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LTC1297J8 Linear Technology IC 1-CH 12-BIT PROPRIETARY METHOD ADC, CDIP8, HERMETIC SEALED, CERDIP-8, Analog to Digital Converter
LTC1093MILDWF Linear Technology IC 6-CH 10-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, UUC16, DIE-16, Analog to Digital Converter
LTC1594LS16 Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter
LTC1093MILDWF#PBF Linear Technology IC 6-CH 10-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, UUC16, DIE-16, Analog to Digital Converter
LTC1594LS16#TR Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter
LTC1594S16 Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter

MIL-STD-750 METHOD 2036 CONDITION E Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2011 - HQ6025NH5RP

Abstract: HQ6025XH5
Text: Solder Heat MIL-STD- 750 : Method 2031 260°C, 10 seconds Solderability ANSI/J-STD-002, Category 3, Test A Lead Bend MIL-STD-750 : Method 2036 , Condition E ©2011 Littelfuse, Inc , Conditions MIL-STD- 750 : Method 1040, Condition A Rated VRRM, 150°C, 1008 hours MIL-STD- 750 : Method 1051 , MIL-STD- 750 : Method 1031 150°C, 1008 hours Low-Temp Storage Careful selection of the correct , Shock MIL-STD- 750 : Method 1056 0°C to 100°C, 5-minute dwell, 10-second transfer, 10 cycles


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PDF HQ6025xH5 25Amp heating12 O-218AC HQ6025RH5 HQ6025KH5 O-220 O-218 O-220AB O-263 HQ6025NH5RP
2011 - KXXXZY

Abstract: K0900S
Text: °C, 10 seconds MIL-STD-750 : Method 2036 , Condition E ©2011 Littelfuse, Inc Specifications are , Temperature Voltage Blocking MIL-STD- 750 : Method 1040, Condition A Rated VDRM (VAC-peak), 125°C, 1008 hours MIL-STD- 750 : Method 1051 -40°C to 150°C, 15-minute dwell, 100 cycles EIA/JEDEC , protect against component damage. High Temp Storage MIL-STD- 750 : Method 1031 150°C, 1008 hours Low-Temp Storage -40°C, 1008 hours Thermal Shock MIL-STD- 750 : Method 1056 0°C to 100°C, 5


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PDF DO-214AA K2400E DO-15 DO-214 K2400G KXXXZY K0900S
2011 - Not Available

Abstract: No abstract text available
Text: MIL-STD-750 : Method 2036 , Condition E ©2011 Littelfuse, Inc Specifications are subject to change , Humidity High Temp. Storage Design Considerations MIL-STD- 750 : Method 1040, Condition A Rated VRRM, 125°C, 1008 hours MIL-STD- 750 : Method 1051 -40°C to 125°C, 15-minute dwell, 100 cycles EIA/JEDEC: JESD22-A101 320VDC, 85°C, 85%RH, 1008 hours MIL-STD- 750 : Method 1031 150°C, 1008 hours Low-Temp , tP TP Temperature Reflow Condition Ramp-up TL tL TS(max) Ramp-do Ramp-down


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PDF Qxx25xx Qxx25xHx O-220L, O-218K, O-218AC O-218X Q6025R5 Q6025K6 O-220AB
2002 - MIL-STD-750 METHOD 2036 CONDITION E

Abstract: pro-electron
Text: installation into a circuit. Conditions: Mil-Std-750 , Method 2036 , Condition E K. Solderability E , mismatch between materials. Conditions: Mil-Std- 750 , Method 1051, -65°C to 150°C, 15 minutes dwell time at , temperature cycle. Conditions: Mil-Std- 750 , Method 1056, -55°C to 125°C, 5 minutes dwell time at each , terminals. Conditions: Mil-Std- 750 , Method 2026 The purpose of this test is to evaluate the moisture , method by which they are fabricated and assembled. ON-GOING RELIABILITY IMPROVEMENT PROBLEM Transistor


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MIL-PRF-195001

Abstract: 1N4459 1N4458R 1N4458 1N1616R 1N1616 1N1615R 1N1615 1N1614R 1N1614
Text: with method 3101 of MIL-STD- 750 . The maximum limit and conditions for ZJX in screening (appendix E , , appendix E , table E-VIb (JANTX and JANTXV) of MIL-PRF-19500. Subgroup Method Condition B2 4016 , . 4.4.3.1 Group C inspection, appendix E , table E-VII of MIL-PRF-19500. Subgroup Method Condition , /inch, t = 15 ±3 s. C2 2036 Test condition F, method B, 5 pounds, t = 15 ±3 s. C2 2036 , method 4066 of MIL-STD- 750 . IO = 0; VRM(W) = 0; IFSM = 100 A; six surges; TA = room ambient as defined


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PDF MIL-PRF-19500/162D MIL-PRF-19500/162C 1N1614, 1N1615, 1N1616, 1N4458, 1N4459, 1N1614R, 1N1615R, 1N1616R, MIL-PRF-195001 1N4459 1N4458R 1N4458 1N1616R 1N1616 1N1615R 1N1615 1N1614R 1N1614
ic 4016

Abstract: 1N3206 DIODE PK IN 4001 MIL-STD-750 METHOD 2036 1n4373 MIL-STD-750 METHOD 2036 CONDITION E MIL-S-19491 D253S IC 4011 details
Text: 4 10 Terminal strength (lead fatigue) (see 4. 7. 3) r 2036 Test condition E ; weight = 4 oz â , strength (lead fatigue) (see 4. 7. 3) 2036 Test condition E ; weight = 4 oz — - — — End points , I. Group A inspection Examination or test MIL-STD- 750 LTPD Limits Method Details Symbol Min , -19500/195D Examination or test MIL-STD- 750 LTPD Limits Method Details Symbol Min Max Unit Subgroup 1 , -65 °C "" • — •• — — — - — . Terminal strength (tension) 2036 Test condition A


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PDF 0005S3M MIL-S-19500/195D 1N3206 MIL-S-19500/195D, QQ0012S MIL-S-19500. MIL-S-19500 1N4373 ic 4016 1N3206 DIODE PK IN 4001 MIL-STD-750 METHOD 2036 MIL-STD-750 METHOD 2036 CONDITION E MIL-S-19491 D253S IC 4011 details
DIODE 1N1206A

Abstract: 1n1124r 1N1128A 1N1202A 1N1204A 1N1126A 1N3649 1N3671A 1N3673A x 260f
Text: ) Thermal response (see 4.3.2) 4 Not applicable VF2 and IR1 10 MIL-STD- 750 , method 1038, test condition A, t = 96 hours MIL-STD- 750 , method 1038, test condition A, t = 48 hours 11 , greater. 3/ 12 Burn-in, see 4.3.3 and 4.5.1. MIL-STD- 750 , method 1038, test condition B. Not , Test condition F, method B, weight = 5 pounds, t = 15 s. C2 2036 Test condition D1, seal , and JANTXV. 4.3.1 Surge current. Surge current, see MIL-STD- 750 , method 4066. IO = 0; VRM(w) = 0


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PDF MIL-PRF-19500/260F MIL-PRF-19500/260E 1N1202A, 1N1204A, 1N1206A, 1N3671A, 1N3673A 1N1124A, 1N1126A, 1N1128A, DIODE 1N1206A 1n1124r 1N1128A 1N1202A 1N1204A 1N1126A 1N3649 1N3671A x 260f
FED-STD-H28 chamfer

Abstract: 1N6304 1N6305 1N6306 DO-203AB
Text: -19500. Subgroup Method Condition C2 2036 Tension, test condition A, weight = 10 pounds, t = 15s. C2 2036 Bending stress, test condition F, method B; weight = 15 pounds, t = 15 s. C2 2036 , 1038 of MIL-STD- 750 , test condition A; TC = +125°C, VR = 0.8 to 0.85 rated dc (see 1.3), t = 48 hours , 48 hours. 4.3.3 Surge current. Surge current, see method 4066 of MIL-STD- 750 . IO = 0; VRWM = 0; IFSM , measurements shall be performed in accordance with method 3101 of MIL-STD- 750 . The ZJX conditions and maximum


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PDF MIL-PRF-19500/550C MIL-PRF-19500/550B 1N6304, 1N6305, 1N6306, MIL-PRF-19500. FED-STD-H28 chamfer 1N6304 1N6305 1N6306 DO-203AB
1N1124A

Abstract: DIODE 1N1206A 1N3673A 1N3671A 1N3649 1N1206A 1N1204A 1N1202A 1N1128A 1N1126A
Text: VF1 and IR1 Method 1038 of MIL-STD- 750 , test condition A, t = 96 hours VF1 and IR1; subgroup 2 of , applicable Not applicable VF1 and IR1 Method 1038 of MIL-STD- 750 test condition A, t = 48 hours , E , table E-VII of MIL-PRF-19500. Subgroup Method Condition C2 1056 Test condition B , , method B, weight = 5 pounds, t = 15 s. C2 2036 Test condition D1, seal torque = 10 ounce-inches , value, whichever is greater. Burn-in, see 4.3.3 and 4.5.2. method 1038 of MIL-STD- 750 , test


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PDF MIL-PRF-19500/260L MIL-PRF-19500/260K 1N1202A, 1N1204A, 1N1206A, 1N3671A, 1N3673A, 1N1124A, 1N1126A, 1N1128A, 1N1124A DIODE 1N1206A 1N3673A 1N3671A 1N3649 1N1206A 1N1204A 1N1202A 1N1128A 1N1126A
kc 2026

Abstract: 100 KC 1N995 1N995M mil-s-19500 color coding
Text: £7UU&I UUp 1 Lead fatigue 2036 Condition E 10 5 — — — Subgroup 5 Salt atmosphere , . CONDITIONS LTPD MIN LIMITS SYMBOL UNITS MEL-STD- 750 REF. METHOD SPECIFIC CONDITIONS or X REJ. NO , (Cont'd, ) EXAMINATION OR CONDITIONS LTPD MIN LIMITS TEST MIL-STD- 750 REF. METHOD SPECIFIC , MIL-STD- 750 REF. METHOD SPECIFIC CONDITIONS SYMBOL MIN MAX UNITS Subgroup 8 (Cont'd.) End , -19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD- 750 - Test Methods


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PDF MIL-S-I9500/227 1N995M MIL-S-19500, 1N995M MIL-S-19500 kc 2026 100 KC 1N995 mil-s-19500 color coding
MIL-STD-961

Abstract: c426 equivalent MIL-STD-750 method 2073 c6331
Text: the manufacturer to use the condition in method 2036 they feel is applicable for their part. 62 , test method 2036 of MIL-STD-883 that are appropriate for the mounting conditions, and assure by , from test method 2036 or MIL-STD-883 that are appropriate for the mounting conditions, and assure by , may be built to Class K, H, G, or E performance requirements." to "Monolithic microcircuits may be built to Class K, H, G,D, E , L, or F performance requirements." DLA Land and Maritime DLA


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PDF MIL-PRF-38534 MIL-STD-961 c426 equivalent MIL-STD-750 method 2073 c6331
2n7572

Abstract: No abstract text available
Text: ), Method 3131 of MIL-STD- 750 (see 4.3.3). Thermal Impedance (transient), Method 3131 of MIL-STD- 750 , : Method 1016 of MIL-STD- 750 , 9 short collector, emitter and base terminals together. Limit is 10 , accordance with method 3161 of MIL-STD- 750 using the guidelines in that method for determining IM, IH, tH , limit as outlined in method 3161. See group E , subgroup 4 herein. Measurement delay time (tMD) 70 µs , -19500 Subgroup Method Condition B3 2037 Test condition A B4 1037 2,000 cycles, adjust


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PDF MIL-PRF-19500/736 2N7572, 2N7573, 2N7574, MIL-PRF-19500. 2n7572
2N3960

Abstract: 2N3960UB
Text: , JANTX, and JANTXV) of MIL-PRF-19500. Subgroup Method Condition C2 2036 Test condition E , and JANTXV levels Thermal impedance Method 3131 of MIL-STD- 750 . Thermal impedance Method 3131 , shall be scrapped. Step Method Condition 1 1027 Steady-state life: Test condition B, 340 , Group C inspection, table VII of MIL-PRF-19500. Subgroup Method Conditions C2 2036 Test condition E , not applicable to UB. C6 1026 VCB = 10 V dc, 1,000 hours; maximum rated power shall be


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PDF MIL-PRF-19500/399D MIL-PRF-19500/399C 2N3960 2N3960UB MIL-PRF-19500. 2N3960UB
PT 2102 ic

Abstract: MIL-PRF-19500 TRANSISTOR SUBSTITUTION DATA BOOK 2N3847 LM 3041 2N3846
Text: e . tH heating time: Steady state (see MIL-STD- 750 , method 3131 for definition). f. tMO , VII of MIL-PRF-19500. Subgroup C1 C2 Method 2066 1056 2036 2036 2036 C3 C4 C5 C6 , conducted in accordance with test method 3131 of MIL-STD- 750 . The following details shall apply: a. IM , 1/ MIL-STD- 750 Method Limits Symbol Conditions Unit Min Max 200 300 , ) TABLE I. Group A inspection - Continued. Inspection 1/ MIL-STD- 750 Method Limits Symbol


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PDF MIL-PRF-19500/412B MIL-S-19500/412A 2N3846, 2N3847, PT 2102 ic MIL-PRF-19500 TRANSISTOR SUBSTITUTION DATA BOOK 2N3847 LM 3041 2N3846
2013 - Not Available

Abstract: No abstract text available
Text: accordance with table I, subgroup 2 herein. Subgroup Method Condition C2 2036 Test condition , ratio MIL-STD- 750 Symbol Method 3041 Conditions Bias condition C, VCE = 60 V dc 3076 , -19500) Measurement JANTX level 2 (1) 3c Required, TA = +200°C Thermal impedance, method 3131 of MIL-STD- 750 , performed in accordance with method 3131 of MIL-STD- 750 using the guidelines in that method for determining , -19500. Subgroup Method B3 1037 Condition VCB ≥ 10 V dc, 2,000 cycles. 4.4.3 Group C inspection


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PDF MIL-PRF-19500/262G MIL-S-19500/262F 2N1722 2N1724, MIL-PRF-19500.
mc 4011

Abstract: MIL-S-19500 1N6304 1N6305 1N6306 DO-203AB
Text: conditions. Burn-in conditions for all levels are as follows: MIL-STD- 750 , method 1038, test condition A; Tc , , test condition A, weight = 10 lbs, t = 15s. 2036 Bending stress, test condition F, method B; weight = , . Surge current, see MIL-STD- 750 , method 4066. IQ = 0; VRUM = 0; lFSM » 800 A; six surges; TA = +25°C , accordance with MIL-STD- 750 , method 3101. The iVF conditions and maximum AVf limit shall be derived by each , inspection, table IVb (JANTX and JANTXV) of HIL-S-19500. Subgroup Method Condition B2 4066 Tc = +55°C; Vg


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PDF MIL-S-19500/550A MIL-S-19500/550 DI00E, 1N6304, 1N6305, 1N6306, JANHCA1N6304) 1N6304 JANHCA1N6304 JANKCA1N6304 mc 4011 MIL-S-19500 1N6305 1N6306 DO-203AB
DIODE 1N3768-R

Abstract: diode 1N1188 1N3768 1N3766 1N1190 1N1188R 1N1188 1N1186R 1N1186 1N1184R
Text: . 4.3.3 Power burn-in. Power burn-in conditions are as follows: Method 1038 of MIL-STD- 750 , condition A, t , -19500. Subgroup Method Condition C2 1056 0°C to +100°C, 10 cycles. C2 2036 Test condition , current. Surge current, method 4066 of MIL-STD- 750 . IO = 0; VRM(W) = 0; IFSM = 500 A; six surges; TA = 25 , impedance measurements shall be performed in accordance with method 3101 of MIL-STD- 750 . The thermal , ) of MIL-PRF-19500. Subgroup Method Condition B2 1051 -55°C to +175°C, 25 cycles. B2


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PDF MIL-PRF-19500/297G MIL-PRF-19500/297F 1N1184, 1N1186, 1N1188, 1N1190, 1N3766, 1N3768, 1N1184R, 1N1186R, DIODE 1N3768-R diode 1N1188 1N3768 1N3766 1N1190 1N1188R 1N1188 1N1186R 1N1186 1N1184R
1N561

Abstract: 1N560 mil-s-19500 coding TNETC
Text: (tension) Terminal strength (lead fatigue) 2036 Condition A 2036 Condition E 4 lbs, 15 sec 4 arcs each lead , MIL-STD- 750 Limits Examination or test Method Details LTPD Symbol Min. Max. Units Subgroup 1 5 Visual ana mecnanicai 2071 examination Siihcrrnun 2 ——O- — — F — e i , MIL-STD- 750 LTPD Symbol Limits Method Details Min. Max. Units Reverse current 1N560 1N561 , MIL-STD- 750 — Test Methods for Semiconductor Devices (Copies of specifications, standards, drawings and


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PDF 9500/167B MIL-S-19500/167A 1N560 1N561 MIL-S-19500, 1N561 mil-s-19500 coding TNETC
1N560

Abstract: ic 4016 1N551 of ic 4016 1N561 IC 4011 D0DD12S 9SS diode
Text: ) 2036 Condition A 2036 Condition E 4 lbs, 15 sec 4 arcs each lead Subgroup 5 20 1 Barometric , -19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD- 750 - Test Methods , , full cycle average 1N560 1N551 Reverse current, full cycle average resistive load 1N560 1N561 MIL-STD- 750 Method i Liei ail h 2071 4011 4016 4021 4016 '.011 :016 Lp = 500 mAdc F VR= 800 Vdc 1000 Vdc VR , . 5 V 0. 5 V 200 l E MIL-S-19500/167B(XAVY) Table II -


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PDF QDDD12S MIL-S-19500/167B 1N560 1N561 MIL-S-19 500/167B( MIL-S-19500/167A ic 4016 1N551 of ic 4016 1N561 IC 4011 D0DD12S 9SS diode
NCSL Z540.3

Abstract: Mil-Std-883 Wire Bond Pull Method 2011 EIA-557 MIL-STD-962 EIA/JESD22-B116 JEDEC JESD22-B116 z5401 Z540-1 Z540 Z-540
Text: equipment to use it for microcircuits. DSCC 6 3.1.1.2 Test condition A2,flexible method . For , : ANSI/NCSL Z540-1 To: ANSI/NCSL Z540.3 Work has been done to revise the test method for MIL-STD- 750 , figure numbers to agree with renumbered figures. Replace this test method with one like that in MILSTD- 750 , . February 28, 2010 To comply with new Test Method 2036 , and to agree with the latest revision of MIL-PRF , Test Method 2036 , and to agree with the latest revision of MIL-PRF-38535 (see TABLE V Group D tests


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PDF MIL-STD-883 STD883 Z540-1 MIL-STD-962. NCSL Z540.3 Mil-Std-883 Wire Bond Pull Method 2011 EIA-557 MIL-STD-962 EIA/JESD22-B116 JEDEC JESD22-B116 z5401 Z540-1 Z540 Z-540
2N3960

Abstract: 2N3960UB
Text: MIL-PRF-19500. Subgroup C2 * Method Conditions 2036 Test condition E , not applicable to UB , Condition C2 2036 Test condition E , ( method 2036 not applicable for UB devices). C6 1026 , Thermal impedance Method 3131 of MIL-STD- 750 (see 4.3.3). Thermal impedance Method 3131 of MIL-STD- 750 , measurements shall be performed in accordance with method 3131 of MIL-STD- 750 using the guidelines in that , failed assembly lot shall be scrapped. Step Method Condition * 1 1026 Steady-state


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PDF MIL-PRF-19500/399E MIL-PRF-19500/399D 2N3960 2N3960UB MIL-PRF-19500. 2N3960UB
vqe 24 d

Abstract: vqe 24 e VQE 24 JANTXV 1N1186 datasheet VQE 13 we vqe 24 d VQE 12 diode 1N3766R datasheet cd 4011 free 1N1188
Text: . 4.4.3.1 Group C inspection, table VII of MIL-PRF-19500. Subgroup Method Condition C2 2036 Test condition B, weight = 15 pounds, t = 15 s. C2 2036 Test condition D1, terminal torque = 3 , , method 1038, test condition A, t = 48 hours 11 Subgroup 2 of table I herein, VF2 and IR1; 2 , Surge current. Surge current, see MIL-STD- 750 , method 4066. IO = 0; VRM(w) = 0; IFSM = 500a; six surges , , table VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500. Subgroup B2 Method 4066 Condition TC = 150


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PDF MIL-PRF-19500/297C MIL-S-19500/297B 1N1184, 1N1186, 1N1188, 1N1190, 1N3766, 1N3768, 1N1184R, 1N1186R, vqe 24 d vqe 24 e VQE 24 JANTXV 1N1186 datasheet VQE 13 we vqe 24 d VQE 12 diode 1N3766R datasheet cd 4011 free 1N1188
1997 - 1N3993RA

Abstract: 1N3015 PLUS
Text: C2 C2 C2 C6 Method 2036 2036 2036 2036 1026 Conditions Tension: Test condition A; 20 pounds; t = 15 ± , Measurement JANS level JANTX and JANTXV levels MIL-STD- 750 , test method 1071, MIL-STD- 750 , test method 1071, condition C, step 2 condition C, step 2 IR and VZ (for devices with Not applicable , inspection, appendix E , table VIb of MIL-PRF-19500. Subgroup B2 B3 B5 Method 4066 1027 4081 Conditions IZSM = , condition D2; 15 pound-inch; t = 30 ± 3 s. Bending stress: Test condition F; 3 pounds; t = 15 ± 3 s, method


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PDF MIL-PRF-19500/124H MIL-S-19500/124G 1N2970 1N2977, 1N2979, 1N2980, 1N2982, 1N2984 1N2986, 1N2988 1N3993RA 1N3015 PLUS
clare mercury-wetted relay

Abstract: CP Clare RELAY hgp 1N3913 1N3912 1N3911A 1N3911 1N3910A 1N3910 1N3909A 1N3909
Text: MIL-STD- 750 , method 1038 test condition A, t = 48 hours 11 3/ Subgroup 2 of table I herein VF2 and , inspection, table VII of MIL-PRF-19500. Subgroup Method Condition C2 2036 Test condition F, method B, Weight = 15 pounds, t = 15s. C2 2036 Test condition D1, seal torque = 3 pound-inches , current, see MIL-STD- 750 , method 4066. IO = 0; VRM(w) = 0; Non-A version, IF(surge) = 400 A; A version , measurements shall be performed in accordance with method 3101 of MIL-STD- 750 . The thermal response conditions


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PDF MIL-PRF-19500/308C MIL-S-19500/308B 1N3909, 1N3910, 1N3911, 1N3912, 1N3913, clare mercury-wetted relay CP Clare RELAY hgp 1N3913 1N3912 1N3911A 1N3911 1N3910A 1N3910 1N3909A 1N3909
equivalent for transistor tt 2222

Abstract: 2N6678T1 2N6676T1 JANS 2N6678T1 2N6693 2N6691 2N6676 2n6678 JANS 2N6676T1 2N6678 JANTX equivalent
Text: accordance with table I, subgroup 2 herein. Subgroup Method Condition C2 2036 Test condition , Thermal impedance, method 3131 of MIL-STD- 750 (see 4.3.1) Thermal impedance, method 3131 of MIL-STD- 750 , thermal impedance measurements shall be performed in accordance with method 3161 of MIL-STD- 750 using the , -19500/538E 4.4.2.1 Group B inspection, table E-VIA (JANS) of MIL-PRF-19500. Method Condition B3 , inspection, table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500. Subgroup Method Condition B3


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PDF MIL-PRF-19500/538E MIL-PRF-19500/538D 2N6676, 2N6678, 2N6676T1, 2N6678T1, 2N6676T3, 2N6678T3, 2N6691, 2N6693, equivalent for transistor tt 2222 2N6678T1 2N6676T1 JANS 2N6678T1 2N6693 2N6691 2N6676 2n6678 JANS 2N6676T1 2N6678 JANTX equivalent
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