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L717SDB25PA4CH3RC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=8.08mm (0.318in), Row Pitch 2.84mm, 25 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, M3 Rear Insert, Ground Tab with Boardlock |
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L717SDE09PABCH3RC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=14.84mm (0.584in), Row Pitch 2.84mm, 09 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, M3 Rear Insert, Ground Tab with Boardlock |
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L77SDE09S1ACH3RC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 09 Socket, 0.76m (30in) Gold, Bright Tin Shell, M3 Rear Insert, Ground Tab with Boardlock |
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L77SDC37SA4CH4RC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=8.08mm (0.318in), Row Pitch 2.84mm, 37 Socket, 0.76m (30in) Gold, Bright Tin Shell, 4-40 Rear Insert, Ground Tab with Boardlock |
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L77HDC62SD1CH3RC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock |
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L717HDE15PD1CH3RC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 15 Pin, 0.76m (30 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock |
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