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    MICROFJ-SMTPA-30035-GEVB Search Results

    MICROFJ-SMTPA-30035-GEVB Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    68020-230-035110LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions

    MICROFJ-SMTPA-30035-GEVB Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    MICROFJ-SMTPA-30035-GEVB ON Semiconductor Development Boards, Kits, Programmers - Evaluation Boards - Sensors - J-SERIES 3MM 35U SMTPA Original PDF
    SF Impression Pixel

    MICROFJ-SMTPA-30035-GEVB Price and Stock

    onsemi MICROFJ-SMTPA-30035-GEVB

    J-SERIES 3MM 35U SMTPA
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    DigiKey MICROFJ-SMTPA-30035-GEVB Bulk
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    Mouser Electronics MICROFJ-SMTPA-30035-GEVB
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    element14 Asia-Pacific MICROFJ-SMTPA-30035-GEVB Each 1
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