The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT1316CMS8#PBF Linear Technology LT1316 - Micropower DC/DC Converter with Programmable Peak Current Limit; Package: MSOP; Pins: 8; Temperature Range: 0°C to 70°C
LT1316CMS8#TRPBF Linear Technology LT1316 - Micropower DC/DC Converter with Programmable Peak Current Limit; Package: MSOP; Pins: 8; Temperature Range: 0°C to 70°C
LT1316CS8#PBF Linear Technology LT1316 - Micropower DC/DC Converter with Programmable Peak Current Limit; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C
LT1316CS8 Linear Technology LT1316 - Micropower DC/DC Converter with Programmable Peak Current Limit; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C
LT1316CS8#TRPBF Linear Technology LT1316 - Micropower DC/DC Converter with Programmable Peak Current Limit; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C
LT1316CS8#TR Linear Technology LT1316 - Micropower DC/DC Converter with Programmable Peak Current Limit; Package: SO; Pins: 8; Temperature Range: 0°C to 70°C

PEAK TRAY qfp 14x14 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
MC9S12Dx256

Abstract: tray qfp 14x14 1.4 tray qfp 14x14 PEAK TRAY qfp 14x14 MC9S12A256CFUE 1K79X peak mqfp 14x14 HCS12 1k79x IPC-1752 HCS12 MC
Text: Notice NEW TRAY INTRODUCTION FOR QFP 14X14X2.2 29 Nov 2005 27 Feb 2006 11462 Product Bulletin , 24 Jun 2003 8886 Product Bulletin REDESIGN OF NH1414 2.2 14X14 MQFP TRAY 19 May 2003 20 , Bulletin 14X14 QFP ASSY MOVE FROM SHC TO KLM, PT 2 OF 2 05 Aug 2002 06 Aug 2002 7659 Product , Description QFP 80 14*14*2.2P0.65 JEDEC Pkg Description PQFP-G80 Pin/Lead/Ball Count 80 , Report Moisture Sensitivity Level (MSL) 3 Floor Life 168 HOURS Package Peak Temperature


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PDF MC9S12A256BCFU MC9S12A256BCFU HCS12 PQFP-G80 MC9S12Dx256 tray qfp 14x14 1.4 tray qfp 14x14 PEAK TRAY qfp 14x14 MC9S12A256CFUE 1K79X peak mqfp 14x14 HCS12 1k79x IPC-1752 HCS12 MC
MCHC908AB32CFUR2

Abstract: No abstract text available
Text: Aug 2003 05 Aug 2003 8886 Product Bulletin REDESIGN OF NH1414 2.2 14X14 MQFP TRAY 19 , 22 Mar 2003 7856 Product Bulletin 14X14 QFP ASSY MOVE FROM SHC TO KLM, PT 2 OF 2 05 Aug , . View PCN and Replacement Part Package Information Parameter Value Package Description QFP , Sensitivity Level (MSL) 3 Floor Life 168 HOURS Package Peak Temperature (°C) 220 , COMPLIANT NON-EXEMPT - 2 09 Jan 2006 09 Jan 2006 11581 Product Change Notice NEW TRAY


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PDF MCHC908AB32CFUR2 MCHC908AB32CFUR2 SAG9AB32
1998 - 116-Pin

Abstract: semiconductor cross index Lead Free reflow soldering profile BGA PBGA 256 reflow profile tray qfp 14x14 1.4 tray bga 10x10 JIS-Z0202 224-pin plastic ball grid array 0.8mm reflow soldering profile BGA pcb warpage after reflow
Text: QFP 12x12 FPBGA 175 14x14 FPBGA 10x10 14x20 QFP 27x27 P-BGA 28x28 QFP 20x20 , AI Advantages FPBGATM and D2BGATM are smaller and lighter than currently prevalent QFP packages , !! Q1: How much smaller and lighter is the CSP compared to the QFP ? In case of FPBGA, 0.8mm pitch , and mixed soldering condition. In concurrent soldering of FPBGATM and D2BGATM with 0.5 mm QFP , the , 0.8mm pitch FPBGATM116PIN Opening ø0.6 mm ø0.35 mm QFP open short (bridge) 100µm


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PDF C13185EJ1V0PF00 116-Pin semiconductor cross index Lead Free reflow soldering profile BGA PBGA 256 reflow profile tray qfp 14x14 1.4 tray bga 10x10 JIS-Z0202 224-pin plastic ball grid array 0.8mm reflow soldering profile BGA pcb warpage after reflow
1999 - strapack s-669

Abstract: strapack d-52 Sivaron S 669 strapack MIL-I-8835A CAMTEX camtex trays s-669 strapping machine PQFP 176 J-Lead PEAK TRAY bga
Text: containing devices and 1 cover tray ). 7 AN 71: Guidelines for Handling J-Lead, QFP & BGA Devices , ) Package Package Dimensions (mm) Tray Capacity (Devices) Note (1) Peak Part Number (2 , ) Note (1) Package Dimensions (mm) Tray Capacity (Devices) Peak Part Number (2) Altera , . The current tray ( Peak part number NH-1010-2.0-0616-kn) for this package is compatible with the old tray ( Peak part number ND-1010-2.0-0616-n). Although Altera will eventually retire the old tray , both


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1995 - MIL-I-8835A

Abstract: camtex trays ND07071 camtex trays QFP E20-02080-00 ITW Camtex nd r304 CAMTEX E20-03708-00 exposed QFP 144
Text: tray ). Figure 7. Properly Aligned Peak Trays Trays with Chamfers Properly Aligned All of the , ° C, n = 6. The current tray ( Peak part number ND-1010-2.0-0616-k) for this package is compatible with the old tray ( Peak part number ND-1010-2.0-0616-n). Although Altera will eventually retire the old tray , both trays can safely be used together. Straps for QFP Devices Without Carriers Straps secure , tray . QFP device leads should never contact the tray . Figure 10. Transferring a QFP Device Using a


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2011 - daewon tray

Abstract: Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
Text: tray ). ■Shipping trays used for shipment of QFP and BGA (including FBGA, and lidless FBGA , . Properly-Aligned Peak Trays Guidelines for Handling J-Lead, QFP , BGA, FBGA, and Lidless FBGA Devices January , 652 BGA Parts or Tray Vendor and Vendor Part Number Handling J-Lead and QFP Devices , device is oriented and seated in the tray properly. ■Do not allow QFP device leads to contact , Guidelines for Handling J-Lead, QFP , BGA, FBGA, and Lidless FBGA Devices AN


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PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
Kostat tray

Abstract: Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 ks 870163 KS-8202 8201
Text: CUSTOMER ADVISORY ALTERNATE QFP SHIPPING TRAYS Altera is adding KOSTAT as an alternate supplier for existing PEAK QFP shipping trays. The new KOSTAT tray dimensions are comparable to the existing , performing functional tests. The QFP package types and KOSTAT tray part numbers are noted in the table below: Package Type 100 Pin QFP 14x20mm 160 Pin QFP 28x28mm 208 Pin QFP 28x28mm 240 Pin QFP 32x32mm PEAK , Tray Part number KS-8202* KS-8201* KS-8201* KS-8205* *Please note KOSTAT and PEAK trays are not


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PDF 14x20mm 28x28mm 32x32mm ND-1420-2 ND-2828-3 ND-3232-3 KS-8202* KS-8201* Kostat tray Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 ks 870163 KS-8202 8201
1995 - QFP JEDEC tray

Abstract: ND-3232-3 ND-2828-3 304-pin dimensions
Text: and places the device directly onto a QFP handling tray or onto a catch plate, which is included with , tray or catch plate. The default size of the extraction tool supports the Peak Plastic Corporation low-profile JEDEC trays listed in Table 2. Table 2. QFP Handling Tray Part Numbers Pin Count 100 160 208 , with the sides of an empty slot on the QFP handling tray . To ensure proper device orientation, align the beveled corner of the extraction tool with the beveled corner of the QFP handling tray . If a


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PDF 304-pin QFP JEDEC tray ND-3232-3 ND-2828-3 304-pin dimensions
1995 - ND-1420-2

Abstract: QFP JEDEC tray 304-Pin 304 QFP
Text: QFP handling tray or onto a catch plate, which is included with the extraction tool. The catch plate , size of the extraction tool supports the Peak Plastic Corporation low-profile JEDEC tray listed in Table 2. Table 2. QFP Handling Tray Part Numbers Pin Count 100 ND-1420-2.7-0811-8 160 ND , ridges on the bottom of the extraction tool with the sides of an empty slot on the QFP handling tray . To , corner of the QFP handling tray . If a handling tray is not available, place the extraction tool over the


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PDF 304-pin 100-Pin ND-1420-2 QFP JEDEC tray 304 QFP
1995 - TO-220 JEDEC

Abstract: ND-1420-2 QFP Package 80 lead QFP Shipping Trays QFP 100 pin parts detail of 5.1 sound pcb nd-3232-3.4 9 pin socket 4040 data sheet 4-0308
Text: carrier and places the device directly onto a QFP handling tray or onto a catch plate, which is included , the handling tray or catch plate. The default size of the extraction tool supports the Peak Plastic Corporation low-profile JEDEC trays listed in Table 2. Table 2. QFP Handling Tray Part Numbers Pin Count , the bottom of the extraction tool with the sides of an empty slot on the QFP handling tray . To ensure , the QFP handling tray . If a handling tray is not available, place the extraction tool over the catch


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PDF 304-pin 100-Pin TO-220 JEDEC ND-1420-2 QFP Package 80 lead QFP Shipping Trays QFP 100 pin parts detail of 5.1 sound pcb nd-3232-3.4 9 pin socket 4040 data sheet 4-0308
1995 - QFP JEDEC tray

Abstract: No abstract text available
Text: supports the Peak Plastic Corporation low-profile JEDEC tray listed in Table 2. Table 2. QFP Handling Tray Part Numbers Pin Count 100 160 208 240 304 Peak Part Number ND-1420-2.7-0811-8 ND , tool ejects the QFP device from the carrier and places the device directly onto a QFP handling tray or , with the sides of an empty slot on the QFP handling tray . To ensure proper device orientation, align the beveled corner of the extraction tool with the beveled corner of the QFP handling tray . If a


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PDF 304-pin QFP JEDEC tray
1995 - QFP Shipping Trays

Abstract: ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
Text: carrier and places the device directly onto a QFP handling tray or onto a catch plate, which is included , the handling tray or catch plate. The default size of the extraction tool supports the Peak Plastic Corporation low-profile JEDEC trays listed in Table 2. Table 2. QFP Handling Tray Part Numbers Pin Count , the bottom of the extraction tool with the sides of an empty slot on the QFP handling tray . To ensure , the QFP handling tray . If a handling tray is not available, place the extraction tool over the catch


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PDF 304-pin 100-Pin QFP Shipping Trays ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
1995 - camtex trays

Abstract: MIL-I-8835A QFP Shipping Trays TQFP Shipping Trays exposed QFP 144 ND07071 CAMTEX ND-1414-1 Drypacked Devices MIL-B-81705C
Text: hold QFP devices not in carriers, use only Altera-approved trays-fullsized Peak Plastic Corporation , : Guidelines for Handling J-Lead & QFP Devices Figure 6. Properly Aligned Peak Trays Trays with Chamfers , ) Package Dimensions Tray Capacity (mm) (Devices) Peak Part Number Note (2) Altera Reference Part , table; then release the vacuum only after the device is properly oriented and seated in the tray . QFP device leads should never contact the tray . Figure 8. Transferring a QFP Device Using a Vacuum Pen


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1995 - PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Text: hold QFP devices not in carriers, use only Altera-approved trays-fullsized Peak Plastic Corporation , & QFP Devices Figure 6. Properly Aligned Peak Trays Trays with Chamfers Properly Aligned , ; then release the vacuum only after the device is properly oriented and seated in the tray . QFP device leads should never contact the tray . Figure 8. Transferring a QFP Device Using a Vacuum Pen Finger Cot Vacuum Pen Tray QFP Device Dry Packing J-Lead & QFP Devices Dry packing is a method


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2004 - STMicroelectronics smd marking code

Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL ST TSSOP Marking TQFP 14X20 STMicroelectronics pentawatt date code STMicroelectronics date code tssop-14 infineon msl HiQuad package opto mold compound
Text: 10x10 QFP 12x12 QFP 14x14 November 18, 2004 © 2004 STMicroelectronics - All Rights Reserved , "large" and "small", which can be respectively exposed to a soldering profile with the peak at 245°C and , 3 peak temperatures: 245°C, 250°C and 260°C, a number of packages moving from the previous "245°C peak " category to the new "260°C peak " category. It is anticipated that some of them may have their , 14X14 FPN 5X5 HI-QUAD 14x20 FPN 6X5 TO18 BGA 4x4 FPN 6X6 TO3 FPN 7X7 TO39 POW


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PDF CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL ST TSSOP Marking TQFP 14X20 STMicroelectronics pentawatt date code STMicroelectronics date code tssop-14 infineon msl HiQuad package opto mold compound
2004 - STMicroelectronics smd marking code

Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 23X23 BGA 15X15 INFINEON package tqfp PART MARKING HEPTAWATT SMD PLCC Part Marking STMicroelectronics Marking STMicroelectronics tqfp Date Code Marking STMicroelectronics PACKAGE DPAK
Text: 10x10 QFP 12x12 QFP 14x14 November 18, 2004 © 2004 STMicroelectronics - All Rights Reserved , respectively exposed to a soldering profile with the peak at 245°C and 250°C. The JEDEC STD-020C specification issued in July 2004 is considering 3 classes of packages and 3 peak temperatures: 245°C, 250°C and 260°C, a number of packages moving from the previous "245°C peak " category to the new "260°C peak , BGA 23x23 DPAK HiQuad BGA 3.5X4.0 BGA 3x3 DPAK QFN FPN 4X4 HI-QUAD 14X14 FPN


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PDF MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 23X23 BGA 15X15 INFINEON package tqfp PART MARKING HEPTAWATT SMD PLCC Part Marking STMicroelectronics Marking STMicroelectronics tqfp Date Code Marking STMicroelectronics PACKAGE DPAK
removal tool from EPLD socket

Abstract: No abstract text available
Text: . QFP Handling Tray Part Numbers Pin Count 100 160 208 Peak Part Number ND-1420-2.7-0811-8 ND , from the carrier and places the device directly onto a QFP handling tray as shown in Figure 8, or onto , of the handling tray or catch plate. The default size of the extraction tool supports the Peak , the tool over an empty slot of the QFP handling tray . Line up the ridges on the bottom of the , corner of the extraction tool with the beveled corner of the QFP tray . If a handling tray is not


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PDF 304pin removal tool from EPLD socket
ADV0505

Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change , as an additional shipping tray for various BGA and QFP packaged devices. The new Daewon tray dimensions are comparable to the existing Peak trays and have been fully qualified by Altera. However, Daewon and Peak trays cannot be stacked together and should be handled separately. Each Altera shipping box will contain only one type of tray . This change does not affect the form, fit, or function of the


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PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
ASE QFP

Abstract: No abstract text available
Text: . QFP Handling Tray Part Numbers Pin Count 100 160 208 240 304 Peak Part Num ber ND-1420-2.7-0611-8 Rev , device from the carrier and places th e device directly onto a QFP h an d lin g tray or onto a catch , an em pty slot on th e QFP h an d lin g tray . To ensure p ro p er device orientation, align the , Platform Base Sliding Platform Q FP Handling Tray " Beveled Corner Altera Corporation 747 QFP , tool over th e QFP h an d lin g tray by lining u p the ridges o n the bottom of the extraction tool w


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PDF 304-pin ASE QFP
Not Available

Abstract: No abstract text available
Text: : 120-pin : 120-pin : 120-pin : 120-pin plastic QFP (28 x 28 mm) plastic QFP (28 x 28 mm) plastic QFP (28 x 28 mm) plastic QFP (28 x 28 mm) /¿PD30210GD-XXX-MBB Soldering Method Infrared reflow Soldering C ondition Package peak tem perature: 235 °C, T im e: 30 seconds MAX. (210 °C MIN.), Num ber of , non-heat-resistance tray ) cannot be baked w hile they are in their package. Sym bol of Recom m ended Soldering C ondition IR 35-367-2 VPS Package peak tem perature: 215 °C, T im e: 40 seconds MAX, (200 °C MIN


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PDF uPD30200 uPD30210 10535E PD30200GD-80-LBB PD30200GD-100-MBB PD30200GD-133-MBB 120-pin
1999 - LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 smd code 38P YAMAICHI ic234 fpq-144-0.5-03 smd p08
Text: QFP LQFP TQFP UQFP HQFP TPQFP Leadless chip carrier SON Quad lead QFN Dual lead , Socket type DTP Quad lead Modules Dual lead QTP SIMM DIMM Piggyback type DIP QFP , TQFP Thin Quad Flat L-Leaded Package 0.40/0.50 ­ HQFP QFP with Heat Sink 0.40/0.50/ 0.65 ­ TPQFP QFP with Test Pad 0.30 ­ 1.016/1.27 ­ 0.50/0.65 ­ SL-DIP* SON QFP LQFP*3 LCC* 3 Leadless Chip Carrier QFN Quad Flat Non-Leaded Package (EIAJ


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2001 - EIA and EIAJ standards 783

Abstract: EIA standards 783 eia783 EIA 783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B ti packing label JEDEC tray standard
Text: cover tape Termination End of the package pins Tray Primary container used for QFP /TQFP/BGA , . . . . . . . . . . . . . . . . 5 Tray ­ Primary Component Container . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 JEDEC Tray , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 JEDEC Tray With , . . . . . 11 Rectangular QFP Package Properly Oriented in Carrier Tape . . . . . . . . . . . . . .


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PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 eia783 EIA 783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B ti packing label JEDEC tray standard
fp1320

Abstract: No abstract text available
Text: J-Lead & QFP Devices Figure 6. Properly Aligned Peak Trays Trays with Chamfers Properly Aligned , d e v ic e le a d s sh o u ld n e v e r c o n tac t th e tray . Figure 8. Transferring a QFP , Guidelines for Handling J-Lead & QFP Devices Ju n e 1996, ver. 2 Application Note 71 , QFP Devices Figure 1. Dead Bug vs. Live Bug Orientation Dead Bug Orie n tation Liv e Bug O , Corporation AN 71: Guidelines for Handling J-Lead & QFP Devices T ab le 1 lists th e p a rt n u m b e


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1998 - 35 x 35 PBGA, 580 100 balls

Abstract: HG7900 Enplas drawings BGA Ball Crack PEAK TRAY bga NEC stacked CSP 2000 BGA-35 153pin Lead Free reflow soldering profile BGA sumitomo 3m
Text: NEC BGA family 9.3 Solder conditions the mixed soldering of QFP and BGA The peak temperature , currently prevalent QFP packages. They have excellent electrical performance and are suitable for high frequency and pin counts. Also, BGA has a broader terminal pitch than the same pin count QFP for easier mounting onto to PCB. Q1: How do the size, weight and terminal pitch of a BGA compared to those of a QFP ? 27mm 30. 2mm 225pin PBGA 208pin QFP Size is reduced by 20% Weight is reduced by 56% 2. 2g


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PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls HG7900 Enplas drawings BGA Ball Crack PEAK TRAY bga NEC stacked CSP 2000 BGA-35 153pin Lead Free reflow soldering profile BGA sumitomo 3m
IC-3216

Abstract: 78P054GC-3B9 D78P054 TDK tad 204 78p054
Text: NEC O R D E R IN G IN F O R M A T IO N Part Number iiPD78P054GC-3B9 Package 80-pin plastic QFP (1 4 x 1 4 mm, resin thickness 2.7 mm) /iPD78P054GC-8BTN oW 80-pin plastic QFP (1 4 x 1 4 mm, resin , Mode · · · 80-pin plastic QFP (14 iiP[)78P054GC-3B9 80-pin plastic QFP (14 x 14 mm, resin thickness 1.4 , (Subsystem Clock) 155 NEC (2) PROM Program m ing Mode · * · · · 80-pin plastic QFP (14 , P10-P17, P20-P27, P40-P47, P50-P55, P70-P72, P130, P131 Output current low I^Hot. 1 pin Peak value


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PDF uPD78P054 uPD78054 78K/0 xPD78P054 PD78P054KK-T PD78054, 78054Y VP15-107-3 /iPD78P054GC-88T IC-3216 78P054GC-3B9 D78P054 TDK tad 204 78p054
Supplyframe Tracking Pixel