The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT1397CDE Linear Technology IC 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, 4 X 3 MM, PLASTIC, MO-229, DFN-14, Audio/Video Amplifier
LT6700MPDCB-2#TR Linear Technology IC DUAL COMPARATOR, 29000 ns RESPONSE TIME, PDSO6, 2 X 3 MM, PLASTIC, MO-229, DFN-6, Comparator
LT1397HDE#TR Linear Technology IC 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, 4 X 3 MM, PLASTIC, MO-229, DFN-14, Audio/Video Amplifier
LT6700MPDCB-3#TR Linear Technology IC DUAL COMPARATOR, 29000 ns RESPONSE TIME, PDSO6, 2 X 3 MM, PLASTIC, MO-229, DFN-6, Comparator
LT1397HDE Linear Technology IC 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, 4 X 3 MM, PLASTIC, MO-229, DFN-14, Audio/Video Amplifier
LT6700MPDCB-1#TR Linear Technology IC DUAL COMPARATOR, 29000 ns RESPONSE TIME, PDSO6, 2 X 3 MM, PLASTIC, MO-229, DFN-6, Comparator

MO-229 datasheet (1)

Part Manufacturer Description Type PDF
MO-229C Pericom Semiconductor 12-Contact, Thin Dual-in-line Flat No-Lead, TDFN Original PDF

MO-229 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
Allegro part numbering

Abstract: MO-229 MS-018 Allegro part "numbering" MO-220 k MS-011 MS-001 MO-220 MO-047 SPRAGUE SEMICONDUCTOR
Text: mm contact pitch, dual ultra-thin chip carrier ( MO-229 ) EF ­ Current-sensing, leadless 1.27 mm pitch, dual very-thin chip carrier ( MO-229 ) EG ­ Square leadless (exposed pad) 0.50 mm contact pitch, dual super-thin chip carrier ( MO-229 ) EH ­ Rectangular leadless (exposed pad) 0.50 mm pitch, dual very-very-thin , carrier ( MO-229 ) EK ­ Square leadless (exposed pad) 0.95 mm pitch, dual very-very-thin chip carrier ( MO-229 ) EL ­ Square leadless (exposed pad) 0.50 mm pitch, dual ultra-thin chip carrier ( MO-229 ) EP ­ Square


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2005 - IPC-7525

Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
Text: ¥ MAC06A 6LD, MLP, JEDEC MO-229 , DUAL, 3mm SQUARE MLP06A 6LD, MLP, DUAL, JEDEC MO-229 , 2mm SQUARE MLP06B 6LD, MLP DUAL, JEDEC MO-229 , 3mm X 2mm MLP06C 6LD, MLP, DUAL, JEDEC MO-229 , 3mm SQUARE MLP06D 6LD, MLP, DUAL, JEDEC MO-229 , 3mm SQUARE MLP06E 6LD, MLP, DUAL, JEDEC MO-229 , 3mm SQUARE, EXTENDED DAP MLP06F 6LD, MLP, DUAL, JEDEC MO-229 , 3mm SQUARE MLP06G 6LD, MLP, DUAL, JEDEC MO-229 , , NON-JEDEC, 2mm SQUARE, DUAL DAP MLP06J 6LD, MLP, DUAL, JEDEC MO-229 , 2mm SQUARE MLP06K 6LD, MLP


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PDF AN-5067 IPC-7525 jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
2001 - transistor RJp 30

Abstract: mo-229 pad layout transistor RJp MO-229 MO-220-wgge RJP PRODUCT jedec package MO-220 QFN 20 jedec package MO-220 for qfn MO-220 Rjc JESD51-9
Text: [t] Plastic Leadless Package with Exposed Thermal Pad (MLPD/DFN/SON) MO-229 UCCD 2 x 2 mm , /SON) MO-229 WCED 3 x 2 mm 6-Contact 50 70-221 2 [p] EJ Plastic Leadless Package with Exposed Thermal Pad (MLPD/DFN/SON) MO-229 WEED 3 x 3 mm 10-Contact 45 65-190 2 [p] EK Plastic Leadless Package with Exposed Thermal Pad (MLPD/DFN/SON) MO-229 WEEA 3 x 3 mm 5 , ) MO-229 WCCD 2 x 2 mm 6-Contact 56 95-250 2 [p] MS-018 AA 20-J Lead 41 78


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2005 - MO-229 footprint

Abstract: LX13043CLD transistor 33825 MO-229
Text: package is JEDEC compliant with MO-229 and meets the full RoHS initiative for Pbfree content. WWW . , VOUT 3.3V @ 1.0A PACKAGE ORDER INFO TJ (°C) 0 to 125 OUTPUT V 3.3V LD Plastic MO-229 6 , details) N.C. ­ No Internal Connection LD Plastic MO-229 6-Pin 6°C/W 25-50°C/W THERMAL , of LDO (Low Drop-Out) linear regulators in the JEDEC MO-229 package which offers maximum power , is negligible) WWW . Microsemi . C OM For the 3 x 3mm, 6 lead MO-229 package, thermal


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PDF LX13043 LX13043 tanta21, MO-229 footprint LX13043CLD transistor 33825 MO-229
1996 - PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: MO-142 JEDEC MO-229 atmel MO-115 soic 20 lead wide dd 127 dd 127 d 3302 tsop CERAMIC LEADLESS CHIP CARRIER LCC 24 8S2 EIAJ SOIC 64 CERAMIC LEADLESS CHIP CARRIER LCC
Text: (2.79) .090( 2.29 ) .060(1.52) .015(.381) .023(.584) .014(.356) .065(1.65) .045(1.14) .620 , SEATING PLANE .200(5.08) .125(3.18) .110(2.79) .090( 2.29 ) .015(.381) .008(.203) .060(1.52 , (.508) .120(3.05) .090( 2.29 ) .180(4.57) .165(4.19) .022(.559) X 45° MAX (3X) .022(.559) X 45 , ) .090( 2.29 ) MAX 1.100(27.94) REF .220(5.59) MAX .005(.127) MIN SEATING PLANE .065(1.65) .015(.381) .022(.559) .014(.356) .161(4.09) .125(3.18) .110(2.79) .090( 2.29 ) .012(.305


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PDF 32DW6 MO-142 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 soic 20 lead wide dd 127 dd 127 d 3302 tsop CERAMIC LEADLESS CHIP CARRIER LCC 24 8S2 EIAJ SOIC 64 CERAMIC LEADLESS CHIP CARRIER LCC
2007 - CM1481-02DE

Abstract: MO-229 CM1481 california micro devices cm1481
Text: 5 PACKAGE DIMENSIONS TDFN JEDEC No. MO-229 (Var. VCCD-3)* Leads 8 Dim. A E , * This package is compliant with JEDEC standard MO-229 , variation VCCD-3 with exception of the D2 and E2 dimensions as called out in the table above and the r1 dimension which is not specified in the MO-229


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PDF CM1481 MO-229, MO-229 CM1481-02DE CM1481 california micro devices cm1481
2012 - cd 2212

Abstract: SP6002-08UTG-1
Text: 800MHz to 3GHz 1 GND 4 Pinout t&4% *&$ ±15kV contact, ±30kV air t4NBMM MPXQSPmMFç%'/ (JEDEC MO-229 , 8 7 6 5 Pin 1 Locator r 8X e JEDEC MO-229 Millimeters Inches Min 0.018 0.000 Max 0.022 0.002 , -12 b E2 12 11 10 9 8 7 Pin 1 Locator e 1 2 3 4 5 6 JEDEC MO-229 Millimeters , JEDEC MO-229 0.10 M C A B b 8 E2 Millimeters Min A A1 0.45 0.00 0.15 3.20 2.70 1.25 0.30 0.15 Max


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PDF SP6002 800MHz MO-229) DFN-08 SP6002-04UTG-1 DFN-12 SP6002-06UTG-1 DFN-16 cd 2212 SP6002-08UTG-1
2007 - Not Available

Abstract: No abstract text available
Text: document. D 8 7 6 5 PACKAGE DIMENSIONS TDFN JEDEC No. MO-229 (Var. VCCD-3)* Leads 8 , GND PAD E2 * This package is compliant with JEDEC standard MO-229 , variation VCCD-3 with , specified in the MO-229 standard. C0.25 L R 8 7 6 5 K b e 8X BOTTOM VIEW 0.10


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PDF CM1481 MO-229, MO-229
2007 - power ic hard disk. western

Abstract: No abstract text available
Text: Quiescent Current, 600A Fully Fault Protected Thin MO-229 , 6-Pin Package WWW . Microsemi . C OM The , currents and thermal shutdown during fault conditions. The 6-pin JEDEC MO-229 package provides a small form , / Pb-free 100% matte Tin Pin Finish THERMAL DATA LD Plastic MLP 3x3mm MO-229 , 6-Pin 4°C/W 25 to 50 , ATA S HEET PACKAGE DIMENSIONS WWW . Microsemi . C OM LD MO-229 6-Pin Plastic 3 x 3 x .9 mm


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PDF LX13049 800mV, 800mv MO-229, LX13049 155mm( power ic hard disk. western
2007 - LX1736CLD

Abstract: MO-229 LX1736 p-MOSFET soft start 70v 3049 MSC
Text: Efficiency Low Quiescent Current, 600A Fully Fault Protected Thin MO-229 , 6-Pin Package The regulator , -pin JEDEC MO-229 package provides a small form factor and low profile at 3x3x1mm with excellent power , ) THERMAL DATA LD Plastic MLP 3x3mm MO-229 , 6-Pin THERMAL RESISTANCE-JUNCTION TO CASE, JC 4°C/W , S HEET PACKAGE DIMENSIONS WWW . Microsemi .C OM LD MO-229 6-Pin Plastic 3 x 3 x .9 mm D


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PDF LX1736 800mv MO-229, LX1736 LX1736CLD MO-229 p-MOSFET soft start 70v 3049 MSC
2007 - CM1482-02DE

Abstract: CM1482 MO-229 footprint MO-229 3482E DSA0043756
Text: DIMENSIONS TDFN JEDEC No. MO-229 (Var. VCCD-3)* Leads 8 Dim. A E Package Pin 1 , package is compliant with JEDEC standard MO-229 , variation VCCD-3 with exception of the D2 and E2 dimensions as called out in the table above and the r1 dimension which is not specified in the MO-229


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PDF CM1482 MO-229, MO-229 CM1482-02DE CM1482 MO-229 footprint 3482E DSA0043756
2012 - dfn16

Abstract: DFN12 DFN 12 A0 DFN MARKING A0
Text: %'/ (JEDEC MO-229 ) package (TYP 0.5mm height) t(SFBUFSUIBOE# attenuation (TYP) at 1GHz DFN , Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate DFN-08 JEDEC MO-229 Time 25 , Time e b Package Dimensions - DFN-16 DFN-16 JEDEC MO-229 Package Dimensions - DFN-12 DFN-12 JEDEC MO-229 D A A1 A3 Millimeters Min 0.45 0.00 0.15 3.20 2.70 1.25 0.30 0.20 0.15 0.35


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PDF SP6001 800MHz MO-229) DFN-08 SP6001-04UTG-1 DFN-12 SP6001-06UTG-1 DFN-16 dfn16 DFN12 DFN 12 A0 DFN MARKING A0
2007 - 3049 MSC

Abstract: No abstract text available
Text: Current ̇ High Efficiency ̇ Low Quiescent Current, 600 A ̇ Fully Fault Protected ̇ Thin MO-229 , 6 , conditions. The 6-pin JEDEC MO-229 package provides a small form factor and low profile at 3x3x1mm with , ) THERMAL DATA LD Plastic MLP 3x3mm MO-229 , 6-Pin THERMAL RESISTANCE-JUNCTION TO CASE, θJC 4 , S HEET PACKAGE DIMENSIONS WWW . Microsemi .C OM LD MO-229 6-Pin Plastic 3 x 3 x .9 mm D


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PDF LX1736 800mv MO-229, 3049 MSC
2007 - Not Available

Abstract: No abstract text available
Text: document. D 8 7 6 5 PACKAGE DIMENSIONS TDFN JEDEC No. MO-229 (Var. VCCD-3)* Leads 8 , GND PAD E2 * This package is compliant with JEDEC standard MO-229 , variation VCCD-3 with , specified in the MO-229 standard. C0.25 L R 8 7 6 5 K b e 8X BOTTOM VIEW 0.10


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PDF CM1482 MO-229, MO-229
1998 - transistors BC 458

Abstract: BC 458 CQFP 208 datasheet EPM7032-44 TQFP-208 0245 EPM5192 44JPLCC 192PGA 280PGA EPM5128
Text: ) 0.090 ( 2.29 ) 0.120 (3.04) 0.050 BSC (1.27) 0.165 (4.19) 0.180 (4.57) 0.385 (9.78) Sq , . ( 2.29 ) 0.200 Max. (5.08) 0.028 ± 0.013 (0.71 ± 0.33) 0.305 ± 0.015 (7.75 ± 0.38) 0.010 ± , ) 0.040 (1.02) 0.090 ( 2.29 ) 0.120 (3.05) Detail A 0.485 (12.32) Sq. 0.495 (12.58) 0.155 (3.94 , ) 0.013 (0.33) 0.021 (0.53) 0.020 Min. (0.508) 0.090 ( 2.29 ) 0.120 (3.05) Detail A 0.485 , ) 0.354 Sq. (9.00) 40CerDIP 14 Window 0.550 ± 0.040 (13.97 ± 1.02) 1 0.090 Max. ( 2.29


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PDF PGAT-187 -DS-PKG-07/J 10KFLEX 9000MAX EPF10K10 transistors BC 458 BC 458 CQFP 208 datasheet EPM7032-44 TQFP-208 0245 EPM5192 44JPLCC 192PGA 280PGA EPM5128
2005 - MO-229

Abstract: msc diode LX1736 LX1736CLD mo-229 pad layout power ic hard disk. western
Text: Quiescent Current, 600A Fully Fault Protected Thin MO-229 , 6-Pin Package The regulator is capable of , inrush currents and thermal shutdown during fault conditions. The 6-pin JEDEC MO-229 package provides , ) THERMAL DATA LD Plastic MLP 3x3mm MO-229 , 6-Pin THERMAL RESISTANCE-JUNCTION TO CASE, JC 4°C/W , DIMENSIONS MO-229 6-Pin Plastic 3 x 3 x .9 mm D L1 D2 Pin 1 ID E E2 L b A1 WWW .


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PDF LX1736 800mV, 900mA, 800mv MO-229, 900mA LX1736 155mm( MO-229 msc diode LX1736CLD mo-229 pad layout power ic hard disk. western
2007 - LX13045A

Abstract: MO-229
Text: Circuit Protection 6 pin MLP, JEDEC MO-229 APPLICATIONS The LX13045A operates as a Current Mode , conditions. The 6 pin MO-229 package provides a small form factor with excellent power dissipation capability , (°C) 0 to 85 LD Plastic MO-229 6 pin LX13045A RoHS Compliant / Pb-free LX13045ACLD , DIMENSIONS WWW . Microsemi . C OM LD MO-229 6-Pin Plastic 3 x 3 x .9 mm D L1 D2 Pin 1 ID


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PDF LX13045A MO-229 LX13045A MO-229
2004 - MO-229

Abstract: MIL-STD-883 method 3015 15kV TDFN-08 CM1407 CM1407-04DE CM1407-04DF MIL-STD-883 method 3015 Pi filter array design
Text: Information document. D 8 7 6 5 PACKAGE DIMENSIONS TDFN JEDEC No. MO-229 (Var. VCCD , package is compliant with JEDEC standard MO-229 , variation VCCD-3 with exception of the "D2" and "E2" dimensions as called out in the table above and the "r1" dimension which is not specified in the MO-229


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PDF CM1407 CM1407 5pF200-7 MIL-STD-883 MO-229, MO-229 MIL-STD-883 method 3015 15kV TDFN-08 CM1407-04DE CM1407-04DF MIL-STD-883 method 3015 Pi filter array design
2010 - MO-229 footprint

Abstract: CM1481 MO-229
Text: TDFN JEDEC No. MO-229 (Var. VCCD-3)* Leads 8 Millimeters Inches Dim. Min A Nom , JEDEC standard MO-229 , variation VCCD-3 with exception of the D2 and E2 dimensions as called out in the table above which are not specified in the MO-229 standard. Package Dimensions for 8


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PDF CM1481 MO-229 footprint CM1481 MO-229
2010 - TDFN08

Abstract: MO-229 TDFN-08
Text: Information document. PACKAGE DIMENSIONS Package TDFN JEDEC No. MO-229 (Var. VCCD-3)* Leads , * This package is compliant with JEDEC standard MO-229 , variation VCCD-3 with exception of the D2 and E2 dimensions as called out in the table above and the r1 dimension which is not specified in the MO-229


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PDF CM1483 CM1483 100pF-3nH-100pF. IEC61000-4-2 MIL-STD-883 TDFN08 MO-229 TDFN-08
2004 - TDFN-08

Abstract: MO-229 CM1406 CM1406-04DE CM1406-04DF california micro devices EMI california micro devices tdfn top marking EMI filter schematic diagram
Text: JEDEC No. MO-229 (Var. VCCD-3) Leads 8 Dim. Millimeters E Package Pin 1 , standard MO-229 , variation VCCD-3 with exception of the "D2" and "E2" dimensions as called out in the table above and the "r1" dimension which is not specified in the MO-229 standard. 0.10 M CAB


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PDF CM1406 CM1406 15pF200-15pF. MIL-STD-883 MO-229, MO-229 TDFN-08 CM1406-04DE CM1406-04DF california micro devices EMI california micro devices tdfn top marking EMI filter schematic diagram
2012 - DFN08

Abstract: DFN12
Text: TVS Diode Arrays (SPATM Family of Products) ESD and EMI Filter Devices - SP6002 Series SP6002 Series 15pF 30kV EMI Filter Array Description RoHS Pb GREEN Features t&.*mMUFSJOHPG frequencies from 800MHz to 3GHz 1 4 GND 8 5 Pinout t&4% *&$ ±30kV contact, ±30kV air t4NBMM MPXQSPmMFç%'/ (JEDEC MO-229 ) package (TYP 0.5mm height) t(SFBUFSUIBOE# attenuation (TYP) at 1GHz DFN , MO-229 Millimeters Min A A1 0.45 0.00 Max 0.55 0.05 Inches JEDEC MO-229 Millimeters Inches Min


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PDF SP6002 800MHz MO-229) DFN-08 SP6002-04UTG-1 DFN-12 SP6002-06UTG-1 DFN08 DFN12
2012 - DFN08

Abstract: dfn-12 DP10P
Text: t&4% *&$ ±15kV contact, ±30kV air t4NBMM MPXQSPmMFç%'/ (JEDEC MO-229 ) package (TYP 0.5mm height , Dimensions - DFN-08 Package Dimensions - DFN-12 D DFN-08 JEDEC MO-229 E D E Inches DFN-12 JEDEC MO-229 Millimeters Min A 0.450 0.000 Max 0.550 0.050 Inches Min 0.018 0.000 Max 0.022 0.002


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PDF SP6003 800MHz MO-229) DFN-08 SP6003-04UTG-1 DFN-12 SP6003-06UTG-1 DFN08 dfn-12 DP10P
2007 - ca 83e

Abstract: No abstract text available
Text: 0.059 0.075 0.031 0.008 0.008 0.012 0.016 3000 pieces TDFN MO-229 (Var. VCCD-3)* 8 Inches Nom 0.030 , : millimeters D2 * This package is compliant with JEDEC standard MO-229 , variation VCCD-3 with exception of , in the MO-229 standard. GND PAD E2 C0.25 R L K e 8 7 6 5 b 8X BOTTOM VIEW 0.10


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PDF CM1483 TDFN-08 IEC61000-4-2 MIL-STD-883 MO-229, MO-229 ca 83e
2007 - MO-229

Abstract: No abstract text available
Text: JEDEC No. MO-229 (Var. VCCD-3)* Leads 8 Dim. A E Package Pin 1 Marking , compliant with JEDEC standard MO-229 , variation VCCD-3 with exception of the D2 and E2 dimensions as called out in the table above and the r1 dimension which is not specified in the MO-229 standard. C0


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PDF CM1483 IEC61000-4-2 MIL-STD-883 -40dB TDFN-08 MO-229, MO-229
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