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    NP276-52928AC-15743 Search Results

    NP276-52928AC-15743 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    69157-436HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    69157-438HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    69157-430HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    69157-432HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    69157-434HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions

    NP276-52928AC-15743 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    NP276-52928AC-15743 Yamaichi Electronics Ball Grid Array (BGA, 1.27mm Pitch) Original PDF