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MSP430-3P-EXTIS-MSP430-PAD-X-ADPT Texas Instruments MSP430-PAD-x Breadboard Units
SLK2701PZP Texas Instruments TRANSCEIVER, PQFP100, POWER PAD, PLASTIC, VQFP-100
EL5327CL-T13 Intersil Corporation 10 BUFFER AMPLIFIER, QCC24, EXPOSED PAD, LPP-24
EL5227CL-T13 Intersil Corporation OCTAL BUFFER AMPLIFIER, QCC24, EXPOSED PAD, LPP-24
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Part Manufacturer Supplier Stock Best Price Price Each Buy Part
CIL43-LPAD-100 Honeywell Sensing and Control Master Electronics 3 - -
CPAD108 AIM Metals & Alloys LP Interstate Connecting Components - - -
CPAD109 AIM Metals & Alloys LP Interstate Connecting Components - - -
DPAD10 Calogic Inc Karl Kruse GmbH & Co KG 1,000 $5.00 $5.00
DPAD10-TO-72 Linear Integrated Systems NAC 500 $4.00 $4.00
DPAD100 Calogic Inc Karl Kruse GmbH & Co KG 500 $5.00 $5.00
DPAD100-TO-72 Linear Integrated Systems NAC 500 $4.60 $4.60
GPAD1001LLA GE Industrial Solutions Allied Electronics & Automation - $7.91 $7.91
GPAD1010LLA GE Industrial Solutions Allied Electronics & Automation - $23.71 $7.91
JPAD10 Calogic Inc Karl Kruse GmbH & Co KG 3,000 - -
JPAD10-LF Calogic Inc Karl Kruse GmbH & Co KG 3,000 - -
JPAD10-TO-92 Linear Integrated Systems NAC 535 $2.70 $2.70
JPAD100 Calogic Inc Karl Kruse GmbH & Co KG 3,000 - -
JPAD100-TO-92 Linear Integrated Systems NAC 500 $2.45 $2.45
MXP-AD10-10 SMC Corporation of America Allied Electronics & Automation - $14.97 $14.97
MXP-AD10-20 SMC Corporation of America Allied Electronics & Automation - $14.35 $14.35
PAD10 Calogic Inc Karl Kruse GmbH & Co KG 1,000 $3.00 $3.00
PAD10-TO-72 Linear Integrated Systems NAC 500 $4.30 $4.30
PAD100 Vishay Siliconix Bristol Electronics 405 $1.88 $0.53
PAD100-TO-72 Linear Integrated Systems NAC 500 $4.10 $4.10
PAD1000AYFFR Texas Instruments Rochester Electronics 63,000 - -
PAD1000YFFR Texas Instruments Avnet - $2.09 $1.79
PAD1000YFFT Texas Instruments Avnet - $2.39 $1.99
SSTDPAD10 Calogic Inc Karl Kruse GmbH & Co KG 1,000 $1.00 $1.00
SSTDPAD100 Calogic Inc Karl Kruse GmbH & Co KG 1,000 $1.00 $1.00
SSTDPAD100-LF Calogic Inc Karl Kruse GmbH & Co KG 500 $1.00 $1.00
SSTDPAD100-LF Calogic Inc Future Electronics - $1.91 $1.91
SSTDPAD100-SOIC Linear Integrated Systems NAC 500 $3.05 $3.05
SSTPAD10-SOT-23 Linear Integrated Systems NAC 500 $2.65 $2.65
SSTPAD100 Calogic Inc Karl Kruse GmbH & Co KG 5,000 - -
SSTPAD100-LF Calogic Inc Karl Kruse GmbH & Co KG 2,500 - -
SSTPAD100-LF Calogic Inc Future Electronics - $0.74 $0.74
SSTPAD100-SOT-23 Linear Integrated Systems NAC 500 $2.42 $2.42

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PAD-10 datasheet (11)

Part Manufacturer Description Type PDF
PAD10 Calogic Low Leakage Pico Amp Diodes Original PDF
PAD10 Linear Integrated Systems Low Leakage, Single, Pico-Amp Diode Original PDF
PAD10 Electronic Devices MiniBridge, Single Phase Doublers Scan PDF
PAD10 Siliconix MOSPOWER Design Data Book 1983 Scan PDF
PAD10 Siliconix FET Design Catalogue 1979 Scan PDF
PAD100 Calogic 100 pA, low leakage pico amp diode Original PDF
PAD100 Linear Integrated Systems Low Leakage, Single, Pico-Amp Diode Original PDF
PAD100 Electronic Devices MiniBridge, Single Phase Doublers Scan PDF
PAD100 Siliconix Low Leakage Pico-Amp Diodes Scan PDF
PAD100 Siliconix MOSPOWER Design Data Book 1983 Scan PDF
PAD100 Siliconix FET Design Catalogue 1979 Scan PDF

PAD-10 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2005 - ADNS-9500

Abstract: ADNS-6190-002 adns9500 Avago adns-9500 ADNS 9500 AV02-1742EN 14-PAD
Text: parameter is 1.0 . (IEC document, Table 4 Note 2, page 40) For further determination of the AEL and MPE , energy when the exposure time is greater than 10 seconds and the illumination wavelength is between 700 , is calculated: C4= 10 0.002(-700) = 10 0.002(832-700) = 1.8365 (7) (2) (3) This value , 2a) for the wavelength range of 400 to 1400 nm: T2 = 10 s If < 1.5 mrad (4) T2 = 10 x 10 [(-min , measurement time t is greater than 10 seconds, and therefore T2 is less than t, formula 1 is used to


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PDF ADNS-9500 ADNS-9500 ADNS-6190-002 AV02-1742EN adns9500 Avago adns-9500 ADNS 9500 14-PAD
2002 - IMP525

Abstract: IMP527 IMP528 IMP560 IMP803 el 803
Text: microns) Bond Wire Size: 1.0 mil (25 microns) Back Side Metal: None Back Side Potential , Size: 1.0 mil (25 microns) Back Side Metal: None Back Side Potential: Ground 3 Die , : 1.0 mil (25 microns) Back Side Metal: None Back Side Potential: Ground 3 Die Attach , 1.38mm x 1.82mm 8 REL-OSC 9 GND Ground pad. 10 * DIS Disable pad. DIS = HIGH disables chip. Die Size: DIS VDD 1 8 REL-OSC 10 RSW-OSC 2 7 VA IMP528 EL lamp


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PDF IMP525 IMP527 180VPP IMP528 220VPP IMP560 IMP803 408-432-9100/www IMP525 IMP527 IMP528 IMP560 IMP803 el 803
IMP803

Abstract: 220V Driver 387 LAMP IMP525 IMP527 IMP528 IMP560 copper bond wire
Text: ) Bond Wire Size: 1.0 mil (25 microns) Back Side Metal: None Back Side Potential: Ground , Wire Size: 1.0 mil (25 microns) Back Side Metal: None Back Side Potential: Ground 3 , Information Pad Description Die Thickness: 25 mils (625 microns) Bond Wire Size: 1.0 mil (25 , 8 REL-OSC 9 GND Ground pad. 10 * DIS Disable pad. DIS = HIGH disables chip. Die Size: DIS VDD 1 8 REL-OSC 10 RSW-OSC 2 7 VA IMP528 EL lamp oscillator


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PDF IMP525 IMP527 180VPP IMP528 220VPP IMP560 IMP803 IMP525 IMP803 220V Driver 387 LAMP IMP527 IMP528 IMP560 copper bond wire
GPM6P1004A

Abstract: GPL162006A GPLB5X GPM6P1001A GPR25 GPY0031A GPCE063 GPR25L080B GPBA02A GPM6P1033a
Text: Sheet 1.1 2005/5/28 2 GPBA02A GPBA02A Data Sheet 1.4 2008/ 10 /14 3 GPC1000A1 4 5 GPC1000A2 GPC1000B GPC Programming Guide 1.0 2006/12/11 GPC Programming Guide 1.0 2006/12/11 , GPC10048A 2009/3/9 GPC1 QuickProg Programming Guide 1.0 2006/5/26 GPC1 Series Programming Guide 1.5 8 GPC10064A 2009/3/9 GPC1 QuickProg Programming Guide 1.0 2006/5/26 GPC1 Series Programming Guide 1.5 9 GPC10096A GPC1000A1 Confirmation Sheet 1.0 Guide 1.2 2007/1/3 2006/3/17


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PDF GPBA01B GPBA01B GPBA02A GPBA02A GPC1000A1 GPC1000A2 GPC1000B GPC10024D GPC10048A GPC10064A GPM6P1004A GPL162006A GPLB5X GPM6P1001A GPR25 GPY0031A GPCE063 GPR25L080B GPM6P1033a
Not Available

Abstract: No abstract text available
Text: LED1 P41 1 2 29 30 VDD VL3 VL2 VL1 GND CAPH VL4 VL3 VL2 VL1 CAPL 20 10 CN2 P137 , VL1 CAPL 20 10 CN2 P137 LED3 13 Power LED ユニバーサルエリã , ) P61/SDAA0/(TI02)/(TO02) RL78/L13 1 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 , 23 25 27 29 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 2 4 6 8 10 12 14 , 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 SEG34 SEG33 SEG32 SEG31


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PDF R20UT2199XJ0300 RL78/L13 QB-R5F10WMG-TB R5F10WMG R5F10WMG 20MHz( SEG37 SEG38 SEG39 SEG40
Not Available

Abstract: No abstract text available
Text: ™ã‚‹ã“とで、その回路はオープンとなります。 UVBUS UREGC AVDD 10 P137 RL78 /L1C , SW1 13 Power LED Main Clock 1 2 CN2 55.88mm UVBUS 10 UREGC AVDD AVREFM , 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 FG1 FG2 FG3 FG4 2 D CN1 VBUS 1uF CN5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 , COM3 COM2 COM1 COM0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


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PDF R20UT2521XJ0200 RL78/L1C QB-R5F110PJ-TB RL78/L1C QB-R5F110PJ-TB R5F110PJ QB-R5F110PJ-TB) P155/ANI5
Coffin-Manson Equation

Abstract: CCGA ADC10D1000CCMLS CCGA-376 A104C CCGA376 SN20 SN21
Text: Seal Ring 1.00 [.0394] 10.00 [.3937] 10 .0 0 [.3 93 7] Combo Lid 1.00 [.039 4 , ) 24.13+0.25 [0.95+0.01] 10 .0 0 [.3 93 7] 0.81 [.0319] (120X) 1.00 [.0394] 1.27+0.13 , 10 Pad 11 Pad 44 Pad 12 Pad 43 Pad 17 Pad 42 Pad 13 Pad 14 Pad 18 Pad 41 Pad , JESD22-A104C with test condition B and soak mode 3, was a -55°C to +125°C temperature range with a 10 minute , resistance changed more than 10 % or 1.5 . The units were stressed until a cumulative 25% failure rate was


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PDF 80Pb/20Sn 10bit ADC10D1000CCMLS, Mil-PRF-38535 100mn Coffin-Manson Equation CCGA ADC10D1000CCMLS CCGA-376 A104C CCGA376 SN20 SN21
2002 - sc10003440

Abstract: SC00260912 SC00260710 SC00180912 SC00180710 SC00120912 SC00120710 SC00080912 SC00080710 DSG6474
Text: without notice. 10 /02A 1 MIS Chip Capacitors SC Series Electrical Specifications Example Part Number Capacitance (+ 20%) Chip Dimensions (+ 1 mil) SC00080710 0.8 7 mil Pad/ 10 mil Chip SC00080912 0.8 9 mil Pad/12 mil Chip SC00120710 1.2 7 mil Pad/ 10 mil Chip SC00120912 1.2 9 mil Pad/12 mil Chip SC00180710 1.8 7 mil Pad/ 10 mil Chip SC00180912 1.8 9 mil Pad/12 mil Chip SC00260710 2.6 7 mil Pad/ 10 mil Chip SC00260912 2.6 9 mil


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PDF Pad/40 SC33303440 SC22203440 SC10002430 SC10003440 10/02A sc10003440 SC00260912 SC00260710 SC00180912 SC00180710 SC00120912 SC00120710 SC00080912 SC00080710 DSG6474
1997 - Not Available

Abstract: No abstract text available
Text: 6.8 8.2 8.2 8.2 10 10 10 15 15 15 22 22 33 47 68 100 100 222 333 500 1000 Chip p Dimensions (+ 1 mil) 7 mil Pad/ 10 mil Chip 9 mil Pad/12 mil Chip 7 mil Pad/ 10 mil Chip 9 mil Pad/12 mil Chip 7 mil Pad/ 10 mil Chip 9 mil Pad/12 mil Chip 7 mil Pad/ 10 mil Chip 9 mil Pad/12 mil Chip 7 mil Pad/ 10 mil Chip 9 mil Pad/12 mil Chip 7 mil Pad/ 10 mil Chip 9 mil Pad/12 mil Chip 7 mil Pad/ 10 mil Chip 9 mil Pad/12 mil Chip 7 mil Pad/ 10 mil Chip 9 mil Pad/12 mil Chip 15 mil Pad/18 mil Chip 7 mil Pad/ 10 mil Chip 9 mil Pad


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PDF Pad/40 Pad/50 Pad/68
2002 - vss 1558

Abstract: NLK3581SSI vs-s1558 PRBS23 VSC7991 VSC7991CD VSC7991CD-01 VSC7991-W electroabsorption modulator laser diode
Text: : www.vitesse.com 1 of 10 VSC7991 Data Sheet SPECIFICATIONS Over recommended operating conditions unless , Load. VMOD = 3V Overshoot/Undershoot - 10 + 10 % DCC Duty-Cycle Control -15 + 10 , Bias Control Voltage - 10 0 V VIP Laser Modulation Control Voltage VSS VSS +0.7 , 10 G52321, Rev 4.2 4/11/02 VSC7991 Data Sheet Table 5. Recommended Operating Conditions , Unit 0 -8.0 V 500 mA -2.0 + 1.0 V VSS -0.5 VSS +2 V 11 Condition


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PDF VSC7991 488Gb/s, 952Gb/s, OC-192 VSC7991 G52321, vss 1558 NLK3581SSI vs-s1558 PRBS23 VSC7991CD VSC7991CD-01 VSC7991-W electroabsorption modulator laser diode
2002 - Not Available

Abstract: No abstract text available
Text: input level – 1.0 –0.5 V DC-coupled VINMIN Single-ended input swing 400 mV AC-coupled S11 Input return loss 10 dB Up to 10 GHz tRIN, tFIN Data input rise time and , temperature. V IMOD ≅ 125 mA, measured across 50 Ω load. PWRZ >47 ps. 17 ±5 ± 10 3 , : 300 µm (0.012") Pad Pitch: 203 µm (Pad 10 - 25, 32 - 46) 235 µm (Pad 1 - 10 , 25 - 32) Pad Size: 122 µm x 146 µm (Pad 2 - 8, 26 - 30) 122 µm x 122 µm (Pad 10 - 25, 31 - 46) Pad Passivation


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PDF VSC7992 OC-192 SDH/STM-64 VSC7992 G52410
2002 - G52410

Abstract: No abstract text available
Text: level – 1.0 –0.5 V DC-coupled VINMIN Single-ended input swing 400 mV AC-coupled S11 Input return loss 10 dB Up to 10 GHz tRIN, tFIN Data input rise time and , DCC = VEE to VEE + 2.0 V, ± 10 % With fixed VDCC over power supply and temperature. 3 , ") Die Thickness: 300 μm (0.012") Pad Pitch: 203 μm (Pad 10 - 25, 32 - 46) 235 μm (Pad 1 - 10 , 25 - 32) Pad Size: 122 μm x 146 μm (Pad 2 - 8, 26 - 30) 122 μm x 122 μm (Pad 10 - 25, 31 - 46


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PDF VSC7992 OC-192 SDH/STM-64 VSC7992 G52410 VSC7992FX
2002 - Not Available

Abstract: No abstract text available
Text: : www.vitesse.com 1 of 10 Downloaded by data_acq@partminer.com on September 22, 2009 from Vitesse.com SONET , Programmable output offset voltage –0.7 0 V At IB = IBN = – 10 V VMOD Modulation voltage , offset control voltage – 10 0 V VIP Laser modulation control voltage VSS VSS + 0.7 , –12 dB 50 MHz to 10 GHz Condition ORL Output return loss, 50 Ω system –8 dB 50 MHz to 10 GHz 2 of 10 G52356 Revision 4.3 January 27, 2005 Downloaded by


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PDF VSC7989 OC-192 VSC7989 G52356
2012 - Not Available

Abstract: No abstract text available
Text: Wave or CMOS output Available in 10 pad or 4/5 pad options Low phase noise and excellent g-sensitivity , TR/TF VOH VOH FVDD/F FLOAD/F -4.6 ±0.02 ±0.02 Symbol F FI TA FT/F Min. 10.000 - 1.0 Typ. Max. 38.880 + 1.0 Units MHz ppm Conditions @ 25°C @ time of shipment Frequency Stabilities , ±5% change in load RF Output See Ordering Information 15 10 / 10 40 50 60 8 80 20 1.0 ±9.2 0.3 0.3 0.5 100 2.7 3.0 4.5 3 pF k / pF % ns % VDD % VDD Vpk-pk ppm V k % @ 10 Hz Offset @ 100 Hz Offset @ 1


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PDF M610x-SYNCE GR-1244-CORE GR-253-CORE M610xyw M610x
2002 - vs-s1558

Abstract: vss 1558 VSC7989-W FLD5F10NP PRBS23 VSC7989CD
Text: : prodinfo@vitesse.com Internet: www.vitesse.com 1 of 10 VSC7989 Data Sheet SPECIFICATIONS Over recommended , 2.5V 50 Load. VMOD = 2.5V DCC 15 ps/p-p Overshoot/Undershoot - 10 13 + 10 % Duty Cycle - 10 +20 % Max Unit Condition DCC in the range of VSS - 0.5V to VSS , - 10 0 V VIP Laser Modulation Control Voltage VSS VSS +0.7 V VIH Input HIGH , 2 of 10 G52356, Rev 4.1 6/28/02 VSC7989 Data Sheet Table 5. Recommended Operating


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PDF VSC7989 488Gb/s, 952Gb/s, OC-192 VSC7989 G52356, vs-s1558 vss 1558 VSC7989-W FLD5F10NP PRBS23 VSC7989CD
Connector 221

Abstract: SD Card connector CMOS Camera Module connector
Text: side) Style 27.4 10.2 (5.525) 9-1.5 10 - 0.5 0.45 2 - 0.9 Connector for SD Memory , # 10 8.6 Pad 2.4 (53.85) Media full length(50) 1.5 ( 10 ) (11.975) Media outline , 1.6 2.4 # 10 4 22.5 ()2.5 min. 2-ø 8.6 Pad Pad 4 Pad 32.6 Mounting datum , ( 10 ) (1.2) Over stroke (12.95) (11.975) Media outline 1.95 2 #1 Pad 10-0.9 , stroke Card center # 10 8.6 Pad 32.6 53.85 24 10 Media eject stroke (11.975


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PDF
2010 - Not Available

Abstract: No abstract text available
Text: Thru-Hole SMD 15pF 3.3V 10 MHz 800 MHz Features ● Wide frequency range : [ 10.0 MHz , X △ △ ○ vs Aging ± 1.0 ppm max., per year at 25°C . vs Voltage Change ± 0.3 ppm max. , for a ±5% input voltage change . vs Load Change ± 0.3 ppm max. , for a ± 10 % load condition change . vs Reflow ( SMD type ) Frequency Stability ± 1.0 ppm max., 1 reflow , —‹ ○ : available ± 1.0 ppm 0°C to 50°C Frequency Stability ( ppm ) Frequency Stability


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PDF M5762P M5762D
2002 - FLD5F10NP

Abstract: 2296 VSC7989CD
Text: ) 987-5896 · Email: prodinfo@vitesse.com Internet: www.vitesse.com 1 of 10 VSC7989 Data Sheet , /Undershoot DCC Duty Cycle Min Typ 28 13 Max 35 15 + 10 +25 Unit ps ps/p-p % % DCC in the range of VSS - 0.5V to VSS +2V. Condition 50 load, 20% to 80%, VMOD = 2.5V 50 Load. VMOD = 2.5V - 10 -25 DC , Unit V V V V Condition At IB = IBN = -10V At VBIAS = 0V At VBIAS = 0V 3.0 - 10 VSS -150 -1.00 900 , 310 Unit mA Condition VSS = -5.2V, RL = 50 to GND VBIAS = 0V, IMOD = 120mA 2 of 10 G52356, Rev 4.0


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PDF VSC7989 488Gb/s, 952Gb/s, OC-192 G52356, FLD5F10NP 2296 VSC7989CD
1998 - SW7 357

Abstract: HV803 CSI 2702 ausi die attach VP0109ND AF03 VP03 VF01 38495 HV82
Text: 3.8 Au 1.0 Au-Si Eutectic LP07 50 70 11 ± 1.5 None Al-Si 4.7 x 4.7 Al , Preform5 Au Al/Si 4x4 Al 1.3 Epoxy 11 ± 1.5 Au Al/Si 3.8 x 3.8 Au 1.0 Epoxy 11 ± 1.5 Au Al-Si 3.8 x 3.8 Au 1.0 Epoxy Thickness Notes: 1. Maximum , Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 8 6 9 5 10 3 11 4 , /HV18 Die Specifications Pad Coordinates in Microns 6 8 7 9 10 11 12 13 15


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PDF VF01/VF06/VF21/VF25 VF22/LND1/LP07 VF05/VF13/VF26/TN07 VF32/LNE1/LP08 HV15/HV16/HV18 HV202 HV204/HV217/HV218/HV227/HV228 HV207 HV208 HV209 SW7 357 HV803 CSI 2702 ausi die attach VP0109ND AF03 VP03 VF01 38495 HV82
2001 - SO 607 NH

Abstract: No abstract text available
Text: XAUI Retimer Figure 1. 10 GbE Parallel Optics Interface 3 of 14 G52390 Revision 4.0 September , detector arrays. Sensitivity The VSC7650 has a typical peak-to-peak input current sensitivity of 10 , achieves its full output swing for all input signals larger than 10 µA, typically. High-Speed Output , assert threshold is 10 µA, and the de-assert threshold is 5 µA. Set the assert threshold by using an , DESCRIPTIONS VSC7650 Data Sheet For example, a maximum 10 kΩ resistor corresponds to a minimum 10 µA


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PDF 10GBASE-LX4 OIF-VSR4-03 VSC7650 10GBASE-LX4 G52390 VSC7650 SO 607 NH
2002 - Not Available

Abstract: No abstract text available
Text: Dual XAUI Retimer Figure 1. 10 GbE Parallel Optics Interface 3 of 14 G52425 Revision 4.0 , photodetectors. Optionally, you can connect 10 nF capacitors to GND for these pads. On-chip filters for each , sensitivity of 10 µA. When used with a photodetector array, the device has a typical optical sensitivity of , full output swing for input signals larger than 10 µA typically. High-Speed Output Drivers VSC7651 , (EXTSDTH) and ground, is 10 kΩ. For this value, assert and deassert thresholds are 10 µA and 5 µA


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PDF VSC7651 VSC7651 10GBASE-LX4 G52425
2001 - Not Available

Abstract: No abstract text available
Text: Figure 1. 10 GbE Parallel Optics Interface 3 of 14 G52390 Revision 4.0 September 20, 2004 , detector arrays. Sensitivity The VSC7650 has a typical peak-to-peak input current sensitivity of 10 , achieves its full output swing for all input signals larger than 10 µA, typically. High-Speed Output , assert threshold is 10 µA, and the de-assert threshold is 5 µA. Set the assert threshold by using an , example, a maximum 10 kΩ resistor corresponds to a minimum 10 µA average assert threshold current


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PDF 10GBASE-LX4 OIF-VSR4-03 VSC7650 10GBASE-LX4 G52390 VSC7650
2001 - Not Available

Abstract: No abstract text available
Text: XAUI Retimer Figure 1. 10 GbE Parallel Optics Interface 3 of 14 G52390 Revision 4.0 September , detector arrays. Sensitivity The VSC7650 has a typical peak-to-peak input current sensitivity of 10 , achieves its full output swing for all input signals larger than 10 µA, typically. High-Speed Output , assert threshold is 10 µA, and the de-assert threshold is 5 µA. Set the assert threshold by using an , example, a maximum 10 kΩ resistor corresponds to a minimum 10 µA average assert threshold current


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PDF VSC7650 10GBASE-LX4 OIF-VSR4-03 VSC7650 10GBASE-LX4 G52390
2001 - SB21150BC

Abstract: SB21150AC GD21150BC dc1111d SB21150 DC1030G 74ls166 SB21150-AC 21150-AC GD21150AC
Text: recommendations. · 10 /3/01 Updated Errata table status column on page 7. Updated status for Erratas 2, 3 , (Tval) and Input Hold Timer from CLK (Th) Violations of 66 MHz PCI Signals on the 21150" on page 10 , this document. 10 /03/00 007 Added new errata item 6:Secondary Clocks Outputs s_clk_o <9:0> may , Errata Steppings No. Page 10 C 1 Status Fixed "P_FRAME_L, P_IRDY_L, P_TRDY_L, S_FRAME_L, S_IRDY_L and S_TRDY_L Return Inverted Version of Proper Level During JTAG Mode". 10 No


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PDF m66ena: SB21150BC SB21150AC GD21150BC dc1111d SB21150 DC1030G 74ls166 SB21150-AC 21150-AC GD21150AC
phase shifter

Abstract: "Phase Shifter" TGP1439 phaseshifter
Text: of Bond Pads 9, 10 , and 11 of this device. Method: Tests were performed to determine which combination of biases applied to Bond Pads 9, 10 , and 11 would result in optimal performance of the 4-bit and , Test Conditions for the 4-bit Phase Shifter 3-Bit Phase Shifter: Bond Pads 9, 10 , and 11 of the TGP1439 are connected to a constant voltage for 3-bit operation. Pads 9 and 10 controls the second least significant bit (22.5°) of the 5-bit phase-shifter. Pads 9 and 10 are complimentary in that when pad 10 is


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PDF TGP1439 phase shifter "Phase Shifter" phaseshifter
Supplyframe Tracking Pixel