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2012 - DTC114TET1

Abstract: No abstract text available
Text: housed in the SC−75 /SOT−416 package which is designed for low power surface mount applications , Component Count The SC−75 /SOT−416 Package Can be Soldered Using Wave or Reflow The Modified , BIAS RESISTOR TRANSISTORS PIN 1 BASE (INPUT) Symbol Value 50 2 1 SC−75 (SOTâ , MARKING and RESISTOR VALUES Device SC−75 /SOT−416 (Pb−Free) SC−75 /SOT−416 (Pb−Free) SC−75 /SOT−416 (Pb−Free) 3000 Tape & Reel 3000 Tape & Reel 3000 Tape & Reel SC−75 /SOTâ


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PDF DTC114EET1 SDTC114EET1 75/SOTâ DTC114EET1/D DTC114TET1
DTA115EET1

Abstract: No abstract text available
Text: device is housed in the SC−75 /SOT−416 package which is designed for low power surface mount applications. http://onsemi.com PNP SILICON BIAS RESISTOR TRANSISTORS SC−75 (SOT−416) CASE 463 , Space Reduces Component Count The SC−75 /SOT−416 package can be soldered using wave or reflow. The , 3,000 Tape & Reel 3,000 Tape & Reel 3,000 Tape & Reel 3,000 Tape & Reel 3,000 Tape & Reel SC−75 (Pb−Free) 3,000 Tape & Reel 3,000 Tape & Reel SC−75 (Pb−Free)  3,000 Tape & Reel


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PDF DTA114EET1 SDTA114EET1 75/SOTâ DTA114EET1/D DTA115EET1
2005 - Not Available

Abstract: No abstract text available
Text: applications. The DAP222 device is housed in the SC−75 /SOT−416 package which is designed for low power , SC−75 CASE 463 STYLE 4 3 NB M G G 1 2 P9, NB = Device Codes M = Date Code* G = , vary depending upon manufacturing location. ORDERING INFORMATION Package Shipping †SC−75 3000 / Tape & Reel DAP222G SC−75 (Pb−Free) 3000 / Tape & Reel DAP202U SC−70 3000 / Tape & Reel DAP202UG SC−70 (Pb−Free) 3000 / Tape & Reel DAP222T1 SC−75


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PDF DAP222, DAP202U DAP222 75/SOTâ DAP202U 70/SOTâ DAP222/D
Not Available

Abstract: No abstract text available
Text: designed for general purpose amplifier applications. This device is housed in the SC−75 /SOT-416 package , NPN GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNT SC−75 CASE 463−01 STYLE 1 , SC−75 (Pb−Free) 3,000/Tape & Reel 2SC4617T1G November, 2011 − Rev. 5 SC−75 , Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Package SC−75 (Pb−Free , 40 2SC4617G, S2SC4617G PACKAGE DIMENSIONS SC−75 /SOT−416 CASE 463−01 ISSUE F NOTES


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PDF 2SC4617G, S2SC4617G 75/SOT-416 inch/3000 2SC4617/D
2004 - Not Available

Abstract: No abstract text available
Text: These transistors are designed for general purpose amplifier applications. They are housed in the SC−75 , implied, damage may occur and reliability may be affected. 3 2 1 CASE 463 SC−75 /SOT−41 6 , , BC847BTT1, BC847CTT1 ORDERING INFORMATION Marking Package Shipping†BC847ATT1 1E SC−75 /SOT−416 3,000 / Tape & Reel BC847BTT1 1F SC−75 /SOT−416 BC847BTT1G 1F SC−75 /SOT−416 (Pb−Free) BC847CTT1 1G SC−75 /SOT−416 BC847CTT1G 1G SC−75 /SOTâ


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PDF BC847ATT1, BC847BTT1, BC847CTT1 75/SOTâ BC847ATT1/D
2014 - Not Available

Abstract: No abstract text available
Text: designed for general purpose amplifier applications. This device is housed in the SC−75 /SOT-416 package , GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNT SC−75 CASE 463−01 STYLE 1 COLLECTOR 3 , manufacturing location. ORDERING INFORMATION Device 1 3,000/Tape & Reel SC−75 (Pb−Free) 3,000/Tape & Reel 2SC4617T1G July, 2014 − Rev. 6 SC−75 (Pb−Free) S2SC4617G  , Techniques Reference Manual, SOLDERRM/D. Package SC−75 (Pb−Free) 3,000/Tape & Reel †For


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PDF 2SC4617G, S2SC4617G 75/SOT-416 inch/3000 2SC4617/D
2014 - NVA4153NT1G

Abstract: No abstract text available
Text: with ESD Protection, SC−75 and SC−89 http://onsemi.com Features • • • • â , =10 ms Operating Junction and Storage Temperature 3 1 660 PD 2 SC−75 / SOTâ , ) *Date Code orientation may vary depending upon manufacturing location. SC−75 , SC−89 THERMAL RESISTANCE RATINGS Parameter Symbol Junction−to−Ambient − Steady State (Note 1) SC−75 / SOTâ , Marking (XX) Package Shipping†NTA4153NT1 TR SC−75 / SOT−416 3000 / Tape & Reel


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PDF NTA4153N, NTE4153N, NVA4153N, NVE4153N NTA4153N/D NVA4153NT1G
2006 - Not Available

Abstract: No abstract text available
Text: NTA4151P, NTE4151P Small Signal MOSFET −20 V, −760 mA, Single P−Channel, Gate Zener, SC−75 , and Longer Battery Life Small Outline Package (1.6 x 1.6 mm) SC−75 Standard Gullwing Package ESD , Current (Note 1) Power Dissipation (Note 1) SC−75 SC−89 Pulsed Drain Current Steady State , ˆ’ (Human Body Model, Method 3015) SC−75 / SOT−416 CASE 463 STYLE 5 3 Drain xx M G G 3 2 , Junction−to−Ambient − Steady State (Note 1) SC−75 SC−89 1 RqJA °C/W 415 400 Stresses exceeding


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PDF NTA4151P, NTE4151P NTA4151P/D
2012 - Not Available

Abstract: No abstract text available
Text: designed for general purpose amplifier applications. This device is housed in the SC−75 /SOT−416/SCâ , * SC−75 CASE 463−01 STYLE 1 COLLECTOR 3 MAXIMUM RATINGS (TA = 25°C) Symbol Value Unit , 1 3,000/T ape & Reel SC−75 (Pb−Free) 3,000/T ape & Reel 2SA1774T1G January, 2012 − Rev. 8 SC−75 (Pb−Free) S2SA1774G © Semiconductor Components Industries, LLC , , SOLDERRM/D. Package SC−75 (Pb−Free) 3,000/T ape & Reel †For information on tape and


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PDF 2SA1774G, S2SA1774G 75/SOTâ 416/SCâ inch/3000 2SA1774/D
2011 - Not Available

Abstract: No abstract text available
Text: , SC−75 Features • • • • • http://onsemi.com Low Gate Charge for Fast , ms Gate mA Power Dissipation (Note 1) SC−75 (3−Leads) °C Pulsed Drain Current , . 2 MARKING DIAGRAM 3 2 TF MG SC−75 / SOT−416 G CASE 463 1 2 STYLE 5 TF = Specific , Shipping†NTA4001NT1G SC−75 (Pb−Free) 3000 / Tape & Reel NVA4001NT1G SC−75 , Brochure, BRD8011/D. http://onsemi.com 4 NTA4001N, NVA4001N PACKAGE DIMENSIONS SC−75 / SOTâ


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PDF NTA4001N, NVA4001N NTA4001N/D
2006 - 4A2 zener diode

Abstract: No abstract text available
Text: Features • • • • • • SC−75 Package Allows Two Separate Unidirectional , DIAGRAM 3 1 2 56 M G G SC−75 CASE 463 STYLE 4 1 Mechanical Characteristics â , . ORDERING INFORMATION Device NZL5V6ATT1 NZL5V6ATT1G Package Shipping†SC−75 3000/Tape & Reel SC−75 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications , . Forward Current versus Forward Voltage http://onsemi.com 3 NZL5V6ATT1 PACKAGE DIMENSIONS SC−75


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PDF
2006 - Not Available

Abstract: No abstract text available
Text: G G SC−75 CASE 463 STYLE 4 Cellular Phones Communication Systems Computers Portable , INFORMATION Device NZF220TT1 NZF220TT1G Package Shipping†SC−75 3000/Tape & Reel SC−75 , 3000 NZF220TT1 OUTLINE DIMENSIONS SC−75 /SOT−416 CASE 463−01 ISSUE F −E− NOTES


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PDF NZF220TT1 IEC61000â 46TION NZF220TT1/D
2007 - Not Available

Abstract: No abstract text available
Text: NTA4153N, NTE4153N Small Signal MOSFET 20 V, 915 mA, Single N−Channel with ESD Protection, SC−75 , IDM 1.3 A TJ, TSTG −55 to 150 280 SC−75 / SOT−416 CASE 463 2 STYLE 5 °C , Junction−to−Ambient − Steady State (Note 1) SC−75 / SOT−416 SC−89 Value Units RqJA °C/W 416 , orientation may vary depending upon manufacturing location. SC−75 , SC−89 Stresses exceeding Maximum , € NTA4153NT1 TR SC−75 / SOT−416 3000/Tape & Reel NTA4153NT1G TR SC−75 / SOTâ


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PDF NTA4153N, NTE4153N NTA4153N/D
Not Available

Abstract: No abstract text available
Text: Compliant* CASE 463 SC−75 /SOT−416 STYLE 4 MAXIMUM RATINGS (TA = 25C) Symbol Max Reverse , € BAW56TT1G SC−75 /SOT−416 (Pb−Free) 3,000 / Tape & Reel SBAW56TT1G SC−75 /SOTâ , BAW56TT1G, SBAW56TT1G PACKAGE DIMENSIONS SC−75 /SOT−416 CASE 463−01 ISSUE F −E− NOTES


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PDF BAW56TT1G, SBAW56TT1G 75/SOTâ BAW56TT1/D
2014 - Not Available

Abstract: No abstract text available
Text: provide best in class protection from IC damage due to ESD. The small SC−75 package is ideal for , orientation may vary depending upon manufacturing location. SC−75 (Pb−Free) 3000/Tape & Reel , Symbol Shipping†ESDR0502BT1G Value Unit ±8.0 Contact Package SC−75 , : Void-free, transfer-molded, thermosetting plastic IEC 61000−4−2 (ESD) 1 2 SC−75 CASE 463 , , SZESDR0502B PACKAGE DIMENSIONS SC−75 /SOT−416 CASE 463−01 ISSUE F −E− NOTES: 1


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PDF ESDR0502B, SZESDR0502B ESDR0502B ESDR0502B ESDR0502B/D
2014 - Not Available

Abstract: No abstract text available
Text: NVA4153N, NVE4153N Small Signal MOSFET 20 V, 952 mA, Single N−Channel with ESD Protection, SC−75 , °C Parameter Symbol Value Units Junction−to−Ambient − Steady State (Note 1) SC−75 , ) 2 1 SC−75 / SOT−416 CASE 463 2 STYLE 5 3 SC−89 CASE 463C 2 1 THERMAL , manufacturing location. °C/W 416 400 3 Drain SC−75 , SC−89 Gate 1 Stresses exceeding , € NVA4153NT1G VR SC−75 / SOT−416 (Pb−Free) 3000 / Tape & Reel NVE4153NT1G VP SCâ


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PDF NVA4153N, NVE4153N NTA4153N/D
Not Available

Abstract: No abstract text available
Text: 1.8 30 VOLT DUAL COMMON CATHODE SCHOTTKY BARRIER DIODES SC−75 CASE 463 STYLE 3 1 ANODE , depending upon manufacturing location. ORDERING INFORMATION Package Shipping†BAT54CTT1G SC−75 (Pb−Free) 3,000 / Tape & Reel SBAT54CTT1G SC−75 (Pb−Free) 3,000 / Tape & Reel Device , 30 BAT54CTT1G, SBAT54CTT1G PACKAGE DIMENSIONS SC−75 / SOT−416 CASE 463−01 ISSUE F


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PDF BAT54CTT1G, SBAT54CTT1G BAT54CTT1/D
2011 - Not Available

Abstract: No abstract text available
Text: , SC−75 http://onsemi.com Features • • • • • Low Gate Charge for Fast , ms Gate mA Power Dissipation (Note 1) SC−75 (3−Leads) °C Pulsed Drain Current , . Parameter 3 3 2 T6 MG SC−75 / SOT−416 G CASE 463 1 2 STYLE 5 T6 = Specific Device Code , Package Shipping†NTA7002NT1G SC−75 (Pb−Free) 3000 / Tape & Reel NVA7002NT1G SC−75 , , BRD8011/D. http://onsemi.com 4 NTA7002N, NVA7002N PACKAGE DIMENSIONS SC−75 / SOT−416 CASE


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PDF NTA7002N, NVA7002N NTA7002N/D
2014 - Not Available

Abstract: No abstract text available
Text: class protection from IC damage due to ESD. The small SC−75 package is ideal for designs where board , vary depending upon manufacturing location. SC−75 (Pb−Free) 3000/Tape & Reel , Symbol Shipping†ESDR0502BT1G Value Unit ±8.0 Contact Package SC−75 , : Void-free, transfer-molded, thermosetting plastic IEC 61000−4−2 (ESD) 1 2 SC−75 CASE 463 , 80 ESDR0502B PACKAGE DIMENSIONS SC−75 /SOT−416 CASE 463−01 ISSUE F −E− NOTES


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PDF ESDR0502B ESDR0502B ESDR0502B/D
2012 - Not Available

Abstract: No abstract text available
Text: Conditions may affect device reliability. SC−75 CASE 463 STYLE 1 XX M Vdc SC−70/SOTâ , MUN5131T1G, NSVMUN5131T1G 6H SC−70/SOT−323 3,000 / Tape & Reel DTA123EET1G 6H SC−75 , (mW) 300 250 (1) SC−75 and SC−70/SOT−323; Minimum Pad (2) SC−59; Minimum Pad (3) SOTâ , Temperature Range THERMAL CHARACTERISTICS ( SC−75 ) (DTA123EE) Total Device Dissipation TA = 25°C (Note , , MMUN2131L, MUN5131, DTA123EE, DTA123EM3 PACKAGE DIMENSIONS SC−75 /SOT−416 CASE 463 ISSUE F NOTES: 1


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PDF MUN2131, MMUN2131L, MUN5131, DTA123EE, DTA123EM3 DTA123E/D
2010 - Not Available

Abstract: No abstract text available
Text: class protection from IC damage due to ESD. The small SC−75 package is ideal for designs where board , SC−75 CASE 463 STYLE 4 AD M G G 1 0.063” x 0.063” (1.60 mm x 1.60 mm) Low Body Height , °C Package SC−75 (Pb−Free) 3000/Tape & Reel Device Meets MSL 1 Requirements MAXIMUM RATINGS , Waveform http://onsemi.com 3 80 ESDR0502B PACKAGE DIMENSIONS SC−75 /SOT−416 CASE 463−01


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PDF ESDR0502B ESDR0502B ESDR0502B/D
2012 - Not Available

Abstract: No abstract text available
Text: XX M SC−75 CASE 463 STYLE 1 XX M MAXIMUM RATINGS (TA = 25°C) Rating SOT−723 CASE , 6N SC−75 3,000 / Tape & Reel DTA115EM3T5G 6N SOT−723 8,000 / Tape & Reel , (mW) 300 250 200 150 (1) SC−75 and SC−70/SOT−323; Minimum Pad (2) SC−59; Minimum Pad , Temperature Range THERMAL CHARACTERISTICS ( SC−75 ) (DTA115EE) Total Device Dissipation TA = 25°C (Note , SC−75 /SOT−416 CASE 463 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982


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PDF MUN2136, MUN5136, DTA115EE, DTA115EM3 DTA115E/D
2013 - Not Available

Abstract: No abstract text available
Text: ˆ’1123 CASE 524AA STYLE 1 1 mAdc Input Forward Voltage SC−75 CASE 463 STYLE 1 XX M Vdc , DTA114EET1G 6A SC−75 (Pb−Free) 3000 / Tape & Reel DTA114EM3T5G, NSVDTA114EM3T5G 6A SOTâ , (mW) 300 250 (1) SC−75 and SC−70/SOT−323; Minimum Pad (2) SC−59; Minimum Pad (3) SOTâ , mW Junction and Storage Temperature Range THERMAL CHARACTERISTICS ( SC−75 ) (DTA114EE) Total , , MMUN2111L, MUN5111, DTA114EE, DTA114EM3, NSBA114EF3 PACKAGE DIMENSIONS SC−75 /SOT−416 CASE 463 ISSUE


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PDF MUN2111, MMUN2111L, MUN5111, DTA114EE, DTA114EM3, NSBA114EF3 DTA114E/D
2013 - Not Available

Abstract: No abstract text available
Text: 631AA STYLE 1 XM 1 mAdc SC−75 CASE 463 STYLE 1 XX M Vdc SC−70/SOT−323 CASE , Reel DTC114YET1G, SDTC114YET1G 8D SC−75 (Pb−Free) 3000 / Tape & Reel DTC114YM3T5G , Packaging Specifications Brochure, BRD8011/D. PD, POWER DISSIPATION (mW) 300 250 (1) SC−75 and , 1.6 2.4 mW Junction and Storage Temperature Range THERMAL CHARACTERISTICS ( SC−75 ) (DTC114YE , DIMENSIONS SC−75 /SOT−416 CASE 463 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14


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PDF MUN2214, MMUN2214L, MUN5214, DTC114YE, DTC114YM3, NSBC114YF3 DTC114Y/D
2013 - Not Available

Abstract: No abstract text available
Text: (rev) 5 SC−70/SOT−323 CASE 419 STYLE 3 XX M SC−75 CASE 463 STYLE 1 XX M , Reel DTA143ZET1G 6K SC−75 (Pb−Free) 3000 / Tape & Reel DTA143ZM3T5G 6K SOTâ , ) 300 250 (1) SC−75 and SC−70/SOT−323; Minimum Pad (2) SC−59; Minimum Pad (3) SOTâ , 1.6 2.4 mW Junction and Storage Temperature Range Thermal Characteristics ( SC−75 ) (DTA143ZE , , MMUN2133L, MUN5133, DTA143ZE, DTA143ZM3, NSBA143ZF3 PACKAGE DIMENSIONS SC−75 /SOT−416 CASE 463 ISSUE


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PDF MUN2133, MMUN2133L, MUN5133, DTA143ZE, DTA143ZM3, NSBA143ZF3 DTA143Z/D
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