The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT1012ACH Linear Technology IC OP-AMP, 160 uV OFFSET-MAX, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier
LT1037MJ8 Linear Technology IC OP-AMP, 160 uV OFFSET-MAX, 60 MHz BAND WIDTH, CDIP8, 0.300 INCH, HERMETIC, CERDIP-8, Operational Amplifier
LT1007MJ8 Linear Technology IC OP-AMP, 160 uV OFFSET-MAX, 8 MHz BAND WIDTH, CDIP8, 0.300 INCH, HERMETIC, CERDIP-8, Operational Amplifier
LT1001MJ8 Linear Technology IC OP-AMP, 160 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, CDIP8, 0.300 INCH, HERMETIC SEALED, CERDIP-8, Operational Amplifier
LT1007MH Linear Technology IC OP-AMP, 160 uV OFFSET-MAX, 8 MHz BAND WIDTH, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier
LT1001MH Linear Technology IC OP-AMP, 160 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier

MO-160 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2001 - transistor BC 458

Abstract: transistor Bc 540 transistor a42 MO-003 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame UA65A transistor bc 577 W144A CERAMIC QUAD FLATPACK CQFP
Text: Feet/Minute) 0 225 500 JC (°C/W) 1000 H06C 70-99 300 220 160 130 110 60 H08A MO-006-AH 300 220 160 130 110 60 H08C TO-99 300 220 160 130 110 60 60 H10C TO-100 300 220 160 130 110 TO-18 H03C TO-18 300 220 160 130 110 60 TO-39 H03A TO-205-AG 300 220 160 130 110 60 H03B TO-39 300 220 160 130 110 60 HA04E TO


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2000 - transistor BC 458

Abstract: transistor BC 945 ac 1084 TRANSISTOR A42 transistor bc 577 Transistor BC 585 MS-015-AB bd 743 transistor CA 358 AE uA109
Text: 225 500 JC (°C/W) 1000 H06C 70-99 300 220 160 130 110 60 H08A MO-006-AH 300 220 160 130 110 60 H08C TO-99 300 220 160 130 110 60 H10C TO-100 300 220 160 130 110 60 TO-18 H03C TO-18 300 220 160 130 110 60 TO-39 H03A TO-205-AG 300 220 160 130 110 60 H03B TO-39 300 220 160 130 110 60 HA04E TO-205-AG 300 220 160 130 110 60


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PDF MS011795 transistor BC 458 transistor BC 945 ac 1084 TRANSISTOR A42 transistor bc 577 Transistor BC 585 MS-015-AB bd 743 transistor CA 358 AE uA109
PD-1503

Abstract: pd1503 h24 sot23-6 MS-026C PBGA272 MO-194AF PD1002 MO-153-AB NA-256 PD1704
Text: -1802 MS-026C/BBA 32 0.80 276 7.0 276 7.0 63 1.60 LQFP-52 PD-1803 MS-026C/BCC 26 0.65 394 10 394 10 63 1.60 LQFP-64 PD- MS-026C/BCD 20 0.50 394 1010 394 1010 63 1.60 LQFP-64 PD- MS-026C/BDC 26 0.65 551 14 63 14 63 1.60 SSOP-14 PD-1230 MO-150AB 26 0.65 245 6.2 209 , 0.80 630 16.0 217 5.5 55 1.40 NB LFBGA-64 PD-2003 MO-205 31 0.80


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PDF NA256 NA272 NB114 PD-1501 MO-153ED TSSOP-56 PD-1502 MO-153EE SSOP-56 PD-1402 PD-1503 pd1503 h24 sot23-6 MS-026C PBGA272 MO-194AF PD1002 MO-153-AB NA-256 PD1704
Not Available

Abstract: No abstract text available
Text: > W eH - * j A a-rJLKjlsjft N A m 10 0 160 160 160 70 8 100 HO 160 HO 70 6 70 8 too mo 70 6 70 6 60 160 160 160 160 mo mo 160 160 mo 70 6 10 U mo


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PDF 209MN
2000 - MS-026-bcd

Abstract: vjp44a MO-16B-AB ad 153 transistor cu50 transistor BC 185 TF11B TA11B mkt 344 transistor bd 905
Text: CU 75 118 118 MA08C Super-SOT M03A M03B None 130 160 CU 37.5 185 , 160 CU 100 410 650 P11A None 1120 135 CU 100 1120 135 R03A , VF196A MO-069-AG Z03A TO-226-AA 225 250 210 180 160 125 Z03B TO-226-AA 225 250 210 180 160 125 Z03C TO-226-AB 961 208 180 160 150 125 Z03D None 961 208 180 160 150 125 Z03E None 961 208 180 160


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PDF MS011798 MS-026-bcd vjp44a MO-16B-AB ad 153 transistor cu50 transistor BC 185 TF11B TA11B mkt 344 transistor bd 905
2001 - T03A

Abstract: TO-202 transistor mkt 344 Cu50 MTL 728 TRANSISTOR BC 136 V84A BD 669 M03A MS-026-bcd
Text: 160 CU 37.5 185 165 MA03B None 55 115 CU 75 104 120 MA06A , P04A None 410 160 CU 100 410 650 P11A None 1120 135 CU 100 , -226-AA 225 250 210 180 160 125 Z03B TO-226-AA 225 250 210 180 160 125 Z03C TO-226-AB 961 208 180 160 150 125 Z03D None 961 208 180 160 150 125 Z03E None 961 208 180 160 150 125 Z03G None 961 208


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1996 - schematic impulse sealer

Abstract: PCB footprint cqfp 132 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern xc4010e-pq208 footprint pga 84 QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7336Q xilinx opd0007
Text: /O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 , 144 61 129 144 160 61 129 160 160 160 XC4010L 160 61 XC4013E 192 XC4013L 192 160 XC4020E 224 160 192 112 153 129 144 160 160 160 192 192 192 192 192 XC4025E 256 XC4028EX 256 160 193 256 256 256 XC4028XL 256 160 , Number of Available I/O Pins (Continued) Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196


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PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 schematic impulse sealer PCB footprint cqfp 132 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern xc4010e-pq208 footprint pga 84 QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7336Q xilinx opd0007
1996 - footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP QFP Package 128 lead .5mm BGA 11x11 junction to board thermal resistance JEDEC Package Code MS-026-AED MS-026-BGA .65mm bga land pattern Shipping Trays 16x16 XC4010E-PQ208
Text: Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 , XC4006E 192 80 112 112 112 112 112 61 113 125 128 128 144 61 129 144 160 61 129 160 160 160 XC4010L 160 61 XC4013E 192 XC4013L 192 160 XC4020E 224 160 192 112 153 129 144 160 160 160 192 192 192 192 192 XC4025E 256 XC4028EX 256 160 193 256 256 256 XC4028XL 256 160 193 256 256 256


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PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP QFP Package 128 lead .5mm BGA 11x11 junction to board thermal resistance JEDEC Package Code MS-026-AED MS-026-BGA .65mm bga land pattern Shipping Trays 16x16 XC4010E-PQ208
MO-137-AB

Abstract: pericom sot23-6 MO-150AB MO-153-AB PD-1301 MO-150AH PD2001 78 mo 5 bcc sot23-5 PD-1803
Text: 10 6.2 6.2 7.2 8.2 10.2 14.0 17.5 9.8 11.3 3.0 5.0 5.0 6.5 7.8 9.7 27.0 16.0 8.0 , MM 47 1.20 47 1.20 79 2.00 79 2.00 79 2.00 43 1.10 47 1.20 63 1.60 63 1.60 79


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PDF TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-48 BQSOP-80 SC70-5 TQFP-32 LQFP-32 LQFP-52 SSOP-14 MO-137-AB pericom sot23-6 MO-150AB MO-153-AB PD-1301 MO-150AH PD2001 78 mo 5 bcc sot23-5 PD-1803
1996 - MO-83-AF

Abstract: footprint jedec MS-026 TQFP PQFP moisture sensitive handling and packaging schematic impulse sealer eftec 64 JEDEC MS-026 footprint BGA 11x11 junction to board thermal resistance EFTEC-64 EIA standards 481 XC7336Q
Text: /O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 , 144 61 129 144 160 61 129 160 160 160 XC4010L 160 61 XC4013E 192 XC4013L 192 160 XC4020E 224 160 192 112 153 129 144 160 160 160 192 192 192 192 192 XC4025E 256 XC4028EX 256 160 193 256 256 256 XC4028XL 256 160 , Number of Available I/O Pins (Continued) Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196


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PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF footprint jedec MS-026 TQFP PQFP moisture sensitive handling and packaging schematic impulse sealer eftec 64 JEDEC MS-026 footprint BGA 11x11 junction to board thermal resistance EFTEC-64 EIA standards 481 XC7336Q
2004 - SmD TRANSISTOR a42

Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 TRANSISTOR BC 413 SNA10A MO-220-WGGD-2 MO-220-WKKD-2 pdf on BC 187 TRANSISTOR
Text: 130 160 CU 37.5 185 165 MA03B None 55 115 CU 75 104 120 , Outline (TO-202) None 410 160 CU 100 410 650 1120 P11A TO-237-AA 145 None , 10 VF196A MO-069-AG Z03A TO-226-AA 225 250 210 180 160 125 Z03B TO-226-AA 225 250 210 180 160 125 Z03C TO-226-AB 961 208 180 160 150 125 Z03D None 961 208 180 160 150 125 Z03E None 961 208


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2001 - SMT CONNECTOR

Abstract: MO-160 MO-190
Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles RA SMT Plastic Latch 1.27mm (0.050) 72 5.5mm (0.217) 0.5A Max. 125V Max. 25 DW Voltage: Contact Material: Insulator , . JEDEC MO-160 SERIES 6402 Series 6402 is a right-angle SMT connector, conforming to JEDEC standard of


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PDF MO-160 MO-160 MO-190 SMT CONNECTOR MO-190
RP150X1.500-DFT UB

Abstract: IQR 2400 hal 02e B300 type ev 8200 - E
Text: PARAMETER VALUE UNITS NOTES Tj Junction tenperature -40 to 125 °C TBtg Storege teaperature -40 to 160 "C , 90 | ta itb « nB" BUfflX — - 96 OflB Recovered charge 'RM (REC) "A" suffix - - 160 , 2400-2200 VOLTS RANGE 200 ISO cc 160 f- UJ K 1M0 cr u 120 tE 100 U 111 An tc Ui 60 , Current 200 XS0 oc 1 160 I— I mo a; 3 120 >- I 100 u SO a bo K ÜJ S MO IE 20 0 — 1 1 1 , Recovered Charge 320 2B0 2M0 200 160 120 80 MO 1 | 1 ■J â


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PDF R30EF R30EF22A. 485S452 RP150X1.500-DFT UB IQR 2400 hal 02e B300 type ev 8200 - E
1998 - transistors BC 458

Abstract: BC 458 CQFP 208 datasheet EPM7032-44 TQFP-208 0245 EPM5192 44JPLCC 192PGA 280PGA EPM5128
Text: 34 31 14 PLCC 11 35 23 18 TQFP 10 44 38 34 31 160 PQFP 7 35 26 20 16 160 Altera Corporation 84 100 PGA 6 20 13 10 8 , 18 14 160 PQFP 6 20 13 10 8 PGA 6 16 11 8 6 PQFP 7 , 20 160 PQFP 6 20 13 10 8 192 PGA 6 16 11 8 6 208 PQFP , 20 160 PQFP 7 35 26 20 16 84 PLCC 11 35 23 18 14 100


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PDF PGAT-187 -DS-PKG-07/J 10KFLEX 9000MAX EPF10K10 transistors BC 458 BC 458 CQFP 208 datasheet EPM7032-44 TQFP-208 0245 EPM5192 44JPLCC 192PGA 280PGA EPM5128
Not Available

Abstract: No abstract text available
Text: Features and Benefits Electrical ■Accepts JEDEC MO-160 modules ■Profile height is 4.0 or 5.5mm Voltage: 125V ■Rugged metal latch prevents breakage Contact Resistance: 20mCJ max. Dielectric Withstanding Voltage: 500V AC Reference Information Insulation Resistance: 1000 M O min. Current: 1.0A Packaging: Tray Physical Mates With: JEDEC MO-160 modules Designed In: Millimeters Sockets and Edge Connectors / ■\® m o l e x 1.27mm (.050") Pitch Small


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PDF MO-160 20mCJ
2002 - MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA MO-113-AA-AD BGA 31 x 31 mm MS026-ACD MS-034-AAU-1 MO-047 MO-151 AAL-1 MO-151-AAN-1
Text: Notes: 1. 2. 3. Plastic PGA 16 x 16 Buried EIAJ 10 x 10 x 2.0 QFP EIAJ 14 x 20 QFP - 1.60 (default) EIAJ 14 x 20 QFP - 1.80 (not used) EIAJ 14 x 20 QFP - 1.95 (old version) EIAJ 28 x 28 0.65mm 1.60 EIAJ


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PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA MO-113-AA-AD BGA 31 x 31 mm MS026-ACD MS-034-AAU-1 MO-047 MO-151 AAL-1 MO-151-AAN-1
SS452

Abstract: R38BF8A FC 0137 MO201
Text: SERIES 800-600 VOLTS RANGE 220 200 IE , 160 z 160 ui tr § 140 u S 120 UI o 100 u LU ir eo ui , 20 MO 60 B0 100 120 IMO 160 ÎBO 200 RATE OF FRLL OF FORHBRD CURRENT t-dl/dt) - fl/US 260 2M0 01 220 200 I 180 £E 3 160 £ IMO UJ g 120 g 100 iü 00 er g 60 UJ K MO 20 0 — 1 1 1 T , = 125 , 20 MO 60 GO 100 120 IMO 160 180 RRTE OF FRLL OF FORHRRD CURRENT (-dl/dt) - B/US Fig. 7 — Typical Reverse Recovery Current Fig. 7a — Typical Reverse Recovery Current 320 200 180 160 IMO 120 100 BD 60


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PDF R38BF R38BF8A. D0-200AB E1017 SS452 R38BF8A FC 0137 MO201
peek 457

Abstract: 180D 00123700 HTG 7000
Text: . UNITS TEST CONDITIONS Vf* Peak forvard voltage - 1.60 1.70 V Initial Tj = 25°C, 50-60Hz half sins , RANGE 160 Œ i X 120 Ui te §100 >- en „ w B0 o u £ 60 - I I I IF(J s'is'oOAâ , Reverse Recovery Current 180 . 160 . mo : 120 ¡ ( ; 100 i I 80 ! , 60 ! I 10 ; 20 0 — 1 1 Tj , Reverse Recovery Current 200 180 160 mo 120 100 80 60 MO 20 0 1 I 1 T . - 125°C 1 1 II , €” Typical Recovered Charge 2M0 220 200 180 160 IMO 120 100 80 60 MO 20 0 - 1 1 1 T i = 125Â


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PDF 08OO8 R34BF 25//S B34BF R34BF14A. D0-200AB E1017 peek 457 180D 00123700 HTG 7000
2001 - M24B SOT23

Abstract: qsc 1110 GTLP16612 GTLP16616 GTLP16617 MQA20 MQA24 soic 16 Jedec package outline
Text: 1.5 8.0 6.65 6.5 5.3 5.45 2.1 M14A 16.0 7.5 ± 0.1 1.55 ± 0.05 1.5 8.0 6.65 6.5 9.5 9.65 2.1 M M16A 16.0 7.5 ± 0.1 1.55 ± 0.05 1.5 , ,Type II (SSOP II) 16.0 7.5 ± 0.1 1.55 ± 0.05 1.5 8.0 6.65 6.5 9.5 9.65 2.1 MQA20 16.0 7.5 ± 0.1 1.55 ± 0.05 1.5 8.0 6.65 6.5 9.5 9.65 2.1 MQA24 16.0 7.5 ± 0.1 1.55 ± 0.05 1.5 8.0 6.65 6.5 9.5 9.65 MSA20 16.0


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PDF GTLP16612, GTLP16616, GTLP16617 MS500144 M24B SOT23 qsc 1110 GTLP16612 GTLP16616 MQA20 MQA24 soic 16 Jedec package outline
1999 - Not Available

Abstract: No abstract text available
Text: (super-rot) · Abstrahlwinkel: extrem breite Abstrahlcharakteristik ( 160 °) · Technologie: InGaAlP · optischer , (LxWxH) · wavelength: 633 nm (super-red) · viewing angle: extremely wide ( 160 °) · technology: InGaAlP · , (typ.) 160 (typ.) 140 (typ.) 2004-09-14 2 LS V196 Grenzwerte Maximum Ratings Bezeichnung , dom 633 ±6 16 nm 2 nm (typ.) (min.) (typ.) (max.) (typ.) (max.) (typ.) 160 1.8 2.0 , Lichtstrom2) Seite 14 Luminous Flux2) page 14 V (mlm) 160 (typ.) 200 (typ.) 250 (typ.) 320 (typ.) 400 (typ


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PDF 5000/Rolle, JESD22-A114-B D-93049
1999 - footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint fine BGA thermal profile schematic impulse sealer qfp 64 0.5 mm pitch land pattern PQ208 TQ144 PQ100 land pattern QFP 208 VQ44
Text: 14.40 28.40 0.80 0.50 0.65 0.65 0.4 - 0.6 0.3 - 0.4 0.3 - 0.5 0.3 - 0.5 1.60 1.60 1.802 1.80 VQ44 VQ64 PQ100 HQ208 PQ208 28.20 28.20 0.50 0.3 - 0.4 1.60 VQ100 TQ100 13.80 13.80 0.50 0.3 - 0.4 1.60 TQ144 TQ176 19.80 23.80 19.80 23.80 0.50 0.50 0.3 - 0.4 0.3 - 0.4 1.60 1.60 HQ240 PQ240 32.20 32.20 0.50 0.3 - 0.4 1.60 HQ304 40.20 40.20 0.50 0.3 - 0.4 1.60 Notes: 1. Dimensions in millimeters 2. For 3.2 mm footprint per MS022, JEDEC


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1999 - schematic impulse sealer

Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint PG299-XC4025E footprint jedec MS-026 TQFP 128 XC4013E-BG225 MS-026-ACB bav 21 diode
Text: 0.6 0.3 - 0.4 0.3 - 0.5 0.3 - 0.5 1.60 1.60 1.802 1.80 VQ44 VQ64 PQ100 HQ208 PQ208 28.20 28.20 0.50 0.3 - 0.4 1.60 VQ100 TQ100 13.80 13.80 0.50 0.3 - 0.4 1.60 TQ144 TQ176 HQ240 PQ240 32.20 32.20 0.50 0.3 - 0.4 1.60 HQ304 40.20 40.20 0.50 0.3 - 0.4 1.60 19.80 23.80 19.80 23.80 0.50 0.50 0.3 - 0.4 0.3 - 0.4 1.60 1.60 Notes: 1. Dimensions in millimeters 2. For 3.2 mm footprint per MS022, JEDEC , (Typ) °C/Watt 30 29 12 11 9 41 26 24 18 109 14 14 12 11 10.9 16.0 84 46 42 33 79 34 27 28 23 23 21 20


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2007 - SMT CONNECTOR

Abstract: JEDEC tray standard
Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles RA SMT Plastic Latch 1.27mm (0.050) 72 5.5mm (0.217) 0.5A Max. 125V Max. 25 DW Voltage: Contact Material: Insulator Material: Operating Temperature: Standard: 500V rms/min. Phosphor Bronze LCP -55ºC~85ºC 95% Max. JEDEC MO-160 SERIES 6402


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PDF MO-160 MO-160 SMT CONNECTOR JEDEC tray standard
MO-166

Abstract: PPF leadframe MO166 MS-013 tip 142
Text: 0.406 0.092 .002 .094 MS-013* 37 1.60 14.2 3.15 0.20 3.35 MO-166 30 , 11.0 mm (.433") 1.000 24 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSOP 3 11.0 mm(.433") 0.800 30 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSOP 3 11.0 mm (.433") 0.650 36 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 PSOP 3 11.0 mm (.433") 0.650 44 15.9 1.60 14.2 3.15 0.20 3.35 MO-166 30 *JEDEC


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PDF MO-166. MS-012 MO-166 PPF leadframe MO166 MS-013 tip 142
105 08049

Abstract: No abstract text available
Text: q: g 180 u 160 S INO S 120 uj K 100 uj g 80 lu 3 60 ^ MO 20 0 — I I I I I I I I , - a: 280 I £ 240 ni CE g 200 >- I 160 g 120 tu in g G0 LU a: MO 20 M0 60 80 100 120 1M0 160 180 200 RRTE OF FALL OF FORWARD CURRENT i-dixdt , 20 MO 60 80 100 120 1M0 160 180 200 RRTE OF FALL OF FORHRRD CURRENT (-dl/"dt) - R/US Fig. 7 â , 20 MO 60 80 100 120 1M0 160 180 RATE OF FALL OF FORHRRD CURRENT (-dl/dt) - A/DS Fig. 8 — Typical


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PDF R38BF 25//S R38BF18A. 4fl55452 D0-200AB E1017 105 08049
Supplyframe Tracking Pixel