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Part ECAD Model Manufacturer Description Datasheet Download Buy Part
HV120-SM02-R HV120-SM02-R ECAD Model Superior Sensor Technology Board Mount Pressure Sensors 20 inWC, Single Die
ND030A-SM02-M ND030A-SM02-M ECAD Model Superior Sensor Technology Absolute Pressure Sensor 30 psia (2.1 Bar) - Multi Tray, SON-11
ND100A-SM02-M ND100A-SM02-M ECAD Model Superior Sensor Technology Absolute Pressure Sensor 100 psia (6.9 Bar) - Multi Tray, SON-11
ND110-SM02-T ND110-SM02-T ECAD Model Superior Sensor Technology Multi-Range Differential Pressure Sensor ±125 to ±2.5K Pa (±0.5 to ±10 inH2O) - Single Tray
SP160-SM02-T SP160-SM02-T ECAD Model Superior Sensor Technology Differential Pressure Sensor Optimized for Medical ±5K Pa to ±40K Pa - Single Tray
ND015A-SM02-Q ND015A-SM02-Q ECAD Model Superior Sensor Technology Absolute Pressure Sensor 15 psia (1 Bar) - Quarter Tape & Reel, SON-11

MIL-STD-883 PRESSURE Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1995 - MIL-STD-883 METHOD 1009

Abstract: sumitomo epoxy 6300h XILINX XC2000 X3132 6300H XC2000 XC3000 XC3100 XC4000 mil-std-883* lead fatigue
Text: patterned after the methods specified in MIL-STD- 883 . Referral to the test methods of MIL-STD- 883 is not intended to imply that nonhermetic products comply with the requirements of MIL-STD- 883 . These test , are qualified using the test methods specified in MIL-STD- 883 . The Group D package qualification , 1000 hr min equivalent at temperature = 125°C Life test circuit equivalent to MIL-STD- 883 LTPD = 5 , Biased moisture life circuit equivalent to MIL-STD- 883 LTPD = 5 Non-Hermetic Package Integrity and


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PDF XC1700 XC1700D XC2000 XC3000 XC3000A XC3100 XC4000 X1825 X3132 MIL-STD-883 METHOD 1009 sumitomo epoxy 6300h XILINX XC2000 X3132 6300H XC2000 XC3000 XC3100 XC4000 mil-std-883* lead fatigue
2004 - Not Available

Abstract: No abstract text available
Text: DESCRIPTION +32V METHOD/CONDITIONS ESD-HBM MIL-STD 883 Human Body Model Method 3015 , With Level 1 conditions JEDEC A113 SPEC #520-1003 MIL-STD- 883 TM.1010 COMMENTS Tpeak = +235°C PRESSURE POT FAIL PRE-CONDITIONING With Level1 precondioning TEMP CYCLE With Level1 precondioning SPEC #1000-0014 BIAS HUMIDITY Ta = +85°C/85%RH With Level1 precondioning MIL-STD- 883 , +121°C/15 PSIG /100% RH 45 168 HR 45 0 MIL-STD- 883 TM.1010 Ta = -65°C/+150°C 45


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PDF MIC2182 EME6300 MIC2182BSM MIC2182BM MP8000 1000H MIC200 MIL-STD-883
EIAJ-IC-121-17

Abstract: JESD22-A110 EIAJ-ED4701-D323 EIAJ-IC-121-18 MIL-STD-883 PRESSURE COOKER failure rate SM stress migration EIAJ-IC-121 JESD22A110
Text: standards, treme temperatures under biased operating con- such as MIL-STD- 883 , the main source of the , normal (MIL-STD- 883 ; 1008) device operation by accelerating infant mortality The , Operating Life Test (HTOL) (MIL-STD- 883 ; 1005) 10 Quality and Reliability Report Bias Life Test (BLT) Package-Related Reliability Tests (MIL-STD- 883 ; 1005.8 and EIAJ-ED4701-D323 , temperature-hu- thermal shock test, the pressure cooker test or the highly-accelerated temperature and


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PDF MIL-STD-883, 85C/140C EIAJ-IC-121-17 JESD22-A110 EIAJ-ED4701-D323 EIAJ-IC-121-18 MIL-STD-883 PRESSURE COOKER failure rate SM stress migration EIAJ-IC-121 JESD22A110
electrolytic ELITE

Abstract: No abstract text available
Text: 45 10 1 5 Power Cycle (P/C) Pressure Cooker Test (PCT) Wet High Temperature Reverse Bias , Axis 1 min for each Axis R = 1 .5 kQ C = 1 OOpF 5 Discharge M >± 1500V 45 10 1 MIL-STD- 883 1011 MIL-STD- 883 101 1 MIL-STD-750 2031 MIL-STD- 883 20 03 8 Temperature Cycle 9 (T/C) 10 Solder Heat Resistance , Atmosphere Mechanical Shock 10 N/A 0 MIL-STD- 883 1009A MIL-STD-750 2016 MIL-STD- 883 2 0 07 MIL-STD- 883 2001 MIL-STD- 883 For Hermeitc For Hermetic For Hermetic 13 10 N/A 0 14


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PDF KSC945 KSD288 KSD288 168HRS) 200CYC) electrolytic ELITE
tlp508

Abstract: JIS-C-5020 JIS C7021 B10 TLP645 JIS-C-5003 JISC5700 TLP573 TLP546G SCR 7704
Text: . Table 9-4 JISC5003 JISC5020 JISC5700 JISC7021 EIAJSD-121 EIAJ-IC-121 Ml L-STD-202 Ml L-STD-750 Ml L-STD- 883 , 260°C. Temperature cycling 0) (- Standard MIL-STD-750: MIL-STD- 883 : JISC7021: EIAJ IC-121 : 1026 1005 B-1 B-1 High temperature storage y0) 0) MIL-STD-750: MIL-STD- 883 : JISC7021: EIAJ IC , , and high hum idity conditions. 6 5 °C j - v MIL-STD-750: MIL-STD- 883 : JISC7021: EIAJ IC-121: 1051 1010 A-4 A-4 c o > Thermal shock LU MIL-STD-750: MIL-STD- 883


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PDF MIL-STD-883B L-STD-883B MIL-STD-883B tlp508 JIS-C-5020 JIS C7021 B10 TLP645 JIS-C-5003 JISC5700 TLP573 TLP546G SCR 7704
2000 - STMICROELECTRONICS MSL

Abstract: CDIP32 package CDIP32 M29F040B TSOP32 Package M29W040B PDIP32 PLCC32 QRFL0004 TSOP32
Text: MIL-STD- 883 Procedure 2016 Test Conditions Note Lots Samp. Fail 2 Published Data , , Catania M5 Diffusion Line Subgroup Test Procedure MIL-STD- 883 Procedure Results Test , Temperature, Humidity, Bias Temperature Cycling Pressure Pot 1 2 250°C ­ 168 hrs ­ 500 hrs ­ , 2 Published Data Coplanarity PLCC32 Package 2 Result MIL-STD- 883 Procedure 2 , Plastic Package - Die Related Tests, Catania M5 Diffusion Line Subgroup Test Procedure MIL-STD- 883


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PDF QRFL0004 M29F040B, M29W040B T6X-U35: M29F040B T6X-U35 STMICROELECTRONICS MSL CDIP32 package CDIP32 TSOP32 Package PDIP32 PLCC32 QRFL0004 TSOP32
1995 - Not Available

Abstract: No abstract text available
Text: Qualification, Plastic Package Related Tests M28F410, SO44, CMOS T6 Subgro up 1 Test Procedure MIL-STD- 883 , , Plastic Package Related Tests M28F411, TSOP40 (10 x 20mm), CMOS T6 Subgro up 1 Test Procedure MIL-STD- 883 , Test MIL-STD- 883 Procedure 1005 Test Conditions Lots 140°C, VCC = 7V, ­ 168 hrs ­ 500 hrs ­ 1000 hrs , Temperature Cycling Thermal Shock 1010 8 1011 9 Pressure Pot 10 Pressure Pot 11 , x 20mm), CMOS T6 Subgro up Test Procedure MIL-STD- 883 Procedure Test Conditions Lots 1 Operating


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PDF M28F410/420, M28F411/421 TSOP40 M28F410/420 5/12V) 512Kx8 256Kx16
1995 - TSOP40

Abstract: M28F410 M28F411
Text: up Test Procedure MIL-STD- 883 Procedure Result Test Conditions Note Lots 1 , Subgro up Test Procedure MIL-STD- 883 Procedure Result Test Conditions Note Lots 1 , 1 2 3 Test Procedure MIL-STD- 883 Procedure 1008 4 Retention Bake (after 10k , 11 1008 CECC 90,000 Temperature Cycling 1010 Thermal Shock 1011 Pressure Pot Pressure Pot HAST CECC 90,000 140°C, VCC = 7V, ­ 168 hrs ­ 500 hrs ­ 1000 hrs 225 225 225


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PDF M28F410/420, M28F411/421 TSOP40 M28F410/420 5/12V) 512Kx8 256Kx16 TSOP40 M28F410 M28F411
1996 - TSOP48 Thermal

Abstract: No abstract text available
Text: , SO44, CMOS T6 Subgro up 1 Test Procedure MIL-STD- 883 Procedure 2016 Test Conditions Lots Physical , , TSOP48 (12 x 20mm), CMOS T6 Subgro up 1 Test Procedure MIL-STD- 883 Procedure 2016 Test Condition s Lots , Tests M28F211, TSOP40 (10 x 20mm), CMOS T6 Subgro up 1 Test Procedure MIL-STD- 883 Procedure 2016 Test , Die Related Tests M28F210, SO44, CMOS T6 Subgro up 1 Test Procedure MIL-STD- 883 Procedure 1005 Test , 7 Thermal Shock 1011 8 Pressure Pot 9 HAST Notes: 1. 2. 3. 4. 5. 6. Sample


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PDF M28F210/220, M28F211/221, TSOP48 TSOP40 M28F210/220 5/12V) 256Kx8 128Kx16 M28F211/221 TSOP48 Thermal
1995 - QR107

Abstract: TSOP40 Flash M28F101 M28F102 PLCC44
Text: , TSOP40 (10 x 14mm), CMOS T5-U20 Subgro up Test Procedure MIL-STD- 883 Procedure Result Test , Tests M28F102, TSOP40 (10 x 14mm), CMOS T5 Subgro up Test Procedure MIL-STD- 883 Procedure , Pressure Pot Pressure Pot HAST CECC 90,000 140°C, VCC = 7V, ­ 168 hrs ­ 500 hrs ­ 1000 hrs , . Temperature Cycling Thermal Shock Pressure Pot Results Test Conditions 1008 1008 1008 , cycles 20,000 cycles 50,000 cycles 1005 Write/Erase Cycling 6 MIL-STD- 883 Procedure 100


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PDF M28F102 T5-U20 TSOP40 PLCC44 T5-U20 100ns TSOP40 PLCC44 QR107 TSOP40 Flash M28F101
CY37128

Abstract: 8361H JESD22 CY37128P84 tsmc mos 45
Text: Hrs., 30°C/60%RH+3IR-Reflow, 220°C+5, -0°C Cold Life Test -30°C, 6.5V (98376) P Pressure , /REFLOW +72 Hrs , 30°C/60%RH) Pressure Cooker Test 121°C, 100%RH P Precondition: JESD22 Moisture Sensitivity Level 3 (98404/99455) 192 Hrs., 30°C/60%RH+3IR-Reflow, 220°C+5, -0°C SEM Analysis MIL-STD- 883 , (ESD-HBM) MIL-STD- 883 , Method 3015.7 (2,000V) P Electrostatic Discharge Charge Device Model , -STRESS: MILITARY LIFE TEST GROUP C MIL-STD- 883 , METHOD 1005.4 (150C, 5.75V) CY37128P84-YMB ALPHA-X


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PDF CY37128P84 128-Macrocell CY37128 CY37256P160-AC 8361H JESD22 CY37128P84 tsmc mos 45
1995 - Not Available

Abstract: No abstract text available
Text: , TSOP40 (10 x 14mm), CMOS T5-U20 Subgro up 1 Test Procedure MIL-STD- 883 Procedure 2016 Test Conditions , M28F102, TSOP40 (10 x 14mm), CMOS T5 Subgro up 1 Test Procedure MIL-STD- 883 Procedure 1005 Test , 7 Pressure Pot 8 Pressure Pot 9 HAST Notes: 1. Sample is coming from 3 different , Procedure Operating Life Test MIL-STD- 883 Procedure 1005 Test Conditions Lots 140°C, VCC = 7V, ­ 168 hrs ­ , Temperature Cycling 1010 8 Thermal Shock 1011 9 Pressure Pot Notes: 1. 2. 3. 4. 5


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PDF M28F102 T5-U20 TSOP40 PLCC44 T5-U20 100ns TSOP40 PLCC44
1997 - TSOP32 Package

Abstract: TSOP32 M29W040 PLCC32 QR125
Text: Related Tests M29W040, PLCC32, CMOS T6-U10 Subgroup 1 Test Procedure Physical Dimensions MIL-STD- 883 , . Delamination Inspection by Acoustic Microscopy (SAM) 6. Electrical Test 10 Pressure Pot 121°C, 2 Atm , ), CMOS T6-U10 Subgroup 1 Test Procedure Physical Dimensions MIL-STD- 883 Procedure 2016 , ), CMOS T6-U10 Subgroup Test Procedure MIL-STD- 883 Procedure Results Test Conditions Lots , 1005 Temperature, Humidity, Bias Temperature Cycling CECC 90,000 1010C Pressure Pot


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PDF M29W040 T6-U10: PLCC32 TSOP32 TSOP32 T6-U10 100ns TSOP32 Package QR125
1997 - QR114

Abstract: CDIP32 tsop32 8x20 TSOP32 Package M29F040 PLCC32 TSOP32 PLCC32 package
Text: Procedure Physical Dimensions MIL-STD- 883 Procedure 2016 Coplanarity PLCC32 Package Result , Dimensions MIL-STD- 883 Procedure Result Test Conditions Note Lots Samp. Fail 3 75 , MIL-STD- 883 Procedure Operating Life Test 1005 Low Temperature Operating Life Test 1005 , hrs 121°C, 2 Atm, ­ 96 hrs ­ 168 hrs ­ 240 hrs 1031 Pressure Pot HAST Lots 25 , M29F040, TSOP32 (8x20 mm), CMOS T6-U10 Subgroup Test Procedure MIL-STD- 883 Procedure Results


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PDF M29F040 T6-U10: PLCC32 TSOP32 TSOP32 T6-U10 QR114 CDIP32 tsop32 8x20 TSOP32 Package PLCC32 package
MIL-STD-883 PRESSURE COOKER

Abstract: No abstract text available
Text: 4 10 1 45 MIL-STD-750 1036.3 5 Power Cycle (P/C) Pressure Cooker Test (PCT) W et , 10 45 1 7 10 1 45 8 45 10 1 MIL-STD- 883 1011 9 Temperature Cycle , Reject is > 10% uncovered surface 10 N/A 0 11 MIL-STD- 883 2003 12 Salt Atmosphere , /A N/A 0 MIL-STD- 883 1009A MIL-STD-750 2016 MIL-STD- 883 2007 MIL-STD- 883 2001 MIL-STD- 883 3015 , 1000HRS 2 TA=TJ(max) 1000HRS T A= i 2 i r ± 2 r 45 10 1 3 Pressure Cooker Test (PCT


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PDF 168HRS) 1200cyc) KSC945 KSD288 MIL-STD-883 PRESSURE COOKER
1999 - M27128

Abstract: M2764A QRR9902
Text: CECC 90,000 Pressure Pot Temperature Cycling M28F256 (B) MIL-STD- 883 Procedure - - , MIL-STD- 883 Procedure Test Conditions Pressure Pot Temperature Cycling 1010 560 560 560 , June 1999 Test Procedure Operating Life Test Retention Bake MIL-STD- 883 Procedure 1005 , Operating Life Test Retention Bake MIL-STD- 883 Procedure 1005 1008 M27C64A Test Conditions , 1998 to June 1999 Test Procedure MIL-STD- 883 Procedure Test Conditions M27C256 (D) M87C257


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PDF QRR9902 M27128 M2764A QRR9902
1997 - M27C256B datecode

Abstract: PART MARKING M27C512 M27C256B PART MARKING m27c512 equivalent M27C256 M27C512 marking M27128A M2716 M2764A QRR038
Text: to June 1997 Test Procedure Operating Life Test Retention Bake MIL-STD- 883 Procedure 1005 , Procedure Operating Life Test Retention Bake MIL-STD- 883 Procedure 1005 1008 M27C64A Test , , Die Related Tests, July 1996 to June 1997 Test Procedure MIL-STD- 883 Procedure M27C256B (B , Operating Life Test Retention Bake MIL-STD- 883 Procedure 1005 1008 M27C512 Test Conditions , 1997 Test Procedure MIL-STD- 883 Procedure Test Conditions M27C4001 (E) M27C801 M27C256


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sumitomo eme 1100

Abstract: EME-6300 CY7C63231A 99273 MIL-STD-883 Method 3015.7 CY7C63221A EME6300 CY7C63231A-PC
Text: %RH+3IR-Reflow, 220°C+5, -0°C Electrostatic Discharge Human Body Model (ESD-HBM) MIL-STD- 883 , Method 3015.7 (2 , accordance with JEDEC 17. Cypress Spec. 01-00081 (±300mA) P Pressure Cooker Cypress Spec. 25-00047 , °C/85%RH+3IR-Reflow, 220°C+5, -0°C Age Bond MIL-STD- 883 , Method 2011 (99273) P Acoustic Microscopy Cypress Spec 25-000104 (99273) P SEM MIL-STD- 883 , Method 2018-2 (99273) P , 3 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH) CY7C63231A-PC STRESS: 2031881


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PDF P26TLM CY7C63221A/ CY7C63231A CY7C63221A/ 7C6399AT 85C/85 sumitomo eme 1100 EME-6300 CY7C63231A 99273 MIL-STD-883 Method 3015.7 CY7C63221A EME6300 CY7C63231A-PC
1997 - DG2xx

Abstract: ICM7218 MAX1232 MAX232 MAX631ACPA MAX690
Text: high-reliability applications where hermetically sealed devices, screened to MIL-STD- 883 , may not be justified , board space. This screening includes many of the requirements common to ­ 883 devices, such as burn-in , SIZE LTPD, ACC. # FREQUENCY Operating Life Test MIL-STD- 883 Method 1005 TA = +135°C, Biased 192 Hours 80 5/1 Weekly Pressure Pot JEDEC Spec 22 TA = +121°C, RH = 100% 96 Hours 22 10/0 Weekly X-Ray MIL-STD- 883 Method 2012 Top View Only N/A 125


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PDF MIL-STD-883, MIL-STD-2010, DG2xx ICM7218 MAX1232 MAX232 MAX631ACPA MAX690
2001 - JEDEC JESD22-B116

Abstract: SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184
Text: Test Physical Dimension Lead Integrity Test Resistance to Solvents EIA/JESD22-A110 MIL-STD- 883 Method 1010 MIL-STD- 883 Method 1005 MIL-STD- 883 Method 1008 EIA/JESD22-A102 JEDEC J-STD-20 MIL-STD- 883 Method 2010 MIL-STD- 883 Method 2009 JEDEC J-STD-035 Per IDT specification MIL-STD- 883 Method 2011 MIL-STD- 883 Method 2003 EIA/JESD22-B116 MIL-STD- 883 Method 2016 MIL-STD- 883 Method 2004 MIL-STD- 883 Method 2015 45 , Resistance to Solvents EIA/JESD22-A110 MIL-STD- 883 Method 1010 MIL-STD- 883 Method 1005 MIL-STD- 883 Method


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PDF G-0110-06 EME-7351LP EME-S351LP 4-10h JEDEC JESD22-B116 SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184
1997 - SGS M27C256

Abstract: TOP SIDE MARKING M27C512 M27C256 SGS-THOMSON mk48t08 BV 726 B m27c mk48t18 SGS M2732A Eprom 2015 static ram CP 1005
Text: MIL-STD- 883 Procedure 1005 1008 M2716 Test Conditions M2732A M2764A M27128A M27256 , 1997 Test Procedure Operating Life Test Retention Bake MIL-STD- 883 Procedure 1005 1008 , Retention Bake MIL-STD- 883 Procedure 1005 1008 M27C512 Test Conditions M27C1001 (E , September 1997 Test Procedure MIL-STD- 883 Procedure Test Conditions M27C4001 (E) M27C801 , Operating Life Test Retention Bake MIL-STD- 883 Procedure 1005 1008 M27C1001 (F) Test


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1996 - TSOP40

Abstract: M28F210 M28F220 mil-std-883* 2015
Text: , Plastic Package Related Tests M28F210, SO44, CMOS T6 Subgro up Test Procedure MIL-STD- 883 , MIL-STD- 883 Procedure Result Test Conditions Note Lots 1 Physical Dimensions Samp , Test Procedure MIL-STD- 883 Procedure Result Test Conditions Note Lots 1 Physical , Procedure MIL-STD- 883 Procedure Results Test Conditions Lots 1 2 3 Retention Bake , Pressure Pot HAST CECC 90,000 Fail 140°C, VCC = 7V, ­ 168 hrs ­ 500 hrs ­ 1000 hrs 65 65


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PDF M28F210/220, M28F211/221, TSOP48 TSOP40 M28F210/220 5/12V) 256Kx8 128Kx16 M28F211/221 TSOP40 M28F210 M28F220 mil-std-883* 2015
Sample form for INPROCESS Inspection of RAW MATERIAL

Abstract: No abstract text available
Text: are metal corrosion and moulding defects. PRESSURE POT (PPT) This test is performed in order to check , time inside an autoclave in the presence of steam and pressure . Detectable failure mechanism is metal , (TEMPERATURE UMIDITY BIAS) PPT ( PRESSURE POT TEST) TCT (THERMAL CYCLE TEST) HTS (HIGH TEMP. STORAGE) TEST , 1800 PRESSURE POT HOURS TOT 94 rej Overall results 168 500 0 0 sample 0 0 TOT 95 rej 0 0 sample 800 , rej 0 0 sample 900 900 PRESSURE POT HOURS TOT 94 rej Overall results 168 500 0 0 sample 0 0 TOT 95


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PDF subj2009; Sample form for INPROCESS Inspection of RAW MATERIAL
1999 - M96S66

Abstract: tsop 3846 ST M27C256B PART MARKING M27128 M2764A QRR9903
Text: Bake MIL-STD- 883 Procedure 1005 1008 M2764A M27128 M27512 Test Conditions Samp , Test Procedure MIL-STD- 883 Procedure Test Conditions M27C256 (D) M87C257 (D) M27C512 (D , October 1998 September 1999 Test Procedure MIL-STD- 883 Procedure Operating Life Test 1005 , 1998 September 1999 Test Procedure Operating Life Test Retention Bake MIL-STD- 883 Procedure , Test Retention Bake MIL-STD- 883 Procedure 1005 1008 M27C160 (F) Test Conditions Samp


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PDF QRR9903 M96S66 tsop 3846 ST M27C256B PART MARKING M27128 M2764A QRR9903
1996 - misplaced Wire Bonds

Abstract: TOP SIDE MARKING M27C512 1562Q M27C512 SGS-THOMSON
Text: Reliability Data, Die Related Tests, January to December 1995 Test Procedure Operating Life Test MIL-STD- 883 , Life Test MIL-STD- 883 Procedure 1005 Test Conditions Samp. 140°C, VCC = 6V, f = 500kHz, ­ 48 hrs ­ 168 , Data, Die Related Tests, January to December1995 Test Procedure MIL-STD- 883 Procedure 1005 Test , , Die Related Tests, January to December 1995 Test Procedure Operating Life Test MIL-STD- 883 Procedure , Test Procedure Operating Life Test MIL-STD- 883 Procedure 1005 Test Conditions 140°C, VCC = 6V, f =


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