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LTC1297J8 Linear Technology IC 1-CH 12-BIT PROPRIETARY METHOD ADC, CDIP8, HERMETIC SEALED, CERDIP-8, Analog to Digital Converter
LTC1093MILDWF#PBF Linear Technology IC 6-CH 10-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, UUC16, DIE-16, Analog to Digital Converter
LTC1594LS16 Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter
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LTC1093MILDWF Linear Technology IC 6-CH 10-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, UUC16, DIE-16, Analog to Digital Converter
LTC1594S16#TR Linear Technology IC 4-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO16, SO-16, Analog to Digital Converter

MIL-STD-202 METHOD 208 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
MIL-STD-202 METHOD 208

Abstract: E54214 B250C800 94v0 circuit board B250C800M b40c3700 B250-C800 b380c1500 b380c3700 B 50 bridge rectifier
Text: MIL-STD-202 Method 208 Glass Passivated C hip Junctions Plastic Package has U nderw riters Laboratory , are Solderable to MIL-STD-202 Method 208 Plastic Package has U nderw riters Laboratory Flam m ability , to MIL-STD-202 Method 208 Plastic Package has U nderw riters Laboratory Flam m ability C , are Solderable to M IL-STD- 202 Method 208 Plastic Package has U nderw riters Laboratory Flam m


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PDF KBPC1005 KBPC110 KBPC6005 KBPC610 KBPC8005 KBPC810 KBPC10-005 KBPC10 KBPC15-005 KBPC15 MIL-STD-202 METHOD 208 E54214 B250C800 94v0 circuit board B250C800M b40c3700 B250-C800 b380c1500 b380c3700 B 50 bridge rectifier
2015 - Not Available

Abstract: No abstract text available
Text: * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, Conflict Mineral Free Compliant Packaging: - Spool (10lbs and 50lbs


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PDF 10lbs 50lbs 100lbs ASTM-B33, MIL-STD-202 MIL-STD-1276 10lbs 50lbs)
2015 - EIA-468

Abstract: No abstract text available
Text: , RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, Conflict


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PDF ASTM-B33, MIL-STD-202 MIL-STD-1276 EIA-468
2015 - Not Available

Abstract: No abstract text available
Text: Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, Conflict Mineral Free Compliant


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PDF ASTM-B33, MIL-STD-202 MIL-STD-1276
2015 - MIL-STD-202 METHOD 208

Abstract: No abstract text available
Text: , RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, Conflict


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PDF ASTM-B33, MIL-STD-202 MIL-STD-1276 EIA-296 30-Ju€ MIL-STD-202 METHOD 208
2015 - Not Available

Abstract: No abstract text available
Text: Material Specifications: * ASTM-B33, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, Conflict Mineral Free Compliant Packaging: - Bulk in Bag Contact factory


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PDF ASTM-B33, MIL-STD-202 MIL-STD-1276
2015 - Not Available

Abstract: No abstract text available
Text: : * ASTM-B33, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C, RoHS, REACH and Conflict Mineral Free Compliant * MIL-STD-202 Method 208 , MIL-STD-1276 Type C


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PDF BR100-XX-L BR200-XX-L BR200-XX-EL, ASTM-B33, MIL-STD-202 MIL-STD-1276
1997 - 3 Pin Screw Terminal Block Connector 5mm Pitch

Abstract: thomas and betts header connector
Text: SOLDERABILITY: MIL-STD-202 , Method 208 Mechanical: PITCH (TERMINAL SPACING): 5mm RECOMMENDED PCB HOLE DIA . , , zinc plated SOLDER PIN : Brass, tin/lead plated SOLDERABILITY: MIL-STD-202 , Method 208 Mechanical , PIN : Brass, tin/lead plated SOLDERABILITY: MIL-STD-202 , method 208 Mechanical: PITCH (TERMINAL


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PDF 5MDV-02-H 5MDV-03-H 5MDV-04-H 5MDV-05-H 5MDV-06-H 5MDV-07-H 5MDV-08-H 5MDV-09-H 5MDV-10-H 5MDV-11-H 3 Pin Screw Terminal Block Connector 5mm Pitch thomas and betts header connector
MIL-C-3098

Abstract: CR-157 34140 transistor CR MIL-STD-202 METHOD 208 CR-60A/U HC-49U SM-C-413570 CR60A/U-8.000MHZ CR-124A/U
Text: resistance Per Mil-Std-202 Method 208 Per Mil-Std-202 Method 208 Per Mil-Std- 202 Method 107 Test Condition B Per Mil-Std- 202 Method 112 Test Condition C +105°c ± 3°c for 168 hours ( ±5ppm Max change) Per Mil-Std- 202 Method 211 Test Condition A Package # HT/T0-5 Package # CRY-15 ( HC-49U Res Weld or , customer request Per Mil-Std- 202 Method 305 Specified per CR # or customer request Specified per CR # or


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PDF Mil-C-3098 CR-10/U CR-157/U CR-59A/U CR-80A/U CR-124A/U SM-C-413570 CR-157 34140 transistor CR MIL-STD-202 METHOD 208 CR-60A/U HC-49U SM-C-413570 CR60A/U-8.000MHZ CR-124A/U
2011 - Not Available

Abstract: No abstract text available
Text: MIL-PRF-55342H MIL-STD- 202 Method 210F MIL-STD- 202 Method 210F (6.25X rated power for 5secs) MIL-STD-202 Method 208 MIL-STD- 202 Method 106G (245°C, 5 seconds) 1.00% 0.25% 0.10% 0.05% 0.05% Solderability ture Resistance Solderability 2 2 MIL-STD-202 Method 208 (245°C, 5 seconds) >95% Coverage , . erability MIL-STD-202 Method 208 TT electronics reserves the right to make changes in product , MIL-STD- 202 Method 108 MIL-STD- 202 Method 108 (Rated Power for 1000hrs 150°C) Method (Rated Power for


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2014 - Not Available

Abstract: No abstract text available
Text: MIL-STD-202 Method 208 MIL-STD-202 Method 208 (245°C, 5 seconds) MIL-STD- 202 (245°C, 5 seconds , make changes in product specification without notice or liability. MIL-STD-202 Method 208 information , est oad Life Test Test Method Method MIL-STD- 202 Method 108 Method MIL-STD- 202 Method , hours 200°C 1000 hours @@ 200°C MIL-STD- 202 Method 108 MIL-PRF-55342H (Rated Power MIL-PRF , Exposure Moisture Resistance 1000 hours @ Method 106G 200°C MIL-STD- 202 Moisture Resistance


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0451001.mrl

Abstract: 32vdc12a 001T 0451001mrl 0452001.MRL 0452500
Text: . Solderability: MIL-STD-202 , Method 208 . For iron soldering, Solder Iron Temp: 350° C ­ 360° C, heating time 3 ­ , maximum Solderability: MIL-STD-202 , Method 208 . PACKAGING SPECIFICATIONS: 12mm Tape and Reel per , - 260°C, 30 seconds maximum Solderability: MIL-STD-202 , Method 208 . PACKAGING SPECIFICATIONS: 12mm , . Ambient Temperature: ­ 55°C to +125°C. Shock: MIL-STD- 202 , Method 213, Test Condition I (100 G's peak for 6 milliseconds). Vibration: MIL-STD- 202 , Method 201 (10­ 55 Hz). Thermal Shock: MIL-STD- 202


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1999 - MIL-STD-202 METHOD 208

Abstract: 5MDV-23-NH
Text: SOLDERABILITY: MIL-STD-202 , Method 208 Mechanical: PITCH (TERMINAL SPACING): 5mm RECOMMENDED PCB HOLE DIA , Terminal: TUBULAR SCREW & SOLDER PIN: Brass, tin/lead plated SOLDERABILITY: MIL-STD-202 , method 208


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PDF UL94V-0 MIL-STD-202, 5MDV-02-NH 5MDV-03-NH 5MDV-04-NH 5MDV-05-NH 5MDV-06-NH 5MDV-07-NH 5MDV-08-NH 5MDV-09-NH MIL-STD-202 METHOD 208 5MDV-23-NH
1N5820

Abstract: 1N5821 1N5822 diode do-201
Text: , solderable per MIL-STD-202 , Method 208 guaranteed. · Mold Compound : Epoxy resin family, flammability solid , Mechanical Data · Case: DO-201AD molded plastic. · Terminals: Axial leads, solderable per MIL-STD-202 method 208 · Polarity: Indicated by cathode band. · Weight: 1.10 gram Maximum Ratings and Electrical , sine wave superimposed Peak forward surge current on rated load(JEDEC method ) VR=VRRM,TA=25(Note 1 , =25, 8.3ms Single Half Sine Wave JEDEC method 70 60 50 40 30 20 10 0 0 50 100 150


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PDF C330LA 1N582XLA DO-201AD MIL-STD-202 MIL-STD-202, UL94V-0 1N582XLA 1N5820 1N5821 1N5822 diode do-201
2001 - H1N5820

Abstract: H1N5821 H1N5822
Text: Lead: Axial leads, solderable per MIL-STD-202 , Method 208 guaranteed. · Polarity: Color band denotes , or packing method , please contact your local HSMC sales office. Material : · Lead : Axial leads, solderable per MIL-STD-202 , Method 208 guaranteed. · Mold Compound : Epoxy resin family, flammability solid , =90°C Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method


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PDF H1N5820 H1N5822 DO-201AD MIL-STD-202, H1N5820, H1N5821, H1N5821 H1N5822
DO-204AL

Abstract: SB160 SB130 SB140 SB150 DO-204AL DO-41 TL-100c MIL-STD-202 METHOD 208
Text: ·Terminals: Tin plated axial leads, solderable per MIL-STD-202 , method 208 ·Polarity: Color band denotes , material. 3.If there is any question with packing specification or packing method , please contact your local CYStek sales office. Material : · Lead : Axial leads, solderable per MIL-STD-202 , Method 208 , surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method ) TJ=25°C Maximum


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PDF C474LB SB120 SB160 DO-204AL DO-41) MIL-STD-202, UL94V-0 SB160 SB130 SB140 SB150 DO-204AL DO-41 TL-100c MIL-STD-202 METHOD 208
2001 - CQ MEF

Abstract: FUSE T4A 250v mil-std-202, method 210 MEF 250 AC Fuse 250V t4a fuse f5A 250V CQ MET MEF 400 Fuse 250V T4A Fuse F5A 250V 2A
Text: Solder:260°C,10sec max.(MIL-STD- 202 , Method 210) Solder ability: MIL-STD-202 , Method 208 Cartridge , Reflow:260°C,20sec max. Wave Solder:260°C,10sec max.(MIL-STD- 202 , Method 210) Solder ability: MIL-STD-202 , Temperature -55°C to +125°C Shock MIL-STD- 202 , Method 213, Condition 1 (Sawtooth) Vibration MIL-STD- 202 , Method 201(10-55 Hz x 3axis/no load) Salt Spray MIL-STD- 202 , Method 101, Test Condition B (48Hrs) Insulation Resistance MIL-STD- 202 , Method 302, Test Condition A (After Opening) 10,000 ohms minimum


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PDF MIL-STD-202, 48Hrs) 336mm 261mm 94-V0 CQ MEF FUSE T4A 250v mil-std-202, method 210 MEF 250 AC Fuse 250V t4a fuse f5A 250V CQ MET MEF 400 Fuse 250V T4A Fuse F5A 250V 2A
DBLS

Abstract: DBLS159G 152G 155G DBLS151G DBLS157G
Text: Terminal: Pure tin plated , Lead free. Leads solderable per MIL-STD-202 Method 208 A Weight: 0.36 gram ^ , Small size, simple installation ❖ Pure tin plated terminal, Lead free. Leads solderable per MIL-STD-202 Method 208 A Green compound with suffix "G" on packing code & prefix "G" on datecode. .047(1.20) .040(1 , Rated Load (JEDEC method ) Ifsm 50 A Maximum Instantaneous Forward Voltage @ 1.5A Vf 1.1


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PDF DBLS151G -DBLS159G MIL-STD-202 50mVp DBLS DBLS159G 152G 155G DBLS157G
2003 - Not Available

Abstract: No abstract text available
Text: : Level 1 per J-STD-020A Polarity: Cathode Band Leads: Solderable per MIL-STD-202 , Method 208 Terminals: Matte Tin Finish, Solderable per MIL-STD-202 , Method 208 (Note 4 on Page 2) Marking: Type Code and , rated load (JEDEC Method ) Power Dissipation (Note 1) Typical Thermal Resistance Junction to Ambient


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PDF B0530WS OD-323 OD-323, J-STD-020A MIL-STD-202, 004umber B0530WS-7-F. DS30249
2003 - B0530W

Abstract: B0530WS B0530WS-7 B0530WS-7-F J-STD-020A MIL-STD-202 METHOD 208
Text: -020A Polarity: Cathode Band Leads: Solderable per MIL-STD-202 , Method 208 Terminals: Solderable per MIL-STD-202 , Method 208 (Note 4 on Page 2) Marking: Type Code and Cathode Band 1.60 D G 2.70 C J , rated load (JEDEC Method ) Pd 235 mW RqJA 426 °C/W Tj, TSTG -40 to +125 °C


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PDF B0530WS OD-323 OD-323, J-STD-020A MIL-STD-202, DS30249 B0530W B0530WS B0530WS-7 B0530WS-7-F J-STD-020A MIL-STD-202 METHOD 208
2003 - Not Available

Abstract: No abstract text available
Text: -020A Polarity: Cathode Band Leads: Solderable per MIL-STD-202 , Method 208 Terminals: Matte Tin Finish, Solderable per MIL-STD-202 , Method 208 (Note 4 on Page 2) Marking: Type Code and Cathode Band Type Code: SE · , Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method ) Power


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PDF B0530WS OD-323 OD-323, J-STD-020A MIL-STD-202, B0530WS-7-F. DS30249
2006 - OF VR 10K

Abstract: No abstract text available
Text: SPICE MODELS: SD101A SD101B SD101C SD101A - SD101C SCHOTTKY BARRIER DIODE Features · · · · · · · · · · · · · Low Forward Voltage Drop Guard Ring Construction for Transient Protection Low Reverse Recovery Time Low Reverse Capacitance Lead Free Finish, RoHS Compliant (Note 2) A B A C Mechanical Data Case: DO-35 Case Material: Glass Moisture Sensitivity: Level 1 per J-STD-020C Leads: Solderable per MIL-STD-202 , Method 208 Terminals: Finish Matte Tin. Solderable per MIL-STD-202 , Method 208


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PDF SD101A SD101B SD101C DO-35 J-STD-020C MIL-STD-202, OF VR 10K
2007 - SD101C AMMO

Abstract: No abstract text available
Text: SPICE MODELS: SD101A SD101B SD101C SD101A - SD101C SCHOTTKY BARRIER DIODE Features · · · · · Low Forward Voltage Drop Guard Ring Construction for Transient Protection Low Reverse Recovery Time Low Reverse Capacitance Lead Free Finish, RoHS Compliant (Note 2) Mechanical Data · · · · · · · · Case: DO-35 Case Material: Glass Moisture Sensitivity: Level 1 per J-STD-020C Leads: Solderable per MIL-STD-202 , Method 208 Terminals: Finish Matte Tin. Solderable per MIL-STD-202 , Method 208


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PDF SD101A SD101B SD101C DO-35 J-STD-020C MIL-STD-202, SD101C AMMO
2006 - Not Available

Abstract: No abstract text available
Text: 1N4148 / 1N4448 FAST SWITCHING DIODE Features · · · · Fast Switching Speed General Purpose Rectification B A Silicon Epitaxial Planar Construction A Lead Free Finish, RoHS Compliant (Note 2) Mechanical Data · · · · · · · · C Case: DO-35 D Case Material: Glass DO-35 Moisture Sensitivity: Level 1 per J-STD-020C Leads: Solderable per MIL-STD-202 , Method 208 Dim Min Terminals: Finish ¾ Sn96.5Ag3.5. Solderable per MIL-STD-202 , Method 208


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PDF 1N4148 1N4448 DO-35 J-STD-020C MIL-STD-202, DS12019
2005 - Not Available

Abstract: No abstract text available
Text: Sensitivity: Level 1 per J-STD-020C Terminals: Solderable per MIL-STD-202 , Method 208 (Note 5 on Page 2) Leads: Solderable per MIL-STD-202 , Method 208 Also Available in Lead Free Plating (Matte Tin Finish annealed over , superimposed on rated load (JEDEC Method ) Power Dissipation (Note 1) Typical Thermal Resistance Junction to


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PDF B0530WS OD-323 J-STD-020C MIL-STD-202, DS30249
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