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QFJ22-P-R290-1 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2000 - Not Available

Abstract:
Text: QFJ22-P-R290-1.27 Spherical surface 5 (g) 42 (5µm) 0.51 TYP. 3 /96.11.11 OKI Electric Industry


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PDF QFJ22-P-R290-1
1999 - Not Available

Abstract:
Text: QFJ22-P-R290-1.27 Spherical surface 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5µm) 0.51 TYP. 3/Nov. 11, 1996 OKI Electric Industry


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PDF QFJ22-P-R290-1
1999 - Not Available

Abstract:
Text: QFJ22-P-R290-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product's datasheet or the Package Information Databook. OKI Electric Industry


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PDF QFJ22-P-R290-1
1999 - QSJ-50074

Abstract:
Text: . 44 75. 47 7 1 7. 71. 711. IC IC IC 7 , , , , 3 7. 72. 721. ( 1 ) DIP 300mil DIP mm QSJ44400 0.5 504 DIP8P3002.54 DIP14P3002 , 4 7. ( 1 ) DIP 600mil DIP mm QSJ44404 0.6 504 DIP24P6002.54 DIP28P6002.54 DIP32P6002 , 24.8 5 6.5 13.0 7. ( 1 ) DIP 300mil DIP 8.9 5.0 mm QSJ50058, (50059) 0.5 504 DIP14C3002 , 13.8 3.1 11.6 20.0 1 . 1.7 6.0 7 SOP 2. PVCOKIQSJxxxxxxANTISTATICMADE IN JAPAN


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PDF 300mil QSJ44400 DIP8P3002 DIP14P3002 DIP16P3002 DIP18P3002 DIP20P3002 DIP22P3002 DIP8G3002 QSJ-50074 QSJ-44403 QFJ28-P-S450-1 QSJ-44574 sop44-p-600-1.27-k SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 SSOP60-P-700-0 QFP80-P-1420-0
1999 - 3360D

Abstract:
Text: QFJ18-P-R290-1.27 1 ,000 1 ,000g 1 ,000g 10,000G 10,000G QFJ22-P-R290-1.27 1 ,000 1 ,000g 1 ,000g 10,000G 10 , . - 47 7 1 7. 7-1. 7-1-1. IC IC IC , . 7-2. 7-2-1. ( 1 ) DIP mm 300mil DIP QSJ-44400 0.5 504 6.0 12.0 7.4 , 4 7. ( 1 ) DIP mm 600mil DIP QSJ-44404 0.6 504 6.0 12.0 DIP24-P , 24.8 5 8 7. ( 1 ) DIP mm 300mil DIP QSJ-50058, (50059) 0.5 504 8.9


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PDF 300mil 400mil 350mil 3360D 800A 711 TQFP64-P-1010-0 44568 QSJ-44440 IC 50061 DIP32 DIP28-G-600-2 DIP28 DIP20
1998 - SMD IC 2025 bl

Abstract:
Text: -1.27 126 2. ( 1 ) PLASTIC QFJ (PLCC) (cont.) mm QFJ22-P-R290-1.27 42 , 1 . 2. 3. 4. 5. 6. 7. 8. 108-8551 4-10-3 TEL.(03)5445-6027 9. Copyright1998OKIELECTRICINDUSTRYCO., LTD. J2T0002-38-60 1 . - 1 1-1. - 3 , . - 271 J2T0001-38-60 1 . 1 2 . 2 3 . 3 4. 4 ( S M D ) 5 . 5


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PDF J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 MK 50075 N DIP16-C-300-2 D560 QFP Package 128 lead .5mm 74925 FPQ20 ZIP20-P-400 IC51-2084-1052-11
2000 - B375A

Abstract:
Text: 16.0 8.8 10.4 11.6 36 7 ( 1 ) 12, 16, 24 mm : PS W QFJ18-P-R290-1.27 QFJ22-P-R290-1.27 , IC 1 7 7.1.2 2 7 7.2 7.2.1 ( 1 , 17 17 17 6.0 15.0 6.0 3 7 ( 1 ) DIP : mm 600mil DIP : QSJ-44404 : 0.6 : 504 , 4 6.5 13.0 7 ( 1 ) DIP 5 7 (2) ZIP 6 7 (3) SOP 7 7 (3) SOP 8 7 (3) SOP 1 . : 2. PVCOKIQSJ-xxxxx-xANTISTATICMADE IN JAPAN 9 PVC


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PDF 300mil QSJ-44400 DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 DIP20-P-300-2 54-W1 54-S1 B375A QSJ52627 040E-6 1890A QFJ68-P-S950 QSJ-44403 QSJ-50345 QSJ-52628
1999 - sac 326

Abstract:
Text: 5. 5. 51. 2 52. 5 5 1 5. 51. IC IC IC IC IC 511 PC 5 511 IC IC 511 2 1 IC 2 IC PC 2 IC PC . 550% IC 2 5. ( 1 ) jc jc 512 Tj [] , Tc [] , P [w] 1 Ta Tc PC Tj PW 512 5 jc Tj-Tc P 1 jc 512 1 (2) ja ja 512 Tj [], Ta [], P [w] 2 Tj-Ta P ja 2 ja 513 511 512 1 [w] 2 5 PC114.3×76.2×1.6 SEMI G4296 ja 513 3 5. 100 90 ja[%] 80 70


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PDF PC114 G4296 513ja 144pin 44pin 100pin G3896 21x24 29x29 P-BGA144-1313-0 sac 326 tsop 138 6-tsop PGA133-C-S14D-2 PBGA352 35 G43-87 PGA240 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
1999 - TSOP 173 g

Abstract:
Text: . - 34 4-7. - 34 1 4. SMD ( 1 ) "" SOP, QFP, SOJ, QFJ , , LQFP, HQFP SOJ, QFJ (PLCC) BGA, LGA 4-1-2-( 1 ) SOP SOP8-P-250-1.27-K 4 1.27 , 0.75 0.15 13.97 0.25 0.7 11.8 12.0 5.9 6.0 1.27 4. SMD 4-1-2-( 1 , 13.0 0.65 12 4. SMD 4-1-3-( 1 ) QFP QFP44-P-910-0.80-2K mm QFP56-P , 7.25 14.5 1.63 12.5 25.0 19.0 0.1 4. SMD 4-1-3-( 1 ) QFP QFP100-P


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PDF 10sec QFP56-P-910-K SnPb9557030 JU-11T 30sec TSOP 173 g TSOP 056 JU-11T SSOP32 SSOP30 SSOP20 QFP304 P151 P150 TSOPI32-P-814-0
1999 - G43-87

Abstract:
Text: . - 5 5 1 5. 5-1. IC IC IC IC IC 5-1-1 PC 5 5-1-1 IC IC 5-1-1 2 1 IC 2 IC PC 2 IC PC . 550% IC 2 5. ( 1 ) jc jc 5-1-2 Tj [] , Tc [] , P [w] 1 Ta Tc PC Tj PW 5-1-2 5 jc Tj-Tc P 1 jc 5-1-2 1 (2) ja ja 5-1-2 Tj [], Ta [], P [w] 2 ja Tj-Ta P , - - 1 [w] - 2 5 - PC114


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PDF PC114 G42-96 P-BGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA560-3535-1 13x13x0 25x25x1 35x35x1 G43-87 DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 G38-96 PBGA-144 PGA240 QFP160 QFP208-P-2828-0
2001 - IC 50061

Abstract:
Text: FilledTray Tube Lower Box Outer Box Packing Tape 1 PACKAGE INFORMATION 7. PACKING 7.1.2 , Tapes-and-Reels 7.2.1 Tubes ( 1 ) DIP Unit: mm 300mil DIP Plastic DIP, SKINNY DIP, CER DIP Tube Drawing No , ( 1 ) DIP Unit: mm 600mil DIP Plastic DIP, CER DIP Tube Drawing No: QSJ-44404 Plate Thickness , . PACKING ( 1 ) DIP Unit: mm 300mil CeramicDIP Tube Drawing No: QSJ-50058, (50059) Plate Thickness , 13.8 20.0 Note 1 . Plug Material: Thermoplastic Elastomer Plug Plug Tube for SOP Note


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PDF
1998 - d1884

Abstract:
Text: 0.65, 0.80, 0.95, 1.00 MB under 50mil pitch TSOP( 1 ) (Thin Small Outline Package Type 1 , Small Outline Package Shrink Small Outline Package RA RB RC RD MA MB TSOP( 1 ) TSOP(2 , B or C 1.6 Character Width, W 0.45 0.5 0.6 0.75 0.78 0.9 1.2 TSOP( 1 , Method OKI Rank Packing Material Packing 1 Normal 2 Simple Dry pack 3 4 5 6 , °C / <85%RH 5-30°C / 30-60%RH on daily average. Bake xH (* 1 ) 240°C max! If over 235°C far


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PDF 50mil 100mil 70mil 40PQFP d1884 TQFP80-P-1212-0 TSOP infrared MSM6779BAV-Z-01 MSM6778BAV-Z-01 MARK W1 TSOP LQFP208-P-2828-0 DIP20-P-300-2 DIP14-P-300-2 8400B
1998 - DIP24-P-600-2

Abstract:
Text: ) 8, 14, 20, 30, 32, 60, 64, 70 0.65, 0.80, 0.95, 1.00 MB under 50mil pitch TSOP( 1 ) (Thin Small Outline Package Type 1 ) 32, 48 0.50 TA Leads on short side Specification are , unique to OKI. Mount Type Abbreviation Standard DIP Shrink DIP Skinny DIP ZIP SOP SSOP TSOP( 1 ) TSOP(2 , ZIP PGA SOP/SSOP 0.75 0.78 TSOP( 1 ) TSOP(2) Unit: mm W Surface Mount -/-/-/-/20-Pin Other , opening) Handling Method Storage Condition Sealed Unsealed Reflow Condition 1 2 3 4 5 6 2Y 1Y


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PDF 100mil 70mil 50mil 40PQFP DIP24-P-600-2 oki qfp tray SEPT24
1998 - oki qfp tray

Abstract:
Text: , 0.80, 0.95, 1.00 MB under 50mil pitch TSOP( 1 ) (Thin Small Outline Package Type 1 ) 32 , Package Shrink Small Outline Package RA RB RC RD MA MB TSOP( 1 ) TSOP(2) Through-Hole , Layout ZIP Through-Hole Character Sizes Remarks SOP/SSOP TSOP( 1 ) 10-Pin C A or K , Packing 1 Normal 2 Simple Dry pack 3 4 5 6 Handling Method Dry pack Bag - , %RH on daily average. Bake xH (* 1 ) 240°C max! If over 235°C far infrared reflow (IR) within 10


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PDF 50mil 100mil 70mil 40PQFP oki qfp tray 353512 P-BGA256-2727-1 ssop64 QFJ28-P-S450-1 LQFP144-P-2020-0 QFP304-P-4040-0 QFP100-P-1420-0 QFJ44-P P-BGA352-3535-1
1999 - 425M

Abstract:
Text: 2. ( 1 ) PLASTIC QFJ (PLCC) (cont.) mm QFJ22-P-R290-1.27 42 5m , - 107 1 2. 2-1. 2-1-1. EIAJ A Seating Plane A1 , MMC b x y -Seating Plane y B B1 Z ZD ZE 2 2 2. 2-1-2. 1 , LEAD 2. ( 1 ) PLASTIC STANDARD DIP mm DIP8-P-300-2.54 2 42 5m , . ( 1 ) PLASTIC STANDARD DIP (cont.) mm DIP16-P-300-2.54 2 42 5m g


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PDF P-LFBGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA420-3535-1 P-BGA560-3535-1 P-TFLGA32-0806-0 425M PGA240 PGA177-C-S15U-2 PGA wire bonding IPGA400-C-S33U-1 DIP40 DIP32 DIP28 DIP20 Tc9s2-l669-5m/s810
1998 - LGA 1156 PIN OUT diagram

Abstract:
Text: Solder plating (5µm) 0.83 TYP. 1 /Mar. 21, 2000 SOJ26/20-P-300-1.27 Mirror finish 5 Package , treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5µm) 0.044 TYP. 1 , treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5µm) 0.066 TYP. 1 , ) 0.088 TYP. 1 /Jan. 22, 1999 SSOP30-P-56-0.65-K Mirror finish 5 Package material Lead frame , ) 2.15 TYP. 3/Dec. 5, 1996 TSOP( 1 )28-P-813-0.55-K Unit in millimeters typ., unless otherwise


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PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram LGA 1151 PIN diagram IC107-26035-20-G IC107-3204-G REFLOW lga socket 1155 TB 2929 H alternative e p1 50171
2001 - bga 208 PACKAGE

Abstract:
Text: , accordingly, the influence for ICs must be considered as the whole system. 1 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE ( 1 ) Thermal resistance jc The thermal resistance jc is defined in the following equation ( 1 ). · Ambient temperature Ta (°C ) Package surface temperature Tc (°C ) PC board Chip , . ( 1 ) Tj (°C) = chip surface temperature Tc (°C) = package surface temperature P (w) = power , materials as shown in the Figure 5.1.2 and the equation ( 1 ). (2) Thermal resistance ja The thermal


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PDF
2001 - koki solder paste

Abstract:
Text: SURFACE MOUNTING TECHNOLOGY ( 1 ) INTRODUCTION Increasing progress in semiconductor design and , consult our sales department before carrying out reflow or wave soldering. 1 PACKAGE INFORMATION 4 , mounting pad length (I2) from the length of the flat part (L) of each pin, the solder lifting dimension ( 1 ) and the solder mask pattern accuracy (2). , 1 , 2, and are parameters which depend on the pattern , Mount Pad Reference Measurements Figure 4.1.2 ( 1 ) SOP Mounting Pad Reference Measurements (Unit: mm


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PDF JU-11T koki solder paste BGA256 koki ju-11t QFP128-P-1420-0 "the package information document consisting of 8 chapters in total" JU-11T Oki Moisture TSOP infrared QFP128-P-2828-0 SSOP20-P-250-0
1999 - MSM7731-02

Abstract:
Text: to People Technology 1 . Regarding Operation · This is NOT a music CD. Please do not play it on an , office. · This CD-ROM is correct as of July 1 , 1999. For updated information, please visit our website at , this CD-ROM subject to the following conditions: 1 . The document may be used for informational purposes , People Technology Sound Sample 1 OkiADPCM Speech Playback Simulation People to People Technology , 1 Input level to acoustic echo canceller block: Input level to noise canceller block: Input level


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PDF 270MB ML670100 D-41460 MSM7731-02 MsM82C59 P-BGA313-3535-1 TBA 931 msm5299 MSM5298 MSM514252 MSM27C201 MSC23136 KGF1203
2007 - L7251-3.1

Abstract:
Text: HEIGHT ( X DIMENSION) NO. OF CHIPS 1 2 3 4 5 UNLEADED ASSEMBLIES NN, NP .100 (2.54) .100 , 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 3 3 3 4 5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 3 3 3 4 5 1 1 1 1 1 1


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2010 - AL133-00015.1

Abstract:
Text: Solderless splices CLOSED-END E F L E L Style 2 F Style 1 Style 2 Style 1 , Dimensions mm (in.) Tool No. YS-2622 YS-2216 YS-1614 YS-1210 YS-8S YA- 1 YA-2 YA-4 o o o o o o o o o o o o o o , ) (4.0 to 9.0) CE1(CE-100) CE2(CE-230) CE5(CE-550) CE8(CE-800) 2-SDW 0.5-SD 1 -SD 2-SD 5.5-SD 8-SD 2 1 , (.315) 22.2 (.874) 10.2 (.402) o o o o Nylon o o o o o o o 1 ,000 1 ,000 500 250 1 ,000 5,000 1 ,000 1 ,000 500 250 9.3 (.366) 12.0 (.472) 9.3 (.366) 12.0 (.472) Note: 1 ) Products with the JIS


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PDF E42024 LR20812 JQ0607003 YS-2622 YS-2216 YS-1614 YS-1210 BCT-0514 CE-800/CE-800V) AL133-00015.1 AP6KE9.1 L7251-3.1 1+to+2+MIPI+buffer+IC 1/CN0944 A608569.1 CSA107.1
UL E42024

Abstract:
Text: Solderless splices ¿D ¿B E Style 1 F E L Actual Style 1 Style 2 CE1(CE , (.150) 7.2 (.283) 9.5 (.374) 28.0(1.102) 12.0 (.472) 1 9.5 (.374) 4.5 (.177) o o , 1.75) 1 -SD 15.2 (.598) 5.9 (.232) 8.0 (.315) 2.2 (.087) 5.0 (.197) 6.2 (.244 , to 1.75) 16 to 14 E YA-2 YA-4 22 to 16 ød L F YA- 1 Standard Style , splice. 686022 YS-2622 LR20812 Applicable Wire Note: 1 ) Products with the JIS mark conform


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PDF CE-100) CE-230) CE-550) CE-800) UL E42024 A612826.1 L7251-3.1 th2167.1 MM 1614 LR20812 E42024 CSA107.1 C2807 1/sn1350
111L2

Abstract:
Text:  1 MIL-M-38510/320C 6 March 1985_ SUPERSEDING MIL-M-38510/320B 28 February 1984 MILITARY , ioecification is approved for use by all Departments and Agencies of the Department of Defense. 1 . SCOPE , , cascadable Presettable 4-bit binary counter, cascadable Q3 Decade counter 04 4-bit binary counter 1 2 2 , -38510, appendix C) A F-l (14-lead, 1 /4" x 1 /4"), flat package i F-3 14-lead 3/16" x 1 /4"), flat package f D-l (14-lead, 1 /4" x 3/4"), dual-in-line package o c ; (U lead 1 /4" x 3/8"), flat package \ cl (terminal


OCR Scan
PDF MIL-M-38510/320C MIL-M-38510/320B MIL-M-38510, officei1985-505-038 111L2 PEF41068FV1.1 13007 h3 DSTH506010.1 L6284-3.1 L7251-3.1 j1 3003 E 13007 AL133-00015.1 1/CN0944
L7251-3.1

Abstract:
Text: 1 Datasheet D 2DFDD D 7!F D"#$FD 8F7 8%995&'7"D 1 1 %DC78C4E91 E59133AA14A38C4E119AA713A74EC8C4E1 1 CE17 , A59A8#1431FA1F7CEA91 %DC78C4E918813A@6C3A104C7A1AE681 1 /A1BA7C3C78C4E91 11 A38CE14&A3196D13EA 1 "01841">01 *AEA3D1+A973C8C4E1 ,-./01 1 AE2DA91 735C4C51 5C3A78CC8 1 83461 2AF1343FCE 1 8A7E4D4 1 69CE1 8&41 4FEC5C3A78C4ED1 FC7344EA91 D7A51 FF1 38"1 ,AF1 343FCE1 8A7E4D4 1 34C5A91 93A31 5C3A78CC8 1 8


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PDF 8C4E91 E59133AA14 13A74 8C4E19 98AF91 2DA15A C7A91967 91F42CDA1 CEA91 8C4E918 L7251-3.1 L6284-3.1 AL133-00015.1 th2167.1 MPC4C2.1 DSTH506010.1 PEF3304EV2.1 AU1329.1 A612826.1 PMB6256-V1.1
th2167.1

Abstract:
Text: CVB CVW CTH CTL CSR GND V+ Vref - 1 - NJW1167/A s SSOP32, SDIP32 INa INb 32 , 13 ADR CTL 20 14 SDA CSR 19 15 SCL Vref 18 16 No. 1 GND V+ 17 No V+ 1 INa 17 2 SR-FIL 18 Vref 3 , 28 TONE-Hb 13 ADR 29 LF1 LPF 1 14 SDA I2C 30 LF3 LPF 3 , TONE-Haa PORT0 GND AUX1 INa AUX0 V+ AGC1 INb OUTa Vref OUTW LF2 1


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PDF NJW1167/A NJW1167/ALPF NJW1167V NJW1167AL NJW1167FJ2 NJW1167: SSOP32, QFP32-J2 NJW1167A: th2167.1 L7251-3.1 AL133-00015.1 PMB6610RV2.1 NJW1167V NJW1167FJ2 NJW1167AL NJW1167 L4973DS.1 TK1337.1
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