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LT1124CS Linear Technology IC DUAL OP-AMP, 100 uV OFFSET-MAX, PDSO, Operational Amplifier
LT1126IJ8 Linear Technology IC DUAL OP-AMP, 100 uV OFFSET-MAX, CDIP8, HERMETIC SEALED, CERDIP-8, Operational Amplifier
LT1127IS Linear Technology IC QUAD OP-AMP, 100 uV OFFSET-MAX, PDSO, Operational Amplifier
LT1124CJ Linear Technology IC DUAL OP-AMP, 100 uV OFFSET-MAX, CDIP, 0.300 INCH, HERMETIC SEALED, CERDIP, Operational Amplifier
LTM2220IV-AA#PBF Linear Technology IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBCC100, 16 X 16 MM, MO-222, SIPLGA-100, Analog to Digital Converter
LT1124CN Linear Technology IC DUAL OP-AMP, 100 uV OFFSET-MAX, PDIP, 0.300 INCH, PLASTIC, DIP, Operational Amplifier

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  You can filter table by choosing multiple options from dropdownShowing 19 results of 19
Part Manufacturer Supplier Stock Best Price Price Each Buy Part
CIL43-LPAD-100 Honeywell Sensing and Control Master Electronics - -
DPAD100 Calogic Inc Karl Kruse GmbH & Co KG 500 $5.00 $5.00
DPAD100-TO-72 Linear Integrated Systems NAC 500 $4.60 $4.60
GPAD1001LLA GE Industrial Solutions Allied Electronics & Automation 0 $7.91 $7.91
JPAD100 Calogic Inc Karl Kruse GmbH & Co KG - -
JPAD100-TO-92 Linear Integrated Systems NAC 500 $2.45 $2.45
PAD100 Vishay Siliconix Bristol Electronics 405 $1.88 $0.53
PAD100-TO-72 Linear Integrated Systems NAC 500 $4.10 $4.10
PAD1000AYFFR Texas Instruments Rochester Electronics - -
PAD1000YFFR Texas Instruments Avnet 0 $2.09 $1.79
PAD1000YFFT Texas Instruments Avnet 0 $2.39 $1.99
SSTDPAD100 Calogic Inc Karl Kruse GmbH & Co KG 1,000 $1.00 $1.00
SSTDPAD100-LF Calogic Inc Karl Kruse GmbH & Co KG 500 $1.00 $1.00
SSTDPAD100-LF Calogic Inc Future Electronics 0 $1.91 $1.91
SSTDPAD100-SOIC Linear Integrated Systems NAC 500 $3.05 $3.05
SSTPAD100 Calogic Inc Karl Kruse GmbH & Co KG 5,000 - -
SSTPAD100-LF Calogic Inc Karl Kruse GmbH & Co KG 2,500 - -
SSTPAD100-LF Calogic Inc Future Electronics 0 $0.74 $0.74
SSTPAD100-SOT-23 Linear Integrated Systems NAC 500 $2.42 $2.42

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PAD-100 datasheet (6)

Part Manufacturer Description Type PDF
PAD100 Calogic 100 pA, low leakage pico amp diode Original PDF
PAD100 Linear Integrated Systems Low Leakage, Single, Pico-Amp Diode Original PDF
PAD100 Electronic Devices MiniBridge, Single Phase Doublers Scan PDF
PAD100 Siliconix Low Leakage Pico-Amp Diodes Scan PDF
PAD100 Siliconix MOSPOWER Design Data Book 1983 Scan PDF
PAD100 Siliconix FET Design Catalogue 1979 Scan PDF

PAD-100 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
14312

Abstract:
Text: Freedom of Choice: 10BaseT / 100BaseT / 100 VG - AnyLAN ThunderLAN Architecture FIFO Pointer Registers PCI Bus PCI Bus Master Control MUXed SRAM FIFO Ethernet LAN Controller 10/ 100 , memory required Media-independent interface for 100 -Mbit/s external transceivers 10Base-T Physical , On-chip 10base-T PHY MII for 100 -Mbit/s protocols · · · Reduces transmit latency Reduces host , thresholding System Implementation · · · Single-chip 10base-T solution MII for connecting 100 Mbit


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PDF 10BaseT 10-/100-Mbit/s 14312 XTAL100
AMI350XXPF

Abstract:
Text: (ns) Conditions: TJ = 25°C, VDD = 3.3V, Typical Process Capacitive Load (pF) 15 50 100 , 3.864 8.667 5.576 15 50 100 200 300 (max) Capacitive Load (pF) From: A To: PADM , 5.884 3.877 15 50 100 200 300 (max) Capacitive Load (pF) From: A To: PADM tPLH , 3.077 15 50 100 200 300 (max) Capacitive Load (pF) From: A To: PADM 0.710 0.563 , ) ODCHXX24 From: A To: PADM tPLH tPHL 15 50 100 200 300 (max) 0.637 0.474


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PDF AMI350XXPF
AMI350XXPR

Abstract:
Text: ) 15 50 100 200 300 (max) tPLH tPHL 0.733 0.587 1.662 1.184 3.009 2.046 , 0.803 0.610 1.768 1.226 3.126 2.071 5.814 3.764 8.551 5.481 15 50 100 200 , 0.514 1.296 0.952 2.205 1.539 4.019 2.647 5.816 3.782 15 50 100 200 300 , tPLH tPHL 15 50 100 200 300 (max) 0.665 0.496 1.613 1.112 2.968 1.964 5.679 3.644 8.390 5.366 15 50 100 200 300 (max) 0.665 0.496 1.613 1.112


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PDF AMI350XXPR crystal oscillator 4049 MAP 3959 ODCHXX16
6260 crystal oscillator

Abstract:
Text: Capacitive Load (pF) 15 50 100 200 300 (max) PADM tPLH tPHL 1.405 1.454 2.040 , tPLH tPHL Capacitive Load (pF) 15 50 100 200 300 (max) 0.903 0.892 1.530 1.316 , Load (pF) ODCSIP16 From: A To: PADM tZH 15 50 100 200 300 (max) 3.717 8.762 15.949 30.329 44.734 15 50 100 200 300 (max) 2.500 4.998 8.605 15.941 23.210 15 50 100 200 300 (max) 1.99 3.72 6.20 11.13 15.99 15


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PDF AMI500HXPR 6260 crystal oscillator ODQFE20M C 3686 ODCSXE04 ODCSXX04 ODQTE60M
11-365

Abstract:
Text: Library DC CHARACTERISTICS Vdd=3.0V to 3.6V; Temperature=0°C to 100 °C; Characteristic Symbol Min , CHARACTERISTICS 0.1 Volt Differential , Vdd=3.0V to 3.6V; Temperature=0°C to 100 °C; Symbol Maximum Frequency , Skew 140 Unit MHz ns 400 tSK ps vPP 100 mV Input LOW Voltage Common Mode , 100 °C; Characteristic Symbol Maximum Frequency fmax Propagation Delay to Output , micron CMOS Pad Library DC CHARACTERISTICS Vdd=3.0V to 3.6V; Temperature=0°C to 100 °C; Characteristic


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PDF AMI350XXPE 11-365 ami-350 truth table NOT gate 74
2009 - N998

Abstract:
Text: Resistance Range Best Absolute TCR Tracking TCR (Track to R1) CDFGJ CDFG ± 100 ppm/°C ±20 , 10 - 24.9 CDFGJ DFG ± 100 ppm/°C ±25ppm/°C 25 - 49.9 CDFGJ CDFG ±50 ppm/°C , Curve % Of Rated Power 100 50 10 25° 70° 150° Temperature in °C © IRC Advanced , -pad, 0.150" wide, schematic A, with 100 % matte tin, Pb-free terminations NS4B: 8-pad, 0.150" wide, schematic B, with 60/40 Sn/Pb terminations NS4BLF: 8-pad, 0.150" wide, schematic B, with 100 % matte tin


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PDF MIL-PRF-83401 MIL-PRF-55342 MIL-PRF-83401 N998
2002 - sc10003440

Abstract:
Text: in vials. Packaging in waffle packs with 100 % electrical test and visual inspection is always available if required. Dielectric Withstanding Voltage 100 V Electrical Specifications Capacitance , Operating Temperature: -65°C to 200°C Dielectric Withstanding Voltage: 100 V Insulation Resistance: 105 , SC04701518 47 15 mil Pad/18 mil Chip SC06801518 68 15 mil Pad/18 mil Chip 100 24 mil Pad/30 mil Chip 100 222 333 34 mil Pad/40 mil Chip SC50004450 500 44 mil Pad/50 mil


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PDF Pad/40 SC33303440 SC22203440 SC10002430 SC10003440 10/02A sc10003440 SC00260912 SC00260710 SC00180912 SC00180710 SC00120912 SC00120710 SC00080912 SC00080710 DSG6474
2002 - el 803

Abstract:
Text: : Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 1.35mm x 1.54mm 8 , % Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 1.35mm x 1.54mm 8 Die Size , Pad Metal: Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 VA , Bond Pad Size: 100 microns per side 7 VA 1.38mm x 1.82mm 8 REL-OSC 9 GND , : Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 VA 1.38mm x 1.82mm


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PDF IMP525 IMP527 180VPP IMP528 220VPP IMP560 IMP803 408-432-9100/www IMP525 el 803 IMP527 IMP528 IMP560 IMP803
HXE12

Abstract:
Text: Capacitive Load (pF) 15 50 100 200 300 (max) PADM tPLH tPHL 1.055 1.162 1.676 , tPLH tPHL Capacitive Load (pF) 15 50 100 200 300 (max) 0.621 0.779 1.255 1.413 , Load (pF) ODCSIP12 From: A To: PADM tZH 15 50 100 200 300 (max) 2.601 6.241 11.428 21.782 32.158 15 50 100 200 300 (max) 1.716 3.611 6.278 11.550 16.902 15 50 100 200 300 (max) 1.757 2.720 4.443 7.978 11.432


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PDF AMI500HXPF HXE12
l 9737 1990 1142

Abstract:
Text: Capacitive Load (pF) 15 50 100 200 300 (max) PADM tPLH tPHL 0.000 0.000 0.000 , tPLH tPHL Capacitive Load (pF) 15 50 100 200 300 (max) 0.708 0.778 1.513 1.470 , Load (pF) ODCSIP12 From: A To: PADM tZH 15 50 100 200 300 (max) 2.444 6.591 12.223 23.247 34.434 15 50 100 200 300 (max) 1.759 3.800 6.642 12.269 17.930 15 50 100 200 300 (max) 1.754 3.265 5.450 9.928 14.494


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PDF AMI500HXPM l 9737 1990 1142 HXE12 equivalent 13007 xxnxx
1997 - Not Available

Abstract:
Text: can be supplied with only sample testing packaged in vials. Packaging in waffle packs with 100 , . . . . . . 100 V Insulation Resistance . . . . . . . . . . . 105 Megohms Typical Leakage Current . , 6.8 8.2 8.2 8.2 10 10 10 15 15 15 22 22 33 47 68 100 100 222 333 500 1000 Chip p Dimensions (+ 1 mil , the capacitor. 10.0 1 pF Insertion Loss (dB) 34 mil Pad/40 mil Chip 34 mil Pad/40 mil Chip 44 , 100 pF 47 pF 100 pF 1­47 pF 0.01 2 6 10 14 18 Frequency (GHz) Figure 1


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PDF Pad/40 Pad/50 Pad/68
4029 truth table

Abstract:
Text: Capacitive Load (pF) 15 50 100 200 300 (max) PADM tPLH tPHL 1.648 1.555 2.715 , tPLH tPHL Capacitive Load (pF) 15 50 100 200 300 (max) 0.954 1.072 2.018 1.863 , Load (pF) ODCSIP12 From: A To: PADM tZH 15 50 100 200 300 (max) 3.833 9.167 16.769 31.979 47.208 15 50 100 200 300 (max) 2.510 5.198 9.015 16.743 24.433 15 50 100 200 300 (max) 2.218 4.390 7.451 13.567 19.728


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PDF AMI500HXPM 4029 truth table 6260 crystal oscillator
6260 crystal oscillator

Abstract:
Text: Capacitive Load (pF) 15 50 100 200 300 (max) PADM tPLH tPHL 1.648 1.555 2.715 , tPLH tPHL Capacitive Load (pF) 15 50 100 200 300 (max) 0.954 1.072 2.018 1.863 , Load (pF) ODCSIP12 From: A To: PADM tZH 15 50 100 200 300 (max) 3.833 9.167 16.769 31.979 47.208 15 50 100 200 300 (max) 2.510 5.198 9.015 16.743 24.433 15 50 100 200 300 (max) 2.218 4.390 7.451 13.567 19.728


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PDF AMI500HXPS 6260 crystal oscillator cell 6260 CMOS 4541 ODCXXX12 truth table of 4012
IMP803

Abstract:
Text: : Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 1.35mm x 1.54mm 8 , % Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 1.35mm x 1.54mm 8 Die Size , : Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 VA 1.38mm x 1.82mm , : 100 microns per side 7 VA 1.38mm x 1.82mm 8 REL-OSC 9 GND Ground pad. 10 , , 1/2% Copper Bond Pad Size: 100 microns per side 7 VA 1.38mm x 1.82mm 8 REL-OSC


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PDF IMP525 IMP527 180VPP IMP528 220VPP IMP560 IMP803 IMP525 IMP803 220V Driver 387 LAMP copper bond wire IMP527 IMP528 IMP560
xxnx

Abstract:
Text: Capacitive Load (pF) 15 50 100 200 300 (max) PADM tPLH tPHL 0.000 0.000 0.000 , tPLH tPHL Capacitive Load (pF) 15 50 100 200 300 (max) 0.708 0.778 1.513 1.470 , Load (pF) ODCSIP12 From: A To: PADM tZH 15 50 100 200 300 (max) 2.444 6.591 12.223 23.247 34.434 15 50 100 200 300 (max) 1.759 3.800 6.642 12.269 17.930 15 50 100 200 300 (max) 1.754 3.265 5.450 9.928 14.494


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PDF AMI500HXPS xxnx HXE12 l 9737 1990 1142 xxnxx cmos tristate buffer schmitt trigger 7414
1999 - HD66710FS

Abstract:
Text: Delivery Units Delivery unit counts (lot size) range from a minimum of 100 units to 10,000 units. 2.2 , are the chip dimensions) (unit: µm) Figure 2 Chip Cross-Section 100 Chip Shipment Products , ­715 ­845 ­975 ­1105 ­1235 ­1365 ­1495 ­1625 ­1760 ­1895 ­2035 ­2175 ­2320 100 SEG79 101 SEG78 102 , · HCD66710* 1 100 2 Type code 81 80 79 Chip size (X × Y): Coordinate: Origin: Pad size (X × Y): 5.36 mm × 6.06 mm Pad center Chip center 100 µm × 100 µm Y 29 30 31 X Pad No. 1 2 3 4 5 6 7 8 9


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PDF HCD66205L HD66710FS Y59 r 130 DB3 X51 HD44105D HD61104A HCD66205L HD61203D HD66100D HD61105A
ami-350

Abstract:
Text: Process Capacitive Load (pF) 15 50 100 200 300 (max) tPLH tPHL 5.159 3.951 , 5.264 2.652 7.686 4.295 11.182 6.289 18.064 10.062 25.026 13.833 15 50 100 , 4.310 2.023 5.785 3.175 7.701 4.359 11.190 6.377 14.432 8.280 15 50 100 200 , ) ODCSCX12 From: A To: PADM tPLH tPHL 15 50 100 200 300 (max) 5.016 3.905 7.525 5.516 11.078 7.457 18.054 11.302 24.903 14.989 15 50 100 200 300 (max


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PDF AMI350XXPE 33MHz ami-350 cmos 4026
2007 - EPC16U88

Abstract:
Text: pads for a 1.00 -mm flip-chip BGA. Figure 5. BGA Pad Dimensions BGA Substrate BGA Pad Solder , ) 0.65 0.75 0.65 0.55 1.00 mm (wirebond) (1) 0.45 0.63 0.45 0.38 1.00 mm (flip-chip) (1) 0.55 0.63 0.55 0.47 1.00 mm (flip-chip) (1) APEX 20KE 0.60 0.65 0.60 , Figure 6. Via & Routing Space Available for 1.00 -mm Flip-Chip BGA NSMD Land Pads 1.00 mm (39.37 mil) 0.53 mm (21.20 mil) 0.53 mm (21.20 mil) 0.94 mm (37.60 mil) 1.00 mm (39.37 mil) 0.47 mm


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PDF
2014 - Not Available

Abstract:
Text: Capabilities Resistance Range Best Absolute TCR Tracking TCR (Track to R1) CDFGJ CDFG ± 100 , 25.1K - 100K BDFGJ ABDFG ±25 ppm/°C ±5 ppm/°C 10Ω - 24.9Ω CDFGJ DFG ± 100 , ±0.01% Resistance To Bonding Exposure Power Derating Curve % Of Rated Power 100 50 10 25° 70 , , with 60/40 Sn/Pb terminations NS4ALF: 8-pad, 0.150" wide, schematic A, with 100 % matte tin, Pb-free , , schematic B, with 100 % matte tin, Pb-free terminations NS7A: 14-pad, 0.150" wide, schematic A, with 60/40


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PDF
2013 - Not Available

Abstract:
Text: Best Absolute TCR Tracking TCR (Track to R1) CDFGJ CDFG ± 100 ppm/°C ±20 ppm/°C , ±25 ppm/°C ±5 ppm/°C 10Ω - 24.9Ω CDFGJ DFG ± 100 ppm/°C ±25ppm/°C 25Ω - , Of Rated Power 100 50 10 25° 70° 150° Temperature in °C © IRC Advanced , , schematic A, with 60/40 Sn/Pb terminations NS4ALF: 8-pad, 0.150" wide, schematic A, with 100 % matte tin , -pad, 0.150" wide, schematic B, with 100 % matte tin, Pb-free terminations NS7A: 14-pad, 0.150" wide


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PDF vulnerab342 MIL-PRF-83401
2005 - micro fineline BGA

Abstract:
Text: NSMD surface land pads for a 1.00 -mm flip-chip BGA. Figure 5. BGA Pad Dimensions BGA Substrate , ) 0.65 0.75 0.65 0.55 1.00 mm (wirebond) (1) 0.45 0.63 0.45 0.38 1.00 mm (flip-chip) (1) 0.55 0.63 0.55 0.47 1.00 mm (flip-chip) (1) APEX 20KE 0.60 0.65 0.60 , Routing Space Available for 1.00 -mm Flip-Chip BGA NSMD Land Pads 1.00 mm (39.37 mil) 0.53 mm (21.20 mil) 0.94 mm (37.60 mil) 1.00 mm (39.37 mil) urface Land Pads Via Capture Pad Layout


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PDF
2001 - SO 607 NH

Abstract:
Text: improve power supply rejection for the photodetectors. Alternatively, you can connect 100 nF capacitors , tR, tF Output rise time and fall time 100 tR, tF Output rise time and fall time DJ Deterministic jitter 100 1.5 ZT GHz DCD Photodetector BW is 5 GHz, input inductance of 0.6 , (CML) VCC – 0.6 VCC – 0.3 VCC V At 100 kHz and 3.3 V. VOUT_DIFF_CML Output voltage swing, differential (CML) 400 550 650 mVp-p At 100 kHz and 3.3 V. With 10 µAp-p


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PDF 10GBASE-LX4 OIF-VSR4-03 VSC7650 10GBASE-LX4 G52390 VSC7650 SO 607 NH
1997 - 32 Bit loadable counter

Abstract:
Text: Performance with 100 % Automatic Placement and Routing · VQFP, TQFP, BGA, and PQFP Packages · Nonvolatile , 3,750 40 15 2,500 6,250 60 25 4,000 10,000 100 40 6,000 15,000 150 60 10,000 25,000 250 100 Logic Modules S-Module C-Module 200 104 96 310 160 150 564 288 , User I/Os (maximum) 80 100 140 168 228 100 84 100 - 100 - - - 133 84 100 , 160 - 100 - - 132 175 84 160 - 100 176 - - 207 - 160, 208 - - 176


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PDF 20-pin A14100 32 Bit loadable counter 175-PIN CQFP 256 PIN actel Actel Accelerator fpga datasheet ACT 3 accelerator FPGAs A1460 A1440 A1425A-3 A1425 A1415
1999 - MD300-10A

Abstract:
Text: (Plastic) P64RQ- 100 -A-1 1.27 LA-027 Window (Ceramic) CD-ROM X13769XJ2V0CD00 (Unit: mm) (1) 40 pin Package NEC Code P40E- 100 -A-1 EIAJ Code Lead pitch Packing Nominal Package , -040 CD-ROM X13769XJ2V0CD00 DIP (Unit: mm) (2) 42 pin Package NEC Code P42E- 100 -A-1 EIAJ Code , -039 Shrink DIP P64EA- 100 -A 1 LA-037 QFP 1.27 LA-027 QUIP P64EQ- 100 -A-1 CD-ROM , P-TSSOP8-0225-0.65 0.65 Packing Nominal Package dimensions height 225 MIL 1.00 Weight


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PDF P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 LA-0543A tray bga P-TQFP100-14X20-0 CDIP28 C-PGA176-S15U-2 C-DIP28-0600-2 50A33
2001 - Not Available

Abstract:
Text: to improve power supply rejection for the photodetectors. Alternatively, you can connect 100 nF , and fall time 100 tR, tF Output rise time and fall time DJ Deterministic jitter 100 , 100 kHz and 3.3 V. VOUT_DIFF_CML Output voltage swing, differential (CML) 400 550 650 mVp-p At 100 kHz and 3.3 V. With 10 µAp-p input current. VOUT_CM_PECL Output common-mode voltage (PECL) V At 100 kHz and 3.3 V. At 100 kHz and 3.3 V. With 10 µAp-p input current. VCC


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PDF VSC7650 10GBASE-LX4 OIF-VSR4-03 VSC7650 10GBASE-LX4 G52390
Supplyframe Tracking Pixel