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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT1017MJ8/883 Linear Technology LT1017 - Micropower Dual Comparator; Package: CERDIP; Pins: 8; Temperature: Military
LM108AJ8 Linear Technology LM108A - Operational Amplifiers; Package: CERDIP; Pins: 8; Temperature: Military
LT1018MJ8/883 Linear Technology LT1018 - Micropower Dual Comparator; Package: CERDIP; Pins: 8; Temperature: Military
LTC1041MJ8/883 Linear Technology LTC1041 - BANG-BANG Controller; Package: CERDIP; Pins: 8; Temperature: Military
RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator

MIL-STD-1835 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1996 - MIL-STD-1835

Abstract: D22 PACKAGE DIAGRAM 40 PIN CERDIP D2 Package diagram D2 Package MIL-STD d 1835 D5011 cerdip 16 lead d4 package diagram
Text: Package Diagram Ceramic Dual-In-Line Packages 16-Lead (300-Mil) CerDIP D2 MIL-STD-1835 D-2 Config. A 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 22­Lead (400­Mil) CerDIP D8 MIL-STD-1835 D -7 , MIL-STD-1835 D-3 Config. A 3 Package Diagram 24-Lead (300-Mil) CerDIP D14 MIL-STD-1835 D- 9 Config.A 28-Lead (600-Mil) CerDIP D16 MIL-STD-1835 D-10 Config .A 4 Package Diagram 40


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PDF 16-Lead 300-Mil) MIL-STD-1835 18-Lead 20-Lead D22 PACKAGE DIAGRAM 40 PIN CERDIP D2 Package diagram D2 Package MIL-STD d 1835 D5011 cerdip 16 lead d4 package diagram
1998 - 80041

Abstract: MIL-STD-1835 40 PIN CERDIP D16 PACKAGE DIAGRAM cerdip d 1835 D2 Package diagram D22 PACKAGE DIAGRAM D50 transistor MIL-STD-1835D
Text: Package Diagram Ceramic Dual-In-Line Packages 16-Lead (300-Mil) CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029 22-Lead (400-Mil) CerDIP MIL-STD-1835 D -7 Config. A 51-80034 2 Package Diagram 22-Lead (300-Mil) CerDIP D10 51-80030 24-Lead (600-Mil) CerDIP D12 MIL-STD-1835 D-3 Config. A 51-80038 3 Package Diagram


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PDF 16-Lead 300-Mil) MIL-STD-1835 18-Lead 20-Lead 22-Lead 80041 40 PIN CERDIP D16 PACKAGE DIAGRAM cerdip d 1835 D2 Package diagram D22 PACKAGE DIAGRAM D50 transistor MIL-STD-1835D
1999 - MIL-STD-1835

Abstract: sidebraze
Text: Package Diagrams Ceramic Dual-In-Line Packages 16-Lead (300-Mil) CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagrams 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029 22-Lead (400-Mil) CerDIP MIL-STD-1835 D -7 Config. A 51-80034 2 Package Diagrams 22-Lead (300-Mil) CerDIP D10 51-80030 24-Lead (600-Mil) CerDIP D12 MIL-STD-1835 D-3 Config. A 51-80038 3 Package Diagrams


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PDF 16-Lead 300-Mil) MIL-STD-1835 18-Lead 20-Lead 22-Lead sidebraze
1996 - CERAMIC LEADLESS CHIP CARRIER

Abstract: MIL-STD-1835 leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79
Text: Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 3 Package Diagram 22 , 28-Pin Rectangular Leadless Chip Carrier L54 MIL-STD-1835 C-11A 32-Pin Rectangular Leadless Chip Carrier L55 MIL-STD-1835 C-12 5 Package Diagram 24-Square Leadless Chip Carrier L63 28-Square Leadless Chip Carrier L64 MIL-STD-1835 C-4 6 Package Diagram 44-Square Leadless Chip Carrier L67


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PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A CERAMIC LEADLESS CHIP CARRIER leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79
1998 - leadless chip carrier

Abstract: MIL-STD-1835 L55 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER diagram L51 transistor L64 PACKAGE DIAGRAM
Text: Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 51-80064 22 , Carrier L53 51-80066 28-Pin Rectangular Leadless Chip Carrier L54 MIL-STD-1835 C-11A 51-80067 4 Package Diagram 32-Pin Rectangular Leadless Chip Carrier L55 MIL-STD-1835 C-12 51-80068 , Carrier L63 51-80050 6 Package Diagram 28-Square Leadless Chip Carrier L64 MIL-STD-1835 C


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PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A leadless chip carrier L55 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER diagram L51 transistor L64 PACKAGE DIAGRAM
1999 - 44 Lead Ceramic Leadless Chip Carrier

Abstract: leadless chip carrier MIL-STD-1835
Text: 1 Package Diagrams 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagrams 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C , -Pin Rectangular Leadless Chip Carrier L53 51-80066 28-Pin Rectangular Leadless Chip Carrier L54 MIL-STD-1835 C-11A 51-80067 4 Package Diagrams 32-Pin Rectangular Leadless Chip Carrier L55 MIL-STD-1835 , MIL-STD-1835 C-4 51-80051 7 Package Diagrams 44-Square Leadless Chip Carrier L67 MIL-STD-1835


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PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A 44 Lead Ceramic Leadless Chip Carrier leadless chip carrier
1996 - transistor k70

Abstract: MIL-STD-1835 K73 Package K70 Package K63 Package diode k70 K69 Package K74 PACKAGE DIAGRAM CERPACK equivalent
Text: Package Diagram Cerpacks 24-Lead Square Cerpack K63 16-Lead Rectangular Cerpack K69 MIL-STD-1835 F- 5 Config. A 1 Package Diagram 18-Lead Rectangular Cerpack K70 MIL-STD-1835 F- 10 Config. A 20-Lead Rectangular Cerpack K71 MIL-STD-1835 F- 9 Config. A 2 Package Diagram 24-Lead Rectangular Cerpack K73 MIL-STD-1835 F-6 Config. A 28-Lead Rectangular Cerpack K74 MIL-STD-1835 F-11 Config. A 3 Package Diagram 32-Lead Rectangular Cerpack K75 28-Lead Rectangular Cerpack K80


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PDF 24-Lead 16-Lead MIL-STD-1835 18-Lead 20-Lead 28-Lead transistor k70 K73 Package K70 Package K63 Package diode k70 K69 Package K74 PACKAGE DIAGRAM CERPACK equivalent
1998 - MIL-STD-1835

Abstract: transistor k70 K70 Package 11F11 11F-11 CERPACK K73 80059 diode k70 80061 K804
Text: Package Diagram Cerpacks 24-Lead Square Cerpack K63 51-80056 16-Lead Rectangular Cerpack K69 MIL-STD-1835 F- 5 Config. A 51-80057 1 Package Diagram 18-Lead Rectangular Cerpack K70 MIL-STD-1835 F- 10 Config. A 51-80058 20-Lead Rectangular Cerpack K71 MIL-STD-1835 F- 9 Config. A 51-80059 2 Package Diagram 24-Lead Rectangular Cerpack K73 MIL-STD-1835 F-6 Config. A 51-80060 28-Lead Rectangular Cerpack K74 MIL-STD-1835 F-11 Config. A 51-80061 3 Package Diagram


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PDF 24-Lead 16-Lead MIL-STD-1835 18-Lead 20-Lead 28-Lead transistor k70 K70 Package 11F11 11F-11 CERPACK K73 80059 diode k70 80061 K804
1999 - MIL-STD-1835

Abstract: D-10 1835
Text: Package Diagrams Ceramic Windowed Dual-In-Line Packages 20-Lead (300-Mil) Windowed CerDIP W6 MIL-STD-1835 D-8 Config. A 24-Lead (600-Mil) Windowed CerDIP W12 MIL-STD-1835 D-3 Config. A 1 Package Diagrams 24-Lead (300-Mil) Windowed CerDIP W14 MIL-STD-1835 D-9 Config. A 28-Lead (600-Mil) Windowed CerDIP W16 MIL-STD-1835 D-10 Config. A 2 Package Diagrams 40-Lead (600-Mil) Windowed , 28-Lead (300-Mil) Windowed CerDIP W22 MIL-STD-1835 D-15 Config. A 51-80087 32-Lead (300


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PDF 20-Lead 300-Mil) MIL-STD-1835 24-Lead 600-Mil) 28-Lead D-10 1835
1995 - CERAMIC LEADLESS CHIP CARRIER LCC 68

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad CERAMIC LEADLESS CHIP CARRIER LCC 44 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package chip led
Text: ) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-9 CONFIG A MIL-STD-1835 D-9 CONFIG A 40DW6, 40 , (Millimeters) MIL-STD-1835 D-5 CONFIG A 10-5 20J, 20 Lead, Plastic J-Leaded Chip Carrier (PLCC , ) Dimensions in Inches and (Millimeters) MIL-STD-1835 C-J1 MIL-STD-1835 C-J2 JEDEC OUTLINE MO-087 AD , ) Dimensions in Inches and (Millimeters)* MIL-STD-1835 C-4 *Ceramic lid standard unless specified. 28LW , )* MIL-STD-1835 C-4 *Ceramic lid standard unless specified. 44LW, 44 Pad, Windowed, Ceramic Leadless


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PDF 180Pin, CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad CERAMIC LEADLESS CHIP CARRIER LCC 44 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package chip led
1997 - w32 transistor

Abstract: W32 Package MIL-STD-1835 W6 Diode transistor w16 CERDIP Package W6 Package D-10 600MIL cerdip
Text: Package Diagram Ceramic Windowed Dual-In-Line Packages 20-Lead (300-Mil) Windowed CerDIP W6 MIL-STD-1835 D-8 Config. A 24-Lead (600-Mil) Windowed CerDIP W12 MIL-STD-1835 D-3 Config. A 1 Package Diagram 24-Lead (300-Mil) Windowed CerDIP W14 MIL-STD-1835 D-9 Config. A 28-Lead (600-Mil) Windowed CerDIP W16 MIL-STD-1835 D-10 Config. A 2 Package Diagram 40-Lead (600-Mil) Windowed , -Mil) Windowed CerDIP W22 MIL-STD-1835 D-15 Config. A 32-Lead (300-Mil) Windowed CerDIP W32 4 Package


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PDF 20-Lead 300-Mil) MIL-STD-1835 24-Lead 600-Mil) 28-Lead w32 transistor W32 Package W6 Diode transistor w16 CERDIP Package W6 Package D-10 600MIL cerdip
1997 - CMGA3-P68

Abstract: CDFP4-F28 CMGA15-P84 CQCC1-N20 CDIP3-T28 CDFP4-F24 CDIP1-T64 MIL-STD-1835 GDIP3-T24
Text: LOGIC Devices/ MIL-STD-1835 Package Code Cross-Reference LOGIC DEVICES PACKAGE CODE DESCRIPTION MIL-STD-1835 PACKAGE DESIGNATOR MIL-STD-1835 DIMENSION REFERENCE GDIP3-T24 GDIP1-T20 D-9 D-8 CERAMIC DIP C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 24-pin, 0.3" wide 20-pin, 0.3" wide 22 , Information 4 LOGIC Devices/ MIL-STD-1835 Package Code Cross-Reference LOGIC DEVICES PACKAGE CODE DESCRIPTION MIL-STD-1835 PACKAGE DESIGNATOR MIL-STD-1835 DIMENSION REFERENCE CQCC1-N28 CQCC1-N44


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PDF Devices/MIL-STD-1835 MIL-STD-1835 GDIP3-T24 GDIP1-T20 24-pin, 20-pin, 22-pin, 28-pin, CMGA3-P68 CDFP4-F28 CMGA15-P84 CQCC1-N20 CDIP3-T28 CDFP4-F24 CDIP1-T64 MIL-STD-1835 GDIP3-T24
2002 - MIL-STD-1835

Abstract: leadless chip carrier Q61 Package
Text: -Pin Windowed Rectangular Leadless Chip Carrier Q55 MIL-STD-1835 C-12 51-80103-*A 3 Package Diagrams 20-Pin Windowed Square Leadless Chip Carrier Q61 MIL­STD­ 1835 C­2A 51-80101 28-Pin Windowed Leadless Chip Carrier Q64 MIL­STD­ 1835 C­4 51-80102 4 Package Diagrams 44-Pin Windowed Leadless Chip Carrier Q67 MIL­STD­ 1835 C­5 51-80104 5 Cypress Semiconductor


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PDF 16-Lead 51-85053-B 20-Lead 51-85054-B 24-Lead 51-85055-B 32-Pin MIL-STD-1835 20-Pin 28-Pin leadless chip carrier Q61 Package
1998 - CERAMIC LEADLESS CHIP CARRIER

Abstract: leadless chip carrier 28-pin
Text: Q55 MIL­STD­ 1835 C­12 2 Package Diagram 20-Pin Windowed Square Leadless Chip Carrier Q61 MIL­STD­ 1835 C­2A 28-Pin Windowed Leadless Chip Carrier Q64 MIL­STD­ 1835 C­4 3 Package Diagram 44-Pin Windowed Leadless Chip Carrier Q67 MIL­STD­ 1835 C­5 4 Cypress Semiconductor


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PDF 16-Lead 51-85053-B 20-Lead 51-85054-B 24-Lead 51-85055-B 32-Pin 20-Pin 28-Pin 44-Pin CERAMIC LEADLESS CHIP CARRIER leadless chip carrier
1996 - PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: MO-142 JEDEC MO-229 atmel MO-115 soic 20 lead wide dd 127 dd 127 d 3302 tsop CERAMIC LEADLESS CHIP CARRIER LCC 24 8S2 EIAJ SOIC 64 CERAMIC LEADLESS CHIP CARRIER LCC
Text: , Ceramic Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-16 CONFIG C MIL-STD-1835 D-10 CONFIG A 1.49(37.9) 1.44(36.6) PIN 1 .610(15.5) .510(13.0) .098(2.49) MAX , (Millimeters) MIL-STD-1835 D-16 CONFIG A MIL-STD-1835 D-16 CONFIG A 1.68(42.7) 1.64(41.7) PIN 1 , (Flatpack) Dimensions in Inches and (Millimeters) MIL-STD-1835 F-12 CONFIG B PIN #1 ID .370(9.40 , ) Dimensions in Inches and (Millimeters) MIL-STD-1835 F-18 CONFIG B JEDEC OUTLINE MO-115 PIN #1 ID .370


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PDF 32DW6 MO-142 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 soic 20 lead wide dd 127 dd 127 d 3302 tsop CERAMIC LEADLESS CHIP CARRIER LCC 24 8S2 EIAJ SOIC 64 CERAMIC LEADLESS CHIP CARRIER LCC
1996 - CERAMIC LEADLESS CHIP CARRIER

Abstract: leadless chip carrier 28-pin 20 PIN LEADLESS CHIP CARRIER MIL-STD-1835 Q1 Package SFE10.7MS2G-A
Text: Leadless Chip Carriers 32-Pin Windowed Rectangular Leadless Chip Carrier Q55 MIL­STD­ 1835 C­12 2 Package Diagram 20-Pin Windowed Square Leadless Chip Carrier Q61 MIL­STD­ 1835 C­2A 28-Pin Windowed Leadless Chip Carrier Q64 MIL­STD­ 1835 C­4 3 Package Diagram 44-Pin Windowed Leadless Chip Carrier Q67 MIL­STD­ 1835 C­5 4 Cypress Semiconductor


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PDF 16-Lead 20-Lead 24-Lead 32-Pin 20-Pin 28-Pin 44-Pin CERAMIC LEADLESS CHIP CARRIER leadless chip carrier 20 PIN LEADLESS CHIP CARRIER MIL-STD-1835 Q1 Package SFE10.7MS2G-A
1997 - CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
Text: (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-9 CONFIG A 1.28(32.5) 1.24(31.5) PIN , ) MIL-STD-1835 D-9 CONFIG A MIL-STD-1835 D-5 CONFIG B 20J, 20 Lead, Plastic J-Leaded Chip Carrier , Carrier (JLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AF MIL-STD-1835 C-J1 , , Windowed, Ceramic Leadless Chip Carrier (LCC) Dimensions in Inches and (Millimeters)* MIL-STD-1835 C-4 MIL-STD-1835 C-4 *Ceramic lid standard unless specified. *Ceramic lid standard unless specified


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1999 - leadless chip carrier

Abstract: Q61 Package
Text: -Pin Windowed Rectangular Leadless Chip Carrier Q55 MIL­STD­ 1835 C­12 51-80103 3 Package Diagrams 20-Pin Windowed Square Leadless Chip Carrier Q61 MIL­STD­ 1835 C­2A 51-80101 28-Pin Windowed Leadless Chip Carrier Q64 MIL­STD­ 1835 C­4 51-80102 4 Package Diagrams 44-Pin Windowed Leadless Chip Carrier Q67 MIL­STD­ 1835 C­5 51-80104 5 Cypress Semiconductor


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PDF 16-Lead 51-85053-B 20-Lead 51-85054-B 24-Lead 51-85055-B 32-Pin 20-Pin 28-Pin 44-Pin leadless chip carrier Q61 Package
1997 - CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
Text: , Non-Windowed Ceramic Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 D , Inches and (Millimeters) MIL-STD-1835 D-9 CONFIG A MIL-STD-1835 D-5 CONFIG B 20J, 20 Lead , Leadless Chip Carrier (JLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AF MIL-STD-1835 , )* MIL-STD-1835 C-4 MIL-STD-1835 C-4 *Ceramic lid standard unless specified. *Ceramic lid standard , Inches and (Millimeters) MIL-STD-1835 C-5 JEDEC STANDARD MS-001 BA *Ceramic lid standard unless


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1998 - 0555B

Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Text: and (Millimeters) JEDEC STANDARD MS-026 BFB MIL-STD-1835 D-16 CONFIG C 22.25(0.876) 21.75 , Array Package (LAP) Dimensions in Millimeters and (Inches)* MIL-STD-1835 D-5 CONFIG C SIDE VIEW , ) MIL-STD-1835 D-2 CONFIG A 19.1 (.752) 18.9 (.744) .830(21.1) .770(19.6) 1.3 (.051) 1.0 (.039 , and (Millimeters) MIL-STD-1835 D-8 CONFIG A MIL-STD-1835 D-9 CONFIG A .985(25.0) .935(23.7 , and (Millimeters) MIL-STD-1835 D-3 CONFIG A MIL-STD-1835 D-10 CONFIG A 1.29(32.8) 1.24(31.5


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PDF 44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Text: (Side Braze) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-16 CONFIG C 6 40B, 40 , ) MIL-STD-1835 D-5 CONFIG C Packages Packages Packaging Information 352B, 352-ball Ball Grid Array , ) MIL-STD-1835 D-2 CONFIG A MIL-STD-1835 D-8 CONFIG A .830(21.1) .770(19.6) .985(25.0) .935(23.7 , and (Millimeters) MIL-STD-1835 D-9 CONFIG A MIL-STD-1835 D-3 CONFIG A 1.29(32.8) 1.24(31.5 , and (Millimeters) MIL-STD-1835 D-10 CONFIG A MIL-STD-1835 D-16 CONFIG A 1.49(37.9) 1.44(36.6


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PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
1997 - MIL-M-38535

Abstract: MIL-STD-1835 MIL-M38535 132-Lead coplanarity 38535
Text: 17.0 PACKAGING B Notes: 1. True position applies to pins at the base plane (Datum C). 2. True position applies at the pin tips. 3. The lid is electrically connected to Vss. 4. Letter designations are for cross-reference to MIL-STD-1835. 5. Lead finish is in accordance with MIL-PRF-38535. 6 , cross-reference to MIL-STD-1835. 5. Lead true position tolerances and coplanarity are not measured. 6. Total , . Letter designations are for cross-reference to MIL-STD-1835. 5. Lead finish is in accordance with MIL-M


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PDF MIL-STD-1835. MIL-PRF-38535. 139-Pingrid 132-Lead MIL-M-38535. MIL-M-38535 MIL-STD-1835 MIL-M38535 coplanarity 38535
1996 - 48 Lead Ceramic Quad Flatpack

Abstract: CERAMIC FLATPACK MIL-STD-1835 F70 Package
Text: Package Diagram Ceramic Flatpacks 16-Lead Rectangular Flatpack F69 MIL-STD-1835 F-5 Config. B 18­Lead Rectangular Flatpack F70 1 Package Diagram 24-Lead Rectangular Flatpack F73 MIL-STD-1835 F- 6 Config. B 32-Lead Rectangular Flatpack F75 2 Package Diagram 42-Lead Rectangular Flatpack F76 48-Lead Quad Flatpack F78 3 Package Diagram 64-Lead Quad Flatpack F90 4 Cypress Semiconductor


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PDF 16-Lead MIL-STD-1835 24-Lead 32-Lead 42-Lead 48-Lead 64-Lead STD-1835 48 Lead Ceramic Quad Flatpack CERAMIC FLATPACK F70 Package
FL65

Abstract: 318N MIL-STD-1835 Mq05 VN 990
Text: Packages Packaging Information 28D6,28 Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 D-10 CONFIG 1 32D6,32 Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters) MIL-STD-1835 CONFIG A 3 «2.71 _ If IT r.0 6 0 f1 .S 2 i .125(3.181 n .110(2.79) .090 , ) Dimensions in Inches and (Millimeters) MIL-STD-1835 C-12 .046 (1.14) X 45* PIN NO. 1 t IDENTIFY


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PDF MIL-STD-1835 MQ-052 FL65 318N Mq05 VN 990
MJL-STD-1835

Abstract: No abstract text available
Text: in Inches and (Millimeters) MIL-STD-1835 D-16 CONFIG C _1.6201*1.15)_ 1.580 , , Non-Windowed, Ceramic Leadless Chip Carrier (LCC) Dimensions in Inches and (Millimeters)* MIL-STD-1835 C , )* MIL-STD-1835 C-5 .6 6 2 (16.8) .6 4 0 (16.3) .6 0 0 (1 5 .2 ) .5 8 0 (14.7) \ * . \ .106 (2 .7 4 ) .0 8 5 , Bottom-Brazed Flat Package (Flatpack) Dimensions in Inches and (Millimeters) MH.-STD- 1835 F-12 CONFIG B 32F , (Millimeters) MJL-STD- 1835 F-18 CONFIG B JEDEC OUTLINE MO-115 .0 5 0 (1 .2 7 ) B S C 0 45 (1 .1 4) MAX


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