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MIL-STD-883 Method 2019 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2000 - MIL-STD-883 Method 2019

Abstract: Mil-Std-883 Wire Bond Pull Method 2011
Text: bond. Then, pull wire. MIL-STD-883 Method 2019 Mount the capacitor on a gold metallized substrate with , MIL-STD-883 Method 2019 No mechanical damage Initial requirement Initial requirement 11 Thermal , MIL-STD- 883 Method 2011 Condition D Mount the capacitors on a gold metallized alumina substrate with Au-Sn , : 2.5% max. YFD : 4% max. 25°C : 100,000 ohm 125°C : 10,000 ohm No damage MIL-STD-202 Method 305 Test Frequency : Temp. Comp.:1MHz ± 10% High K : 1kHz ± 10% Test Voltage : 1Vrms max. MIL-STD-202 Method 306 Test


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PDF 20GHz MIL-STD-202 10000M CG01-J MIL-STD-883 Method 2019 Mil-Std-883 Wire Bond Pull Method 2011
MIL-STD-883 Method 2010

Abstract: No abstract text available
Text: FLOW W AFER PRF.P/MOUNT/SAW DIE VISUAL INSPECTION MIL-STD- 883 , METHOD 2010, CONDITION B P C DTE. VISIJAE EOT ACCEPTANCE MIL-STD- 883 , METHOD 2010, CONDITION B LTPD 5/0 DIE ATTACH PER PARADIGM BUILD SHEET SPECIFICATION DIE ATTACH MONITOR MIL-STD-883 , METHOD 2019 OR 2017 WIRE BOND PER PARADIGM BUILD SHEET SPECIFICATION WIRE BOND MONITOR MIL-STD- 883 , METHOD 2011 INTERN AT. VISUAL INSPECTION MIL-STD- 883 , METHOD 2010, CONDITION B P C VISUAL LOT ACCEPTANCE MIL-STD- 883 , METHOD 2010, CONDITION B


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PDF -STD-883, MIL-STD-883 Method 2010
2011 - CHA2066-99S

Abstract: No abstract text available
Text: RF testing As per data sheet or detail specification 100% Visual inspection MIL-STD- 883 Method 2010, Cond.A 100% Wire bond evaluation MIL-STD- 883 Method 2011 (1 failure allowed) Die shear test MIL-STD-883 Method 2019 (0 failure allowed) SEM MIL-STD- 883 Method 2018 , Sampling for element evaluation 12 Internal visual inspection MIL-STD- 883 Method 2010, Cond.A 12 Temperature cycling (note 1) MIL-STD- 883 Method 1010, Cond.C 12 Initial electrical


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PDF PPH25X, PPH15, HB20S, HB20P) HB20M) MIL-PRF-38534. CND2047 CHS5100 CHP6013 CHX2089 CHA2066-99S
2000 - JESD22-B116

Abstract: MIL-STD-883 Method 2019 EIA/JESD22-B116 "MIL-STD-883 Method 2019" 74LVC16245 JESD78 74LVC16244 74LVCH162244 L0007-04
Text: Test Vehicle: QLG-00-07 74LVC16245 Test Bond Pull EIA/JESD22-B116 Die Shear Mil-Std-883 , Method 2019 Ball Shear EIA/JESD22-B116 Operating Life Test (Dynamic) Mil-Std- 883 , Method 1005 85/85(THB) or HAST EIA/JESD22-A110 Pressure Pot EIA/JESD22-A102 Thermal Shock Mil-Std- 883 , Method 1011 Temperature Cycling Mil-Std- 883 , Method 1010 ESD: HBM Mil-Std- 883 , Method 3015 ESD: CDM Latch-Up Immunity


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PDF L0007-04 74LVC16244, 74LVC16245 74LVCH162244 QLG-00-07 EIA/JESD22-B116 Mil-Std-883, JESD22-B116 MIL-STD-883 Method 2019 EIA/JESD22-B116 "MIL-STD-883 Method 2019" 74LVC16245 JESD78 74LVC16244 74LVCH162244 L0007-04
2001 - JESD22-B116

Abstract: MIL-STD-883 method 2019 JESD22-A110 MIL-STD-883 PRESSURE JESD22A110
Text: Pull EIA/JESD22-B116 Die Shear Mil-Std-883 , Method 2019 Ball Shear EIA/JESD22-B116 Operating Life Test (Dynamic) Mil-Std- 883 , Method 1005 85/85(THB) or HAST EIA/JESD22-A110 Pressure Pot EIA/JESD22-A102 Thermal Shock Mil-Std- 883 , Method 1011 Temperature Cycling Mil-Std- 883 , Method 1010 ESD: HBM Mil-Std- 883 , Method


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PDF L0007-04 74LVC16244, 74LVC16245 74LVCH162244 L0007-04 QLG-00-07 74LVC16245 EIA/JESD22-B116 Mil-Std-883, JESD22-B116 MIL-STD-883 method 2019 JESD22-A110 MIL-STD-883 PRESSURE JESD22A110
2004 - Mil-Std-883 Wire Bond shear Method 2011

Abstract: MIL-STD-883 method 2019
Text: / degree C Group III (36 pieces) MIL-STD-202, Method 208 No physical damage (Ref: MIL-C-49464A) MIL-STD- 883 , Method 2011 6 grams, gold wire 1 mil MIL-STD-883 , Method 2019 Group IV (125 pieces) MIL-STD-202, No , =TaN, 8=TiW, 9=TiWNi OSOS=Special Order Please Supply Design TEST METHODS MIL Reference MIL-STD- 883 MIL-STD- 883 MIL-STD-202 MIL-STD-202 MIL-STD-202 MIL-STD-202 Parameter Bond Strength Shear Strength Solderability Thermal Shock Life Load Humidity (THB) Method or Paragraph 2011.7 2019 208 107 108 103 @ rated VDC


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PDF MIL-STD-883, MIL-STD-202, 50MHz-25GHz Mil-Std-883 Wire Bond shear Method 2011 MIL-STD-883 method 2019
2006 - MIL-STD-883 Method 2019

Abstract: No abstract text available
Text: ) -55 to +150ºC +50ppm / degree C Group III (36 pieces) MIL-STD-202, Method 208 No physical damage (Ref: MIL-C-49464A) MIL-STD- 883 , Method 2011 6 grams, gold wire 1 mil MIL-STD-883 , Method 2019 Group IV (125 pieces) MIL-STD-202, No mechanical damage; Method 108; 2x rated; IR above minimum; no , Thermal Shock Life Load Humidity (THB) Method or Paragraph 2011.7 2019 208 107 108 103 @ rated , =TiWNi OSOS=Special Order Please Supply Design TEST METHODS MIL Reference Parameter MIL-STD- 883 MIL-STD- 883


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PDF 50MHz-25GHz MIL-STD-883 Method 2019
2009 - Not Available

Abstract: No abstract text available
Text: wire. MIL-STD-883 Method 2019 Mount the capacitor on a gold metallized alumina substrate with Au-Sn (80 , to the capacitor terminal using an ultrasonic ball bond. Then, pull wire. MIL-STD-883 Method 2019 , Strength Pull force: 0.03N min. 10 Mechanical Strength Die Shear Strength MIL-STD- 883 Method , . 10 Mechanical Strength Die Shear Strength MIL-STD- 883 Method 2011 Condition D Mount the , ) (P.71). No. Item Operating Temperature Range R7: Y55 to W125D Specifications Test Method


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PDF
2009 - y10c

Abstract: No abstract text available
Text: ) gold wire to the capacitor terminal using an ultrasonic ball bond. Then, pull wire. MIL-STD-883 Method , (0.001 inch) gold wire to the capacitor terminal using an ultrasonic ball bond. Then, pull wire. MIL-STD-883 Method 2019 Mount the capacitor on a gold metallized alumina substrate with Au-Sn (80/20). Apply the , force : 0.03N min. 10 Mechanical Strength Die Shear Strength MIL-STD- 883 Method 2011 Condition , : 0.03N min. 10 Mechanical Strength Die Shear Strength MIL-STD- 883 Method 2011 Condition D Mount


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PDF GMD155 y10c
2000 - jesd22-b116

Abstract: L9912-04 0.8um MIL-STD-883 method 2019 l9912
Text: Bond Pull EIA/JESD22-B116 Die Shear Mil-Std-883 , Method 2019 Ball Shear EIA/JESD22-B116 Operating Life Test (Dynamic) Mil-Std- 883 , Method 1005 85/85(THB) or HAST EIA/JESD22-A110 Pressure Pot EIA/JESD22-A102 Thermal Shock Mil-Std- 883 , Method 1011 Temperature Cycling Mil-Std- 883 , Method 1010 ESD: HBM Mil-Std- 883 , Method 3015 ESD: CDM Latch-Up Immunity EIA/JESD78 Electrical Characterization Per


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PDF L9912-04 EIA/JESD22-A110 EIA/JESD22-A102 Mil-Std-883, EIA/JESD78 jesd22-b116 L9912-04 0.8um MIL-STD-883 method 2019 l9912
2009 - MVL3030

Abstract: MVL3030X103MGH5N MVL3030Y104ZGH5R military capacitor codes mvl4 MVL3030Y104 MVL3030X103
Text: Layer Capacitors Mechanical Parameters Bond Strength: Shear Strength: Metallization Thickness: Mil-Std- 883 , Method 2011 Mil-Std-883 , Method 2019 Minimum 100 microinches (2.5 micrometers) Global Part Number , : 100%, as per Mil-Std- 883 , Method 2032. Can be upgraded to Test Code H as per Mil-PRF-38534 Class H


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PDF MVL3030X103MGH5N-* MVL4080X104MGH5N-* Mil-C-49464/55681 Mil-Std-202 MVL3030 MVL3030X103MGH5N MVL3030Y104ZGH5R military capacitor codes mvl4 MVL3030Y104 MVL3030X103
2008 - MVB3030X103ZGH5N1

Abstract: MVB4080X104ZGK5R3 MVB3030X103ZGH5R1 MVB3030X103ZGH5N MVB2040X103ZGH5R1 103 bypass capacitor MIL-STD-883 Method 2019 Presidio Components Presidio Components CAP
Text: Mechanical Parameters Bond Strength: Shear Strength: Metallization Thickness: Mil-Std- 883 , Method 2011 Mil-Std-883 , Method 2019 Minimum 100 microinches (2.5 micrometers) 7169 Construction Court, San Diego , (DWV) Visual: 100%, as per Mil-Std- 883 , Method 2032. Can be upgraded to Test Code H as per MilPRF


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PDF Mil-C-49464/55681 Mil-Std-202 Mil-Std-883, MVB3030X103ZGH5N1 MVB4080X104ZGK5R3 MVB3030X103ZGH5R1 MVB3030X103ZGH5N MVB2040X103ZGH5R1 103 bypass capacitor MIL-STD-883 Method 2019 Presidio Components Presidio Components CAP
bd 9h

Abstract: MIL-PRF-49464 6282 bd-bj P105 P115
Text: MIL-STD- 883 , Method 2011. · 10(0) Die Shear per MIL-STD-883 , Method 2019 . Consult Factory for other alternatives or assistance in specifying custom testing. 6 Side Visual Screening per MIL-STD- 883 , Method , 2kH z. s MI L-STD - 883 M ethod 2011 2019 1010 2002 2001 Tolerance Code A B C D E F , ith .001" dia w ire Limit per MIL-STD- 883 , Figure 2019-4. C B,Y1, 3,000g' Y1 direction s, 7


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PDF 500tion, MIL-STD-883, bd 9h MIL-PRF-49464 6282 bd-bj P105 P115
1999 - ph44

Abstract: Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
Text: 0/45 0/45 B11 INTERNAL VISUAL INSPECTION : Mil-Std- 883 , Method 2010 0/5 - 0/5 0/5 0/5 B12 DIE SHEAR TEST : Mil-Std-883 , Method 2019 0/5 - 0/5 0/5 0/5 B13 , Group D : Package Design Test D3 Description TEMPERATURE CYCLE (T/C) : Mil-Std- 883 , Method 1010


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PDF G9911-04 Mil-Std-883, S-7390) S-7383 ph44 Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
2008 - presidio X7R

Abstract: MVL3030X103MGH5N
Text: Layer Capacitors Mechanical Parameters Bond Strength: Shear Strength: Metallization Thickness: Mil-Std- 883 , Method 2011 Mil-Std-883 , Method 2019 Minimum 100 microinches (2.5 micrometers) Global Part Number , : 100%, as per Mil-Std- 883 , Method 2032. Can be upgraded to Test Code H as per Mil-PRF-38534 Class H


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PDF MVL3030X103MGH5N-* MVL4080X104MGH5N-* Mil-C-49464/55681 Mil-Std-202 presidio X7R MVL3030X103MGH5N
2009 - MIL-STD-883 Method 2019

Abstract: MVB3030X103ZGH5N1
Text: Parameters Bond Strength: Shear Strength: Metallization Thickness: Mil-Std- 883 , Method 2011 Mil-Std-883 , Method 2019 Minimum 100 microinches (2.5 micrometers) 7169 Construction Court, San Diego, CA 92121 USA , Mil-Std- 883 , Method 2032. Can be upgraded to Test Code H as per MilPRF-38534 Class H Element evaluation as


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PDF Mil-C-49464/55681 Mil-Std-202 Mil-Std-883, MIL-STD-883 Method 2019 MVB3030X103ZGH5N1
2005 - MIL-C-49464

Abstract: MIL-STD-883 method 2019 "MIL-STD-883 Method 2019" Microcap
Text: Strength: All terminations meet or exceed MIL-STD-883 Method 2019 for Die Shear Strength. Wire bondability meets or exceeds ML-C-49464 Para. 3.12 and MIL-STD- 883 Method 2011. Inspection A M E R I C A N 4


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PDF MIL-C-49464. MIL-C-49464 MIL-STD-883 method 2019 "MIL-STD-883 Method 2019" Microcap
BT22

Abstract: No abstract text available
Text: has been tested as part of the water acceptance procedure by sample testing to MIL-STD-883 , Method 2019 . To ensure adequate wetting to the back face of the chip, the mounting surface should be gold , testing (WBST) is performed as part of the wafer acceptance procedure to MIL-STD- 883 , Method 2011 using , preferred method of mount ing is the use of a machine such as a Mullins 8-140 die bonder. This utilizes a


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PDF Ablestick36-2 BT22
2000 - MIL-STD-883 method 2019

Abstract: Diode T3D 82 T3D 82 T3D 82 diode t3d diode W125D "MIL-STD-883 Method 2019" 48T4 Mil-Std-883 Wire Bond Pull Method 2011
Text: Shear force : 200g min. MIL-STD-883 Method 2019 Mount the capacitor on a gold metallized alumina , . MIL-STD- 883 Method 2011 Condition D Mount the capacitor on a gold metallized alumina substrate with , Specifications and Test Methods No. 1 Specification Item Operating Temperature Test Method X7R : Y55D to W125D Y5V : Y30D to W85D 2 Rated Voltage See the previous pages. The , . No. Specification Item Test Method The measured values shall satisfy the values in the


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PDF W125D 1000T12 MIL-STD-883 method 2019 Diode T3D 82 T3D 82 T3D 82 diode t3d diode W125D "MIL-STD-883 Method 2019" 48T4 Mil-Std-883 Wire Bond Pull Method 2011
1999 - Not Available

Abstract: No abstract text available
Text: to the capacitor terminal using an ultrasonic wedge bond. Then, pull wire. MIL-STD-883 Method 2019 , after 5 min. at each specified temperature stage. MIL-STD- 883 Method 2011 Condition D Mount the , mutually perpendicular directions (total 6 hours). Specification Test Method 2 3 4 5 Appearance , ) No failure Test Method A voltage treatment shall be given to the capacitor, in which a DC voltage


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PDF W125D 1000T12
2003 - Not Available

Abstract: No abstract text available
Text: G E N E R A L S P E C I F I C AT I O N S Mechanical Characteristics Resistance to Solvents: ATC’s dielectrics are virtually unaffected by moisture and commonly used cleaning solvents. Bond Strength: All terminations meet or exceed MIL-STD-883 Method 2019 for Die Shear Strength. Wire bondability meets or exceeds ML-C-49464 Para. 3.12 and MIL-STD- 883 Method 2011. Environmental Characteristics Operating Temperature: -55˚ to +125˚C with no derating of working voltage. Additional Environmental


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PDF MIL-STD-883 ML-C-49464 MIL-STD-883 MIL-C-49464. MIL-C-49464)
84-1 CONDUCTIVE EPOXY

Abstract: copper bond wire
Text: has been tested as part of the water acceptance procedure by sample testing to MIL-STD-883 , Method 2019 . To ensure adequate wetting to the back face of the chip, the mounting surface should be gold , procedure to MIL-STD- 883 , Method 2011 using a Dage BT22 tester. Pull strength in excess of 2 grams should be , " thick, placed between the die and the attachment surface. The preferred method of mounting is the use of


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PDF
2062c

Abstract: No abstract text available
Text: : 2.5% Max. 2.5% Max. MECHANICAL Bond strength: Die shear strength: MIL-STD- 883 Method 2011 MIL-STD-883 Method 2019 Condition D 3.0 gram minimum ENVIRONMENTAL Life Test: Thermal Shock: Humidity Test: Low Voltage Humidity: MIL-STD-202 Method 108 MIL-STD-202 Method 107 MIL-STD-202 Method


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PDF 20GHz. 2062c
2009 - Presidio Components CAP

Abstract: MVL3030X103MGH5N capacitor North Dakota military capacitor codes
Text: Layer Capacitors Mechanical Parameters Bond Strength: Shear Strength: Metallization Thickness: Mil-Std- 883 , Method 2011 Mil-Std-883 , Method 2019 Minimum 100 microinches (2.5 micrometers) Global Part Number , : 100%, as per Mil-Std- 883 , Method 2032. Can be upgraded to Test Code H as per Mil-PRF-38534 Class H


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PDF MVL3030X103MGH5N-* MVL4080X104MGH5N-* Mil-C-49464/55681 Mil-Std-202 16-Aug-2010 Presidio Components CAP MVL3030X103MGH5N capacitor North Dakota military capacitor codes
2007 - 48T4

Abstract: No abstract text available
Text: (0.0008 inch) gold wire to the capacitor terminal using an ultrasonic wedge bond. Then, pull wire. MIL-STD-883 Method 2019 Mount the capacitor on a gold metallized alumina substrate with Au-Sn (80/20). Apply the , for 48T4 hours at room temperature. Perform the initial measurement. MIL-STD- 883 Method 2011 Condition , Specifications Test Method Reference Temperature:25D The rated voltage is defined as the maximum voltage which , % Specifications Test Method Humidity 13 D.F. (Steady State) I.R. Dielectric Strength Appearance Capacitance


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PDF 1000T12 48T4
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