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Part Manufacturer Description Datasheet Download Buy Part
SM34020APCM40 Texas Instruments SM34020APCM40 144-QFP
GC3021A-PQ Texas Instruments Mixer/Carrier Remover 160-QFP
TNETD2000C Texas Instruments ADSL Chipset 208-QFP
CSM30003PJM Texas Instruments Long Duration Processor 100-QFP
TNETD2000P Texas Instruments ADSL Chipset 208-QFP
TL1051FR-X Texas Instruments Video Preprocessor Circuit 44-QFP

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PF5AN

Abstract: Sony SPC700 HC-49U03 SCK 018 P-LQFP64-10X10-0 81124 SPC700 CXP81124 CXP81120 CXP81100
Text: Topr -2075 Tstg -55150 PD 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE , EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64 , protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD , . PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT


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PDF CXP81120/81124 CXP81120811248CPUROMRAM 250ns16MHz 333ns12MHz CXP81120) CXP81124) 820s16MHz RAM1321 88FIFO181 64QFPLQFP PF5AN Sony SPC700 HC-49U03 SCK 018 P-LQFP64-10X10-0 81124 SPC700 CXP81124 CXP81120 CXP81100
CXP86212

Abstract: CST16 P-LQFP64-10X10-0 CXP86460 CXP86448 CXP86440 CXP86400 CXP86332 CXP86324 CXP86216
Text: Topr -2075 Tstg -55150 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 PD *1 VIN, VOUTVDD0.3V *2 CPC6PC7 DPD FPF LSI LSI , SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL 42 , SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL 42 , protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD


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PDF CXP86212/86216, CXP86324/86332 CXP86440/86448/86460 CXP8621286216CXP8632486332CXP86440 86448864608CPUROMRAMIO HSYNC32kHz 250ns16MHz 122s32kHz 12KCXP86212 24KCXP86324 CXP86212 CST16 P-LQFP64-10X10-0 CXP86460 CXP86448 CXP86440 CXP86400 CXP86332 CXP86324 CXP86216
CXP86400

Abstract: 00MXW0C1 QFP-64P-L01 LQFP-64P-L01 SPC700 CXP86560 CXP86548 CXP86540 CXP86490 CST16.00MXW0C1
Text: mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 PD *1 VIN , SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL 42 , SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL 42 , PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ , MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE


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PDF CXP86540/86548/86560 CXP8654086548865608CPUROM 32kHz1 250ns16MHz 122s32kHz 40KCXP86540 48KCXP86548 60KCXP86560 25s16MHz 32kHz CXP86400 00MXW0C1 QFP-64P-L01 LQFP-64P-L01 SPC700 CXP86560 CXP86548 CXP86540 CXP86490 CST16.00MXW0C1
2006 - CXP86400

Abstract: CXP86490 CXP86540 CXP86548 CXP86560 SPC700
Text: ­55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL , RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64 , include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 , protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD


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PDF CXP86540/86548/86560 CXP86540/86548/86560 32kHz 16-bit LQFP-64P-L01 P-LQFP64-10x10-0 42/COPPER 5-18m CXP86400 CXP86490 CXP86540 CXP86548 CXP86560 SPC700
2001 - 74HC04

Abstract: CXP811P24 SPC700 P-LQFP64-10X10-0
Text: dissipation PD 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 Supply voltage Symbol , 0 ° to10 ° PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 , Outline PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 , RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64 , EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64


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PDF CXP811P24 CXP811P24 CXP81120/81124 LQFP-64P-L01 P-LQFP64-10x10-0 42/COPPER 74HC04 SPC700
2001 - CXP86400

Abstract: CXP86490 CXP86540 CXP86548 CXP86560 SPC700
Text: ­55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL , RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64 , include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 , protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD


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PDF CXP86540/86548/86560 CXP86540/86548/86560 32kHz 16-bit LQFP-64P-L01 P-LQFP64-10x10-0 42/COPPER CXP86400 CXP86490 CXP86540 CXP86548 CXP86560 SPC700
2006 - CXP81100

Abstract: CXP81120 CXP81124 SPC700 64pin digital sony P-QFP64-14X20-1
Text: temperature Tstg ­55 to +150 °C PD 600 mW QFP-64P-L01 Allowable power dissipation 380 mW LQFP- 64P-L01 V Total of output pins Total of output pins 1 VIN and VOUT , CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL 42/COPPER , PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL , PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ


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PDF CXP81120/81124 CXP81120/81124 16-bit 250ns 16MHz 333ns LQFP-64P-L01 P-LQFP64-10x10-0 42/COPPER CXP81100 CXP81120 CXP81124 SPC700 64pin digital sony P-QFP64-14X20-1
2003 - CXP86400

Abstract: CXP86490 CXP86608 CXP86612 CXP86616 SPC700 sony 64pin digital 86612
Text: ­55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE , PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE , CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64-10x10-0.5 LEAD , CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64-10x10-0.5 LEAD


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PDF CXP86608/86612/86616 CXP86608/86612/86616 32kHz 16-bit LQFP-64P-L01 P-LQFP64-10x10-0 42/COPPER CXP86400 CXP86490 CXP86608 CXP86612 CXP86616 SPC700 sony 64pin digital 86612
2001 - CXP81100

Abstract: CXP81120 CXP81124 SPC700
Text: temperature Tstg ­55 to +150 °C PD 600 mW QFP-64P-L01 Allowable power dissipation 380 mW LQFP- 64P-L01 V Total of output pins Total of output pins 1 VIN and VOUT , MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE , PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE , include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01


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PDF CXP81120/81124 CXP81120/81124 16-bit 250ns 16MHz 333ns LQFP-64P-L01 P-LQFP64-10x10-0 42/COPPER CXP81100 CXP81120 CXP81124 SPC700
2006 - Sony SPC700

Abstract: 74HC04 CXP811P24 SPC700
Text: temperature Tstg ­55 to +150 °C Allowable power dissipation PD 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 V V Total of output pins Total of output pins 1 VIN and VOUT , 0 ° to10 ° PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 , Outline PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 , RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64


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PDF CXP811P24 CXP811P24 CXP81120/81124 LQFP-64P-L01 P-LQFP64-10x10-0 42/COPPER 5-18m Sony SPC700 74HC04 SPC700
2002 - Not Available

Abstract: No abstract text available
Text: Tstg –55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 V Low level output current Allowable power dissipation PD ∗1 VIN and VOUT , PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL , MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE , . PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT


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PDF CXP86212/86216, CXP86324/86332 CXP86440/86448/86460 CXP86324/86332, CXP86440/ 32kHz
2001 - Not Available

Abstract: No abstract text available
Text: temperature Tstg –55 to +150 °C Allowable power dissipation PD 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 Supply voltage Symbol Remarks Incorporated PROM Total of , EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64 , PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE , SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64


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PDF CXP811P24 CXP811P24 CXP81120/81124 LQFP-64P-L01 P-LQFP64-10x10-0 42/COPPER
2003 - Not Available

Abstract: No abstract text available
Text: Storage temperature Tstg –55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 Low level output current Allowable power dissipation PD V â , QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL 42/COPPER ALLOY , PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64-14x20-1.0 LEAD MATERIAL , LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64-10x10-0.5 LEAD MATERIAL


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PDF CXP86608/86612/86616 CXP86608/86612/86616 32kHz LQFP-64P-L01 P-LQFP64-10x10-0 42/COPPER
2001 - CXP86212

Abstract: CXP86216 CXP86324 CXP86332 CXP86440 CXP86448
Text: ­55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64 , EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64 , EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64 , EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64


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PDF CXP86212/86216, CXP86324/86332 CXP86440/86448/86460 CXP86324/86332, CXP86440/ 32kHz CXP86212 CXP86216 CXP86324 CXP86332 CXP86440 CXP86448
2006 - CXP86324

Abstract: HSYNC and VSYNC to sync converter CXP86448 CXP86440 CXP86332 CXP86216 CXP86212 pwm generator 14bit pqfp 14x20 cxp86440 circuit diagram
Text: ­55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64 , EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE P-QFP64 , CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64-10x10-0.5 LEAD , CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-LQFP64-10x10-0.5 LEAD


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PDF CXP86212/86216, CXP86324/86332 CXP86440/86448/86460 CXP86324/86332, CXP86440/ 32kHz CXP86324 HSYNC and VSYNC to sync converter CXP86448 CXP86440 CXP86332 CXP86216 CXP86212 pwm generator 14bit pqfp 14x20 cxp86440 circuit diagram
pa5an

Abstract: CXP750097 CXP750000 CXP750010 CXP750096 SPC700
Text: 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 *1 VIN, VOUTVDD0.3V *2 CPC6PC7 DPD FPF , STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT , STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT


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PDF CXP750096/750010 CXP750097/750011 CXP750096750010, CXP7500977500118 32kHz1 167ns24MHz 122s32kHz 96KCXP750096750097 120KCXP750010750011 25s16MHz pa5an CXP750097 CXP750000 CXP750010 CXP750096 SPC700
Not Available

Abstract: No abstract text available
Text: V V V V V mA mA mA mA °C °C mW mW QFP-64P-L01 LQFP- 64P-L01 Total of output pins Total of output pins , SONY CODE EIAJ CODE JEDEC CODE QFP-64P-L01 QFP064- P-1420 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS , CODE JEDEC CODE LQFP- 64P-L01 LQFP064-P-1010 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN


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PDF CXP811P24 CXP81120/81124 23fl3 DG17772 CXP811P24 64PIN QFP-64P-L01 QFP064--
1998 - Sony SPC700

Abstract: xtal 32.768 CXP86400 CXP86490 CXP86540 CXP86548 CXP86560 SPC700
Text: ­55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , Package Outline ± 0.12 M PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE QFP­ 64P­L01 , STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER


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PDF CXP86540/86548/86560 CXP86540/86548/86560 32kHz 16-bit QFP064 64PIN LQFP-64P-L01 LQFP064-P-1010 Sony SPC700 xtal 32.768 CXP86400 CXP86490 CXP86540 CXP86548 CXP86560 SPC700
Not Available

Abstract: No abstract text available
Text: temperature Tstg — to +150 55 °C mW QFP-64P-L01 Pd 600 Allowable power dissipation 380 mW LQFP- 64P-L01 Total of output pins Total of output pins V in and V out should not , QFP-64P-L01 LEAD TREATMENT SOLDER/PALLADIUM PLATING EIAJ CODE QFP064-P-1420 LEAD , . DETAIL A PA CKAGE S TR U C TU R E PACKAGE MATERIAL EPOXY RESIN SONY CODE LÛFP- 64P-L01 LEAD


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PDF XP81120/81124 16-bit 250ns 16MHz 333ns 12MHz QFP-64P-L01 QFP064-P-1420 42/COPPER CXP81120/81124
1996 - 74HC04

Abstract: CXP811P24 SPC700
Text: temperature Tstg ­55 to +150 °C Allowable power dissipation PD 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 V V Total of output pins Total of output pins 1 VIN and VOUT , EPOXY RESIN SONY CODE QFP­ 64P­L01 LEAD TREATMENT SOLDER/PALLADIUM PLATING EIAJ CODE , SONY CODE LQFP- 64P-L01 LEAD TREATMENT EIAJ CODE LQFP064-P-1010 LEAD MATERIAL 42


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PDF CXP811P24 CXP811P24 CXP81120/81124 QFP064 42/COPPER 64PIN LQFP-64P-L01 74HC04 SPC700
CXP86400

Abstract: CXP86490 CXP86540 CXP86548 CXP86560 SPC700
Text: ­55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , PACKAGE MATERIAL EPOXY RESIN SONY CODE QFP­ 64P­L01 LEAD TREATMENT EIAJ CODE QFP064­P , RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER/PALLADIUM PLATING EIAJ CODE


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PDF CXP86540/86548/86560 CXP86540/86548/86560 32kHz 16-bit QFP064 64PIN LQFP-64P-L01 LQFP064-P-1010 CXP86400 CXP86490 CXP86540 CXP86548 CXP86560 SPC700
CXP7500P10

Abstract: 74HC04 CSA10 CXP750000 CXP750064 xtal 24mhz pa5an
Text: 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 875 mW SDIP-52P-01 PD , PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE , MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE QFP-64P-L01 LEAD TREATMENT EIAJ CODE


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PDF CXP7500P10/7500P11 CXP7500P107500P11 32kHz CXP7500P107500P11ROM CXP750064 750097750011PROM 167ns24MHz 122s32kHz 2496VRAM 25s16MHz CXP7500P10 74HC04 CSA10 CXP750000 xtal 24mhz pa5an
CXP86324

Abstract: AN321 CSA12.0MTZ MURATA CXP86212 CXP86216 CXP86332 CXP86440 CXP86448
Text: ­55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , SONY CODE QFP­ 64P­L01 LEAD TREATMENT EIAJ CODE QFP064­P­1420 LEAD MATERIAL SOLDER , RESIN SONY CODE LQFP- 64P-L01 LEAD TREATMENT SOLDER/PALLADIUM PLATING EIAJ CODE


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PDF CXP86212/86216, CXP86324/86332 CXP86440/86448/86460 CXP86324/86332, CXP86440/ 32kHz CXP86324 AN321 CSA12.0MTZ MURATA CXP86212 CXP86216 CXP86332 CXP86440 CXP86448
81120

Abstract: No abstract text available
Text: to +150 600 380 mA mA mA mA °C °C mW mW QFP-64P-L01 LQFP- 64P-L01 Total of output pins Total of , 64PIN QFP(PLASTIC) PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE QFP-64P-L01 , mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE LQFP- 64P-L01


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PDF XP81120/81124 CXP81120/81124 16-bit 64PIN QFP-64P-L01 QFP064-P-1420 42/COPPER LQFP-64P-L01 LQFP064-P-1010 81120
1998 - CXP86324

Abstract: CXP86212 CXP86216 CXP86332 CXP86440 CXP86448 86332
Text: ­55 to +150 °C 1000 mW SDIP-64P-01 600 mW QFP-64P-L01 380 mW LQFP- 64P-L01 , PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE QFP­ 64P­L01 LEAD TREATMENT EIAJ , . DETAIL A PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE LQFP- 64P-L01 LEAD


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PDF CXP86212/86216, CXP86324/86332 CXP86440/86448/86460 CXP86324/86332, CXP86440/ 32kHz CXP86324 CXP86212 CXP86216 CXP86332 CXP86440 CXP86448 86332
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