-M01 192-pin BGA-192P-M01) B192001S-2C-2
1998 - 192 1C 12

Abstract: B1920
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 192 PIN PLASTIC To Top / Package Lineup / Package Index BGA-192P-M01 192-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 16 Sealing method Plastic mold (BGA-192P-M01) 192-pin plastic FBGA (BGA-192P-M01) 14.00±0.10(. 551±.004 )SQ Note: The actual shape of corners may differ from the dimension. 1.40(.055)MAX (Mounting height) 0.8(.032) TYP 12.00(.472)REF 0.15(.006) INDEX C 1997 FUJITSU LIMITED


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PDF BGA-192P-M01 192-pin BGA-192P-M01) B192001S-1C-1 192 1C 12 B1920
2322 m

Abstract: Lem LT 300 - t lem lt 100 p
Text: . 1.25 W a tt at 40°C N o t Applicable 0 W a tt at 125°C 500 VD C or Power Rating, whichever is less , Resistive E lem ent _ 500 = C a rb o n 5 1 0 - C e rm e t A d ju s tm e n t , Te rm , T o p A djust, Inline Resistance C ode s (C o n s u lt Factory) _ W ith o u t Shaft -25°C to 70°C -25°C to 70',C 290" Nominal. -25°C to 70D C -4 0 'C to , Adjust 1.50- mm f" _M0UNT|NG_ SURFACE 14.0±0.10nvn (. 551±.004 ) /j\_ _ j IL 10.16


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PDF 10nvn 100nmi ft88j) 2322 m Lem LT 300 - t lem lt 100 p
1997 - QFP080-P-1414-1

Abstract: No abstract text available
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 80 PIN PLASTIC FPT-80P-M11 EIAJ code : QFP080-P-1414-1 Lead pitch 0.65mm Package width × package length 14 × 14mm Lead shape Gullwing Sealing method 80-pin plastic LQFP Plastic mold (FPT-80P-M11) 80-pin plastic LQFP (FPT-80P-M11) +0.20 16.00±0.20(.630±.008)SQ 14.00±0.10(. 551±.004 )SQ 60 1.50 -0.10 +.008 .059 -.004 41 61 (Mounting height) 40 12.35 (.486) REF 15.00 (.591) NOM 1 PIN INDEX 80 LEAD


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PDF FPT-80P-M11 QFP080-P-1414-1 80-pin FPT-80P-M11) F80016S-1C-3 0580-P-1414-1 QFP080-P-1414-1
1997 - 0012

Abstract: QFP-168
Text: TEST PAD QFP 168 PIN PLASTIC FPT-168P-M02 Lead pitch 0.30mm Lead shape Gullwing Sealing method Plastic mold 168-pin plastic TPQ (FPT-168P-M02) PRELIMINARY 168-pin plastic TPQ (FPT-168P-M02) 15.46(.609)SQ 1.70(.067)MAX (Mounting height) 14.54(.572)SQ 126 0.10±0.05 (STAND OFF) (.004±.002) 85 84 127 14.00±.004 (. 551±.004 ) SQ 85 18.00±0.20 SQ (.709±.008) 16.00±0.10 SQ (.630±.004) 126 127 84 12.30(.484) 17.00(.669) REF NOM (TOP VIEW


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PDF FPT-168P-M02 168-pin FPT-168P-M02) F168002S-1C-2 0012 QFP-168
1997 - Not Available

Abstract: No abstract text available
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 120 PIN PLASTIC FPT-120P-M05 EIAJ code : QFP120-P-1414-1 Lead pitch 0.40mm Package width × package length 14 × 14mm Lead shape Gullwing Sealing method Plastic mold 120-pin plastic LQFP (FPT-120P-M05) 120-pin plastic LQFP (FPT-120P-M05) +0.20 16.00±0.20(.630±.008)SQ 14.00±0.10(. 551±.004 )SQ 90 1.50 -0.10 +.008 .059 -.004 61 (Mounting height) 0.10±0.10 (STAND OFF) (.004±.004) 91 60 Details


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PDF FPT-120P-M05 QFP120-P-1414-1 120-pin FPT-120P-M05)
1998 - QFP100-P-1414-1

Abstract: No abstract text available
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M05 EIAJ code :QFP100-P-1414-1 100-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold (FPT-100P-M05) 100-pin plastic LQFP (FPT-100P-M05) +0.20 16.00±0.20(.630±.008)SQ 75 1.50 ­0.10 +.008 14.00±0.10(. 551±.004 )SQ 76 (Mouting height


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PDF FPT-100P-M05 QFP100-P-1414-1 100-pin FPT-100P-M05) F100007S-2C-3 QFP100-P-1414-1
P-LFQFP100

Abstract: No abstract text available
Text: (.630±.008)SQ * 14.00±0.10(. 551±.004 )SQ 75 51 76 50 0.08(.003) Details of "A" part +0.20


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PDF FPT-100P-M05 100-pin P-LFQFP100-14 FPT-100P-M05) F100007S-c-4-6 P-LFQFP100
1999 - BGA-77P-M01

Abstract: No abstract text available
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 77 PIN PLASTIC BGA-77P-M01 77-pin plastic FBGA Ball pitch 0.80 mm (Pin pitch) Package width × package length 9.0 × 14.0 mm Sealing method Plastic mold Mounting height 1.40 mm MAX Weight About 0.26 g (BGA-77P-M01) 77-pin plastic FBGA (BGA-77P-M01) 10.40(.409) +0.15 14.00±0.10(. 551±.004 ) 1.25 ­0.10 +.006 .049 ­.004 (Mounting height) 8.80(.346) 7.20(.283) 0.38±0.10 (Stand


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PDF BGA-77P-M01 77-pin BGA-77P-M01) B77001S-1C-1 BGA-77P-M01
1999 - TQFP100

Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width × package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold (FPT-100P-M09) 100-pin plastic TQFP (FPT-100P-M09) 16.00±0.20SQ (.630±.008) 14.00±0.10SQ (. 551±.004 ) 75 +0.13 1.07 ­0.10 +.005 (Mounting height) .042 ­.004 51 76 50 15.00(.591) NOM 12.00(.472


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PDF FPT-100P-M09 TQFP100-P-1414-1 100-pin FPT-100P-M09) F100011S-1C-2 TQFP100
1999 - QFP080-P-1414-1

Abstract: No abstract text available
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC FPT-80P-M11 EIAJ code :QFP080-P-1414-1 80-pin plastic LQFP Lead pitch 0.65 mm Package width × package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold (FPT-80P-M11) 80-pin plastic LQFP (FPT-80P-M11) +0.20 16.00±0.20(.630±.008)SQ 1.50 ­0.10 +.008 14.00±0.10(. 551±.004 )SQ 60 .059 ­.004 41 61 (Mounting height) 40 12.35


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PDF FPT-80P-M11 QFP080-P-1414-1 80-pin FPT-80P-M11) F80016S-1C-3 QFP080-P-1414-1
1998 - QFP080-P-1414-1

Abstract: No abstract text available
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M11 EIAJ code :QFP080-P-1414-1 80-pin plastic LQFP Lead pitch 0.65 mm Package width × package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold (FPT-80P-M11) 80-pin plastic LQFP (FPT-80P-M11) +0.20 16.00±0.20(.630±.008)SQ 1.50 ­0.10 +.008 14.00±0.10(. 551±.004 )SQ 60 .059 ­.004 41 61


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PDF FPT-80P-M11 QFP080-P-1414-1 80-pin FPT-80P-M11) F80016S-1C-3 QFP080-P-1414-1
1999 - 9806

Abstract: diode 9806 FPT-56P-M01
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 56 PIN PLASTIC FPT-56P-M01 56-pin plastic TSOP (I) Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-56P-M01) 56-pin plastic TSOP (I) (FPT-56P-M01) +0.05 0.10(.004) M 0.20 ­0.04 1.20(.047)MAX (Mounting height) +.002 .008 ­.002 LEAD No. 1 56 INDEX 14.00±0.10 (. 551±.004 ) 0.50(.020) TYP 28 13.50 (.532) REF


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PDF FPT-56P-M01 56-pin FPT-56P-M01) F56001S-3C-4 9806 diode 9806 FPT-56P-M01
1997 - QFP100-P-1414-1

Abstract: No abstract text available
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 100 PIN PLASTIC FPT-100P-M05 EIAJ code : QFP100-P-1414-1 Lead pitch 0.50mm Package width × package length 14 × 14mm Lead shape Gullwing Sealing method 100-pin plastic LQFP Plastic mold (FPT-100P-M05) 100-pin plastic LQFP (FPT-100P-M05) +0.20 16.00±0.20(.630±.008)SQ 75 1.50 -0.10 +.008 .059 -.004 51 14.00±0.10(. 551±.004 )SQ 76 (Mounting height) 50 12.00 (.472) REF 15.00 (.591) NOM


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PDF FPT-100P-M05 QFP100-P-1414-1 100-pin FPT-100P-M05) QFP100-P-1414-1
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