SL2ICS5101EW/V7 Search Results
SL2ICS5101EW/V7 Datasheets (2)
Part | ECAD Model | Manufacturer | Description | Curated | Type | |
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SL2ICS5101EW/V7 |
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Data sheet addendum; SL2ICS5101EW/V7 Bumped sawn wafer on UV-tape specification | Original | |||
SL2ICS5101EW/V7,00 |
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SL2ICS5101EW/V7 - SL2 ICS50/SL2 ICS51 ICODE SLI-L/ I CODE SLI-L/HC, NAU000 Package, No Marking, Chips On Wafer, Pre-Sawn, On FFC | Original |
SL2ICS5101EW/V7 Price and Stock
NXP Semiconductors SL2ICS5101EW/V7,00IC I-CODE SLI SMART LABEL DIE |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SL2ICS5101EW/V7,00 | Bulk |
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Buy Now | |||||||
NXP Semiconductors SL2ICS5101EW/V7,005Dedicated Chip For Smart Lapel Applications FFC Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SL2ICS5101EW/V7,00) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SL2ICS5101EW/V7,005 | Waffle Pack | 28,477 |
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