Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SIGC186T170R3 Search Results

    SF Impression Pixel

    SIGC186T170R3 Price and Stock

    Infineon Technologies AG SIGC186T170R3EX1SA

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC186T170R3EX1SA)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC186T170R3EX1SA Waffle Pack 1,233
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $30.80265
    Buy Now

    Infineon Technologies AG SIGC186T170R3X1SA3

    Trans IGBT Chip N-CH 1.7KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC186T170R3X1SA3)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC186T170R3X1SA3 Waffle Pack 17
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    Get Quote

    SIGC186T170R3 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SIGC186T170R3 Infineon Technologies For drive application, Trench-and Fieldstop technology Original PDF