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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
CDC925DL Texas Instruments 133-MHz Clock Synthesizer/Driver for PC Motherboards with 3-State Outputs 56-SSOP
CDC925DLG4 Texas Instruments 133-MHz Clock Synthesizer/Driver for PC Motherboards with 3-State Outputs 56-SSOP
CDC921DL Texas Instruments 133-MHz Clock Synthesizer/Driver for PC Motherboards with 3-State Outputs 48-SSOP
CDC921DLR Texas Instruments 133-MHz Clock Synthesizer/Driver for PC Motherboards with 3-State Outputs 48-SSOP
CDC922DLR Texas Instruments 133-MHz Clock Synthesizer/Driver for PC Motherboards with 3-State Outputs 48-SSOP
CDC922DL Texas Instruments 133-MHz Clock Synthesizer/Driver for PC Motherboards with 3-State Outputs 48-SSOP

Motherboard Foxconn LS 36 rev a01 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1997 - DELL Front Panel foxconn ls 36

Abstract: foxconn motherboard ls 36 foxconn ls 36 BIOS BEEP CODES Motherboard Foxconn LS 36 intel motherboard display problem repairing foxconn ls 36 motherboard front panel connector foxconn LS 36 Motherboard Foxconn LS 36 rev a01 AC POWER SWITCH foxconn ls 36 latest laptop motherboard circuit diagram
Text: device transfer rate and translation mode. The motherboard supports LS -120 diskette technology through , DK440LX Motherboard Technical Product Specification October 1997 Order Number 682717-001 The DK440LX motherboard may contain design defects or errors known as errata which may cause the , DK440LX Motherboard Specification Update. Revision History Revision Revision History Date -001 Release -001 of the DK440LX Motherboard Technical Product Specification October 1997


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PDF DK440LX DELL Front Panel foxconn ls 36 foxconn motherboard ls 36 foxconn ls 36 BIOS BEEP CODES Motherboard Foxconn LS 36 intel motherboard display problem repairing foxconn ls 36 motherboard front panel connector foxconn LS 36 Motherboard Foxconn LS 36 rev a01 AC POWER SWITCH foxconn ls 36 latest laptop motherboard circuit diagram
PT44L61-6411

Abstract: PT44L61
Text: IDEAS GENERATED DRAWING, REV . DD NOT CHANGE BY HAND. © PART NO, R EF. PT44L61 , , DETAIL i PAGE 3° - MOTHERBOARD =n co A o n a u s i y o ssa o ca w j H3AOO 3 D V U 3 8 CN V 3 A V S MOTHERBOARD o o CO -H O X , xxx± PT44A68— 6411 ILM WITH COVER + SRV , 351-0000-1168 SCALE 1/1 SHEET 1/3 REV . APPD, IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND , ABS/PC , BLACK FOXCONN LOGO IS LOCATED APPROXIMATELY] SOCKET LOGO IS LOCATED APPROXIMATELY] A DATE


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PDF PT44L61-6411 BC-11-0018338 BC-11-0040455 BC-11-004805* PT44P1* PT44A68â PT44A69â PT44L61-6411 PT44L61
2002 - foxconn motherboard

Abstract: Cherokee International Power Cherokee CHEROKEE INTERNATIONAL cherokee power
Text: motherboard area in multiprocessor applications Reduces footprint area and improves thermal management , (3.3V @ 30A) 36 ­ 75Vdc Solid state switch opens @ 10A 3.4A @ (36Vin) -8% to +10% of Vout nominal* +/- , +32.10.438.213 (f) 97MS2081 Rev . A - 04.23.02 Hyper Series ­ Isolated DC-DC Power Modules Output: 1.3 to , Module and 70-pin latching connector: (AMP PN 145459-6 or FOXCONN PN EW03506-A1) Pin-out of 70-pin non-latching connector: (AMP PN 2-530843-3 or FOXCONN PN EW03506-B1) 70 60 50 40 30 3 6 9 12 15 18 21 24 27


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PDF 300LFM 118mV -109mV 500ns B-1301 97MS2081 foxconn motherboard Cherokee International Power Cherokee CHEROKEE INTERNATIONAL cherokee power
1997 - IBM motherboard socket 478 rev 1.6

Abstract: lm78 h12 k latest laptop motherboard circuit diagram IBM motherboard rev 1.6 socket 478 identifying functions of different ics on laptops motherboard 845 MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD CIRCUIT diagram RJ45 connector IEEE 802.3 computer motherboard circuit diagram PS-5201-6I
Text: DB440FX Motherboard Technical Product Specification April, 1997 Order Number 282971-001 The DB440FX motherboard may contain design defects or errors known as errata which may cause the product to , Motherboard Specification Update. Revision History Revision Revision History Date -001 First , will be published in the DB440FX Motherboard Specification Update before being incorporated into a , notice. The DB440FX motherboard may contain design defects or errors known as errata which may cause the


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PDF DB440FX IBM motherboard socket 478 rev 1.6 lm78 h12 k latest laptop motherboard circuit diagram IBM motherboard rev 1.6 socket 478 identifying functions of different ics on laptops motherboard 845 MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD CIRCUIT diagram RJ45 connector IEEE 802.3 computer motherboard circuit diagram PS-5201-6I
2000 - foxconn motherboard

Abstract: titania EW03506-B4 Titania Power Modules foxconn Foxconn Technology Group lucent comcode onami lucent ONAMI lucent DC-DC POWER MODULE
Text: Converters: 36 Vdc to 75 Vdc Input; 12 Vdc Output; 10 A Features n n Small size: ideal for minimizing motherboard area in multiprocessor applications Dimensions: 91.08 mm x 41.28 mm x 9.9 mm (3.586 , radiated EMI limits Onami 12 V Isolated Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input; 12 , Converters: 36 Vdc to 75 Vdc Input; 12 Vdc Output; 10 A Product Brief September 2000 Outline Diagrams , TITANIA TM ONAMI Vin= Iin= Vout= Iout= Onami Module Foxconn Part # T-0024(F) Figure


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PDF Para-305-569-3820 foxconn motherboard titania EW03506-B4 Titania Power Modules foxconn Foxconn Technology Group lucent comcode onami lucent ONAMI lucent DC-DC POWER MODULE
2000 - foxconn motherboard

Abstract: titania lucent DC-DC POWER MODULE Titania Power Modules onami lucent ONAMI titania power foxconn Foxconn Technology Group foxconn motherboard pinout
Text: Converters: 36 Vdc to 75 Vdc Input; 5 Vdc Output; 25 A Features n n Small size: ideal for minimizing motherboard area in multiprocessor applications Dimensions: 91.08 mm x 41.28 mm x 9.9 mm (3.586 , EMI limits Onami 5V Isolated Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input; 5 Vdc , ; dc-dc Converters: 36 Vdc to 75 Vdc Input; 5 Vdc Output; 25 A Product Brief September 2000 , Foxconn Part # T-0051(F) Figure 2. Onami Module with 70-Pin Latching Connector ( Foxconn * Part No


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PDF Parall-305-569-3820 foxconn motherboard titania lucent DC-DC POWER MODULE Titania Power Modules onami lucent ONAMI titania power foxconn Foxconn Technology Group foxconn motherboard pinout
PC MOTHERBOARD foxconn sc242

Abstract: foxconn motherboard slot 1 foxconn sc242 Foxconn Precision Co slot AGP 124 pin
Text: HC97%t; HC97450 HC97114 HC97026 S . J.LEE S. LU S. LU S.LU S.LU APPD. FOXCONN HON HA I PRECISION INDUSTRY CO. LTD TAIPEI TAIWAN R.O.C r^ APPD.: -c -c o TITLE: 11C961822 A HC961672 REV . ECN. NO , s b(A tyiJüh REV .: F SHEET: 1 OF Ì7 REV . ECN. NO. IDEA; CENTERATED DRAW I N C . DOW' T CHANCE , ) Foxconn SC242 © fZT) I0 . 2 5 I -X- ©E l 6A © I5 2 . 6 4 I ©2 0 .3 0 ( T Y P , I* SECTION B -B SC242 © UNITS MAT 'L RTT1 NAME( INTENDED USE) Foxconn HON HA


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PDF MIL-STD-1344A, MIL-STD-202 HC97967 HC97234 HC961673 PC242DD-DD PC MOTHERBOARD foxconn sc242 foxconn motherboard slot 1 foxconn sc242 Foxconn Precision Co slot AGP 124 pin
2001 - Chomerics T710

Abstract: PHC029C02012 845 motherboard intel 845 foxconn motherboard 845 motherboard check point INTEL 845 sdr a1349 845 motherboard circuit ATA-33
Text: corresponds to Tdie. 2.5.2 90 Degree Angle Attach Methodology 1. 2. 3. 4. 5. 6. Use 36 , into the heatsink base. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction , motherboard and the thermal solution. Proper mating requires the following: · Ensure that the solder ball cuboid in the chipset model makes direct contact with the motherboard . Good modeling contact must be , cuboid and the motherboard . · Ensure that the die cuboid in the chipset model is properly mated to the


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PDF A65066-001 A67031-001 A61203-001 A13494-005 HB96030-DW A67625-001 PHC029C02012 Chomerics T710 PHC029C02012 845 motherboard intel 845 foxconn motherboard 845 motherboard check point INTEL 845 sdr a1349 845 motherboard circuit ATA-33
2000 - JESD51-1

Abstract: AP-720 a1349 foxconn motherboard T-710 82801BA 82801BAM JESD-51-1 FIN26
Text: .21 4 Application Note ® Intel 850 Chipset: Thermal Considerations R Revision History Rev . Date Doc. Ref. No. Rev . No. Description November 2000 292268 -0011 Initial , Intel® 850 Thermal User's Guide, Rev 0.1 Contact your local Intel sales office or your distributor , motherboard component height under the Intel® 850 chipset component is limited to 0.090". Figure 4. Heat , Motherboard 35 m m 31 m m 35 m m Heatsk_Vol_Restrict Application Note 13 ® Intel 850


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PDF AP-720) T-710) 69-12-22066-T710) A20097-001 TEH-1000-001) A20932-001 A13494-002 JESD51-1 AP-720 a1349 foxconn motherboard T-710 82801BA 82801BAM JESD-51-1 FIN26
2001 - intel 845

Abstract: MOTHERBOARD INTEL 845 INTEL 845 sdr 82801BA ATA-33 T-710 intel pin grid array package intel 82845 foxconn motherboard
Text: . 6. Use 36 gauge or smaller K-type thermocouples. Ensure that the thermocouples have been , and bead. The cutouts should match the slot and hole milled into the heatsink base. Attach a 36 , predicts thermal behavior. These issues are the proper mating of the model with the motherboard and the , chipset model makes direct contact with the motherboard . Good modeling contact must be specified and the , motherboard . · Ensure that the die cuboid in the chipset model is properly mated to the thermal solution


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PDF A65066-001 A67031-001 A61203-001 A13494-005 HB96030-DW A67625-001 PHC029C02012 intel 845 MOTHERBOARD INTEL 845 INTEL 845 sdr 82801BA ATA-33 T-710 intel pin grid array package intel 82845 foxconn motherboard
2002 - 82801BA

Abstract: 82801DB ATA-33 E7205 PHC029C02012 T-710 Intel E7205 A13494-005 bga intel
Text: ). 36 Figure 19. MCH Heatsink Clip Frame (Sheet 3 of 3 , cutouts should match the slot and hole milled into the heatsink base. Attach a 36 gauge or smaller , Figure 7, any motherboard components placed between the heatsink and motherboard cannot exceed 2.286 mm , interfaces to the motherboard through four through-hole mount anchors and an integral lever (see Figure 9). , package and the motherboard are susceptible to damage under mechanical shock conditions depending on the


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PDF E7205 82801BA 82801DB ATA-33 PHC029C02012 T-710 Intel E7205 A13494-005 bga intel
2001 - teac fd 235hf

Abstract: teac fd-235hf ATI Rage 128 A34124-16 floppy drive scsi TEAC FD-235HF FD-235HF ROADM QS5000 maxtherm grease foxconn motherboard
Text: controllers · Integrated ATI Rage XL graphics accelerator -> same motherboard used for Tower and 1U form , processor ­ FET case for each processor ­ Under motherboard at Northbridge ­ Power supply exhaust ­ , Determination of processor power consumption ­ Processor placed in modified motherboard used for measuring , Systems in Tower Form Factor · Layout motherboard using keepout region definition for single processor , Incorporating Copper · Foxconn PK0453AEDAU52 ­ 63 x 70 x 60 mm ­ Basic aluminum extrusion ­ 50 x 50 x 3mm


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PDF 25325B AMD-760TMMP PC2100 64-Bit AMD-760 teac fd 235hf teac fd-235hf ATI Rage 128 A34124-16 floppy drive scsi TEAC FD-235HF FD-235HF ROADM QS5000 maxtherm grease foxconn motherboard
2003 - 855GM

Abstract: 82801DB intel chipset g 41 motherboard no display intel 845gv MOTHERBOARD CIRCUIT 852GME 845G T-710 T411 MCH/K12140 intel 855gme
Text: .10 3.1 3.2 3.3 3.4 3.5 3.6 3.7 4 Document Objective , ) . 36 CompactPCI* Reference Design Heatsink Assembly Suppliers (as referenced in Section 5) . 36 , that range. 2. Airflow ranges between 50 and 500 LFM. 3. The entire motherboard is modeled as an , motherboard . In the analysis Intel® 855GME and Intel® 852GME Thermal Design Guide for Embedded Applications , 10 percent of the overall volume of the motherboard . 4. Board-to-board spacing of 0.8", consistent


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PDF 855GME 852GME 852GME 855GM 82801DB intel chipset g 41 motherboard no display intel 845gv MOTHERBOARD CIRCUIT 845G T-710 T411 MCH/K12140 intel 855gme
2000 - Titania

Abstract: Titania Power Modules lucent ONAMI POWER MODULE TM 39 lucent DC-DC POWER MODULE foxconn motherboard onami Foxconn Technology Group lucent comcode lucent ONAMI 36/75v 2.0v 40A
Text: minimizing motherboard area in multiprocessor applications Dimensions: 95.52 mm x 49.27 mm x 9.40 mm (3.80 , TITANIA ONAMI Vin= Iin= Vout= Iout= Onami Module Foxconn Part # Vin= Iin= Vout= Iout , Technologies Figure 3. Onami module in 70-pin latching connector ( Foxconn Part # EW03506-A1) Onami Module , Onami Module Foxconn Part # Figure 5. Onami module in 70-pin non-latching connector ( Foxconn Part , Description ONAMI 36 /75V 1.3/3.5V 30 A ­ 40 A SW Comcode 108676586 Expanded Product Description 48


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PDF performanc5086 Titania Titania Power Modules lucent ONAMI POWER MODULE TM 39 lucent DC-DC POWER MODULE foxconn motherboard onami Foxconn Technology Group lucent comcode lucent ONAMI 36/75v 2.0v 40A
2007 - HB96030-DW

Abstract: E7520 BGA heatsink compressive force E7520 Chipset Platform Design Guide 6700PXH INTEL MOTHERBOARD Chip Level MANUAL TMDG C19228-001 E7320 pcm45
Text: . 36 Intel® 6700PXH 64-Bit PCI Hub Heat Sink Assembly , spherical crowns of the solder balls (shown before motherboard attach) 2. All dimensions and tolerances , . Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is , seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach) 2 , post-SMT height of 0.41-0.46mm 4. Shown before motherboard attach; FCBGA has a convex (dome shaped


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PDF E7520/E7320 6700PXH 64-Bit HB96030-DW E7520 BGA heatsink compressive force E7520 Chipset Platform Design Guide INTEL MOTHERBOARD Chip Level MANUAL TMDG C19228-001 E7320 pcm45
2002 - 845GL

Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA MOTHERBOARD INTEL 845 GMCH of motherboard chipset reflow profile
Text: or TC-MAX. 2.5.2 90 Degree Angle Attach Methodology 1. 2. 3. 4. 5. 6. Use 36 gauge , match the slot and hole milled into the heatsink base. Attach a 36 gauge or smaller calibrated K-type , are the proper mating of the model with the motherboard and the thermal solution. Proper mating , with the motherboard . Good modeling contact must be specified and the contact should be verified by closely zooming in on the interface between the solder ball cuboid and the motherboard . · Ensure that the


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PDF 845G/845GL/845GV 82845G/82845GL/82845GV Pkg760 845GL 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA MOTHERBOARD INTEL 845 GMCH of motherboard chipset reflow profile
2002 - intel 82801DB

Abstract: ICH4 Chomerics T710 chipset reflow profile P64H2 E7505 E7500 ATA-33 82870P2 82801DB
Text: cutouts should match the slot and hole milled into the heatsink base. Attach a 36 gauge or smaller , the MCH reference heatsink envelope shown in Figure 7, any motherboard components placed between the heatsink and motherboard cannot exceed 2.286 mm (0.090 in.) in height. ® Intel E7500/E7505 Chipset , Volumetric Envelope for the MCH 40 mm (1.6 in.) (Tall Heatsink) Keep-out Zone Above the Motherboard 28 mm (1.1 in.) (Short Heatsink) Motherboard MCH 42.5 mm (1.67 in.) 42.5 mm (1.67 in


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PDF E7500/E7505 E7500 intel 82801DB ICH4 Chomerics T710 chipset reflow profile P64H2 E7505 ATA-33 82870P2 82801DB
2002 - P64H2

Abstract: flotherm E7500 E7501 E7505 82801DB 251929 1156 pin FCBGA 251934 chipset reflow profile
Text: hole milled into the heatsink base. Attach a 36 gauge or smaller calibrated K-type thermocouple bead , motherboard components placed between the heatsink and motherboard cannot exceed 2.286 mm (0.090 in.) in , Heatsink) Keep-out Zone Above the Motherboard 28 mm (1.1 in.) (Short Heatsink) Motherboard , 29 Reference Thermal Solutions R 6.4 Reliability Guidelines Each motherboard , heatsink , ) Foxconn Bob Hall 503-693-3509 x235 bhall@foxconn.com Harry Lin 714-739-5797 hlinack@aol.com CCI


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PDF E7500/E7501/E7505 E7500/E7501/E7505 P64H2 flotherm E7500 E7501 E7505 82801DB 251929 1156 pin FCBGA 251934 chipset reflow profile
2002 - hall 503

Abstract: AH 503 hall 82801CA 82870P2 ATA-33 E7500 P64H2 T-710 foxconn motherboard
Text: thermocouple attach. 5.1.1 90° Angle Attach Methodology 1. Use 36 gauge or smaller diameter K-type , into the heatsink base. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction , reference heatsink envelope shown in Figure 8, any motherboard components placed between the heatsink and motherboard cannot exceed 2.286 mm (0.090 in.) in height. ® Intel E7500 MCH Thermal and Mechanical , 29 Reference Thermal Solutions R 6.4 Reliability Requirements Each motherboard , heatsink


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PDF E7500 hall 503 AH 503 hall 82801CA 82870P2 ATA-33 P64H2 T-710 foxconn motherboard
2007 - intel g31 chipset motherboard

Abstract: BB17 Motherboard Foxconn LS 36 foxconn motherboard ls 36 AC4 honeywell AY21 intel marking STD 164997 g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42
Text: Platforms ­ Ramp Retainer Sheet 1 . 36 18. GMCH Reference Heatsink for ATX Platforms ­ Ramp Retainer , 22 24 26 28 30 32 34 36 38 40 42 BC12 BB11 BB7 BA6 12 BC10 BB9 BB6 BB5 BA4 , 30 32 34 36 38 40 42 Non-standard grid ball pattern. Minimum Pitch 0.8mm [0.31 in] 2.2 , 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 , 37 39 41 43 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 § Thermal and Mechanical Design


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PDF 82G35 OTH97; D29081 intel g31 chipset motherboard BB17 Motherboard Foxconn LS 36 foxconn motherboard ls 36 AC4 honeywell AY21 intel marking STD 164997 g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42
2011 - g31 m7 te MOTHERBOARD CIRCUIT diagram

Abstract: FDV301N SOT23 D E6327 Application
Text: . 9 TLK10002EVM Motherboard Schematics . 17 TLK10002EVM Motherboard Bill of Materials . 37 TLK10002EVM Motherboard Layout , . TLK10002EVM Motherboard , . TLK10002EVM Motherboard and FPGA Daughterboard


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PDF SLLU148 TLK10002 10-Gbps, g31 m7 te MOTHERBOARD CIRCUIT diagram FDV301N SOT23 D E6327 Application
1997 - TC430HX

Abstract: AA 666740-601 aa 677269-604 virge bios jumper ls 36 s3 virge s3 virge graphic card 82439HX 82430HX intel DOC
Text: motherboard allows connection of an LS -120 compatible drive and a standard 3.5-inch diskette drive. The LS , TC430HX Motherboard Specification Update Release Date: January 1998 Order Number: 281826-015 The TC430HX motherboard may contain design defects or errors known as errata which may cause the , TC430HX motherboard may contain design defects or errors known as errata which may cause the product to , Intel TC430HX motherboard . September 1996 -002 Added Erratum 3 and Documentation Changes 1-2


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PDF TC430HX TC430HX J10C1-D AA 666740-601 aa 677269-604 virge bios jumper ls 36 s3 virge s3 virge graphic card 82439HX 82430HX intel DOC
1997 - TC430HX

Abstract: bios jumper ls 36 AA 666740-601 82430HX J4D2 82371SB intel DOC intel 28182 82439HX aa 677269-604
Text: Windows* 95 and Windows NT* operating systems. The TC430HX motherboard allows connection of an LS , TC430HX Motherboard Specification Update Release Date: October 1997 Order Number: 281826-014 The TC430HX motherboard may contain design defects or errors known as errata which may cause the , TC430HX motherboard may contain design defects or errors known as errata which may cause the product to , Intel TC430HX motherboard . September 1996 -002 Added Erratum 3 and Documentation Changes 1-2


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PDF TC430HX TC430HX J10C1-D bios jumper ls 36 AA 666740-601 82430HX J4D2 82371SB intel DOC intel 28182 82439HX aa 677269-604
2003 - E28 ferrite

Abstract: Header 2x1 365R C0402X7R160-104K BLM31P601SGPT F28-F29 CR0402-16W-000T motherboard PCB diagram FERRITE E15 jUMP MOTHERBOARD
Text: Si5100/Si5110-EVB Si5100/Si5110-EVB Bill of Materials: Loopback Motherboard Assembly Revision A-01 Si5100 Loopback Motherboard Assy Rev A-01 Reference Part Desc Part Number Manufacturer C1 , -01 Full-Duplex Motherboard Revision History Assembly Level PCB Assembly Notes A-01 Rev . A , BOM rev C-01 Loopback Motherboard Revision History Assembly Level PCB A-01 Rev . A , Status Ouputs Figure 2. Optional Full-Duplex Motherboard Functional Block Diagram Preliminary Rev


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PDF OC-48/STM-16 Si5100-EVB Si5110-EVB Si5100/Si5110 Si5100 Si5110 300-pincidental E28 ferrite Header 2x1 365R C0402X7R160-104K BLM31P601SGPT F28-F29 CR0402-16W-000T motherboard PCB diagram FERRITE E15 jUMP MOTHERBOARD
1997 - TC430HX

Abstract: AA 666740-601 bios jumper ls 36 J4D2 S3 Virge DX intel DOC intel 28182 82439HX 82430HX 82371SB
Text: Windows* 95 and Windows NT* operating systems. The TC430HX motherboard allows connection of an LS , TC430HX Motherboard Specification Update Release Date: July 1997 Order Number: 281826-012 The TC430HX motherboard may contain design defects or errors known as errata which may cause the , descriptions at any time, without notice. The TC430HX motherboard may contain design defects or errors known , Update for the Intel TC430HX motherboard . September 1996 -002 Added Erratum 3 and Documentation


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PDF TC430HX TC430HX LS-120 AA 666740-601 bios jumper ls 36 J4D2 S3 Virge DX intel DOC intel 28182 82439HX 82430HX 82371SB
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