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1999 - QSJ-50074

Abstract: QSJ-44403 QFJ28-P-S450-1 QSJ-44574 sop44-p-600-1.27-k SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 SSOP60-P-700-0 QFP80-P-1420-0
Text: SOJ26/24P3001.273 QFJ18PR2901.27 QFJ22PR2901.27 27 27 27 35 35 8.2 4.4 9.1 10.3 1.5 7.4 8.0 , .27 QFJ18PR2901.27 QFJ22PR2901.27 QFJ28PS4501.27 / W P A B K F D 16.0 12.0 7.2 5.5 2.3 7.5 1.6 2,000 R1/R2 , .27 SOJ32P4001.27,1 SOJ36P4001.27 SOJ40P4001.27 SOJ42P4001.27 SOJ50P4000.80 QFJ18PR2901.27 QFJ22PR2901.27 , QFJ22PR2901.27 1,000 1,000g 1,000g 10,000G 10,000G QFJ QFJ28PS4501.27 1,000 1,000g 1,000g 10,000G 10,000G


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PDF 300mil QSJ44400 DIP8P3002 DIP14P3002 DIP16P3002 DIP18P3002 DIP20P3002 DIP22P3002 DIP8G3002 QSJ-50074 QSJ-44403 QFJ28-P-S450-1 QSJ-44574 sop44-p-600-1.27-k SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 SSOP60-P-700-0 QFP80-P-1420-0
1999 - Not Available

Abstract: No abstract text available
Text: QFJ22-P-R290-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product's datasheet or the Package Information Databook. OKI Electric Industry


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PDF QFJ22-P-R290-1
1998 - d1884

Abstract: MSM6779BAV-Z-01 TSOP infrared TQFP80-P-1212-0 8400B 3360D oki marking DIP20-P-300-2 DIP14-P-300-2 MSM6778BAV-Z-01
Text: 2450 a 1.9 22400 A 25 19600 A 16 QFJ22-P-R290-1.27 48 2688 a 2.7 , -1.27 1000 1000 g 1.2 1000 g 1.3 10000 G 13 10000 G 14 QFJ22-P-R290-1.27 , QFJ18-P-R290-1.27 24 12 8.5 13.8 3.6 11.5 1.5 1000 QFJ22-P-R290-1.27 24 12 8.5 13.8 3.6 , , 1996 QFJ22-P-R290-1.27 Spherical surface 5 Package material Lead frame material Pin


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PDF 50mil 100mil 70mil 40PQFP d1884 MSM6779BAV-Z-01 TSOP infrared TQFP80-P-1212-0 8400B 3360D oki marking DIP20-P-300-2 DIP14-P-300-2 MSM6778BAV-Z-01
1999 - sac 326

Abstract: tsop 138 6-tsop PGA133-C-S14D-2 DIP18-P-300-2 G38-96 G43-87 PBGA352 35 PGA240 TSOP 48 thermal resistance
Text: . PLASTIC QFJ PKG QFJ18-P-R290-1.27 QFJ20-S350-1.27 QFJ22-P-R290-1.27 QFJ28-P-S450-1.27 QFJ32-P-R450


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PDF PC114 G4296 513ja 144pin 44pin 100pin G3896 21x24 29x29 P-BGA144-1313-0 sac 326 tsop 138 6-tsop PGA133-C-S14D-2 DIP18-P-300-2 G38-96 G43-87 PBGA352 35 PGA240 TSOP 48 thermal resistance
2000 - QSJ52627

Abstract: B375A QSJ-50345 040E-6 QSJ-44403 QFJ68-P-S950 1890A QSJ-52628
Text: /24-P-300-1.27-3 SOJ26-P-300-1.27 QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 27 27 27 27 35 35 8.2 4.4 , 16.0 8.8 10.4 11.6 36 7 (1) 12, 16, 24 mm : PS W QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 , -400-1.27 SOJ50-P-400-0.80 QFJ QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 QFJ20-P-S350-1.27 QFJ28-P-S450-1.27 QFJ32-P-R450 , -400-1.27 SOJ42-P-400-1.27 QFJ18-P-R290-1.27 QFJ QFJ22-P-R290-1.27 QFJ28-P-S450-1.27 QFJ44-P-S650-1.27 QFJ68-P-S950


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PDF 300mil QSJ-44400 DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 DIP20-P-300-2 54-W1 54-S1 QSJ52627 B375A QSJ-50345 040E-6 QSJ-44403 QFJ68-P-S950 1890A QSJ-52628
2001 - koki solder paste

Abstract: BGA256 koki ju-11t QFP128-P-1420-0 "the package information document consisting of 8 chapters in total" JU-11T SSOP20-P-250-0 Oki Moisture SSOP32-P-430-1 drying oven
Text: 1.08 11.56 QFJ22-P-R290-1.27 for reference 7.88 QFJ28-P-S450-1.27 for reference 1.27


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PDF JU-11T koki solder paste BGA256 koki ju-11t QFP128-P-1420-0 "the package information document consisting of 8 chapters in total" JU-11T SSOP20-P-250-0 Oki Moisture SSOP32-P-430-1 drying oven
2001 - TSOP 48 thermal resistance

Abstract: QFP160-P-2828-0 QFP304 bga 208 PACKAGE TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance junction to case QFP208-P-2828-0 SOJ28-P-400-1 G43-87 SDIP64-P-750-1
Text: -1.27 QFJ22-P-R290-1.27 QFJ28-P-S450-1.27 QFJ32-P-R450-1.27 QFJ44-P-S650-1.27 QFJ68-P-S950-1.27 QFJ84-P-S115


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2001 - IC 50061

Abstract: 50-P-400 LFBGA P-LFBGA224-1515-0 QFP128-P-1420-0 QSJ-44440 QFP304 tray size qfp304 SOJ32-P-400-1 P-LFBGA84-0909-0
Text: -P-300-1.27-3 SOJ26-P-300-1.27 QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 Max. CAP ICs/tube 27 27 27 27 35 35 , : mm) Package Code W QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 QFJ28-P-S450-1.27 TQFP48-P , -1.27 35 2,800/a 2,450/a 22,400/A 19,600/A QFJ22-P-R290-1.27 35 2,800/a 2,450/a , -400-1.27 SOJ40-P-400-1.27 SOJ42-P-400-1.27 QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 QFJ28-P-S450-1.27 QFJ44-P-S650


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1998 - LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram LGA 1151 PIN diagram IC107-26035-20-G IC107-3204-G REFLOW lga socket 1155 TB 2929 H alternative e p1 50171
Text: plating (5µm) 0.59 TYP. 3/Nov. 11, 1996 QFJ22-P-R290-1.27 Spherical surface 5 Package


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PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram LGA 1151 PIN diagram IC107-26035-20-G IC107-3204-G REFLOW lga socket 1155 TB 2929 H alternative e p1 50171
1998 - DIP24-P-600-2

Abstract: oki qfp tray SEPT24
Text: QFJ18-P-R290-1.27 QFJ20-P-S350-1.27 QFJ22-P-R290-1.27 QFJ QFJ28-P-S450-1.27 QFJ32-P-R450-1.27 QFJ44-P-S650 , -400-1.27 QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 QFJ QFJ28-P-S450-1.27 QFJ44-P-S650-1.27 QFJ68-P-S950-1.27 QFJ84-P-S115 , /24-P-400-1.27 SOJ28-P-400-1.27 QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 QFJ28-P-S450-1.27 P-LFBGA104 , ./Last Revised Epoxy resin Cu alloy Solder plating (5µm) 0.59 TYP. 3/Nov. 11, 1996 QFJ22-P-R290-1.27


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PDF 100mil 70mil 50mil 40PQFP DIP24-P-600-2 oki qfp tray SEPT24
1999 - 3360D

Abstract: 800A 711 TQFP64-P-1010-0 QSJ-44440 44568 DIP32 SDIP30 DIP28 882A IC 50061
Text: SOJ26/20-P-300-1.27 SOJ26/24-P-300-1.27 SOJ26/24-P-300-1.27-3 QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 , -P-400-1.27 SOJ28-P-400-1.27 QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 QFJ28-P-S450-1.27 35 (mm) / W P A B , -400-1.27 SOJ40-P-400-1.27 SOJ42-P-400-1.27 SOJ50-P-400-0.80 QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 QFJ20-P-S350 , QFJ18-P-R290-1.27 1,000 1,000g 1,000g 10,000G 10,000G QFJ22-P-R290-1.27 1,000 1,000g 1,000g 10,000G 10


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PDF 300mil 400mil 350mil 3360D 800A 711 TQFP64-P-1010-0 QSJ-44440 44568 DIP32 SDIP30 DIP28 882A IC 50061
1998 - oki qfp tray

Abstract: 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
Text: QFJ22-P-R290-1.27 48 2688 a 2.7 1536 a 2.5 21504 A 22 12288 A 21 , -1.27 1000 1000 g 1.2 1000 g 1.3 10000 G 13 10000 G 14 QFJ22-P-R290-1.27 , QFJ18-P-R290-1.27 24 12 8.5 13.8 3.6 11.5 1.5 1000 QFJ22-P-R290-1.27 24 12 8.5 13.8 3.6 , product's datasheet or the Package Information Databook. QFJ22-P-R290-1.27 Unit in millimeters typ


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PDF 50mil 100mil 70mil 40PQFP oki qfp tray 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
1999 - 425M

Abstract: PGA177-C-S15U-2 PGA240 IPGA400-C-S33U-1 PGA wire bonding SOJ28-P-400-1 DIP40 DIP32 DIP28 Tc9s2-l669-5m/s810
Text: 2. (1) PLASTIC QFJ (PLCC) (cont.) mm QFJ22-P-R290-1.27 42 5m


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PDF P-LFBGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA420-3535-1 P-BGA560-3535-1 P-TFLGA32-0806-0 425M PGA177-C-S15U-2 PGA240 IPGA400-C-S33U-1 PGA wire bonding SOJ28-P-400-1 DIP40 DIP32 DIP28 Tc9s2-l669-5m/s810
1999 - G43-87

Abstract: DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 G38-96 PBGA-144 PGA240 QFP160 QFP208-P-2828-0
Text: -1.27 QFJ22-P-R290-1.27 QFJ28-P-S450-1.27 QFJ32-P-R450-1.27 QFJ44-P-S650-1.27 QFJ68-P-S950-1.27 QFJ84-P-S115


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PDF PC114 G42-96 P-BGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA560-3535-1 13x13x0 25x25x1 35x35x1 G43-87 DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 G38-96 PBGA-144 PGA240 QFP160 QFP208-P-2828-0
1999 - TSOP 173 g

Abstract: TSOP 056 JU-11T TSOPI32-P-814-0 P150 SSOP32 SSOP30 SSOP20 P151 QFP304
Text: 0.69 7.88 6.35 1.27 4 1.12 0.98 1.02 1.08 11.56 QFJ22-P-R290-1.27 7.88


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PDF 10sec QFP56-P-910-K SnPb9557030 JU-11T 30sec TSOP 173 g TSOP 056 JU-11T TSOPI32-P-814-0 P150 SSOP32 SSOP30 SSOP20 P151 QFP304
2000 - Not Available

Abstract: No abstract text available
Text: QFJ22-P-R290-1.27 Spherical surface 5 (g) 42 (5µm) 0.51 TYP. 3 /96.11.11 OKI Electric Industry


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PDF QFJ22-P-R290-1
1999 - Not Available

Abstract: No abstract text available
Text: QFJ22-P-R290-1.27 Spherical surface 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5µm) 0.51 TYP. 3/Nov. 11, 1996 OKI Electric Industry


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PDF QFJ22-P-R290-1
1999 - MSM7731-02

Abstract: MsM82C59 P-BGA313-3535-1 TBA 931 msm5299 MSM5298 MSM514252 MSM27C201 MSC23136 KGF1203
Text: No file text available


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PDF 270MB ML670100 D-41460 MSM7731-02 MsM82C59 P-BGA313-3535-1 TBA 931 msm5299 MSM5298 MSM514252 MSM27C201 MSC23136 KGF1203
1998 - SMD IC 2025 bl

Abstract: ssop64 DIP16-C-300-2 D560 QFP Package 128 lead .5mm MK 50075 N 40280 FPQ20 S115 PLCC-18-1
Text: -1.27 126 2. (1) PLASTIC QFJ (PLCC) (cont.) mm QFJ22-P-R290-1.27 42


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PDF J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 DIP16-C-300-2 D560 QFP Package 128 lead .5mm MK 50075 N 40280 FPQ20 S115 PLCC-18-1
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