The Datasheet Archive

Top Results (6)

Part ECAD Model Manufacturer Description Datasheet Download Buy Part
TPH9R00CQH TPH9R00CQH ECAD Model Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
XPH3R206NC XPH3R206NC ECAD Model Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
XPH2R106NC XPH2R106NC ECAD Model Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
TPHR7404PU TPHR7404PU ECAD Model Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 0.00074 Ω@10V, SOP Advance, U-MOS-H
ISO7142CCQDBQRQ1 ISO7142CCQDBQRQ1 ECAD Model Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125
ISO7142CCQDBQQ1 ISO7142CCQDBQQ1 ECAD Model Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125

S-PQFP-G100 Package footprint Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1999 - S-PQFP-G100 Package powerPAD

Abstract: S-PQFP-G100 S-PQFP-G100 Package MS-026
Text: notice. Body dimensions do not include mold flash or protrusion The package thermal performance may be , latest package information, go to http://www.ti.com/sc/docs/ package /pkg_info.htm PowerPAD is a trademark


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PDF MPQF080­ S-PQFP-G100) 4146938/A MS-026 S-PQFP-G100 Package powerPAD S-PQFP-G100 S-PQFP-G100 Package MS-026
1999 - MS-026

Abstract: S-PQFP-G100
Text: dimensions do not include mold flash or protrusion. The package thermal performance may be enhanced by


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PDF MPQF053 S-PQFP-G100) 4146929/A MS-026 MS-026 S-PQFP-G100
1999 - S-PQFP-G100

Abstract: S-PQFP-G100 Package powerPAD MS-026
Text: dimensions do not include mold flash or protrusion The package thermal performance may be enhanced by , package information, go to http://www.ti.com/sc/docs/ package /pkg_info.htm PowerPAD is a trademark of


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PDF MPQF085­ S-PQFP-G100) 4146939/A MS-026 S-PQFP-G100 S-PQFP-G100 Package powerPAD MS-026
1996 - MS-026

Abstract: S-PQFP-G100
Text: enhanced molded plastic package with a heat slug (HSL) Falls within JEDEC MS-026 POST OFFICE BOX 655303


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PDF MHTQ003A S-PQFP-G100) MS-026 MS-026 S-PQFP-G100
1999 - S-PQFP-G100

Abstract: MS-026
Text: notice. Body dimensions do not include mold flash or protrusion. The package thermal performance may be


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PDF MPQF054 S-PQFP-G100) 4146930/A MS-026 S-PQFP-G100 MS-026
1996 - S-PQFP-G100

Abstract: No abstract text available
Text: MECHANICAL DATA MHTQ002 ­ OCTOBER 1994 VG (S-PQFP-G100) PLASTIC QUAD FLATPACK (DIE-DOWN) 0,30 0,10 0,50 75 0,08 M 51 Heat Slug 76 50 100 26 0,13 NOM 1 25 14,40 SQ 13,90 Gage Plane 16,30 SQ 15,70 0,25 0,00 MIN 1,45 1,35 0°­ 10° 0,70 0,30 Seating Plane 0,08 1,70 MAX 4040173 / B 03/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Thermally enhanced molded plastic package


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PDF MHTQ002 S-PQFP-G100) S-PQFP-G100
1996 - S-PQFP-G100

Abstract: No abstract text available
Text: package with a heat slug (HSL) POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 1 IMPORTANT


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PDF MPQF016 S-PQFP-G100) 4073183/A S-PQFP-G100
1996 - S-PQFP-G100

Abstract: No abstract text available
Text: MECHANICAL DATA MPQF031 ­ JANUARY 1996 PZV (S-PQFP-G100) PLASTIC QUAD FLATPACK 0,28 0,16 0,50 75 0,08 M 51 76 50 100 26 0,13 NOM 25 1 12,00 TYP Gage Plane 14,10 SQ 13,90 16,20 SQ 15,80 0,25 0,05 MIN 1,05 0,95 0°­ 10° 0,70 0,30 Seating Plane 1,20 MAX Heat Slug 0,10 4073193/A 02/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Thermally enhanced molded plastic package


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PDF MPQF031 S-PQFP-G100) 4073193/A S-PQFP-G100
1995 - MS-026

Abstract: S-PQFP-G100
Text: without notice. Thermally enhanced molded plastic package with a heat slug (HSL) Falls within JEDEC MS


Original
PDF MHTQ003A S-PQFP-G100) MS-026 MS-026 S-PQFP-G100
1996 - S-PQFP-G100

Abstract: No abstract text available
Text: . Thermally enhanced molded plastic package with a heat slug (HSL) Falls within JEDEC MO-136 POST OFFICE


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PDF MHTQ003 S-PQFP-G100) MO-136 S-PQFP-G100
1996 - MO-143

Abstract: S-PQFP-G100
Text: plastic package with a heat slug (HSL) POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 1


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PDF MHQF016 S-PQFP-G100) MO-143 MO-143 S-PQFP-G100
1996 - S-PQFP-G100

Abstract: No abstract text available
Text: MECHANICAL DATA MPQF030 ­ JANUARY 1996 PZU (S-PQFP-G100) PLASTIC QUAD FLATPACK 0,28 0,16 0,50 75 0,08 M 51 76 50 100 26 0,13 NOM 25 1 12,00 TYP Gage Plane 14,10 SQ 13,90 16,20 SQ 15,80 0,25 0,05 MIN 1,05 0,95 0°­ 10° 0,70 0,30 Seating Plane 1,20 MAX 0,10 Heat Slug 4073192/A 02/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Thermally enhanced molded plastic package


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PDF MPQF030 S-PQFP-G100) 4073192/A S-PQFP-G100
1998 - MS-026

Abstract: S-PQFP-G100
Text: notice. Body dimensions include mold flash or protrusions. The package thermal performance may be


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PDF MPQF054 S-PQFP-G100) 4146930/A MS-026 S-PQFP-G100
1998 - S-PQFP-G100 Package powerPAD

Abstract: MS-026 S-PQFP-G100
Text: dimensions include mold flash or protrusions. The package thermal performance may be enhanced by bonding the


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PDF MPQF053 S-PQFP-G100) 4146929/A S-PQFP-G100 Package powerPAD MS-026 S-PQFP-G100
2000 - S-PQFP-G100 Package footprint

Abstract: S-PQFP-G100 Package powerPAD layout TFP403 TFP501
Text: advanced packaging technology results in best of class power dissipation, footprint , and ultralow ground , technology, along with PowerPAD package technology to achieve a reliable, low-powered, low-noise, high-speed , QO4 QO3 QO2 PZP PACKAGE (TOP VIEW) 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 , . . . 260°C Package power dissipation/PowerPAD: Soldered (see Note 1) . . . . . . . . . . . . . . . , reliability. NOTES: 1. Specified with PowerPAD bond pad on the backside of the package soldered to a 2 oz. Cu


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PDF TFP403 SLDS125A TFP501 S-PQFP-G100 Package footprint S-PQFP-G100 Package powerPAD layout TFP403
1994 - MS-026

Abstract: S-PQFP-G100
Text: No file text available


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PDF MTQF013A S-PQFP-G100) MS-026 MS-026 S-PQFP-G100
1995 - S-PQFP-G100

Abstract: No abstract text available
Text: No file text available


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PDF MTQF013 S-PQFP-G100) MO-136 S-PQFP-G100
2000 - lvds 30 pin lcd panel

Abstract: No abstract text available
Text: Technology 65 MHz Phase-Lock Input 100-pin TQFP Package for Compact LCD Module Tolerates 4 kV HBM ESD for , A2M A1P A1M A0P A0M GNDD SHTDN VDDD NC NC TQFP PACKAGE (TOP VIEW) 2 POST OFFICE BOX , TABLE PACKAGE TA 25°C POWER RATING OPERATING FACTOR§ ABOVE TA = 25°C TA = 70°C POWER , do not include mold flash or protrusion. The package thermal performance may be enhanced by , without notice. Body dimensions do not include mold flash or protrusion The package thermal performance


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PDF SN75LVDS88B SLLS407A 100-pin lvds 30 pin lcd panel
1996 - S-PQFP-G100

Abstract: No abstract text available
Text: No file text available


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PDF MTQF013 S-PQFP-G100) MO-136 S-PQFP-G100
2000 - SN75LVDS88

Abstract: No abstract text available
Text: Input 100-pin TQFP Package for Compact LCD Module Tolerates 4 kV HBM ESD for LVDS Pins and 2 kV HBM for , TQFP PACKAGE (TOP VIEW) MODE2 TP1 CPV VSS STV OE1 REV_E VDD REV_O OE2 TP2 VSSIO CLK VDDIO TEST2 ER5 , otherwise noted. DISSIPATION RATING TABLE PACKAGE PFD RDD TA 25°C POWER RATING 1.548 W 1.089 W OPERATING , to change without notice. Body dimensions do not include mold flash or protrusion. The package , . Body dimensions do not include mold flash or protrusion The package thermal performance may be enhanced


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PDF SN75LVDS88B SLLS407B 100-pin SN75LVDS88B SN75LVDS88
1996 - MS-026

Abstract: S-PQFP-G100
Text: No file text available


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PDF MTQF011 S-PQFP-G100) MS-026 MS-026 S-PQFP-G100
1994 - MS-026

Abstract: S-PQFP-G100
Text: No file text available


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PDF MTQF012B S-PQFP-G100) MS-026 MS-026 S-PQFP-G100
2000 - Not Available

Abstract: No abstract text available
Text: Input 100-pin TQFP Package for Compact LCD Module Tolerates 4 kV HBM ESD for LVDS Pins and 2 kV HBM for , TQFP PACKAGE (TOP VIEW) MODE2 TP1 CPV VSS STV OE1 REV_E VDD REV_O OE2 TP2 VSSIO CLK VDDIO TEST2 ER5 , otherwise noted. DISSIPATION RATING TABLE PACKAGE PFD RDD TA 25°C POWER RATING 1.548 W 1.089 W OPERATING , to change without notice. Body dimensions do not include mold flash or protrusion. The package , . Body dimensions do not include mold flash or protrusion The package thermal performance may be enhanced


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PDF SN75LVDS88B SLLS407C 100-pin SN75LVDS88B
1996 - S-PQFP-G100

Abstract: No abstract text available
Text: No file text available


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PDF MHQF004 S-PQFP-G100) S-PQFP-G100
1994 - MS-026

Abstract: S-PQFP-G100
Text: No file text available


Original
PDF MTQF013A S-PQFP-G100) MS-026 MS-026 S-PQFP-G100
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