The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT6300CGN#TRPBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C
LT6300CGN#PBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C
LT6300IGN#TR Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LT6300IGN#PBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LT6300IGN#TRPBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LT6300CGN#TR Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C

QFP Package 128 lead .5mm Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
Not Available

Abstract: No abstract text available
Text: . Package P a rt Lead S ty le N um ber Count D2 3320-40S3 3320-44S5 40 44 .610 , /(25.40) 1.050/(26.67) Package P a rt Lead S ty le N um ber Count 3322-44S7 , B ADVANCED QFP Adapters .025" (.635mm) Pitch - INTERCONNECTIONS 5 Energy Way, P.O. Box , advintcorp@aol.com Internet http://www.advintcorp.com Adapters for .025"(.635mm) Pitch QFP Devices 0 Features: • Adapters for .025" pitch and 0.5, 0.65, 0.8 & 1.Omm pitch QFP 's (leaded gull wing type). â


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PDF 635mm) For780/ 3322-44S7 3322-52S3 3322-52S4 3323-64S7
2009 - QFP Package 128 lead .5mm

Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
Text: "] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket (1.00mm centers, 26X26 array, 27X27mm body) to 256 QFP , 0.5mm gull-wing leads. For pin mapping see page 6 , socket base . 4. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation into socket is critical. 5. Place the compession plate (D), on top of the BGA package , orientation is not


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PDF 26X26 27X27mm PC-BGA/QFP-SX72A-Z-01 A54Sx72A-CQ256 A54SX72A-FG484 SI-SX72-ACQ256SFG484 QFP Package 128 lead .5mm QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 BGA 256 PACKAGE thermal resistance
Not Available

Abstract: No abstract text available
Text: Quad Flat Package ( QFP ) DIP or PGA Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP or PGA , PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface mount IC's to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC's. Package types supported are: QFP (Quad Flat Package ). These Adapters were developed for users with motherboard designs that , " depending on number of pins, and incorporate 0.300", 0.600" and 0.900" row-to-row spacing with 0.100" lead


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PDF AK208PGA-208QFP QFP-08) QFP-09)
160 Pin PGA Board

Abstract: AK48D900-QFP .8mm 12x12 AK48D600-QFP .5mm 7x7 AK44D900-QFP 1.0mm AK44D600-QFP .8mm 10x10 AK44D600-QFP .65mm AK32D600-QFP7X7-A1-1 AK32D600-QFP7X7 AK32D300-QFP7X7 AK32D600-QFP5X5
Text: ACCUTEK Quad Flat Package ( QFP ) DIP or PGA Adapters MICROCIRCUIT CORPORATION DIP or PGA , PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface mount IC's to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC's. Package types supported are: QFP (Quad Flat Package ). These Adapters were developed for users with motherboard designs that , " depending on number of pins, and incorporate 0.300", 0.600" and 0.900" row-to-row spacing with 0.100" lead


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PDF AK208PGA-208QFP QFP-08) QFP-09) 160 Pin PGA Board AK48D900-QFP .8mm 12x12 AK48D600-QFP .5mm 7x7 AK44D900-QFP 1.0mm AK44D600-QFP .8mm 10x10 AK44D600-QFP .65mm AK32D600-QFP7X7-A1-1 AK32D600-QFP7X7 AK32D300-QFP7X7 AK32D600-QFP5X5
AK68D1200-PLCC

Abstract: 84 Pin PLCC Socket DIP plcc socket 64 PLCC surface mount to dip adapter CLCC 84 SOCKET TSOP dip adapter AK84D1400-PLCC
Text: packages for creating drop-in replacements for end-of-life DIP IC's. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , spacing with 0.100" lead spacing. Custom configurations up to 200 pins, multi-chip and double sided , available EPROM and Flash programming available Custom lead lengths available Custom multi-chip and , " AK64D900-QFP .8mm QFP 0.8mm PITCH TO 64 PIN DIP 3.200" 0.8mm (0.031") 0.710" 0.565" 1.000


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PDF Accutek84D1400-PLCC AK84DS1400-PLCC AK80D900-TSSOP AK80D900-QFP AK68D1200-PLCC 84 Pin PLCC Socket DIP plcc socket 64 PLCC surface mount to dip adapter CLCC 84 SOCKET TSOP dip adapter AK84D1400-PLCC
Not Available

Abstract: No abstract text available
Text: packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , " row-to-row spacing with 0.100” lead spacing. Custom configurations up to 200 pins, multi-chip and double , assembly and testing available EPROM and Flash programming available Custom lead lengths available , 44 ACCUTEKMICRO.COM 01/2013 (DA44) AK80D900-QFP.5mm QFP 0.5mm PITCH TO 80 PIN DIP 0.590


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PDF AK80D900-QFP 65mm-A1-1 AK84D1400-PLCC AK84DS1400-PLCC AK100D900-100QFP 14x14
tSSOP 56 socket

Abstract: 48 pin ic dip adapter 48-pin TSOP AK52D900-PLCC adapter 56-pin TSOP ,adapter 48-pin TSOP DA20 TSOP 56 socket surface mount to dip adapter ic socket DIP
Text: packages for creating drop-in replacements for end-of-life DIP IC's. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , spacing with 0.100" lead spacing. Custom configurations up to 200 pins, multi-chip and double sided , available EPROM and Flash programming available Custom lead lengths available Custom multi-chip and , " AK48D900-QFP .8mm QFP 0.8mm PITCH TO 48 PIN DIP 2.600" 0.8mm (0.031") 0.640" 0.500" 1.000


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PDF Accutek125" AK52DS900-PLCC AK52D900-QFP AK56D600-TSSOP tSSOP 56 socket 48 pin ic dip adapter 48-pin TSOP AK52D900-PLCC adapter 56-pin TSOP ,adapter 48-pin TSOP DA20 TSOP 56 socket surface mount to dip adapter ic socket DIP
Not Available

Abstract: No abstract text available
Text: packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , " row-to-row spacing with 0.100” lead spacing. Custom configurations up to 200 pins, multi-chip and double , assembly and testing available EPROM and Flash programming available Custom lead lengths available , 25 ACCUTEKMICRO.COM 01/2013(DA25) AK32D300-QFP5X5 AK32D600-QFP5X5 32 PIN QFP 5x5mm TO DIP300


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PDF AK32D600-QFN/MLP 6MM-32 7MM-32 AK32D600-QFN DA26A)
Not Available

Abstract: No abstract text available
Text: creating drop-in replacements for end-of-life DIP IC’s. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package ) and CLCC , spacing with 0.100” lead spacing. Custom configurations up to 200 pins, multi-chip and double sided , and testing available EPROM and Flash programming available Custom lead lengths available Custom , : www.accutekmicro.com AK44D600-QFP .5mm 7x7 7x7 QFP .5mm PITCH TO 44 PIN DIP 2.200" 0,5mm 0.426" 0.298


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PDF AK44DS900-PLCC AK44D600-TSSOP
Not Available

Abstract: No abstract text available
Text: packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , " row-to-row spacing with 0.100” lead spacing. Custom configurations up to 200 pins, multi-chip and double , assembly and testing available EPROM and Flash programming available Custom lead lengths available , " AK64D600-QFP .5mm 10x10 10x10 QFP .5mm PITCH TO 64 PIN 600 WIDE DIP 0.512" 3.200" 0,5mm 0.384


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PDF AK64D750-70-QFP14x20-1 64PIN AK68D1200-PLCC AK68DS1200-PLCC AK72D900-QFN/MLP 10X10 10MM-72
Not Available

Abstract: No abstract text available
Text: packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , " row-to-row spacing with 0.100” lead spacing. Custom configurations up to 200 pins, multi-chip and double , assembly and testing available EPROM and Flash programming available Custom lead lengths available , 25 ACCUTEKMICRO.COM 01/2013(DA25) AK32D300-QFP5X5 AK32D600-QFP5X5 32 PIN QFP 5x5mm TO DIP300


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PDF AK32D600-QFN/MLP 6MM-32 7MM-32 AK32D600-QFN DA26A)
Not Available

Abstract: No abstract text available
Text: packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , " row-to-row spacing with 0.100” lead spacing. Custom configurations up to 200 pins, multi-chip and double , assembly and testing available EPROM and Flash programming available Custom lead lengths available , " AK64D600-QFP .5mm 10x10 10x10 QFP .5mm PITCH TO 64 PIN 600 WIDE DIP 0.512" 3.200" 0,5mm 0.384


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PDF AK64D750-70-QFP14x20-1 64PIN AK68D1200-PLCC AK68DS1200-PLCC AK72D900-QFN/MLP 10X10 10MM-72
clcc 44 socket

Abstract: AK36D600M-SOJ4
Text: packages for creating drop-in replacements for end-of-life DIP IC's. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , spacing with 0.100" lead spacing. Custom configurations up to 200 pins, multi-chip and double sided , available EPROM and Flash programming available Custom lead lengths available Custom multi-chip and , (DA16) AK44D900-QFP 1.0mm QFP 1.0mm PITCH TO 44 PIN DIP 2.200" 1.0mm (0.0393") 0.640


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PDF AK44D600-QFP AK44D-LLP AK44D600-SOJ AK44D900-PLCC AK44DS900-PLCC clcc 44 socket AK36D600M-SOJ4
1997 - 0.3mm pitch csp package

Abstract: 116PIN qfp 20x20 0.3mm pitch package bga
Text: Chip Size Package D2BGATM 6×6mm 96 5.9mm 121 7×7mm 128 6.9mm 168 8×8mm 9×9mm 160 7.9mm 216 , CSP Chip Size Package small! CSP Chip Size Package CSPChip Size Package CSP , Si AI AI 3 BGA 2 CSP Chip Size Package FPBGATM D2BGATM QFPQuad Flat Package 0.5mm 17 ) FPBGATM 16 D2BGATM Q1) FPBGA 0.8mm120 D2BGA 0.5mm208 32mm 5.2g , % down 3 CSP Chip Size Package EIAJ FPBGATM * 7×7mm 48 5.5mm 3 10×10mm 96


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PDF 8mm120 5mm208 C13185JJ2V0PF00 0.3mm pitch csp package 116PIN qfp 20x20 0.3mm pitch package bga
AK28D300-QSOP

Abstract: AK28D300-SOJ AK28D300-TSOP AK28D-LLP DA10 DA11A 28-pin SOJ SRAM clcc 28 socket
Text: packages for creating drop-in replacements for end-of-life DIP IC's. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , spacing with 0.100" lead spacing. Custom configurations up to 200 pins, multi-chip and double sided , available EPROM and Flash programming available Custom lead lengths available Custom multi-chip and , : sales@accutekmicro.com Internet: www.accutekmicro.com AK28D-LLP AK28D300-TSOP LEADLESS LEADFRAME PACKAGE (5 X


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PDF AK68128-512-D32 AK32D300-S0J AK32D400-SOJ AK32DS600-PLCC AK32DW600-PLCC AK28D300-QSOP AK28D300-SOJ AK28D300-TSOP AK28D-LLP DA10 DA11A 28-pin SOJ SRAM clcc 28 socket
28-pin SOJ SRAM

Abstract: clcc 32 socket 28-pin SOJ SRAM 512k TSOP dip adapter AK28D300-SOJ AK28D300-TSOP AK28D300-QSOP DA10 DIP600 AK28D-LLP
Text: packages for creating drop-in replacements for end-of-life DIP IC's. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package , spacing with 0.100" lead spacing. Custom configurations up to 200 pins, multi-chip and double sided , available EPROM and Flash programming available Custom lead lengths available Custom multi-chip and , : sales@accutekmicro.com Internet: www.accutekmicro.com AK28D-LLP AK28D300-TSOP LEADLESS LEADFRAME PACKAGE (5 X


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PDF AK68128-512-D32 AK32D300-S0J AK32D400-SOJ AK32DS600-PLCC AK32DW600-PLCC 28-pin SOJ SRAM clcc 32 socket 28-pin SOJ SRAM 512k TSOP dip adapter AK28D300-SOJ AK28D300-TSOP AK28D300-QSOP DA10 DIP600 AK28D-LLP
1996 - footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP QFP Package 128 lead .5mm BGA 11x11 junction to board thermal resistance JEDEC Package Code MS-026-AED MS-026-BGA .65mm bga land pattern Shipping Trays 16x16 XC4010E-PQ208
Text: 112 128 XC4008E XC4010E 96 120 138 144 144 144 144 138 176 176 144 61 XC4006E 192 80 112 112 112 112 112 61 113 125 128 128 144 61 129 144 160 , 61 72 XC8103 128 32 61 64 XC8106 168 61 76 129 192 XC8109 208 61 129 192 11-2 84 133 196 June 1, 1996 (Version 1.1) Package Options PLCC JEDEC , Standard Lead Pitch Body Temperature Options Ordering Code XC7236A XC7272A XC7318 XC7336 XC7336Q


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PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP QFP Package 128 lead .5mm BGA 11x11 junction to board thermal resistance JEDEC Package Code MS-026-AED MS-026-BGA .65mm bga land pattern Shipping Trays 16x16 XC4010E-PQ208
28-pin SOJ SRAM

Abstract: DA11A
Text: creating drop-in replacements for end-of-life DIP IC's. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package ), CSP (Chip Scale Package ) and CLCC. These DIP , incorporate 0.300", 0.400", 0.600", 0.900", 1.200" and 1.400" row-to-row spacing with 0.100" lead spacing , Custom lead lengths available Custom multi-chip and double-sided modules available ORDERING OPTIONS · , LEADLESS LEADFRAME PACKAGE (5 X 5) TO 28 PIN DIP AK28D300-TSOP 28 PIN TSOP & SSOP 0.65mm PITCH TO DIP


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PDF AK32DW600-PLCC AK32DS600-PLCC 28-pin SOJ SRAM DA11A
1996 - schematic impulse sealer

Abstract: PCB footprint cqfp 132 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern xc4010e-pq208 footprint pga 84 QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7336Q xilinx opd0007
Text: The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead , Reel Packaging Package Type PLCC (Plastic Leaded Chip Carrier) SO (Plastic Small Outline) QFP , 112 61 77 XC4005L 112 128 XC4008E XC4010E 96 120 138 144 144 144 144 138 176 176 144 61 XC4006E 192 80 112 112 112 112 112 61 113 125 128 128 , 196 August 6, 1996 (Version 1.2) Package Options PLCC JEDEC 50 mil Plastic PQFP EIAJ


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PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 schematic impulse sealer PCB footprint cqfp 132 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern xc4010e-pq208 footprint pga 84 QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7336Q xilinx opd0007
antistatic epe foam

Abstract: mark JS sot-25 sot89 MARK JB V7100 TTO-220 QFP Shipping Trays LQFP Package tray SOT-25 JB 600MIL 300MIL
Text: (1212) LQFP 322.6mm(L)135.9mm(W)7.62mm(T) 64/80/100/ 128 QFP Rev. 1.80 Remark 50cm(L)6mm(W , Materials Purpose Type Product Name Quality and Specification 80/100/ 128 LQFP 144/160/208 QFP , ) P_QFP_002 80(1212) LQFP 322.6mm(L) 135.9mm(W) 7.62mm(T) P_LQFP_003 64 / 80 / 100 / 128 QFP , Packing Materials. SCOPE Related all packing materials in warehouse. DESCRIPTION Package , tray. Table 2Specifications of Chip's Packing Material Packing materials for package (refer to


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PDF 200mm 150mm 118MIL 150MIL 300MIL antistatic epe foam mark JS sot-25 sot89 MARK JB V7100 TTO-220 QFP Shipping Trays LQFP Package tray SOT-25 JB 600MIL 300MIL
CXA1541M

Abstract: QFP Package 128 lead .5mm QFP 128 lead .5mm 100MIL circuit diagram of MOD 64 counter
Text: Through Hole Lead 1-direction Standard flat QFP QUAD FLAT L LEADED PACKAGE P C 1.0mm 0.8mm 0 65mm , CODE Package Name Type Package name Package Features Symbol Description Materni* Lead pitch Lead shape Lead pull D I P DUAL IN-LINE PACKAGE P C 2.54mm (100MIL) Through Hole Lead 2-direction S I P SINGLE IN LINE PACKAGE 0 P 2 54mm UOOMIL) Through Hole Lead 1-direction Standard Z I P ZIG ZAG IN-LINE PACKAGE 0 P 2 54mm (100MILI Zig-Zag in-line Through Hole Lead 1-direction Inserted PGA


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PDF CXA1541M CXA1541M 50MIL) 127mm QFP Package 128 lead .5mm QFP 128 lead .5mm 100MIL circuit diagram of MOD 64 counter
1996 - MO-83-AF

Abstract: footprint jedec MS-026 TQFP PQFP moisture sensitive handling and packaging schematic impulse sealer eftec 64 JEDEC MS-026 footprint BGA 11x11 junction to board thermal resistance EFTEC-64 EIA standards 481 XC7336Q
Text: The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead , Reel Packaging Package Type PLCC (Plastic Leaded Chip Carrier) SO (Plastic Small Outline) QFP , 112 61 77 XC4005L 112 128 XC4008E XC4010E 96 120 138 144 144 144 144 138 176 176 144 61 XC4006E 192 80 112 112 112 112 112 61 113 125 128 128 , 196 August 6, 1996 (Version 1.2) Package Options PLCC JEDEC 50 mil Plastic PQFP EIAJ


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PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF footprint jedec MS-026 TQFP PQFP moisture sensitive handling and packaging schematic impulse sealer eftec 64 JEDEC MS-026 footprint BGA 11x11 junction to board thermal resistance EFTEC-64 EIA standards 481 XC7336Q
68 pin plcc socket view bottom

Abstract: 28 PIN plcc socket 32 pin plcc socket plcc socket 68 PLCC bottom view 84 Pin PLCC Socket plcc socket 32 pin plcc socket view bottom AK84PLCC-PGA 84 pin PGA socket AK32PLCC-PGA
Text: designed to permit the soldering of surface mount PLCC, QFP , TQFP, PQFP devices into a standard PGA , rectangular PLCCs with 0.050" lead pitch and sizes from 0.600" to 1.500". They also accommodate Quad Flat Packs with 0,5mm and 0,65mm lead pitch. They feature 0.018" diameter machined pins with integral , ) AK208PGA-208QFP.5MM 208 PIN .5MM QFP TO PIN GRID ARRAY 2.000" 0,5mm 2.000" 1.191" 1.083 , -100QFP AK144PGA-144QFP.5MM 100 PIN .5MM QFP TO PIN GRID ARRAY 144 PIN .5MM QFP TO PIN GRID ARRAY 1.500


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PDF AK48TSOP-DIP 68 pin plcc socket view bottom 28 PIN plcc socket 32 pin plcc socket plcc socket 68 PLCC bottom view 84 Pin PLCC Socket plcc socket 32 pin plcc socket view bottom AK84PLCC-PGA 84 pin PGA socket AK32PLCC-PGA
plcc socket 68 PLCC bottom view

Abstract: No abstract text available
Text: PGA Adapter Modules are designed to permit the soldering of surface mount PLCC, QFP , TQFP, PQFP , 100 pins. Can accommodate square and rectangular PLCCs with 0.050” lead pitch and sizes from 0.600” to 1.500”. They also accommodate Quad Flat Packs with 0,5mm and 0,65mm lead pitch. They feature , " 0.275" ACCUTEKMICRO.COM 6/2004(PG01A) AK208PGA-208QFP.5MM 208 PIN .5MM QFP TO PIN GRID ARRAY , " 0.205" PIN #1 0.100" AK100PGA-100QFP AK144PGA-144QFP.5MM 100 PIN .5MM QFP TO PIN GRID


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PDF AK48TSOP-DIP plcc socket 68 PLCC bottom view
AK84PGA-80QFP

Abstract: AK144PGA-144QFP.5MM AK208PGA-208QFP.5MM 160 Pin PGA BOARD 28 PIN plcc socket
Text: PGA Adapter Modules are designed to permit the soldering of surface mount PLCC, QFP , TQFP, PQFP , 100 pins. Can accommodate square and rectangular PLCCs with 0.050” lead pitch and sizes from 0.600” to 1.500”. They also accommodate Quad Flat Packs with 0,5mm and 0,65mm lead pitch. They feature , " ACCUTEKMICRO.COM 6/2004(PG01A) AK208PGA-208QFP.5MM 208 PIN .5MM QFP TO PIN GRID ARRAY 2.000" 0,5mm , 0.100" AK100PGA-100QFP AK144PGA-144QFP.5MM 100 PIN .5MM QFP TO PIN GRID ARRAY 144 PIN .5MM


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PDF AK48TSOP-DIP AK84PGA-80QFP AK144PGA-144QFP.5MM AK208PGA-208QFP.5MM 160 Pin PGA BOARD 28 PIN plcc socket
Supplyframe Tracking Pixel