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LT1017MJ8/883 Linear Technology LT1017 - Micropower Dual Comparator; Package: CERDIP; Pins: 8; Temperature: Military
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MIL-R-55342E Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
Not Available

Abstract: No abstract text available
Text: +200ppm/°C Short Time Overload MIL-R-55342E , Sect. 4.7.5 ±(1.0% + 0.050) Dielectric , % coverage Resistance to Soldering Heat MIL-R-55342E , Sect. 4.7.7 ±(1.0% + 0.05Q) Robustness of , ) Low Temperature Operation MIL-R-55342E , Sect. 4.7.4 +(1.0% + 0.050) High Temperature Exposure MIL-R-55342E , Sect. 4.7.6 ±(1.0% + 0.050) Thermal Shock MIL-STD-202F, Method 107 ±(0.5% +


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PDF 1/16W 1/10W MIL-STD-202F, MIL-STD-883F, MIL-R-55342E,
2005 - Not Available

Abstract: No abstract text available
Text: Adhesion Strength Maximum Change Test Method As specified MIL-R-55342E Par 4.7.9 (-55°C +125°C) ±0.5% +0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) ±0.25% +0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) ±0.5% +0.01 ohm MIL-R-55342E Par 4.7.5 ±1% for R>100K ohm 2.5 x for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) ±0.5% +0.01 ohm ±0.25% 0.01 ohm MIL-R-55342E Par 4.7.7 , 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) ±0.5% +0.01 ohm MIL-R-55342E Par


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2009 - MMA0204

Abstract: MMA0204-50 MMC0310 1206 footprint dimension MMB0207 1R00 51R0 R250
Text: MIL-R-55342E Par 4.7.9 (-55°C +125°C) Thermal Shock ±0.5% +0.01 MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) Low Temperature Operation ±0.25% +0.01 MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% +0.01 ±1% for R>100K MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds High Temperature Exposure ±0.5% +0.01 MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±0.25% +0.01 MIL-R-55342E Par 4.7.7 (Reflow soldered to


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PDF MMC0310 MMA0204 MMA0204-50 MMC0310 1206 footprint dimension MMB0207 1R00 51R0 R250
2012 - MIL-R55342E

Abstract: PAR/LS17-203W31 PAR/LS17-202W27 PAR/LS17 PAR/INS2651 PAR/DMG9N65CT PAR/DF06S PAR/AP13005 PAR/4100K PAR/SF30JG-B
Text: Change As specified Test Method MIL-R-55342E Par 4.7.9 (-55°C + 125°C) MIL-R-55342E Par 4.7.3 (-65°C + , Coefficient Short Time Overload High Temperature Exposure Resistance to Bonding Exposure MIL-R-55342E Par 4.7.4 (-65°C @ (-55°C working voltage) MIL-R-55342E Par 4.7.9 + 125°C) MIL-R-55342E Par 4.7.5 2.5 x P x , MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) voltage) MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) perature Operation ±0.25% + 0.01 ohm ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C


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PDF HRISTI4EXAS53! 083ERIES MIL-R55342E PAR/LS17-203W31 PAR/LS17-202W27 PAR/LS17 PAR/INS2651 PAR/DMG9N65CT PAR/DF06S PAR/AP13005 PAR/4100K PAR/SF30JG-B
2004 - Not Available

Abstract: No abstract text available
Text: damage ±1% + 0.01 ohm no mechanical damage Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent) 1200


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PDF 50ppm 100ppm/
2011 - Not Available

Abstract: No abstract text available
Text: +150°C, MIL-R-55342E 4.7.4 (-65°C 5 @cycles) working voltage) MIL-R-55342E Par 4.7.4Par (-65°C @ working voltage) MIL-R-55342E 4.7.5 MIL-R-55342E Par 4.7.5 PxR for 5 seconds 2.5 x for 5 seconds 2.5 x PxR MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.6Par (+150°C for 100 soldered hours) to board at MIL-R-55342E 4.7.7 (Reflow MIL-R-55342E (Reflow soldered to board at 260°CPar for4.7.7 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E


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PDF 100RFI 100ppm/ 50ppm/ IEC62 2500/reel 1500/reel
2012 - Not Available

Abstract: No abstract text available
Text: Maximum Change Temperature Coefficient Test Method ±100 ppm/°C MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) ±0.25% + 0.01 ohm ±1% for R>100K ohm Short Time Overload MIL-R-55342E Par 4.7.5 2.5 x √ P x R for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par


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Not Available

Abstract: No abstract text available
Text: (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ w orking voltage) MIL-R-55342E Par 4.7.5 2.5 x \/P x R fo r 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, M ethod 208 (245°C fo r 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent) 1200


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PDF 10000m
1998 - Not Available

Abstract: No abstract text available
Text: MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x Ö PxR for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par


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PDF ISO-9001
MMA0204

Abstract: No abstract text available
Text: damage ±1% + 0.01 ohm no mechanical damage Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 (2.5 x PxR for 5 seconds) MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent) 1200


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PDF ISO-9001 MMA0204 MMB0207 MMC0310 MMA0204, MMB0207, MMC0310)
2014 - Not Available

Abstract: No abstract text available
Text: specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±(0.5% + 0.01Ω) MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±(0.25% + 0.01Ω) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±(1.0% + 0.01Ω) MIL-R-55342E Par 4.7.5 2.5 x √ PxR for 5 seconds High Temperature Exposure ±(0.5% + 0.01Ω) MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±(0.25% + 0.01Ω) MIL-R-55342E


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Not Available

Abstract: No abstract text available
Text: Coefficient Thermal Shock Low Temperature Operation Short Time Overload MIL-R-55342E Par 4.7.9 (-55°C + 1 25C ) MIL-R-55342E Par 4.7.3 (-65"C +150 C. 5 cvcles) MIL-R-55342E Par 4.7.4 (-65°C @ workina voltaae) MIL-R-55342E Par 4.7.5 2.5 x V PxR for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E , seconds) MIL-R-55342E Par 4.7.8 (10 cvcles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70 'C


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PDF
2008 - 10k resistor 2 watt

Abstract: MRC 100
Text: ) Test Method MIL-R-55342E Par 4.7.9 (-55°C + 125°C) MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x PxR for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent) 1200 gram push from underside of mounted chip


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2005 - Not Available

Abstract: No abstract text available
Text: specified ±0.5% +0.01 ohm ±0.25% +0.01 ohm ±0.5% +0.01 ohm Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E , seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70


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PDF 50ppm 100ppm/
2014 - Not Available

Abstract: No abstract text available
Text: Test Method Thermal Shock ±(0.5% + 0.01 ohm) MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±(0.25% + 0.01 ohm) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±(1.0% + 0.01 ohm) MIL-R-55342E Par 4.7.5 (2.5 x (PxR)½ onmental Data eristic Shock High Temperature Exposure ±(0.5% + 0.01 Maximum Changeohm) MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Test Method Resistance to Bonding Exposure MIL-R-55342E Par 4.7.7 (Reflow


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PDF PPS11001000FLF 100ppm/Â 500/reel
resistor metal GLAZE 120 ohm 2 1W IRC

Abstract: IRC MAR MRC 058 datasheet 1R00 51R0 R250 EFB810-3/4-3/mrc 736
Text: Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x PxR for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent) 1200 gram push from underside of


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PDF ISO-9001 EIA-481: resistor metal GLAZE 120 ohm 2 1W IRC IRC MAR MRC 058 datasheet 1R00 51R0 R250 EFB810-3/4-3/mrc 736
2012 - MMA0204

Abstract: MMB0207
Text: mum Ctolerance, hange Test Method As specified ±0.5% +0.01 ±0.25% +0.01 ±1% for R>100K MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds onmental Data Low , ±0.25% ±0.5% +0.01 +0.01 Solderability Moisture Resistance MIL-R-55342E Par 4.7.9 (-55°C MIL-R-55342E Par 4.7.6 (+150°C for 100 +125°C) hours) (Reflow soldered to board at 260°C for 10 seconds) MIL-R-55342E


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2014 - Not Available

Abstract: No abstract text available
Text: Characteristics Temperature Coefficient Maximum Change ±100 ppm/°C Test Method MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.25% + 0.01 ohm ±1% for R>100K ohm MIL-R-55342E Par 4.7.5 2.5 x √ P x R for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par


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2008 - 3610 footprint

Abstract: MMA-0204-50 mma0204-50
Text: Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds , no mechanical damage ±0.5% +0.01 no mechanical damage MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent) 1200 gram push from underside of mounted


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PDF MMA0204 MMB0207 MMC0310 MMA0204, MMB0207, MMC0310) MMA0204 3610 footprint MMA-0204-50 mma0204-50
2008 - 10e 2w resistor

Abstract: 1R00 51R0 R250
Text: Temperature Coefficient Maximum Change As specified Test Method MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% + 0.01 ohm ±1% for R>100K ohm MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to


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2010 - MRC 025

Abstract: MRC 100 RESISTOR FOOTPRINT 1206 1R00 51R0 R250
Text: MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±(0.5% + 0.01) MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±(0.25% + 0.01) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±(1.0% + 0.01) MIL-R-55342E Par 4.7.5 2.5 x PxR for 5 seconds High Temperature Exposure ±(0.5% + 0.01) MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±(0.25% + 0.01) MIL-R-55342E Par 4.7.7 (Reflow soldered to


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2014 - Not Available

Abstract: No abstract text available
Text: specified MIL-R-55342E Par 4.7.9 (-55°C +125°C) Thermal Shock ±0.5% +0.01Ω MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) Low Temperature Operation ±0.25% +0.01Ω MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% +0.01Ω ±1% for R>100KΩ MIL-R-55342E Par 4.7.5 2.5 x √P x R for 5 seconds High Temperature Exposure ±0.5% +0.01Ω MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±0.25% +0.01Ω MIL-R-55342E


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PDF 2011/65/EU
2004 - Not Available

Abstract: No abstract text available
Text: damage ±1% + 0.01 ohm no mechanical damage Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent) 1200


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PDF 50ppm 100ppm/
2008 - mchp

Abstract: MIL-R-39017 87037 resistor 94047 R250 MIL-R-55342 MIL-R-55182 51R0 R-55182 MIL-STD-202 208 94047
Text: Coefficient Maximum Change ±100 ppm/°C Test Method MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.25% + 0.01 ohm ±1% for R>100K ohm MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to


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PDF MIL-R-39017 mchp 87037 resistor 94047 R250 MIL-R-55342 MIL-R-55182 51R0 R-55182 MIL-STD-202 208 94047
2008 - hsf1

Abstract: barrier film irc chp1
Text: mechanical damage ±1% + 0.01 ohm no mechanical damage Test Method MIL-R-55342E Par 4.7.9 (-55°C +125°C) MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x for 5 seconds MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) MIL-STD-202, Method 208 (245°C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent) 1200 gram


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PDF 50ppm 100ppm/ hsf1 barrier film irc chp1
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