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SEAFP-50-05.0-L-06 Samtec Inc Samtec - $14.74 $9.52
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SEAFP-50-05.0-L-06 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2014 - Not Available

Abstract: No abstract text available
Text: F-214 (Rev 13AUG14) SEAFP–20–05.0–S– 06 SEAFP–30–05.0–L–04 (1,27 mm) .050" SEAFP SERIES PRESS FIT OPEN PIN FIELD ARRAY SPECIFICATIONS Low insertion/extraction force Mates with: SEAM, SEAM-RA, SEAMP For complete specifications and recommended PCB layouts see , area, Matte Tin on solder tail – 06 = Six Rows –S = 30µ" (0,76 µm) Gold on contact area, Matte Tin on solder tail NO. OF ROWS No. of positions x (1,27) .050 + (5,82) .229 –04 06 – 06


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PDF F-214 13AUG14)
2013 - Not Available

Abstract: No abstract text available
Text: .050 1.27 C L .321 8.15 REF .100 2.54 REF (TYP) SEAFP-XX-XX.X- 06 -X .040 1.02 REF , C L C L .221 5.61 REF .117 2.97 REF (TYP) SEAFP-XX-XX.X- 06 -LP "G" REF FIG 5 -LP , * -06.0: .237[6.02] HEIGHT * -07.0: .276[7.01] HEIGHT PLATING SPECIFICATION - L : 10 u" SELECTIVE GOLD IN , ON TAIL (USE C-365-XX.X-S) ROW -04: 4 ROWS (SEE FIG 4, SHT 2) - 06 : 6 ROWS (SEE FIG 3, SHT 2 , SHOWN FOR CLARITY) (NOT TOOLED) C L .074 1.88 REF .361 9.17 REF .421 10.69 REF .200 5.08


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PDF C-365-XX
2014 - Not Available

Abstract: No abstract text available
Text: .169 4.29 REF .050 1.27 C L .321 8.15 REF .100 2.54 REF (TYP) SEAFP-XX-XX.X- 06 , * -06.0: .237[6.02] HEIGHT * -07.0: .276[7.01] HEIGHT PLATING SPECIFICATION - L : 10 u" SELECTIVE GOLD IN , ON TAIL (USE C-365-XX.X-S) ROW -04: 4 ROWS (SEE FIG 4, SHT 2) - 06 : 6 ROWS (SEE FIG 3, SHT 2 , SHOWN FOR CLARITY) (NOT TOOLED) C L .074 1.88 REF .361 9.17 REF .421 10.69 REF .200 5.08 , C .521 13.23 REF C L .100 2.54 REF (TYP) C L .172 4.37 REF .300 7.62 REF


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PDF C-365-XX
2012 - Not Available

Abstract: No abstract text available
Text: F-212 SEAFP–20–05–S– 06 SEAFP–30–05–L–04 (1,27mm) .050" SEAFP SERIES PRESS FIT OPEN PIN FIELD ARRAY SPECIFICATIONS Low insertion/extraction force Mates with: SEAM, SEAM-RA, SEAMP For complete specifications and recommended PCB layouts see www.samtec.com?SEAFP , area, Matte Tin on solder tail (Per Row) – 06 = Six Rows –S = 30µ" (0,76µm) Gold on , ROWS 06 6 –0 –04 – 06 A (1,27) .050 1,27) 01 1 (1,78) .070 (5,00 (5,00


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PDF F-212
2013 - Not Available

Abstract: No abstract text available
Text: F-213 SEAFP–20–05–S– 06 SEAFP–30–05–L–04 (1,27 mm) .050" SEAFP SERIES PRESS FIT OPEN PIN FIELD ARRAY SPECIFICATIONS Low insertion/extraction force Mates with: SEAM, SEAM-RA, SEAMP For complete specifications and recommended PCB layouts see www.samtec.com?SEAFP , area, Matte Tin on solder tail (Per Row) – 06 = Six Rows –S = 30µ" (0,76 µm) Gold on , ROWS 06 6 –0 –04 – 06 A (1,27) .050 1,27) 01 1 (1,78) .070 (5,00 (5,00


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PDF F-213
Not Available

Abstract: No abstract text available
Text: www.samtec.com?SEAFP L o w insertio n /e xtra ctio n force / Mates with: SEAM, SEAM-RA, SADL, SEAMP Insu , 5 5 " N O M IN A L W IP E P ress fit tails SEAFP D NO. OF posmoNS D D 05 NO. OF ROWS PLATING OPTION -0 4 - 10, - 20, - 30,-40 (Per Row) - L = Four Rows = 10p , SAMTEC GERMANY • Tel: +49 (0) 89 /89460-0 SAMTEC FRANCE • Tel: 33 01 60 95 06 60 SAMTEC ITALY â


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PDF
2013 - Not Available

Abstract: No abstract text available
Text: F-213-1 SEAFP–20–05.0–S– 06 SEAFP–30–05.0–L–04 (1,27 mm) .050" SEAFP SERIES PRESS FIT OPEN PIN FIELD ARRAY SPECIFICATIONS Low insertion/extraction force Mates with: SEAM, SEAM-RA, SEAMP For complete specifications and recommended PCB layouts see , €“ 20, – 30, –40 = 10µ" (0,25 µm) Gold on contact area, Matte Tin on solder tail – 06 = , positions x (1,27) .050 + (5,82) .229 NO. OF ROWS 06 –04 – 06 A (1,27) .050 01 (1


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PDF F-213-1
2011 - Not Available

Abstract: No abstract text available
Text: F-211-1 SEAFP–20–05–S– 06 SEAFP–30–05–L–04 (1,27mm) .050" SEAFP SERIES PRESS FIT OPEN PIN FIELD ARRAY SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SEAFP Low insertion/extraction force Mates with: SEAM, SEAM-RA, SADL , ) Gold on contact area, Matte Tin on solder tail (Per Row) – 06 = Six Rows –S = 30µ" (0 , NO. OF O O ROWS 06 6 –0 –04 – 06 A (1,27) .050 1,27) 01 1 (1,78) .070


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PDF F-211-1
Not Available

Abstract: No abstract text available
Text: O perating Temp Range: -40°C to +100°C RoHS C om pliant: Yes D iffe re n tia l o r S in g le -E n d e d s ig n a l routing .raw C O N TAC T' APPLICATION SPECIFIC OPTION Other sizes , €¢ Tel: 33 01 60 95 06 60 SAMTEC ITALY • Tel: 39 039 6890337 SAMTEC NORDIGBALTIC • Tel: *46-84477280


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2011 - Not Available

Abstract: No abstract text available
Text: 0.5 0.6 -0.1 - 0.6 -1.2 -0.4 -0.1 Tracking Code: 105823_Report_Rev_1 Part #: SEAF- 50-05.0-L , -0.5 -0.5 -0.1 -1.0 - 0.6 Tracking Code: 105823_Report_Rev_1 Part #: SEAF- 50-05.0-L , : 105823_Report_Rev_1 Date: 1/13/2011 Part #: SEAF- 50-05.0-L -06-2-A-K-TR / SEAM-50-02.0- L , SEAF / SEAM SEAF- 50-05.0-L -06-2-A-K-TR / SEAM-50-02.0- L -06-2-A-K-TR Page 1 of 35 Tracking Code: 105823_Report_Rev_1 Part #: SEAF- 50-05.0-L -06-2-A-K-TR / SEAM-50-02.0- L -06-2-A-K-TR Part description


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PDF SEAF-50-05 0-L-06-2-A-K-TR SEAM-50-02 0-L-06-2-A-K-TR
Not Available

Abstract: No abstract text available
Text: Infiniband PISMO 2 VITA 47 VITA 57 fina l i nch.com 7mm Stack Height Rated @ 3dB Insertion Loss , TYPE A K ­A TR ­ L = 10µ" (0,25µm) Gold on contact area, Matte Tin on solder tail ­2 ­ , (­10 only available in 04 row) (­15 only available in 10 row) NO. OF ROWS ­04 ­05, ­ 06 ­08 ­10 = Alignment Pins (Required. Arrays will not self-center on solder pads) B (7, 06 ) .278 (9,60) .378 (12,14 , 06 =Six Rows (­06.5 not available) DIFFERENTIAL (1,27) .050 (1,27) .050 (1,27) .050 B ­ 08


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PDF F-211-2 50x10 40x10
Not Available

Abstract: No abstract text available
Text: F-211-1 (1,27mm) .050" SEAM-RA, SEAM-GP SERIES SEAM­30­02.0­ L ­04­2­A­GP­K­TR SEAM­20­01­ L , , ­50 ­ L = 10µ" (0,25µm) Gold on contact area, Matte Tin on solder tail ­ 04 =Four Rows ­2 = Lead-Free Tin Alloy 95.5% Sn/ 3.8% Ag/ 0.7% Cu Solder Charge = Guide Post ­ TR =Tape & Reel ­ 06 , 2 A GP K TR ­K ­ 20, ­ 30, ­40, ­50 ­ L = 10µ" (0,25µm) Gold on contact area , ­ 06 =Six Rows ­ TR =Tape & Reel (Not available with 50 positions) ­ 08 =Eight Rows 06


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PDF F-211-1
VITA57

Abstract: 20x5
Text: recommended. Solder charges ® fina l i nch.com CURRENT RATING Rated @ 3dB Insertion Loss with PCB , Specify LEAD STYLE from chart PLATING OPTION NO. OF ROWS SOLDER TYPE A K ­A TR ­ L = , only available in 10 row) NO. OF ROWS ­04 ­05, ­ 06 ­08 ­10 = Alignment Pins (Required. Arrays will not self-center on solder pads) B (7, 06 ) .278 (9,60) .378 (12,14) .478 (14,68) .578 01 ­S = , Contact SIG on protocols for questions ­ TR =Tape & Reel TM ­ 06 =Six Rows (­06.5 not available


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PDF F-212 charges040 50x10 40x10 VITA57 20x5
2013 - Not Available

Abstract: No abstract text available
Text: (0,25 µm) Gold on contact area, Matte Tin on solder tail – 06 = Six Rows –S – 08 , RECOGNITIONS – 20, – 30, –40, –50 06 (3,05) .120 DIA PLATING OPTION 02.0 – 04 –L =Four Rows = 10µ" (0,25 µm) Gold on contact area, Matte Tin on solder tail – 06


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PDF F-214
Not Available

Abstract: No abstract text available
Text: F-212 (1,27mm) .050" SEAM-RA, SEAM-GP SERIES SEAM­30­02.0­ L ­04­2­A­GP­K­TR SEAM­20­01­ L , Solderable: Yes ­ GP ­ 20, ­ 30, ­40, ­50 ­ L = 10µ" (0,25µm) Gold on contact area, Matte Tin on solder , Guide Post ­ TR =Tape & Reel ­ 06 =Six Rows SEAM-RA/SEAF-RA Rated @ 3dB Insertion Loss , 2 A GP K TR ­K ­ 20, ­ 30, ­40, ­50 ­ L = 10µ" (0,25µm) Gold on contact area , ­ 06 =Six Rows ­ TR =Tape & Reel (Not available with 50 positions) ­ 08 =Eight Rows 06


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PDF F-212
2011 - Not Available

Abstract: No abstract text available
Text: ) (–15 only available in 10 row) NO. OF ROWS –04 –05, – 06 –08 –10 notes at , DIFFERENTIAL (1,27) .050 (1,27) .050 PAIR ARRAY COUNT 50x10 50x8 40x10 125 100 100 l i , (–06.5 not available) (1,27) .050 (1,02) .040 TR –K – 06 B No. of , solder tail (7, 06 ) .278 –A – 04 –S B SOLDER TYPE –L = 10µ" (0,25µm


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PDF F-211-1
thermotron sm 32

Abstract: Seaf SEAM-50 Thermotron OV-03 Keithley 138 30274 50090 LC2500
Text: Part #: mated with SEAF- 50-05.0 -S-10-2-A Product Rev: E Lot #: 1 Part description: NR-SEAM-50-09.0-S-10-2-A Test Start: 11/15/ 06 Tech: Troy Cook Eng: Dave Scopelliti Qty to test: 50 Test Completed: 12/18/2006 DVT TEST REPORT SEAF- 50-05.0 -S-10-2-A mated with SEAM-50-9.0-10-2-A Page 1 of 21 Tracking Code: TC0645-1204 Part #: mated with SEAF- 50-05.0 -S-10-2-A Part description: NR-SEAM , Technology (NIST) traceable standards according to IS0 10012- l and ANSI/NCSL 2540-1, as applicable. All


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PDF TC0645--1204 SEAF-50-05 0-S-10-2-A NR-SEAM-50-09 0-S-10-2-A SEAM-50-9 thermotron sm 32 Seaf SEAM-50 Thermotron OV-03 Keithley 138 30274 50090 LC2500
2011 - Not Available

Abstract: No abstract text available
Text: OVERALL LENGTH SIGNAL ROUTING –10.00 SADL – 06 –20, –30 = 3 layer flex –DP , S S S G G G G G G 06 06 G G G G G G S S S S S S G G G G G G , + + - G G G G G G 06 06 06 06 01 01 –20= (33,0) 1.30 â


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PDF F-211-1
2006 - code for pn generator in digital

Abstract: direct sequence spread spectrum AMIS-50050 direct sequence spread spectrum BPSK GOLD CODE 4 bit pn sequence generator pn sequence generator
Text: Semiconductor ­ Sept. 06 www.amis.com 1 AMIS- 50050 : Spread Spectrum Baseband Controller Wireless Products 3.0 Block Diagram Figure 1: AMIS- 50050 Block Diagram AMI Semiconductor ­ Sept. 06 , 1.27mm AMI Semiconductor ­ Sept. 06 www.amis.com 3 Data Sheet AMIS- 50050 : Spread , 0.50mm 68 Lead TQFP AMI Semiconductor ­ Sept. 06 www.amis.com 4 Data Sheet AMIS- 50050 , , 50pF load using indicated condition. AMI Semiconductor ­ Sept. 06 www.amis.com 7 AMIS- 50050


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PDF AMIS-50050: AMIS-50050 AMIS-5005x code for pn generator in digital direct sequence spread spectrum direct sequence spread spectrum BPSK GOLD CODE 4 bit pn sequence generator pn sequence generator
2006 - 11564-503

Abstract: AMI Semiconductor DSP AMIS-50051 dsss demodulator AMIS-50050 AMIS50051 11564-504-XTP direct sequence spread spectrum AMI Semiconductor
Text: -50051 is a small digital demodulator, specially developed to work with the AMIS- 50050 spread spectrum , tracking output to AMIS- 50050 (Please refer to the AMIS- 50050 spread spectrum baseband controller.) Fully , of a direct sequence spread spectrum system. This output is a voltage, which the AMIS- 50050 (please refer to AMIS- 50050 spread spectrum baseband controller) uses to change the phase of the receiver's PN , with the AMIS- 50050 to simplify the design effort of a wireless communication link. AMI


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PDF AMIS-50051: AMIS-50051 AMIS-50050 AMIS-50050 11564-503 AMI Semiconductor DSP dsss demodulator AMIS50051 11564-504-XTP direct sequence spread spectrum AMI Semiconductor
2014 - Not Available

Abstract: No abstract text available
Text: ) 1.770 (57,66) 2.270 0 (70,36) (7 ) 2.770 2 (83, 06 ) (8 3.270 3 (36,45) ,45) 1.435 35


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PDF F-214 12AUG14)
2013 - Not Available

Abstract: No abstract text available
Text: data. Complete test data available at www.samtec.com?SEAM-RA or contact sig@samtec.com – 06 , solder tail Note: Other Gold plating options available. Contact Samtec. =Four Rows – 06 =Six , 06 = Polyimide film Pick & Place Pad – TR =Tape & Reel (Not available with 50


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PDF F-213
2013 - Not Available

Abstract: No abstract text available
Text: available in 10 row) NO. OF ROWS –04 –05, – 06 –08 –10 100 GbE el ibre Chann F apid I , 30µ" (0,76 µm) Gold on contact area, Matte Tin on solder tail (7, 06 ) .278 (9,60) .378 (12,14 , €“06.5 not available) –2 –K = Polyimide film Pick & Place Pad – TR =Tape & Reel – 06


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PDF F-214 Resis13 50x10 40x10 30x10 20x10
1998 - rkm 3B

Abstract: SO2484 BCW67E
Text: 0.7 0 7 0.7 0.7 l O 75 '0.75 '0.72 l 0.72 '0.75 l 0.72 '0.75 '0.75 '0.75 '0.75 '0.75 '0.72 l 0.72 ImAmA 50050 50050 50050 50050 50050 50050 50050 50050 50050 50050 50050 50050 100.5 100.5 1005 1100.5 10 , 'Leadcode: 1 VBEsaf = "BEiON) l vBEsat = fyp/ca/ value V V 5 5 5 5, 5 5 5 5 5 ~ 5 5 5 6 6 5 5 6 6 6 5 , 100 100 100 100 200 200 200 200 200 200 200 200 200 200 200 200 200 250 l /l00 400 1'100 600 i 1'100 250 l /,100 400 1'100 600 1100 250 1100 400 1100 600 1100 250 1100 400 IL100 600 1100 220 450 250 475


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2013 - Not Available

Abstract: No abstract text available
Text: . RA –1 – 06 = Six Rows SEAM-RA/SEAF-RA –20 SOLDER TYPE SOLDER TYPE (0,64) .025 A GP = Tin/Lead Alloy Solder Charge – 06 – 08 = Polyimide film Pick & , K 06 =Tape & Reel (Not available with 50 positions) – 10 =Ten Rows No. of


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PDF F-213-1
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