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2007 - movinand

Abstract:
Text: 16 chips Multi-Chip Packages Use of MCP technology has become so widespread that almost all cellphones now contain these multilayer memory chips. Facts about Samsung MCPs: · Samsung has led the MCP market for more than three years · Samsung manufactures all the types of memory used in MCPs - DRAM, SRAM and flash · Samsung has developed MCP technology for 2- to 16-chip stacks · MCPs can include flash (NAND, NOR, OneNAND), SRAM/UtRAM and mobile DRAM · For its 16-die MCP , Samsung created a new


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PDF BR-07-MEM-001 movinand samsung 32GB Nand flash MLC memory Samsung 8Gb MLC Nand flash Samsung 16GB Nand flash Flex-OneNAND Samsung oneDRAM OneNAND Samsung 32Gb Nand flash SAMSUNG moviNAND samsung 2GB Nand flash
2001 - graphic card circuit diagram

Abstract:
Text: EP-MT-01002A-02 Hitachi MCM/ MCP Products Hitachi MCM/ MCP Products Feb.1st, 2001 Multi , Ltd. EP-MT-01002A-02 Hitachi MCM/ MCP Products 1. Hitachi neither warrants nor grants , regarding this document or Hitachi semiconductor products. EP-MT-01002A-02 Hitachi MCM/ MCP Products Hitachi Proposes MCM as a one of System Solution System LSI Market Environment High Performance Low Power (Increasing gate , mask count) Rapid market change Uncertainty market size (Difficulty to


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PDF EP-MT-01002A-02 SH7709A, SH7709S SH7729 SH7729R ADE-A03-006D graphic card circuit diagram HJ945010BP SMART ASIC bga SH3-DSP 7729R hitachi sh3 network HJ945010 hitachi sh3 Hitachi DSA00201 DESIGN RULE CHECK PCB
2006 - samsung 2GB X16 Nand flash

Abstract:
Text: configurations that reflect the needs of the mobile products market . They are: Samsung's MCP portfolio , flash ­ it produces a comprehensive MCP portfolio when compared to vendors that must purchase wafers for their MCP products. Choosing Samsung assures customers of product breadth, availability and , the ability to keep specific MCP configurations in existence longer than other suppliers, while its , management. Multi-Chip Package ( MCP ) technology. Using Samsung MCP technology is an extremely efficient


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PDF BR-06-MEM-001 samsung 2GB X16 Nand flash SAMSUNG MCp samsung camera module samsung NAND Flash DIE MCP Technology Trend samsung 2GB Nand flash SAMSUNG MCp nand ddr SAMSUNG MCp nand ddr sram 256mb 512MB NOR FLASH
2010 - samsung eMMC 4.5

Abstract:
Text: · Faster time to market The latest MCP solution from Samsung replaces NOR Flash with PRAM ­ the , ) MCP (Multi-Chip-Package) The future of MCP : moviMCPTM and PRAM As the popularity of handheld , , and now even PRAM technology. Samsung moviMCPTM is the newest generation of MCP technology , with the space and power savings of an MCP . moviMCP can eliminate the need to design for external , PRAM · Samsung has developed MCP technology for 2-to 16-chip stacks · For its 16-die MCP , Samsung


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PDF BRO-09-DRAM-001 samsung eMMC 4.5 eMMC samsung* lpddr2 lpddr2 SAMSUNG emmc emmc 4.5 emmc samsung SAMSUNG moviNAND lpddr2 mcp samsung lpddr2
1996 - MCP Specification

Abstract:
Text: and space requirements in the desk-top computer market . In applications such as supercomputers , the device unusable. Market Requirements In the supercomputing market , the system's speed , manufacturable in large low-cost quantities. Multichip Packages The multichip package ( MCP ) has evolved to , and surface mount assembly lines that most manufacturers already have in place. Constructing the MCP , in a similar fashion. Many of today's manufacturers implementing MCP technology support such


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2002 - 128M-BIT

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Text: New products MB84VZ128A Stacked MCP Mounted with 128M-bit (×16) Page Mode NOR-type Dual , is an MCP with a 256M-bit ROM and 20M-bit RAM. The combined density, 276M-bit, is the world , with digital images. Some of the mobile terminals now on the market incorporate almost every function , package. FUJITSU has been providing highly advanced stacked MCP (Multi Chip Package) products to meet the market demand. FUJITSU has now developed the remarkable MB84VZ128A the world's very first


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PDF MB84VZ128A 128M-bit 16M-bit 256M-bit 20M-bit 276M-bit, FBGA-139BGA-139P-M01 128M-BIT 128-MBIT image distribution MCP market sram 128m
2001 - MB84VR5E3J1A1

Abstract:
Text: respond to this market demand, FUJITSU has developed the world's first three-chip MCP with a 64 M-bit NOR , 3-Chip Stacked MCP with 64 M-Bit NOR-Type Flash Memory,16 M-Bit Mobile FCRAMTM, and 4 M-Bit SRAM , Worlds first three-chip stacked MCP , with a 64 M-bit NOR-type flash memory, a 16 M-bit mobile FCRAM, and , of two-chip MCP (multi-chip package) products combining NOR-type flash memory with SRAM or mobile , three-chip MCP developed by FUJITSU includes a 64 M-bit flash memory for program storage, a 16 M-bit mobile


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PDF MB84VR5E3J1A1/ MB84LR5E3J1A1 MB84VR5E3J1A1
1998 - missile seeker

Abstract:
Text: appropriate technology to directly serve all of the needs of a particular military/aerospace market - high , the Multichip Products Group ( MCP ) of Analog Devices Inc. in Greensboro, N.C., have taken a renewed look at their approach to serving this market . The result is a multichip product strategy that takes , attention to this market need. Furthermore, the complexity of requirements is unique, so system , Recognizing this, as part of re-focusing on the military-COTS customer, leaders of the Analog Devices MCP


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AD834x

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Text: Analog Devices, Inc. MultiChip Products Business Unit MCP High Performance Signal Processing Solutions MultiChip Products Business Unit ADI MCP 's MIXED SIGNAL INTEGRATED CHIP MODULES: Sub-System , 6645 80MSPS 9433 125MSPS ADC 100MSPS 2.5Vs 2001 2002 PERFORMANCE MCP Leverage of , 9732 9751 200MSPS 300MSPS DAC MCP 8B 2000 2001 2002 Expanding Options for , DDS ADI MCM Customer Design Cycle Options MCP : Managing Performance and Cost (Through


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2006 - "NOR Flash"

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Text: applications. ST's response is a new family of multi-chip package ( MCP ) devices that contain Flash memories , package. In terms of size, features and performance, these latest MCP devices are perfectly tailored to meet the needs of the mobile phone market , while at the same time offering the most cost-effective , , handling multimedia content and fast internet connectivity. To reduce any application's time to market , ' specific development platforms. The MCP devices, combined with the software, provide complete memory


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PDF 133MHz, 256Mb 512Mb FLNORWIR0206 "NOR Flash" NOR Flash "NOR Flash" 512MB 512MB NOR FLASH 512Mb nor flash memory MCP market ST Flash TFBGA105
29LV160TE

Abstract:
Text: x16 70/13.5ns FBGA/ MCP Now *Depends on market 1.8V Flash ­ Product Guideline CFI , Cycle Ram MCP ­ Multi-Chip Packages Packaging Technology NOR-FLASH, MIRRORFLASHTM, FCRAMTM , Flash Memory INTRODUCTION TO FLASH MEMORY NOR-Flash MirrorFlashTM FCRAMTM ­ Fast Cycle Ram MCP ­ Multi-Chip Packages Back Packaging Technology As a market leader in flash memory , multi-faceted needs of flash memory users world-wide, in a market that is currently estimated by Dataquest to


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PDF D-63303 F-94035 D-85737 I-20080 29LV160TE 29lv800ta Micron 512MB NOR FLASH 29F800TA 29f400tc 29F033C TSOP 48 Package 29f160te Micron 32MB NOR FLASH 29f002tc
movinand emmc

Abstract:
Text: When Less Is More: Bigger & Faster Memory in Shrinking Packages for the Mobile Market Kathy Choe , 26 70 148 NAND Overall Mobile Market Driving Memory Demand Mobile DRAM Growth @ CAGR of , MCP & MoviNAND: More Die & Capacity per Pkg 120GB Chip Stack Number Technology 20 EA , MCP 6 EA 32GB 16GB 4GB 5Chip 4GB 4 EA moviMCP Year 2004 2005 2006 , Higher Performance ND Modem MCP MCP Solution Modem Modem (169mm2) (169mm2) ( CDMA Phone


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2003 - samsung roadmap

Abstract:
Text: market . Advances in system design techniques also enable the more cost effective NAND FLASH to replace , shape the market . Samsung Semiconductor, the established leader in memory, is such a supplier. Committed to the FLASH memory market since 1992, Samsung is already the world's leading producer of NAND FLASH, the fastest growing architecture in the FLASH market , and has became the second largest supplier , ? Is my supplier ahead of the market curve? Can they give me an advantage? What should I look for in


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PDF CG2020-A samsung roadmap USB Flash Memory SAMSUNG SAMSUNG MCp nand Samsung Nand gb MCP Technology Trend SAMSUNG NAND FLASH NAND flash differences NAND Reliability note MCP NAND, DRAM, NOR Samsung MCP
2002 - Not Available

Abstract:
Text: New products MB84VZ064A Stacked MCP Mounted with Two 64M-bit NOR-type Flash Memories, a 32M-bit Mobile FCRAMTM, and an 8M-bit SRAM MB84VZ064A A quadruple-stacked MCP with the world , power consumption and cheaper memory. To respond to these market demands, FUJITSU has developed the MB84VZ064A, a quadruple-stacked multi-chip package ( MCP ) mounted with two 64M-bit NOR-type flash memories , , while increasing memory density at the same time. Figure 1 Section Diagram of 4-Chip Stacked MCP Au


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PDF MB84VZ064A 64M-bit 32M-bit MB84VZ064A, 40REF 80REF
2002 - fujitsu LVDS vga

Abstract:
Text: 's stacked Multi-Chip Package ( MCP ) sets the industry pace for the growing wireless market and are designed , devices to consumer products. Automotive Electronics, Leadership for a Stable, Expanding Market The automotive market offers the opportunity for steady, stable growth, and we will build on our successful history in this sector. Fujitsu began marketing 4- and 8-bit microcontrollers to the automotive market 20 years ago in Japan. By the early 1990s, we had moved into the European market and, for the past


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PDF 16-bit MB90F372 MB90372, 90-nm 90-nanometer CORP-NL-20908-10/2002 fujitsu LVDS vga smart traffic light control by laser wireless video camera construction MB86S02A cell phone camera module wiring pcb camera ccd Fingerprint module USING DVD LASER DIODE fingerprint lock circuit MBF200 optical fingerprint sensor
2000 - "The design of the leadframe" national

Abstract:
Text: Multi-Chip Packages "Multi-Chip Packages" or MCP is a terminology used within National , MCC) or low-end Multi-Chip Modules (MCM). MCP refers to a packaging configuration containing at most , . MCPs can also incorporate the use of passive components. A key feature of MCP is the use of standard packages as a vehicle for low-end MCM applications. This allows the end user to readily incorporate MCP , power consumption. · Mixed Signal Applications: MCP allows the integration of chips made from


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1996 - Not Available

Abstract:
Text: . Multichip Package ( MCP ) In today's competitive market , the need to minimize "time-to-market" is essential , widest range of JEDEC/EIAJ compliant MCP and SCP packages. Leveraging our strength and experience in , customers the most cost-effective MCP and SCP packaging solutions under a high-volume and high-yield , coplanarity problem seen in Quad Flat Packs (QFP), our MCP and SCP packages also offer enhanced electrical , not, Fujitsu's MCP and SCP packages can meet your most challenging requirements. Our creativity and


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1996 - cohesive

Abstract:
Text: Fujitsu offers the widest range of multichip module (MCM) and multichip package ( MCP ) technology available in the industry today. MCM is a completely custom solution that creates a specialized module. MCP , . With today's high demands, the use of MCM/ MCP technology allows designers to achieve the maximum performance through size and space reductions. The MCM/ MCP solution provides several clear and distinct advantages over the conventional ASIC approach. In addition to time savings, the MCM/ MCP solution can


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2000 - powerchip DDR3

Abstract:
Text: various information-communication and electronics equipment. The market for DRAM products is the largest , achieved the third highest share of the DRAM market and established a formidable presence in a DRAM , . In the Computing DRAM business Elpida is steadily gaining market share by outsourcing much of its , Electronics DRAMs Digital TV Market ·Strengthen our DDR3, XDRTM and other high-performance DRAMs to prepare for high-definition (HD) Game Consoles, Blu-ray Disc Recorder Market ·Develop and supply


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PDF E0001EC0 powerchip DDR3 POWERCHIP powerchip sdram DDR3 DRAM layout ELPIDA mobile DDR powertech kingston ddr3 memory Tera Probe ELPIDA ddr2 RAM Banner Engineering
1996 - Not Available

Abstract:
Text: Fujitsu's MCP family of available packaging options, including BGAs THE FUJITSU ADVANTAGE Vast design , offers the widest range of multichip module (MCM) and multichip package ( MCP ) technology available in the industry today. MCM is a completely custom solution that creates a specialized module. MCP , . With today's high demands, the use of MCM/ MCP technology allows designers to achieve the maximum performance through size and space reductions. The MCM/ MCP solution provides several clear and distinct


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PDF ITD-MCM-TB-20022-8/95
2005 - NOR Flash

Abstract:
Text: is offered as both stand-alone and MCP solutions, in combination with PSRAM and LPSDRAM memories in , up to 1Gb in MCP . With common ball-out for easy upgrading and backward-compatible software, the , supply I Low-voltage, low-power consumption I Stand-alone and MCP solutions I Increased , handset applications I MCP combination with PSRAM and LPSDRAM I 1Gb solution available in MCP I High read bandwidth for fast code execution I Increased program throughput for


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PDF app128Mb 8/16/32/64Mb FLNORMOB1005 NOR Flash FLASH NOR 64mb 512MB NOR FLASH MCP market "NOR Flash" 512MB 130nm 1GB EASY BGA NOR FLASH ST nor flash
Playstation2 power supply

Abstract:
Text: shortfall created when the DRAM market bottomed out. SRAM, on the other hand, is grabbing a lot of , particularly noteworthy for this memory are the Internet market , where high-speed, multimedia communication devices are in high demand, and the mobile communication market , where products that incorporate flash , digital consumer appliance (especially PC) market , has caused a major shake up in the industry as , cards for file applications have started to appear on the market . The PC Market 's Next Main Memory


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PCB design for very fine pitch csp package

Abstract:
Text: /04 The Market 's Requirement for New ASIC Packaging Technology · The need for increased , small form factor market like cell phones, GPS systems, PCMCIA cards, wireless LANS and other mobile , package responds to the market demand for feature-rich ASIC solutions < < < · The Oki's W-CSP , ASIC W-CSP 02/04 Packaging Technology Trends High Speed & High Density Multi Chip MCP MCP , Carrier *2Tray (2inch) 12 ASIC W-CSP 02/04 Market Trends · · W-CSP market started in the


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2014 - CGY2108GS

Abstract:
Text: enabling its customers to be leaders in a more and more demanding market place. OMMIC is a supplier of , Policy OMMIC operates in a highly competitive global market and must be competitive and responsive , Wafers to the Merchant Market . Our on site epitaxy serves High performance low cost PHEMT, MHEMT & HBT , offering, OMMIC also supplies epi wafers to the merchant market in 3-, 4- and 6-inch formats using , introduce to the market advanced technologies based on III-V compounds. This means moving to shorter gate


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PDF 500MHz 160GHz CGY2108GS D01GH CGY2190UH/C2 CGY2191UH/C2 D01MH D01PH ED02AH
1996 - PDM41257SA15D

Abstract:
Text: Drawing AC/DC tested at ­55, +25 and +125°C with High Temp Burn-in - MCP Ceramic Sidebraze DIP E , world-wide rights to manufacture and market Paradigm Technology Incorporated's very fast, pure CMOS SRAMs , 15, 20, 25, 35, 45, 55 J, E, DIE 28, 32 /883, -SMD, - MCP MD8, MDA, MDQ /883, -SMD, - MCP , , 25, 35 15, 20, 25, 35 J J 24 24 /883, - MCP /883, - MCP NS41258L NS41258S 256K , , - MCP /883, - MCP NS41024L 1 MEG 128K x 8 OE, CE1, CE2, WE 17, 20, 25, 35, 45, 55 E


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PDF MIL-STD-883 PDM41257SA15D Paradigm 41256 PDM41024-S20L32 PDM41024S20L32 MT5C1005C25/883C SRAM Cross Reference IDT71256L35L32B EDI8M8512 EDI84256LPS25TB CY7C1008-15LMB
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