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2002 - MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA MO-113-AA-AD BGA 31 x 31 mm MS026-ACD MS-034-AAU-1 MO-047 MO-151 AAL-1 MO-151-AAN-1
Text: OBG0040 OPQ0021 OPQ0020 OPQ0019 OPQ0014 OPQ0006 OPQ0011 OPC0006 OPC0001 OPC0005 OPC0001 OPC0001 OPD0002 , -026-ACD MS-026-AED MO-087 MO-087 OPG0006 OPQ0015 OPQ0013 OPQ0016 OPQ0013 OPQ0002 OPQ0003 OPQ0010 OPQ0014


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PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA MO-113-AA-AD BGA 31 x 31 mm MS026-ACD MS-034-AAU-1 MO-047 MO-151 AAL-1 MO-151-AAN-1
1996 - EFTEC-64

Abstract: eftec HQ208 leadframe C7025 XC4020E XC4013E OPQ0020 OPQ0019 OPQ0014 HQ240
Text: Xilinx Thermally Enhanced Packaging ® April 1996 Application Note The Package Offering Xilinx Code Body (mm) HQ304 HQ240 HQ208 THK (mm) Mass (gm) Heatsink Location JEDEC No. Xilinx No. 3.80 3.40 3.37 26.2 15.0 10.0 TOP DOWN DOWN MO-143-JA MO-143-GA MO-143-FA OPQ0014 OPQ0019 OPQ0020 40x40 32x32 28x28 Overview Mass Comparison Xilinx offers thermally enhanced quad flat pack packages on certain devices. This app note discusses the performance and usage of


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PDF HQ304 HQ240 HQ208 MO-143-JA MO-143-GA MO-143-FA OPQ0014 OPQ0019 OPQ0020 40x40 EFTEC-64 eftec HQ208 leadframe C7025 XC4020E XC4013E OPQ0020 OPQ0019 OPQ0014 HQ240
2002 - EFTEC-64

Abstract: OPQ0014
Text: _143-FA OPQ0020 MO-143-GA MO-143-JA OPQ0019 OPQ0014 Overview Xilinx offers thermally enhanced quad flat pack


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PDF Q1-02 HQ160 HQ208 HQ240 HQ304 MO-108DDI OPQ0021 143-FA OPQ0020 MO-143-GA EFTEC-64 OPQ0014
1999 - schematic impulse sealer

Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint PG299-XC4025E footprint jedec MS-026 TQFP 128 XC4013E-BG225 MS-026-ACB bav 21 diode
Text: OCQ0003 OCQ0007 OCQ0005 OCQ0012 OPD0005 OPQ0021 OPQ0020 OPQ0019 OPQ0014 OPC0006 OPC0005 OPC0001 OPC0001 , . MO-108-DD1 MO-143-FA MO-143-GA MO-143-JA Xilinx No. OPQ0021 OPQ0020 OPQ0019 OPQ0014 Overview


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1996 - schematic impulse sealer

Abstract: PCB footprint cqfp 132 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern xc4010e-pq208 footprint pga 84 QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7336Q xilinx opd0007
Text: OPQ0019 OPQ0014 OPQ0006 OPQ0011 OPC0006 OPC0001 OPC0005 OPC0001 OPC0001 OPD0001 OPD0002 OPG0012 , -143-JA MO-143-GA MO-143-FA OPQ0014 OPQ0019 OPQ0020 Overview Mass Comparison Xilinx offers


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PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 schematic impulse sealer PCB footprint cqfp 132 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern xc4010e-pq208 footprint pga 84 QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7336Q xilinx opd0007
2000 - schematic impulse sealer

Abstract: qfp 64 0.4 mm pitch land pattern Rotron EFTEC-64 pk100 power supply XC4013E-PQ240 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Text: 15.0 HQ304 Metric QFP 40 40-H/S die Down MO-143-JA OPQ0014 26.2 PC20 PLCC JEDEC MO , 40x40 3.80 26.2 TOP MO-143-JA OPQ0014 www.xilinx.com 1-800-255-7778 PK100 (v1


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PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron EFTEC-64 pk100 power supply XC4013E-PQ240 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
1999 - footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint fine BGA thermal profile schematic impulse sealer qfp 64 0.5 mm pitch land pattern PQ208 TQ144 PQ100 land pattern QFP 208 VQ44
Text: OCQ0003 OCQ0007 OCQ0005 OCQ0012 OPD0005 OPQ0021 OPQ0020 OPQ0019 OPQ0014 OPC0006 OPC0005 OPC0001 , -108-DD1 MO-143-FA MO-143-GA MO-143-JA OPQ0021 OPQ0020 OPQ0019 OPQ0014 package. This was done to


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1996 - footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP QFP Package 128 lead .5mm BGA 11x11 junction to board thermal resistance JEDEC Package Code MS-026-AED MS-026-BGA .65mm bga land pattern Shipping Trays 16x16 XC4010E-PQ208
Text: OPQ0019 OPQ0014 OPQ0006 OPQ0011 OPC0006 OPC0001 OPC0005 OPC0001 OPC0001 OPD0001 OPD0002 OPG0012 , -143-JA MO-143-GA MO-143-FA OPQ0014 OPQ0019 OPQ0020 Overview Mass Comparison Xilinx offers


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PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP QFP Package 128 lead .5mm BGA 11x11 junction to board thermal resistance JEDEC Package Code MS-026-AED MS-026-BGA .65mm bga land pattern Shipping Trays 16x16 XC4010E-PQ208
1996 - MO-83-AF

Abstract: footprint jedec MS-026 TQFP PQFP moisture sensitive handling and packaging schematic impulse sealer eftec 64 JEDEC MS-026 footprint BGA 11x11 junction to board thermal resistance EFTEC-64 EIA standards 481 XC7336Q
Text: OPQ0019 OPQ0014 OPQ0006 OPQ0011 OPC0006 OPC0001 OPC0005 OPC0001 OPC0001 OPD0001 OPD0002 OPG0012 , -143-JA MO-143-GA MO-143-FA OPQ0014 OPQ0019 OPQ0020 Overview Mass Comparison Xilinx offers


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PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF footprint jedec MS-026 TQFP PQFP moisture sensitive handling and packaging schematic impulse sealer eftec 64 JEDEC MS-026 footprint BGA 11x11 junction to board thermal resistance EFTEC-64 EIA standards 481 XC7336Q
1998 - JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP QFP PACKAGE thermal resistance die down footprint jedec MS-026 TQFP 128 PQ-208 EIA standards 481 ipc-sm-786A VQ44
Text: OPQ0021 OPQ0020 OPQ0019 OPQ0014 OPC0006 OPC0005 OPC0001 OPC0001 OPD0002 OPG0003 OPG0012 OPG0004 , ) MO-108-DD1 MO-143-FA MO-143-GA MO-143-JA OPQ0021 OPQ0020 OPQ0019 OPQ0014 Die Up/Heatsink


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schematic impulse sealer

Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 footprint jedec MS-026 TQFP 128 footprint jedec mo-067 BGA 31 x 31 mm XC4013E-PQ240 PQ160
Text: OPQ0019 OPQ0014 OPC0006 OPC0005 OPC0001 OPC0001 OPD0002 OPG0003 OPG0012 OPG0004 Mass (g) 2.2 , -108-DD1 MO-143-FA MO-143-GA MO-143-JA OPQ0021 OPQ0020 OPQ0019 OPQ0014 8-13 R Packages and


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PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 footprint jedec MS-026 TQFP 128 footprint jedec mo-067 BGA 31 x 31 mm XC4013E-PQ240 PQ160
2000 - footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer TSOP 86 land pattern footprint jedec MS-026 TQFP xc4010e-pq208 QFP PACKAGE thermal resistance leadframe C7025 BAV 235 CB228 BGA and QFP Package
Text: OCQ0003 OCQ0007 OCQ0005 OCQ0012 OPD0005 OPQ0021 OPQ0020 OPQ0019 OPQ0014 OPC0006 OPC0005 OPC0001 , -108-DD1 MO-143-FA MO-143-GA MO-143-JA OPQ0021 OPQ0020 OPQ0019 OPQ0014 8-13 08 001-022


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PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer TSOP 86 land pattern footprint jedec MS-026 TQFP xc4010e-pq208 QFP PACKAGE thermal resistance leadframe C7025 BAV 235 CB228 BGA and QFP Package
2000 - XAPP186

Abstract: XC4025E-4PG299 XC3090-100PG175 XC4013E-4CB228 XAPP151 XC3042-100PG84 XQ4036XL-3HQ240N XC3042-100PG132 XQ4028EX4HQ240N 5962-9752501QYC
Text: No file text available


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2000 - interfacing cpld xc9572 with keyboard

Abstract: VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX creative labs model 3400 XC2S15-VQ100 FXS-100 ISA level pressure transmitter
Text: No file text available


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PDF XC2064, XC-DS501, XC3090, XC4005, XC5210, interfacing cpld xc9572 with keyboard VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX creative labs model 3400 XC2S15-VQ100 FXS-100 ISA level pressure transmitter
1996 - A7 SMD TRANSISTOR

Abstract: fnd 503 7-segment 4013 FLIP FLOP APPLICATION DIAGRAMS HP 1003 WA SMD fuse P110 transistor SMD making code GC 1736DPC RCL TOKO data verilog code for 32 BIT ALU implementation xilinx xc95108 jtag cable Schematic
Text: No file text available


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1998 - 7448 bcd to seven segment decoder

Abstract: 7448 seven segment display data sheet datasheet The 555 Timer Applications Sourcebook 7448 BCD to Seven Segment display CI 7448 SERVICE MANUAL OF FLUKE 175 interfacing cpld xc9572 with keyboard 100352 The Transistor Manual Japanese 1993 xc95144 pinout
Text: No file text available


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PDF XC2064, XC3090, XC4005, XC-DS501, VersaR467-9828 7448 bcd to seven segment decoder 7448 seven segment display data sheet datasheet The 555 Timer Applications Sourcebook 7448 BCD to Seven Segment display CI 7448 SERVICE MANUAL OF FLUKE 175 interfacing cpld xc9572 with keyboard 100352 The Transistor Manual Japanese 1993 xc95144 pinout
1996 - apple ipad 2 circuit schematic

Abstract: SMD TRANSISTOR MARKING P28 fnd 503 7-segment apple ipad schematic drawing marking w25 SMD smd code marking NEC tantalum capacitor smd TRANSISTOR code marking bu pin DIAGRAM OF IC 7400 32 pin eprom to eprom copier circuit TRANSISTOR SMD MARKING CODE W25
Text: No file text available


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PDF CH-4450 2-765-1488w apple ipad 2 circuit schematic SMD TRANSISTOR MARKING P28 fnd 503 7-segment apple ipad schematic drawing marking w25 SMD smd code marking NEC tantalum capacitor smd TRANSISTOR code marking bu pin DIAGRAM OF IC 7400 32 pin eprom to eprom copier circuit TRANSISTOR SMD MARKING CODE W25
1998 - A23 780-4

Abstract: vhdl code for 8-bit BCD adder star delta wiring diagram with timer CI 7448 XC4013XL PIN BG256 100352 XC6200 transistor L43 SMD schemat xilinx xc3000a MARKING CODE
Text: No file text available


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PDF XC2064, XC3090, XC4005, XC-DS501, Versa108 XC95144 XC95216 XC95288 XC9536 XC9572 A23 780-4 vhdl code for 8-bit BCD adder star delta wiring diagram with timer CI 7448 XC4013XL PIN BG256 100352 XC6200 transistor L43 SMD schemat xilinx xc3000a MARKING CODE
1999 - SERVICE MANUAL OF FLUKE 175

Abstract: SHARP IC 701 I X11 dot led display large size with circuit diagram The 555 Timer Applications Sourcebook IR power mosfet switching power supply xc95144 pinout interfacing cpld xc9572 with keyboard distributed control system of power plant XC3090-100PG175 100352
Text: No file text available


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PDF XC2064, XC3090, XC4005, XC-DS501, SERVICE MANUAL OF FLUKE 175 SHARP IC 701 I X11 dot led display large size with circuit diagram The 555 Timer Applications Sourcebook IR power mosfet switching power supply xc95144 pinout interfacing cpld xc9572 with keyboard distributed control system of power plant XC3090-100PG175 100352
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