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Part ECAD Model Manufacturer Description Datasheet Download Buy Part
TPH9R00CQH TPH9R00CQH ECAD Model Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
XPH3R206NC XPH3R206NC ECAD Model Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
XPH2R106NC XPH2R106NC ECAD Model Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
TPHR7404PU TPHR7404PU ECAD Model Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 0.00074 Ω@10V, SOP Advance, U-MOS-H
ISO7142CCQDBQRQ1 ISO7142CCQDBQRQ1 ECAD Model Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125
ISO7142CCQDBQQ1 ISO7142CCQDBQQ1 ECAD Model Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125

PZ S-PQFP-G100 Package footprint Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1994 - Not Available

Abstract: No abstract text available
Text: Operation With 5-V Tolerance Using 5-V Bias Terminals High Performance 100-Pin PZ Package Implements , ACTIVE ACTIVE ACTIVE Package Type LQFP LQFP LQFP LQFP Package Drawing PZ PZ PZ PZ Pins Package , Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING , used between the die and package , or 2) lead-based die adhesive used between the die and leadframe. The , DATA MTQF013A ­ OCTOBER 1994 ­ REVISED DECEMBER 1996 PZ (S-PQFP-G100) PLASTIC QUAD FLATPACK 0


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PDF TSB12LV32 TSB12LV32I SLLA215 P1394a 1394a-2000
1994 - P1394a TSB12LV32

Abstract: Physical Layer Controllers TSB12LV31 TSB12LV32 TSB12LV32-EP TSB12LV32I TSB12LV32IPZ TSB12LV32IPZG4 TSB12LV32PZ TSB12LV32PZG4
Text: Operation With 5-V Tolerance Using 5-V Bias Terminals High Performance 100-Pin PZ Package NOTE , PACKAGE OPTION ADDENDUM www.ti.com 2-Mar-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TSB12LV32IPZ ACTIVE LQFP PZ 100 TSB12LV32IPZG4 ACTIVE LQFP PZ 100 TSB12LV32PZ ACTIVE LQFP PZ 100 TSB12LV32PZG4 ACTIVE LQFP PZ 100 1 Lead/Ball Finish MSL Peak Temp (3


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PDF TSB12LV32 TSB12LV32I SLLA215 P1394a 1394a-2000 P1394a TSB12LV32 Physical Layer Controllers TSB12LV31 TSB12LV32 TSB12LV32-EP TSB12LV32I TSB12LV32IPZ TSB12LV32IPZG4 TSB12LV32PZ TSB12LV32PZG4
1994 - P1394a TSB12LV32

Abstract: Physical Layer Controllers TSB12LV31 TSB12LV32 TSB12LV32-EP TSB12LV32I TSB12LV32IPZ TSB12LV32IPZG4 TSB12LV32PZ TSB12LV32PZG4
Text: Operation With 5-V Tolerance Using 5-V Bias Terminals High Performance 100-Pin PZ Package NOTE , PACKAGE OPTION ADDENDUM www.ti.com 4-Nov-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty 1 Eco Plan (2) TBD Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TSB12LV32IPZ NRND LQFP PZ 100 TSB12LV32IPZG4 OBSOLETE LQFP PZ 100 TSB12LV32PZ ACTIVE LQFP PZ 100


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PDF TSB12LV32 TSB12LV32I SLLA215 P1394a 1394a-2000 P1394a TSB12LV32 Physical Layer Controllers TSB12LV31 TSB12LV32 TSB12LV32-EP TSB12LV32I TSB12LV32IPZ TSB12LV32IPZG4 TSB12LV32PZ TSB12LV32PZG4
1994 - Physical Layer Controllers

Abstract: TSB12LV31 TSB12LV32 TSB12LV32-EP TSB12LV32I TSB12LV32IPZ TSB12LV32IPZG4 TSB12LV32PZ TSB12LV32PZG4
Text: Operation With 5-V Tolerance Using 5-V Bias Terminals High Performance 100-Pin PZ Package NOTE , PACKAGE OPTION ADDENDUM www.ti.com 28-May-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TSB12LV32IPZ ACTIVE LQFP PZ 100 TSB12LV32IPZG4 OBSOLETE LQFP PZ 100 TSB12LV32PZ ACTIVE LQFP PZ 100 TSB12LV32PZG4 ACTIVE LQFP PZ 100 1 Lead/Ball Finish MSL Peak Temp (3


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PDF TSB12LV32 TSB12LV32I SLLA215 P1394a 1394a-2000 Physical Layer Controllers TSB12LV31 TSB12LV32 TSB12LV32-EP TSB12LV32I TSB12LV32IPZ TSB12LV32IPZG4 TSB12LV32PZ TSB12LV32PZG4
1994 - Physical Layer Controllers

Abstract: No abstract text available
Text: Operation With 5-V Tolerance Using 5-V Bias Terminals High Performance 100-Pin PZ Package Implements , Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2012 PACKAGING INFORMATION Orderable Device TSB12LV32IPZ TSB12LV32IPZG4 TSB12LV32PZ TSB12LV32PZG4 Status (1) Package Type Package Drawing LQFP LQFP LQFP LQFP PZ PZ PZ PZ Pins 100 100 100 100 Package Qty Eco Plan , ) lead-based flip-chip solder bumps used between the die and package , or 2) lead-based die adhesive used


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PDF TSB12LV32 TSB12LV32I SLLA215 P1394a 1394a-2000 Physical Layer Controllers
1994 - Not Available

Abstract: No abstract text available
Text: 100-Pin PZ Package NOTE: Implements technology covered by one or more patents of Apple Computer , Feedback PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL , LQFP PZ 100 TBD Call TI Call TI -40 to 85 TSB12LV32PZ ACTIVE LQFP PZ , F711538A TSB12LV32PZG4 ACTIVE LQFP PZ 100 90 Green (RoHS & no Sb/Br) CU NIPDAU


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PDF TSB12LV32 TSB12LV32I SLLA215 P1394a 1394a-2000
1994 - Not Available

Abstract: No abstract text available
Text: Operation With 5-V Tolerance Using 5-V Bias Terminals High Performance 100-Pin PZ Package Implements , Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 15-Nov-2012 PACKAGING INFORMATION Orderable Device TSB12LV32IPZG4 TSB12LV32PZ TSB12LV32PZG4 Status (1) Package Type Package Pins Package Qty Drawing LQFP LQFP LQFP PZ PZ PZ 100 100 100 90 90 Eco Plan (2) Lead/Ball Finish , package , or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise


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PDF TSB12LV32 TSB12LV32I SLLA215 P1394a 1394a-2000
1994 - MS-026

Abstract: S-PQFP-G100
Text: MECHANICAL DATA MTQF013A ­ OCTOBER 1994 ­ REVISED DECEMBER 1996 PZ (S-PQFP-G100) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 75 0,08 M 51 76 50 100 26 1 0,13 NOM 25 12,00 TYP Gage Plane 14,20 SQ 13,80 16,20 SQ 15,80 0,05 MIN 1,45 1,35 0,25 0°­ 7° 0,75 0,45 Seating Plane 0,08 1,60 MAX 4040149 /B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC


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PDF MTQF013A S-PQFP-G100) MS-026 MS-026 S-PQFP-G100
1995 - S-PQFP-G100

Abstract: No abstract text available
Text: MECHANICAL DATA MTQF013 ­ OCTOBER 1994 PZ (S-PQFP-G100) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 75 0,08 M 51 76 50 100 26 1 0,13 NOM 25 12,00 TYP Gage Plane 14,20 SQ 13,80 16,20 SQ 15,80 0,05 MIN 1,45 1,35 0,25 0°­ 7° 0,75 0,45 Seating Plane 0,08 1,60 MAX 4040149 / B 10/94 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MO-136 · POST OFFICE BOX


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PDF MTQF013 S-PQFP-G100) MO-136 S-PQFP-G100
1996 - S-PQFP-G100

Abstract: No abstract text available
Text: MECHANICAL DATA MTQF013 ­ OCTOBER 1994 PZ (S-PQFP-G100) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 75 0,08 M 51 76 50 100 26 1 0,13 NOM 25 12,00 TYP Gage Plane 14,20 SQ 13,80 16,20 SQ 15,80 0,05 MIN 1,45 1,35 0,25 0°­ 7° 0,75 0,45 Seating Plane 0,08 1,60 MAX 4040149 /A 03/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MO-136 POST OFFICE BOX


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PDF MTQF013 S-PQFP-G100) MO-136 S-PQFP-G100
1992 - transistor 3B6 smd

Abstract: 5962-9557701NXD SN54ABTH32245 SN74ABTH32245 SN74ABTH32245PZ PRR10MHz
Text: °C High-Impedance State During Power Up and Power Down Released as DSCC SMD 5962-9557701NXD PZ Package Qualified , Quad Flat ( PZ ) Package With 14 × 14-mm Body Using 0.5-mm Lead Pitch and Space-Saving 100-Pin Ceramic , GND 1B1 1B2 1B3 1B4 1B5 GND 1B6 1B7 1B8 'ABTH32245 . . . PZ PACKAGE (TOP VIEW) 100 99 , To Eight Other Channels Pin numbers shown are for the PZ package . POST OFFICE BOX 655303 · , , JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50


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PDF SN54ABTH32245, SN74ABTH32245 36-BIT SCBS228G JESD-17 5962-9557701NXD MIL-PRF-38535 32-mA 64-mA transistor 3B6 smd 5962-9557701NXD SN54ABTH32245 SN74ABTH32245 SN74ABTH32245PZ PRR10MHz
1992 - Not Available

Abstract: No abstract text available
Text: °C High-Impedance State During Power Up and Power Down Released as DSCC SMD 5962-9557701NXD PZ Package Qualified for , Need for External Pullup/Pulldown Resistors Package Options Include 100-Pin Plastic Thin Quad Flat ( PZ , ) Package 'ABTH32245 . . . PZ PACKAGE (TOP VIEW) 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 , shown are for the PZ package . To Eight Other Channels POST OFFICE BOX 655303 · DALLAS, TEXAS , ): PZ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C/W Storage


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PDF SN54ABTH32245, SN74ABTH32245 36-BIT SCBS228G JESD-17 5962-9557701NXD MIL-PRF-38535 32-mA 64-mA
1992 - 5962-9557701NXD

Abstract: SN54ABTH32245 SN74ABTH32245 SN74ABTH32245PZ
Text: °C High-Impedance State During Power Up and Power Down Released as DSCC SMD 5962-9557701NXD PZ Package Qualified , Quad Flat ( PZ ) Package With 14 × 14-mm Body Using 0.5-mm Lead Pitch and Space-Saving 100-Pin Ceramic , GND 1B1 1B2 1B3 1B4 1B5 GND 1B6 1B7 1B8 'ABTH32245 . . . PZ PACKAGE (TOP VIEW) 100 99 , To Eight Other Channels Pin numbers shown are for the PZ package . POST OFFICE BOX 655303 · , , JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50


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PDF SN54ABTH32245, SN74ABTH32245 36-BIT SCBS228G JESD-17 5962-9557701NXD MIL-PRF-38535 32-mA 64-mA 5962-9557701NXD SN54ABTH32245 SN74ABTH32245 SN74ABTH32245PZ
1992 - smd 1a2

Abstract: transistor 3B6 smd SN54ABTH32245 SN74ABTH32245 SN74ABTH32245PZ 5962-9557701NXD ABTH32245 smd 1A9
Text: °C High-Impedance State During Power Up and Power Down Released as DSCC SMD 5962-9557701NXD PZ Package Qualified , Quad Flat ( PZ ) Package With 14 × 14-mm Body Using 0.5-mm Lead Pitch and Space-Saving 100-Pin Ceramic , GND 1B1 1B2 1B3 1B4 1B5 GND 1B6 1B7 1B8 'ABTH32245 . . . PZ PACKAGE (TOP VIEW) 100 99 , To Eight Other Channels Pin numbers shown are for the PZ package . POST OFFICE BOX 655303 · , , JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50


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PDF SN54ABTH32245, SN74ABTH32245 36-BIT SCBS228G JESD-17 5962-9557701NXD MIL-PRF-38535 32-mA 64-mA smd 1a2 transistor 3B6 smd SN54ABTH32245 SN74ABTH32245 SN74ABTH32245PZ 5962-9557701NXD ABTH32245 smd 1A9
1992 - Not Available

Abstract: No abstract text available
Text: -Pin Plastic Thin Quad Flat ( PZ ) Package With 14 × 14-mm Body Using 0.5-mm Lead Pitch and Space-Saving 100 , 2OE 2DIR GND 1B1 1B2 1B3 1B4 1B5 GND 1B6 1B7 1B8 ’ABTH32245 . . . PZ PACKAGE (TOP , shown are for the PZ package . POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54ABTH32245 , . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): PZ package . . . , 25°C High-Impedance State During Power Up and Power Down Released as DSCC SMD 5962-9557701NXD PZ


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PDF SN54ABTH32245, SN74ABTH32245 36-BIT SCBS228G JESD-17 5962-9557701NXD MIL-PRF-38535 32-mA 64-mA
TMS320AV7100

Abstract: TSB12LV41
Text: Terminals High-Performance 100-Pin PZ (S-PQFP-G100) Package · · · · · description The , CONTROLLER S L L S 2 76-J U N E 1997 PZ PACKAGE (TO P V IE W ) PRODUCT PREVIEW Functional Block


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PDF TSB12LV41 TSB11C03, TSB11LV01, TSB21LV03 100/100/200M TMS320AV7100/7110/7200 8-/16-bit 256-Byte) A052297 TMS320AV7100 TSB12LV41
1992 - Not Available

Abstract: No abstract text available
Text: Options Include 100-Pin Plastic Thin Quad Flat ( PZ ) Package With 14 × 14-mm Body Using 0.5-mm Lead Pitch and Space-Saving 100-Pin Ceramic Quad Flat (HS) Package 'ABTH32543 . . . PZ PACKAGE (TOP VIEW , 40 41 39 14 C1 1D 62 2B1 C1 1D To 17 Other Channels Pin numbers shown are for the PZ package , . ­50 mA Package thermal impedance, JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . , Package Drawing PZ PZ PZ Pins Package Eco Plan (2) Qty 100 100 100 1 90 90 TBD Green (RoHS & no Sb/Br


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PDF SN54ABTH32543, SN74ABTH32543 36-BIT SCBS230F JESD-17 5962-9557801NXD 32-mA 64-mA 100-Pin
1992 - 5962-9557601NXD

Abstract: SN54ABTH32501 SN74ABTH32501
Text: Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include 100-Pin Plastic Thin Quad Flat ( PZ ) Package With 14 × 14-mm Body Using 0.5-mm Lead Pitch and Space-Saving 100 , . PZ PACKAGE (TOP VIEW) 2A10 2A9 GND 2A8 2A7 2A6 2A5 GND 2A4 2A3 2A2 2A1 VCC 1A1 , Channels Pin numbers shown are for the PZ package . 4 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 , , JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50


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PDF SN54ABTH32501, SN74ABTH32501 36-BIT SCBS229F MIL-STD-883, JESD-17 5962-9557601NXD 5962-9557601NXD SN54ABTH32501 SN74ABTH32501
1992 - Not Available

Abstract: No abstract text available
Text: External Pullup/Pulldown Resistors Package Options Include 100-Pin Plastic Thin Quad Flat ( PZ ) Package With , 'ABTH32501 . . . PZ PACKAGE (TOP VIEW) 2A10 2A9 GND 2A8 2A7 2A6 2A5 GND 2A4 2A3 2A2 2A1 VCC 1A1 1A2 1A3 , CLK LE D 64 2B1 To 17 Other Channels Pin numbers shown are for the PZ package . 4 POST OFFICE , impedance, JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , ) OBSOLETE ACTIVE ACTIVE Package Type LQFP LQFP LQFP Package Drawing PZ PZ PZ Pins Package Eco Plan


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PDF SN54ABTH32501, SN74ABTH32501 36-BIT SCBS229F MIL-STD-883, JESD-17 5962-9557601NXD
1992 - Not Available

Abstract: No abstract text available
Text: Options Include 100-Pin Plastic Thin Quad Flat ( PZ ) Package With 14 × 14-mm Body Using 0.5-mm Lead Pitch and Space-Saving 100-Pin Ceramic Quad Flat (HS) Package 'ABTH32543 . . . PZ PACKAGE (TOP VIEW , 40 41 39 14 C1 1D 62 2B1 C1 1D To 17 Other Channels Pin numbers shown are for the PZ package , . ­50 mA Package thermal impedance, JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . , Package Drawing PZ PZ PZ Pins Package Eco Plan (2) Qty 100 100 100 1 90 90 TBD Green (RoHS & no Sb/Br


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PDF SN54ABTH32543, SN74ABTH32543 36-BIT SCBS230F JESD-17 5962-9557801NXD 32-mA 64-mA 100-Pin
1992 - Not Available

Abstract: No abstract text available
Text: External Pullup/Pulldown Resistors Package Options Include 100-Pin Plastic Thin Quad Flat ( PZ ) Package With , 'ABTH32501 . . . PZ PACKAGE (TOP VIEW) 2A10 2A9 GND 2A8 2A7 2A6 2A5 GND 2A4 2A3 2A2 2A1 VCC 1A1 1A2 1A3 , CLK LE D 64 2B1 To 17 Other Channels Pin numbers shown are for the PZ package . 4 POST OFFICE , impedance, JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , Package Type LQFP LQFP Package Drawing PZ PZ Pins Package Eco Plan (2) Qty 100 100 90 TBD Green


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PDF SN54ABTH32501, SN74ABTH32501 36-BIT SCBS229F MIL-STD-883, JESD-17 5962-9557601NXD
1994 - MS-026

Abstract: S-PQFP-G100
Text: MECHANICAL DATA MTQF013A ­ OCTOBER 1994 ­ REVISED DECEMBER 1996 PZ (S-PQFP-G100) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 75 0,08 M 51 76 50 100 26 1 0,13 NOM 25 12,00 TYP Gage Plane 14,20 SQ 13,80 16,20 SQ 15,80 0,05 MIN 1,45 1,35 0,25 0°­ 7° 0,75 0,45 Seating Plane 0,08 1,60 MAX 4040149 /B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC


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PDF MTQF013A S-PQFP-G100) MS-026 MS-026 S-PQFP-G100
1992 - Not Available

Abstract: No abstract text available
Text: Options Include 100-Pin Plastic Thin Quad Flat ( PZ ) Package With 14 × 14-mm Body Using 0.5-mm Lead Pitch and Space-Saving 100-Pin Ceramic Quad Flat (HS) Package 'ABTH32543 . . . PZ PACKAGE (TOP VIEW , 40 41 39 14 C1 1D 62 2B1 C1 1D To 17 Other Channels Pin numbers shown are for the PZ package , . ­50 mA Package thermal impedance, JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . , SN74ABTH32543PZ (1) Status (1) ACTIVE ACTIVE Package Type LQFP LQFP Package Drawing PZ PZ Pins


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PDF SN54ABTH32543, SN74ABTH32543 36-BIT SCBS230F JESD-17 5962-9557801NXD 32-mA 64-mA 100-Pin
1992 - Not Available

Abstract: No abstract text available
Text: Options Include 100-Pin Plastic Thin Quad Flat ( PZ ) Package With 14 × 14-mm Body Using 0.5-mm Lead Pitch and Space-Saving 100-Pin Ceramic Quad Flat (HS) Package 'ABTH32543 . . . PZ PACKAGE (TOP VIEW , 40 41 39 14 C1 1D 62 2B1 C1 1D To 17 Other Channels Pin numbers shown are for the PZ package , . ­50 mA Package thermal impedance, JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . , Package Drawing PZ PZ PZ Pins Package Eco Plan (2) Qty 100 100 100 1 90 90 Green (RoHS & no Sb/Br


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PDF SN54ABTH32543, SN74ABTH32543 36-BIT SCBS230F JESD-17 5962-9557801NXD 32-mA 64-mA 100-Pin
1994 - SN74ABTH32543-EP

Abstract: 1A11 1A12 1A13 SN74ABTH32543MPZEP
Text: /Pulldown Resistors 100-Pin Plastic Thin Quad Flat ( PZ ) Package With 14- × 14-mm Body Using 0.5-mm Lead , ­55°C to 125°C LQFP ­ PZ SN74ABTH32543MPZEP 74ABTH32543MEP Package drawings, standard packing , 1B2 1B3 1B4 1B5 GND 1B6 1B7 1B8 PZ PACKAGE (TOP VIEW) 100 99 98 97 96 95 94 93 92 91 90 , thermal impedance, JA (see Note 2): PZ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , OBSOLETE LQFP PZ Pins Package Eco Plan (2) Qty 100 TBD Lead/Ball Finish Call TI MSL


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PDF SN74ABTH32543-EP 36-BIT SCBS757 SN74ABTH32543-EP 1A11 1A12 1A13 SN74ABTH32543MPZEP
Supplyframe Tracking Pixel