Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SBT-BGA-6002 Search Results

    SBT-BGA-6002 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TLK6002ZEU Texas Instruments Dual Channel 0.47Gbps to 6.25Gbps Multi-Rate Transceiver 324-BGA -40 to 85 Visit Texas Instruments Buy
    60022-116HLF Amphenol Communications Solutions 60022-116HLF-PCN13094 LTB SEP/15/14 Visit Amphenol Communications Solutions
    60022-120HLF Amphenol Communications Solutions 60022-120HLF-PCN13094 LTB SEP/15/14 Visit Amphenol Communications Solutions
    TMS320C28344ZEPQ Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28345ZEPQ Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28343ZEPQ Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments

    SBT-BGA-6002 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SBT-BGA-6002 Ironwood Electronics Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size X (mm): 27; IC Size Y (mm): 27; IC Size Tolerance (mm): 0.2; IC Ball Coplanarity (mm): 0.2; IC Ball Height Min (mm): 0.4; IC Ball Height Max (mm): 0.6; IC Ball Diameter Max (mm): 0.7; Max Package Code: BGA676C; Part Description: Stamped pin Burn-in socket Original PDF