MWDM-142210 Search Results

MWDM-142210 Result Highlights (6)

Part	Manufacturer	Description
10131319-142210PLF	Amphenol Communications Solutions	Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
10131319-142210RLF	Amphenol Communications Solutions	Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 14 Positions, Non GW Compatible Nylon66, With Pegs, Tape and Reel with cap.
10131318-1422100LF	Amphenol Communications Solutions	Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Black Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing.
10131319-1422100LF	Amphenol Communications Solutions	Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing.
10131319-142210TLF	Amphenol Communications Solutions	Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 14 Positions, Non GW Compatible Nylon66, Tape and Reel with cap.
77311-422-10LF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch.

Part	ECAD Model	Manufacturer	Description	Curated	Type	PDF
MWDM-142210		OPLINK Communications	1480nm Pump Combiner		Original	PDF