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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT1017MJ8/883 Linear Technology LT1017 - Micropower Dual Comparator; Package: CERDIP; Pins: 8; Temperature: Military
LT1018MJ8/883 Linear Technology LT1018 - Micropower Dual Comparator; Package: CERDIP; Pins: 8; Temperature: Military
LM108AJ8 Linear Technology LM108A - Operational Amplifiers; Package: CERDIP; Pins: 8; Temperature: Military
LTC1041MJ8/883 Linear Technology LTC1041 - BANG-BANG Controller; Package: CERDIP; Pins: 8; Temperature: Military
RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator

MIL-STD-883 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1996 - 5962-9208001MPA

Abstract: 8418001XA 5962-8688701CA 7703401YA 7703405XA 5962-8684501IA 5962-8688701 5962-3870701 7703402XA 5962-8859702XA
Text: -976 (Certification Requirements for Microcircuits), MIL-STD-883 (Test Methods and Procedures for Microelectronics , to MIL-M-38510 and MIL-STD-883 specifications. Since that time the Company has been reaudited to the , , and will be pursuing full QML certification. PRESEAL INTERNAL VISUAL MIL-STD-883 , METHOD 2010 , accelerated. This category 25°C ELECTRICAL TEST 100% 100% STABILIZATION BAKE MIL-STD-883 , METHOD , qualification process for JAN components. CONSTANT ACCELERATION MIL-STD-883 , METHOD 2001 (Y1 ONLY


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PDF MIL-Q-9858 MIL-I-45208 LT1181AMJ/883 LT1280MJ/883 LT1281MJ/883 LTC485MJ8/883 LTC1045MJ/883 LTC1059MJ/883 LTC1060AMJ/883 LTC1060MJ/883 5962-9208001MPA 8418001XA 5962-8688701CA 7703401YA 7703405XA 5962-8684501IA 5962-8688701 5962-3870701 7703402XA 5962-8859702XA
1998 - 5962-9208001MPA

Abstract: QML-38535 5962-3870701MPA MIL-STD 833 test method 3015 5962-8951101EA JM38510/01405BEA 5962-8956201 LT119AH LT1003 LM138K equivalent
Text: .12-6 MIL-STD-883 Product , . 12-9 MIL-STD-883 Test Methods , Microcircuits), MIL-STD-883 (Test Methods and Procedures for Microelectronics) and more recently the ISO 9000 , MIL-M-38510 and MIL-STD-883 specifications. Since that time the Company has been reaudited to the latest , INTERNAL VISUAL MIL-STD-883 , METHOD 2010 CONDITION B 100% LTC Standard Military Drawings DESC


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PDF 12--MILITARY MIL-M-38535 LTC485MJ8/883 LTC1045MJ/883 LTC1059MJ/883 LTC1060AMJ/883 LTC1060MJ/883 LTC1061AMJ/883 LTC1061MJ/883 5962-9208001MPA QML-38535 5962-3870701MPA MIL-STD 833 test method 3015 5962-8951101EA JM38510/01405BEA 5962-8956201 LT119AH LT1003 LM138K equivalent
2000 - 5962-9208001MPA

Abstract: 5962-8853701GA 5962-8951101EA 7703401YA 5962-9950101QPA 5962-9054501RA 5962-8993301GA 5962-9159501MPA 5962-8859702XA 5962-8864601XA
Text: -976 (Certification Requirements for Microcircuits), MIL-STD-883 (Test Methods and Procedures for Microelectronics , certification and QPL approvals 12-3 MILITARY PRODUCTS were awarded to MIL-M-38510 and MIL-STD-883 , , contact your local LTC sales office or LTC Military Marketing. PRESEAL INTERNAL VISUAL MIL-STD-883 , % STABILIZATION BAKE MIL-STD-883 , METHOD 1008 CONDITION C 100% In June 1994, LTC was granted transitional , . CONSTANT ACCELERATION MIL-STD-883 , METHOD 2001 (Y1 ONLY) CONDITION E 100% WAFER FABRICATION AND


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PDF MIL-Q-9858 MIL-I-45208 LTC485MJ8/883 LTC1045MJ/883 LTC1059MJ/883 LTC1060AMJ/883 LTC1060MJ/883 LTC1061AMJ/883 LTC1061MJ/883 LTC1062MJ8/883 5962-9208001MPA 5962-8853701GA 5962-8951101EA 7703401YA 5962-9950101QPA 5962-9054501RA 5962-8993301GA 5962-9159501MPA 5962-8859702XA 5962-8864601XA
Mil-Std-883 Wire Bond Pull Method 2011

Abstract: mil-std-883 mil-std-883 2015 MIL-STD883 MIL-STD-883 Method 2010 MIL-STD-883 method 2011 mil-std-883* 2015 centrifuge
Text: 55°C to +125°) T = High Temp Grade (-55°C to +125°C) DSCC = Mil-STD-883 Compliant PROCESS FLOW , % 100% WAFER PROBE X X X X SAW 100% 100% 100% 100% MIL-STD-883 , METHOD 2010 DIE VISUAL INSPECTION COND. B X X X X DIE ATTACH X X X X QC DIE ATTACH MONITOR MIL-STD-883 , METHOD 2027 X X X X WIRE BOND X X X X BOND PULL MONITOR MIL-STD-883 , METHOD 2011 COND. D X X X X PRE SEAL VISUAL X X X X SEAL 100% 100% 100% 100% 10 CYCLES, MIL-STD-883 TEMPERATURE CYCLE METHOD 1010, COND. C 100% 100% 100% 100% MIL-STD-883


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PDF Mil-STD-883 MIL-STD-883, Mil-Std-883 Wire Bond Pull Method 2011 mil-std-883 2015 MIL-STD883 MIL-STD-883 Method 2010 MIL-STD-883 method 2011 mil-std-883* 2015 centrifuge
1999 - MIL-M-55565

Abstract: 60024 apex PA02 Transistors smd mark code 883U MIL-PRF-38534 PA02M
Text: requirements of MIL-STD-883 , Method 2003. 1.4 PERFORMANCE SPECIFICATIONS The performance specifications for , are attached using MIL-STD-883 method 5011 conductive epoxy. Chip capacitors are attached with , Microcircuits 1.2 STANDARDS MIL-STD-883 Test Methods and Procedures for Microelectronics 2.3.2 MARKING ON , PERMANENCE Marking is permanent in nature to MIL-STD-883 , Method 2015. 3.7 HERMITICITY Hermiticity tests , performed to MIL-STD-883 , Method 1014, Condition A, at 1X10-6 cc/sec standard leak rate. 2.3.5 PART


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PDF 546-APEX MIL-PRF-38534, MIL-STD-883, MIL-M-55565 /883U MIL-M-55565 60024 apex PA02 Transistors smd mark code 883U MIL-PRF-38534 PA02M
2001 - JEDEC JESD22-B116

Abstract: SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 SB-U-00-004 MIL-STD-883 SB-U-02-002 mold compound
Text: Test Physical Dimension Lead Integrity Test Resistance to Solvents EIA/JESD22-A110 MIL-STD-883 Method 1010 MIL-STD-883 Method 1005 MIL-STD-883 Method 1008 EIA/JESD22-A102 JEDEC J-STD-20 MIL-STD-883 Method 2010 MIL-STD-883 Method 2009 JEDEC J-STD-035 Per IDT specification MIL-STD-883 Method 2011 MIL-STD-883 Method 2003 EIA/JESD22-B116 MIL-STD-883 Method 2016 MIL-STD-883 Method 2004 MIL-STD-883 Method 2015 45 , Resistance to Solvents EIA/JESD22-A110 MIL-STD-883 Method 1010 MIL-STD-883 Method 1005 MIL-STD-883 Method


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PDF G-0110-06 EME-7351LP EME-S351LP 4-10h JEDEC JESD22-B116 SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 SB-U-00-004 MIL-STD-883 SB-U-02-002 mold compound
MIL-STD-883

Abstract: No abstract text available
Text: MIL-STD-833, Mtd 1010, Cond. B -55°C to +125°C; Air-to-Air; 100 cycles; 10 min. dwell MIL-STD-883 , MIL-STD-883 , Mtd 1011.7 Cond. B MIL-STD-833, Mtd 1010, Cond. B MIL-STD-883 , Mtd 3015 Class II MIL-STD-883 , Mtd 2002, MIL-STD-883 , Mtd 2022.2 Cond. B 100°C to 0°C; Water-to-Water; 15 cycles; 10 -55°C to , Meniscograph Criteria MIL-STD-883 , Mtd 1014.8, Cond. B Mass spectro. 0.0610-8 atmos.; CC/sec He MIL-STD 883 , °C; 30 seconds MIL-STD-202, Mtd 103 40°C; 90%-95% R.H.; 56 days MIL-STD-883 , Mtd 2004.5, Cond. A, B1


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PDF 20ppm MIL-STD-883, MIL-STD-883
2007 - MIL-STD 833 test method 3015

Abstract: mtd2002 K1100FC K1100FA K1100FB K500F 20222 MTD2007
Text: Mechanical Shock MIL-STD-833, Mtd 1010, Cond. B MIL-STD-883 , Mtd 2002, Cond. B min. dwell +125°C; Air-to-Air; 100 cycles; 10 -55°C to min. dwell 1500 g's Mechanical Shock Vibration MIL-STD-883 , Mtd , -202, Mtd 103 MIL-STD-883 , Mtd 1011.7 Cond. B 40°C; 90%-95% R.H.; 56 days 100°C to 0°C; Water-to-Water; 15 cycles Thermal Shock Electrostatic Discharge MIL-STD-883 , Mtd 1011.7 Cond. MIL-STD-883 , Solderability Discharge Hermeticity Solderability MIL-STD-883 , Mtd 3015 MIL-STD-883 , Mtd 2022.2 Class II


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PDF K500F 100MHz 100ppm K1100FC 25ppm K1100FA 50ppm K1100FB K500FA MIL-STD 833 test method 3015 mtd2002 K1100FC K1100FA K1100FB 20222 MTD2007
2003 - MIL-STD-883 PRESSURE

Abstract: No abstract text available
Text: accordance with MIL-STD-883 class B specification: Test Salt spray Temperature cycling Stabilization bake , Norm MIL-STD 883 MIL-STD 883 MIL-STD 883 MIL-STD 883 MIL-STD 883 MIL-STD 883 MIL-STD 883 MIL-STD 883 , Environmental Tests Hi-rel programs corresponding to MIL STD- 883 , class S are available for the whole range of , Constant acceleration Burn-in External visual inspection Final electrical tests Norm MIL-STD 883 MIL-STD 883 MIL-STD 883 MIL-STD 883 MIL-STD MIL-STD MIL-STD MIL-STD 883 883 883 883 Method Method 2017


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PDF ISO9001-2000 ISO14001 3000m2 STD-883, MIL-STD-883 PRESSURE
MIL-STD-883 Method 2010

Abstract: No abstract text available
Text: FLOW W AFER PRF.P/MOUNT/SAW DIE VISUAL INSPECTION MIL-STD-883 , METHOD 2010, CONDITION B P C DTE. VISIJAE EOT ACCEPTANCE MIL-STD-883 , METHOD 2010, CONDITION B LTPD 5/0 DIE ATTACH PER PARADIGM BUILD SHEET SPECIFICATION DIE ATTACH MONITOR MIL-STD-883 , METHOD 2019 OR 2017 WIRE BOND PER PARADIGM BUILD SHEET SPECIFICATION WIRE BOND MONITOR MIL-STD-883 , METHOD 2011 INTERN AT. VISUAL INSPECTION MIL-STD-883 , METHOD 2010, CONDITION B P C VISUAL LOT ACCEPTANCE MIL-STD-883 , METHOD 2010, CONDITION B


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PDF -STD-883, MIL-STD-883 Method 2010
2006 - CMO3X

Abstract: mtronPTI CMO3
Text: ; 10 min. dwell 1500 g's Mechanical Shock MIL-STD-883 , Mtd 2002, Cond. B MECHANICAL AND , to +125°C; Air-to-Air; 100 cycles; 10 100°C to 0°C; Water-to-Water; 15 cycles MIL-STD-883 , 1011.7 Cond. MIL-STD-833, Mtd 1010, Cond. BB min. dwell MIL-STD-883 , Mtd 3015 Class II 2 KV to 4 KV Threshold 1500 g's MIL-STD-883 , Mtd 2002, Cond. B MIL-STD-883 , Mtd 2022.2 Solder dip; Meniscograph Criteria MIL-STD 883 , Mtd 2007, Cond. B 20-2000 Hz; 0.06 inch; 15g's; 3 planes MIL-STD-883 , Mtd 1014.8


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PDF 20ppm 1000requirements: CMO3X mtronPTI CMO3
2010 - mil-std-883

Abstract: MTD2007 K1100FA K1100FB K1100FC K500F mtd2002
Text: Mechanical Shock MIL-STD-833, Mtd 1010, Cond. B MIL-STD-883 , Mtd 2002, Cond. B min. dwell +125°C; Air-to-Air; 100 cycles; 10 -55°C to min. dwell 1500 g's Mechanical Shock Vibration MIL-STD-883 , Mtd , -202, Mtd 103 MIL-STD-883 , Mtd 1011.7 Cond. B 40°C; 90%-95% R.H.; 56 days 100°C to 0°C; Water-to-Water; 15 cycles Thermal Shock Electrostatic Discharge MIL-STD-883 , Mtd 1011.7 Cond. MIL-STD-883 , Solderability Discharge Hermeticity Solderability MIL-STD-883 , Mtd 3015 MIL-STD-883 , Mtd 2022.2 Class II


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PDF K500F 100MHz 100ppm K1100FC 25ppm K1100FA 50ppm K1100FB K500FA mil-std-883 MTD2007 K1100FA K1100FB K1100FC mtd2002
Not Available

Abstract: No abstract text available
Text: 1010, Cond. B MIL-STD-883 , Mtd 2002, Cond. B min. dwell +125°C; Air-to-Air; 100 cycles; 10 -55°C to min. dwell 1500 g’s Mechanical Shock Vibration MIL-STD-883 , Mtd 2002, Cond. MIL-STD , MIL-STD-883 , Mtd 1011.7 Cond. B 40°C; 90%-95% R.H.; 56 days 100°C to 0°C; Water-to-Water; 15 cycles Thermal Shock Electrostatic Discharge MIL-STD-883 , Mtd 1011.7 Cond. MIL-STD-883 , Mtd 3015 Class II B , Discharge Hermeticity Solderability MIL-STD-883 , Mtd 3015 MIL-STD-883 , Mtd 2022.2 Class II MIL-STD-883


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PDF K500F 100MHz 100ppm K1100FC 25ppm K1100FA 50ppm K1100FB K500FA
2007 - MIL-STD 833 test method 3015

Abstract: oscillator 50mhz DIP
Text: ; 10 min. dwell Mechanical Shock MIL-STD-883 , Mtd 2002, Cond. B 1500 g's Vibration , MIL-STD-202, Mtd 103 40°C; 90%-95% R.H.; 56 days Thermal Shock MIL-STD-883 , Mtd 1011.7 Cond. B 100°C to 0°C; Water-to-Water; 15 cycles MIL-STD-883 , Mtd 3015 Class II REFERENCE PROCEDURES 2 , Soldering MIL-STD-883 , MIL-STD-833, MIL-STD-883 , MIL-STD-883 , MIL-STD-202, Mtd Mtd Mtd Mtd , MIL-STD-883 , 2004.5, Cond. MIL-STD 883 , Mtd 2007, Cond. B A, B1 Lead tension0.06 inch; 15g's; 3 planes


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PDF 20ppm MIL-STD-883, MIL-STD 833 test method 3015 oscillator 50mhz DIP
2013 - Not Available

Abstract: No abstract text available
Text: , 96 hours MIL-STD-883 , Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883 , Method 1014, Condition A MIL-STD-883 , Method 1014, Condition C MIL-STD-883 , Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883 , Method 1008, Condition C, 125°C, 168 hours JESD22-A110, Biased, 130°C, 85 , 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883 , Method 2004 Per Datasheet MIL-STD-883 , , Condition K MIL-STD-202, Method 215 MIL-STD-883 , Method 2003 MIL-STD-883 , Method 1010, Condition B


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PDF EA1620 JESD22-A102, MIL-STD-883, UL94-V0 TEN01-100-244
2014 - EA2532

Abstract: No abstract text available
Text: JESD22-A102, 121°C, 100% RH, 15 PSIG, 96 hours MIL-STD-883 , Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883 , Method 1014, Condition A MIL-STD-883 , Method 1014, Condition C MIL-STD-883 , Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883 , Method 1008, Condition C, 125°C, 168 hours , 100 10 10 100 100 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883 , Method 2004 Per Datasheet MIL-STD-883 , Method 2002, Condition B, 1,500G’s, 0.5msec, ½ sine J-STD-020, MSL = 1


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PDF EA2532 TEN01-100-285 EA2532
Not Available

Abstract: No abstract text available
Text: :.25 cycles, -55°C to +125°C per MIL-STD-883 , Method 1010 Constant Acceleration:. 5000g's, 0.5mS, 3 shocks per direction, per MIL-STD-883 , Method 2002 Sinusoidal Vibration:.0.06" D.A., 10 to 55 Hz and 30g's, 55 to 2000 Hz, 3 cycles per direction, per MIL-STD-883 , Method 2007 Random Vibration:. 20GRS 20 to 2000 Hz, M, per MIL-STD-883 , Method 2026 Lead MIL-STD-883 , Method


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PDF MX045LV/MX045HSLV MX045LV MX045 MX045LV MIL-STD-202, MIL-STD-883,
workmanship ipc 610

Abstract: ipc 610 ML005 MIL-STD-883 PRESSURE MIL-STD-883, Method 1010 209E
Text: -004 Gross Leak Test at PDI MIL-STD-883 , Method 1014 (Fine & Gross) ML-003 Thermal Shock Oven Guide , Condition B Assemble Oscillators Internal Visual Visual & Mechanical Inspection Seal MIL-STD-883 , Method 2017 MIL-STD-1285, method 1 (Marking) IAW 55310/16 H MIL-STD-883 , Method 1008 100% Screening , Condition C MIL-STD-883 , Method 1015, Test Condition B. Nominal supply voltage and load, 320 Hours Minimum. MIL-STD-883 , Method 2001, Test Condition A. Y1 Axis only. IAW MIL-PRF-38534 & PDI Design


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PDF MIL-STD-790 MIL-STD-38534 800-274-XTAL MIL-STD-883, MIL-PRF-38534 1-800-274-XTAL workmanship ipc 610 ipc 610 ML005 MIL-STD-883 PRESSURE MIL-STD-883, Method 1010 209E
2000 - CMOS 4060

Abstract: mil-std-883 MIL-STD-883 METHOD 1009 SXO550 MIL-STD-883 METHOD 1009 condition A MilSTD-883 cts REEVES crystal
Text: MIL-STD-883 , Method 1010 Constant Acceleration: . 5000g's, 0.5mS, 3 shocks per direction, per MIL-STD-883 , Method 2002 Sinusoidal Vibration: . 0.06" D.A., 10 to 55 Hz and 30g's, 55 to 2000 Hz, 3 cycles per direction, per MIL-STD-883 , Method 2007 Random Vibration: . 20GRMS, 20 to 2000 Hz, per MIL-STD-883 , Method 2026 Lead Integrity: .per MIL-STD-883 , Method 2004


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PDF SXO550 50ppm inIL-STD-883, MIL-STD-883, CMOS 4060 mil-std-883 MIL-STD-883 METHOD 1009 SXO550 MIL-STD-883 METHOD 1009 condition A MilSTD-883 cts REEVES crystal
MIL-STD-883 METHOD 1009

Abstract: cts REEVES
Text: Temperature Cycle: . 25 cycles, -55°C to +125°C per MIL-STD-883 , Method 1010 , MIL-STD-883 , Method 2002 Sinusoidal Vibration: . 0.06" D.A., 10 to 55 Hz and 30g's, 55 to 2000 Hz, 3 cycles per direction, per MIL-STD-883 , Method 2007 Random Vibration: . 20GRMS, 20 to 2000 Hz, per MIL-STD-883 , Method 2026 Lead Integrity: .per MIL-STD-883 , Method 2004 conditions B1 and B2 Hermeticity


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PDF CXO63HT CXO63HT MHzL-STD-883, MIL-STD-883, MIL-STD-883 METHOD 1009 cts REEVES
2012 - MIL-STD-883, Method 2002

Abstract: MIL-STD-883, Method 1010 EA2025
Text: days JESD22-A102, 121°C, 100% RH, 15 PSIG, 96 hours MIL-STD-883 , Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883 , Method 1014, Condition A MIL-STD-883 , Method 1014, Condition C MIL-STD-883 , Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883 , Method 1008, Condition C, 125°C, 168 , Pass 100 100 10 10 100 100 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883 , Method 2004 Per Datasheet MIL-STD-883 , Method 2002, Condition B, 1,500G’s, 0.5msec, ½ sine J-STD


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PDF EA2025 TEN01-100-197 MIL-STD-883, Method 2002 MIL-STD-883, Method 1010 EA2025
2012 - MIL-STD-883, Method 1010

Abstract: EA5070
Text: JESD22-A102, 121°C, 100% RH, 15 PSIG, 96 hours MIL-STD-883 , Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883 , Method 1014, Condition A MIL-STD-883 , Method 1014, Condition C MIL-STD-883 , Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883 , Method 1008, Condition C, 125°C, 168 hours , 100 10 10 100 100 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883 , Method 2004 Per Datasheet MIL-STD-883 , Method 2002, Condition B, 1,500G’s, 0.5msec, ½ sine J-STD-020, MSL = 1


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PDF EA5070 TEN01-100-195 MIL-STD-883, Method 1010 EA5070
2012 - JESD22-B102D

Abstract: MIL-STD-883, Method 2002
Text: Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883 , Method 1011, Condition A MIL-STD-883 , Method 1004 MIL-STD-883 , Method 2002, Condition B MIL-STD-883 , Method 2007 , JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883 , Method 2004, Test Condition D MIL-STD-883 , Method 1014, Condition C MIL-STD-883 , Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking , Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883


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PDF ILCX07-24 000000M-2389 JESD22-B102D MIL-STD-883, Method 2002
2014 - Not Available

Abstract: No abstract text available
Text: JESD22-A102, 121°C, 100% RH, 15 PSIG, 96 hours MIL-STD-883 , Method 3015, Class 1, HBM = 1,500V UL94-V0 MIL-STD-883 , Method 1014, Condition A MIL-STD-883 , Method 1014, Condition C MIL-STD-883 , Method 1005, Condition B, Biased, 125°C, 1,000 hours MIL-STD-883 , Method 1008, Condition C, 125°C, 168 hours , 100 10 10 100 100 100 100 100 Fail 0 0 0 0 0 0 0 0 0 MIL-STD-883 , Method 2004 Per Datasheet MIL-STD-883 , Method 2002, Condition B, 1,500G’s, 0.5msec, ½ sine J-STD-020, MSL = 1


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PDF EA2540 TEN01-100-292
Not Available

Abstract: No abstract text available
Text: :.-55°C to +125°C Temperature Cycle:. 25 cycles, -55°C to +125°C per MIL-STD-883 , direction, per MIL-STD-883 , Method 2002 Sinusoidal Vibration:. 0.06" D.A., 10 to 55 Hz and 30g's, 55 to 2000 Hz, 3 cycles per direction, per MIL-STD-883 , Method 2007 Random 20 to 2000 Hz, M, per MIL-STD-883 , Method 2026 Lead Integrity:. per MIL-STD-883 , Method 2004 conditions B1 and


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PDF EX055 MIL-STD-202, MIL-STD-883, 1000hrs.
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