The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC1655LCN8#PBF Linear Technology LTC1655 - 16-Bit Rail-to-Rail Micropower DACs in SO-8 Package; Package: PDIP; Pins: 8; Temperature Range: 0°C to 70°C
LTC1655LCN8 Linear Technology LTC1655 - 16-Bit Rail-to-Rail Micropower DACs in SO-8 Package; Package: PDIP; Pins: 8; Temperature Range: 0°C to 70°C
LTC1655CN8#PBF Linear Technology LTC1655 - 16-Bit Rail-to-Rail Micropower DACs in SO-8 Package; Package: PDIP; Pins: 8; Temperature Range: 0°C to 70°C
LTC1655CN8 Linear Technology LTC1655 - 16-Bit Rail-to-Rail Micropower DACs in SO-8 Package; Package: PDIP; Pins: 8; Temperature Range: 0°C to 70°C
LTC1655LIN8#PBF Linear Technology LTC1655 - 16-Bit Rail-to-Rail Micropower DACs in SO-8 Package; Package: PDIP; Pins: 8; Temperature Range: -40°C to 85°C
LTC1655IN8 Linear Technology LTC1655 - 16-Bit Rail-to-Rail Micropower DACs in SO-8 Package; Package: PDIP; Pins: 8; Temperature Range: -40°C to 85°C

Package TO-78 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1973 - amp dpm hfe nv

Abstract: MAT01 MAT01AH
Text: -Pin Metal Header Package [ TO-78 ] (H-06) Dimensions shown in inches and (millimeters) ORDERING GUIDE , -Pin Metal Header Package [ TO-78 ] 6-Pin Metal Header Package [ TO-78 ] 6-Pin Metal Header Package [ TO-78 ] 6-Pin Metal Header Package [ TO-78 ] 022306-A Package Option H-06 H-06 H-06 H-06 Z = RoHS Compliant , reduced by a factor of 2 to 10 times by connecting the substrate ( package ) to a potential that is lower , a factor of 2 to 10 times by connecting the substrate ( package ) to a potential that is lower than


Original
PDF MAT01 MAT01 MAT01AH MAT01AHZ MAT01GH MAT01GHZ 22306-A D00282-0-4/13 amp dpm hfe nv
2014 - MAT01AH

Abstract: No abstract text available
Text: . 6-Pin Metal Header Package [ TO-78 ] (H-06) Dimensions shown in inches and (millimeters) ORDERING , ˆ’55°C to +125°C Package Description 6-Pin Metal Header Package [ TO-78 ] 6-Pin Metal Header Package [ TO-78 ] 6-Pin Metal Header Package [ TO-78 ] 6-Pin Metal Header Package [ TO-78 ] Z = RoHS Compliant Part , factor of 2 to 10 times by connecting the substrate ( package ) to a potential that is lower than either , factor of 2 to 10 times by connecting the substrate ( package ) to a potential that is lower than either


Original
PDF MAT01 MAT01 MAT01AH MAT01AHZ MAT01GH MAT01GHZ D00282-0-9/14 MAT01AH
2010 - AD8512

Abstract: AMP02 MAT12 NPN MATCHED PAIRS 1N914 MAT02 MAT-12 Package TO-78
Text: -A BASE & SEATING PLANE Figure 19. 6-Pin Metal Header Package [ TO-78 ] (H-06) Dimensions shown in , Package Description 6-Pin Metal Header Package [ TO-78 ] Z = RoHS Compliant Part. Rev. 0 | Page 10 of , B1 2 C2 5 E1 3 4 B2 E2 NOTE 1. SUBSTRATE IS CONNECTED TO CASE ON TO- 78 PACKAGE , Resistance 40 V Package Type 6-Lead TO- 78 40 V 40 V ESD CAUTION 20 mA 20 mA -65°C to , . 09044-001 FEATURES Figure 1. 6-Lead TO- 78 GENERAL DESCRIPTION The MAT12 is a dual, NPN-matched


Original
PDF MAT12 MAT12 22306-A MAT12AHZ D09044-0-7/10 AD8512 AMP02 NPN MATCHED PAIRS 1N914 MAT02 MAT-12 Package TO-78
2010 - Not Available

Abstract: No abstract text available
Text: IN DESIGN. 022306-A BASE & SEATING PLANE Figure 19. 6-Pin Metal Header Package [ TO-78 ] (H , ˆ’40°C to +85°C Package Description 6-Pin Metal Header Package [ TO-78 ] Z = RoHS Compliant Part , B1 2 C2 5 E1 3 4 B2 E2 NOTE 1. SUBSTRATE IS CONNECTED TO CASE ON TO- 78 PACKAGE , . Rating 40 V Table 3. Thermal Resistance 40 V Package Type 6-Lead TO- 78 40 V 40 V ESD , . 09044-001 FEATURES Figure 1. 6-Lead TO- 78 GENERAL DESCRIPTION The MAT12 is a dual, NPN-matched


Original
PDF MAT12 MAT12 22306-A MAT12AHZ D09044-0-7/10
cisa

Abstract: Package TO-78
Text: hermetic TO- 78 package . ORDERING INFORMATION Part U421-U426 XU421-U426 Package TO-78 Hermetic Packag e


OCR Scan
PDF U421-U426 20logio cisa Package TO-78
U422CHP

Abstract: U421 L144cj U422 U423 U424 AN-743 Package TO-78
Text: Op Amps ■pH Meters ■Electrometer TYPE Dual PACKAGE TO-78 Chip PERFORMANCE CURVES (25°C unless , (25°C) TO- 78 See Section 7 Gate-to-Gate Voltage . . . +40 V D D _ Gate-Drain or Gate-Source


OCR Scan
PDF U421-3) 30jliA U4213) U422CHP U421 L144cj U422 U423 U424 AN-743 Package TO-78
2010 - Not Available

Abstract: No abstract text available
Text: . 6-Pin Metal Header Package [ TO-78 ] (H-06) Dimensions shown in inches and (millimeters) ORDERING , Header Package [ TO-78 ] Z = RoHS Compliant Part. Rev. A | Page 10 of 12 Package Option H , CASE ON TO- 78 PACKAGE . 2. SUBSTRATE IS NORMALLY CONNECTED TO THE MOST NEGATIVE CIRCUIT POTENTIAL, BUT CAN BE FLOATED. 09044-001 FEATURES Figure 1. 6-Lead TO- 78 GENERAL DESCRIPTION The , Resistance 40 V Package Type 6-Lead TO- 78 40 V 40 V ESD CAUTION 20 mA 20 mA −65°C to


Original
PDF MAT12 MAT12 22306-A MAT12AHZ D09044-0-1/14
OPB960N55

Abstract: marking code ny SMD Transistor npn OPB840L51 Package TO-78 E23 SMD Transistor A1 OPB875N51 MEXICO TRANSMISSIVE SENSOR OPB365T55 OPB840L55 OPB970N51
Text: Information - Sorted by Package Type C-1 VISIBLE LED'S Visible Light Emitting Diode (VLED) - Definition , D-5 RGB D-6 PACKAGE CONFIGURATIONS E-1 WORLDWIDE DISTRIBUTOR LOCATIONS F , 14:01 Magenta Yellow Cyan Black Light Emitting Diodes (LEDs) PACKAGE SELECTION GaAs is , PRODUCT CAPABILITY The two broad classifications of package types are hermetic and plastic. Each offers , 208 compares these package types. PRODUCT PACKAGING In addition to the standard products shown


Original
PDF F-Distributors9-12-05 OPB960N55 marking code ny SMD Transistor npn OPB840L51 Package TO-78 E23 SMD Transistor A1 OPB875N51 MEXICO TRANSMISSIVE SENSOR OPB365T55 OPB840L55 OPB970N51
E421 fet

Abstract: equivalent transistor e176 J2N2608 2N390G TRANSISTOR e420 dual jfet 2N4360 equivalent transistors E112 jfet J2N3821 E421 dual JFET Teledyne Semiconductor jfet
Text: en @ 1 kHz n V A /H z Max @ 30juA aA Package TO-78 TO- 78 TO- 78 TO- 78 TO- 78 TO- 78 , .41 Package Drawings , developed for high volume production of de­ pendable diodes. Glass package devices start with a thick , . Performance is the other half of the Teledyne diode story. Features like the new PowerStud package - a glass DO-41 outline package w ith extra large studs, used in the 1 Watt zener line to boost power handling


OCR Scan
PDF O-72P* O-92X O-105 O-106 O-106P E421 fet equivalent transistor e176 J2N2608 2N390G TRANSISTOR e420 dual jfet 2N4360 equivalent transistors E112 jfet J2N3821 E421 dual JFET Teledyne Semiconductor jfet
1999 - PAC1000

Abstract: SAM448 DALLAS 2501 WS27c010 PSD100 IR 9515 datasheet Waferscale Integration pac1000 Microcontroller AT89C51 plcc 44 pin details BA 9706 K 9435, ic
Text: .4-1 PSD/SYSTEM LOGIC RELIABILITY DATA DEVICE PACKAGE PRODUCT DESCRIPTION PSD813F1 52 , DEVICE PACKAGE PRODUCT DESCRIPTION WS27C128L 28 Pin CERDIP (600 Mil) 28 Pin PDIP (600 Mil , .) DEVICE PACKAGE PRODUCT DESCRIPTION WS57C128FB 28 Pin CERDIP (600 Mil) High Speed 16K x 8 , appropriate, data is summarized by stress test, and further segregated by package type. Since Waferscale , product (mechanical shock; solderability; package mark integrity; etc) are routinely performed in


Original
PDF 8/10/99mc PAC1000 SAM448 DALLAS 2501 WS27c010 PSD100 IR 9515 datasheet Waferscale Integration pac1000 Microcontroller AT89C51 plcc 44 pin details BA 9706 K 9435, ic
2009 - 208z

Abstract: PBGA 23X23 0.8 pitch SSZA002 Texas Instruments Philippines 23x23 tray 27X27 376ZDW high current pogo pin shape tray 23X23
Text: SSZA002 ­ August 2009 1. Introduction: The Plastic Ball Grid Array or PBGA package , qualified and ramp by Texas Instruments Philippines is a cavity-up laminate based substrate package in which the die is , then overmolded and solder balls attached to form the package . This package provides a cost-effective , design and simulation capabilities enable package optimizations needed for maximum electrical and thermal performance. The PBGA package is offered in a range of sizes from 17mm x 17mm to 31mm x 31mm, in


Original
PDF SSZA002 208z PBGA 23X23 0.8 pitch SSZA002 Texas Instruments Philippines 23x23 tray 27X27 376ZDW high current pogo pin shape tray 23X23
2002 - transistor H1A

Abstract: h1a transistor transistor H1A H2A sony CCD ICX452AQ ICX452AQ H1A marking TO-78 package
Text: Excellent anti-blooming characteristics · 20-pin high-precision plastic package V 8 12 Pin 11 H 40 , 3632 1 5 44 980 CLK 936 1 28 1 RG SHP SHD 40 1 1 26 1 78 1 130 1 182 1 234 1 1 52 1 78 234 1 78 1 234 1 234 1 78 78 1 78 1 78 1 1 234 1 78 1 78 1 234 1 78 1 78 1 234 1 234 1 234 78 78 1 1 234 1 234 1 78 1 78 1 78 1 234 1 234 1 208 V1 1 156 V2 ­ 25 ­ 1 372 88 1 1 104 V3A/V3B 1 1 78 52 V4 1 V5A/V5B 1 234 1 78 V6 1


Original
PDF ICX452AQ ICX452AQ AS-B6-02 transistor H1A h1a transistor transistor H1A H2A sony CCD ICX452AQ H1A marking TO-78 package
2011 - IS43TR16640A

Abstract: IS43TR81280A DDR31866K 64MX16 bc 888
Text: Configuration: 128Mx8 64Mx16 Package : 96-ball FBGA (9mm x 13mm) for x16 78 -ball FBGA (8mm x 10.5mm) for x8 , package ballout 78 -ball FBGA ­ x8 A B C D E F G H J K L M N 1 VSS VSS VDDQ VSSQ VREFDQ NC1 ODT NC VSS VDD , -187FBL IS43TR81280A -15GBL IS43TR81280A -15HBL IS43TR81280A -125JBL IS43TR81280A -125KBL Package 78 , IS43TR81280A -15GBLI IS43TR81280A -15HBLI IS43TR81280A -125JBLI IS43TR81280A -125KBLI Package 78 -ball FBGA , IS46TR81280A -15HBLA1 IS46TR81280A -125JBLA1 IS46TR81280A -125KBLA1 Package 78 -ball FBGA,Lead-free 78 -ball FBGA


Original
PDF IS43/46TR16640A/AL, IS43/46TR81280A/AL 128Mx8, 64Mx16 cycles/64 cycles/32 78-ball IS43TR16640A IS43TR81280A DDR31866K bc 888
2002 - transistor H1A

Abstract: transistor H1A H2A h1a transistor marking v6 78 diode icx452 H1A marking V6 69 diode package marking v5a ICX452AQF
Text: · Excellent anti-blooming characteristics · 20-pin high-precision plastic package V 8 12 Pin , 40 1 1 26 1 78 1 130 1 182 1 234 1 1 52 1 78 234 1 78 1 234 1 234 1 78 78 1 78 1 78 1 1 234 1 78 1 78 1 234 1 78 1 78 1 234 1 234 1 234 78 78 1 1 234 1 234 1 78 1 78 1 78 1 234 1 234 1 208 V1 1 156 V2 ­ 25 ­ 1 372 88 1 1 104 V3A/V3B 1 1 78 52 V4 1 V5A/V5B 1 234 1 78 V6 1 26 H1A/H1B H2A/H2B ICX452AQF SUB 1 476 1008


Original
PDF ICX452AQF ICX452AQF AS-B7-03 transistor H1A transistor H1A H2A h1a transistor marking v6 78 diode icx452 H1A marking V6 69 diode package marking v5a
Ablebond 8390

Abstract: LM358CD ppt on ic TL431CD PPF leadframe TL082CD mp8000 CH4 LM358D TL082 LM393
Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN DSG-COM/03/145 PCN LEADFREE PLATING FOR SO8 PACKAGE , STANDARD LINEAR products in SO8 package Type Of Change Package assembly process change Reason For , "E" letter on the package close to ST LOGO Description of qualification program See Attached , 0091984 Construction analysis 0037709 Package construction analysis 7006451 Management of manufacturing , possible, the letter "E" will be added in the marking pattern beside the ST logo on the package body. 1.3


Original
PDF DSG-COM/03/145 LM393DT/LM358DT. DSG-COM/03/145" 07-May-2003 Ablebond 8390 LM358CD ppt on ic TL431CD PPF leadframe TL082CD mp8000 CH4 LM358D TL082 LM393
1999 - sot446

Abstract: sot482a MSC090 SOD89
Text: SO packages by insertion into its end and turning to lock in place Package Packing method , PHILIPS PACKAGE TYPE/OUTLINE CODE SOD27 TAPPING WIDTH (mm) 26 52 37 SOD57 SOD61 SOD64 SOD66 SOD68 SOD70 , Packing Methods Tape and reel - surface mount devices PHILIPS PACKAGE TYPE/OUTLINE CODE SOD80 REEL , Semiconductors Discrete Semiconductor Packages Packing Methods Chapter 6 PHILIPS PACKAGE TYPE/OUTLINE , PHILIPS PACKAGE TYPE/OUTLINE CODE SOD80 SOD87 SOD106 SOD110 SOD323 SOD523 SOT23 SOT89 SOT96-1 (SO8) SOT143


Original
PDF OT186 OT32/82 MSC084 OT195 OT223 MSC078 sot446 sot482a MSC090 SOD89
1997 - SAM448

Abstract: pac1000 PSD100 PAC1000A BA 9515 WS*57c257 ws57c257 ba 4913 ws57c43 psi c 275 9 121
Text: .4-1 PROM/RPROM/EPROM RELIABILITY DATA DEVICE PACKAGE PRODUCT DESCRIPTION WS27C128L 28 , .) DEVICE PACKAGE PRODUCT DESCRIPTION WS57C49C 24 Pin CERDIP (300 Mil) 24 Pin PDIP (300 Mil , Table of Contents ­ Reliability Summary 1997 PSD/SYSTEM LOGIC RELIABILITY DATA DEVICE PACKAGE , the thermal resistance of the package . It is then added to the ambient temperature. hours of the , monitors include retention tests and dynamic life tests as well as various package related tests. A


Original
PDF WS59032 2-201-1A 91-1624-AC CA112 101-Pin 92-201-1B SAM448 pac1000 PSD100 PAC1000A BA 9515 WS*57c257 ws57c257 ba 4913 ws57c43 psi c 275 9 121
B 315 D

Abstract: SOT494 SOT89 pq SOT89 Package pq TRANSISTOR SMD CODE PACKAGE SOT89 4 SOT233 SOD89 TRANSISTOR SMD CODE PACKAGE SOT89 SOT128 msc377
Text: 40 315 × 118 × 78 B 4 8 32 315 × 118 × 78 D PHILIPS PACKAGE TYPE/OUTLINE , 118 × 78 D 20 3 60 315 × 118 × 78 A PHILIPS PACKAGE TYPE/OUTLINE CODE SOT423 , can contain IC products Package Container with leads for an IC chip (also known as an envelope , PACKING QUANTITIES, BOX DIMENSIONS AND CARRIER SHAPES Reel pack - axial and radial taped PHILIPS PACKAGE , DIMENSIONS D×W (mm) 330 × 8 PHILIPS PACKAGE TYPE/OUTLINE CODE 50000 5 339 × 339 × 71 180 ×


Original
PDF OT195 OT223 MSC078 B 315 D SOT494 SOT89 pq SOT89 Package pq TRANSISTOR SMD CODE PACKAGE SOT89 4 SOT233 SOD89 TRANSISTOR SMD CODE PACKAGE SOT89 SOT128 msc377
2003 - A1-0505S

Abstract: A10505 A1053 A1057 5-1205S A1-0505SH
Text: Package Single, Dual and Dual Separate Output Low Ripple and Noise ASIAN CONVERTER TECHNOLOGY , 29 3.3 5 7 12 5 12 5 150 100 70 42 100 42 100 76 78 74 76 74 76 72 1W, 1kVDC, Single , * A1-1205S12 16 107 5 200 78 * A1-1212S12 15 128 12 100 78 * A1-2405S24 8 53 5 200 78 * * Select on Inquiry Form SIP4 (Suffix 'S') or DIP8 (Suffix 'D') package size, see model code information on page 6 , 128 60 64 56 ±5 ±12 ±15 ±5 ±12 ±5 ±12 ±15 ±100 ±50 ±35 ±100 ±50 ±100 ±50 ±35 72 78 78 70 78 70 78 75


Original
PDF 5-0505S* 5-0512S* 5-1205S* 5-1212S* 5-2405S* A1-053 3SA1-0505S- 12VDC 15VDC 12/12VDC A1-0505S A10505 A1053 A1057 5-1205S A1-0505SH
2011 - 78 ball fbga

Abstract: 128Mx16 DDR3 DRAM 2GB 128Mx16 96BALL FBGA 78-Ball 96-ball FBGA 256Mx8 96-BALL 96-ball FBGA ddr3 ddr3 78 ball 78ball FBGA
Text: Configuration: 256Mx8 128Mx16 Package : 96-ball FBGA (9mm x 13mm) for x16 78 -ball FBGA (9mm x 10.5mm) for x8 , /AL, IS43/46TR82560A/AL 1. DDR3 PACKAGE BALLOUT 1.1 DDR3 SDRAM package ballout 78 -ball FBGA ­ x8 A , . IS43TR82560A -187FBL IS43TR82560A -15HBL IS43TR82560A -125KBL Package 78 -ball FBGA,Lead-free 78 -ball FBGA , -15HBLI IS43TR82560A -125KBLI Package 78 -ball FBGA,Lead-free 78 -ball FBGA,Lead-free 78 -ball FBGA,Lead-free , Package 78 -ball FBGA,Lead-free 78 -ball FBGA,Lead-free 78 -ball FBGA,Lead-free 256Mx8 ­ Automotive, A2


Original
PDF IS43/46TR16128A/AL, IS43/46TR82560A/AL 256Mx8, 128Mx16 cycles/64 cycles/32 Ref82560A/AL 78-ball 78 ball fbga DDR3 DRAM 2GB 128Mx16 96BALL FBGA 96-ball FBGA 256Mx8 96-BALL 96-ball FBGA ddr3 ddr3 78 ball 78ball FBGA
2007 - SP1117M3-3

Abstract: SOT 24 ZC 3PIN 807 tube TO-263-3 SP1117M3-3.3 SP1117 tube 807 SPX1117U 2N3904 adj612
Text: improve the load transient response. Soldering Methods The SPX1117 SOT-223 package is designed to be , package . The SOT-223 recommended soldering method are as follows: vapor phase reflow and infrared , thermal resistance of SPX1117 (SOT-223 Package ) is 15°C/W from junction to tab and 31 °C/W from tab to , Voltage Regulator 9 © 2007 Sipex Corporation PACKAGE : 3 PIN SOT-223 Apr 20-07 Rev B SPX1117 800mA Low Dropout Voltage Regulator 10 © 2007 Sipex Corporation PACKAGE : 3 PIN TO


Original
PDF SPX1117 800mA OT-223 O-252, O-220, O-263 SPX1117 SP1117M3-3 SOT 24 ZC 3PIN 807 tube TO-263-3 SP1117M3-3.3 SP1117 tube 807 SPX1117U 2N3904 adj612
2009 - X02A SOT23-6

Abstract: x01a ADCS7478AIMF ADCS7478 ADCS7477AIMF ADCS7477 ADCS7476AIMFX ADCS7476AIMF ADCS7476 x01a SOT23-6
Text: -bit analog-to-digital converters that operate at 1 MSPS. The ADCS7476/77/ 78 are dropin replacements for Analog Devices' AD7476/77/ 78 . Each device is based on a successive approximation register architecture with internal , , and many common DSP serial interfaces. The ADCS7476/77/ 78 uses the supply voltage as a reference , trade throughput for power consumption. The ADCS7476/77/ 78 is operated with a single supply that can , available in a 6-lead, SOT-23 package and in a 6-lead LLP, both of which provide an extremely small


Original
PDF 12-/10-/8-Bit OT-23 ADCS7476, ADCS7477, ADCS7478 ADCS7476/77/78 AD7476/77/78. X02A SOT23-6 x01a ADCS7478AIMF ADCS7477AIMF ADCS7477 ADCS7476AIMFX ADCS7476AIMF ADCS7476 x01a SOT23-6
2007 - ADCS7476

Abstract: ADCS7476AIMF ADCS7476AIMFX ADCS7477 ADCS7477AIMF ADCS7478 ADCS7478AIMF Voltage Regulator X01A X01A
Text: -bit analog-to-digital converters that operate at 1 MSPS. The ADCS7476/77/ 78 are dropin replacements for Analog Devices' AD7476/77/ 78 . Each device is based on a successive approximation register architecture with internal , , and many common DSP serial interfaces. The ADCS7476/77/ 78 uses the supply voltage as a reference , trade throughput for power consumption. The ADCS7476/77/ 78 is operated with a single supply that can , available in a 6-lead, SOT-23 package and in a 6-lead LLP, both of which provide an extremely small


Original
PDF ADCS7476/ADCS7477/ADCS7478 12-/10-/8-Bit OT-23 ADCS7476, ADCS7477, ADCS7478 ADCS7476/77/78 AD7476/77/78. ADCS7476 ADCS7476AIMF ADCS7476AIMFX ADCS7477 ADCS7477AIMF ADCS7478AIMF Voltage Regulator X01A X01A
2007 - Not Available

Abstract: No abstract text available
Text: -bit analog-to-digital converters that operate at 1 MSPS. The ADCS7476/77/ 78 are dropin replacements for Analog Devices' AD7476/77/ 78 . Each device is based on a successive approximation register architecture with internal , „¢, and many common DSP serial interfaces. The ADCS7476/77/ 78 uses the supply voltage as a reference , trade throughput for power consumption. The ADCS7476/77/ 78 is operated with a single supply that can , available in a 6-lead, SOT-23 package and in a 6-lead LLP, both of which provide an extremely small


Original
PDF ADCS7476/ADCS7477/ADCS7478 12-/10-/8-Bit OT-23 ADCS7476, ADCS7477, ADCS7478 ADCS7476/77/78 AD7476/77/78.
2002 - D-0505S-S

Abstract: D24050 Asian Converter Technology SIP7 D12051 D0515S D2415 SIP7 package
Text: Package Single, Dual and Dual Separate Output Low Ripple and Noise ASIAN CONVERTER TECHNOLOGY , 53 55 29 28 5 12 5 12 3.3 5 12 5 12 200 84 200 84 303 200 84 200 84 78 78 78 78 74 78 75 70 , 256 ±15 ±34 78 * D-1205D12 15 119 ±5 ±100 70 * D-1212D12 15 106 ±12 ±42 78 * D-243.3D24 6 61 ±3.3 ±150 , SIP7 (Suffix 'S') or DIP14 (Suffix 'D') package size, see model code information on page 20. Continued , 256 256 250 106 111 53 55 53 5 12 15 5 12 5 12 15 200 84 67 200 84 200 84 67 78 78 80 78 75


Original
PDF D-0505S- D-0512S* D-1205S* D-1212S* D-243 D-2405S* D-2412S* D-4805S* D-4812S* D-053 D-0505S-S D24050 Asian Converter Technology SIP7 D12051 D0515S D2415 SIP7 package
Supplyframe Tracking Pixel